JPS6130029B2 - - Google Patents
Info
- Publication number
- JPS6130029B2 JPS6130029B2 JP8946782A JP8946782A JPS6130029B2 JP S6130029 B2 JPS6130029 B2 JP S6130029B2 JP 8946782 A JP8946782 A JP 8946782A JP 8946782 A JP8946782 A JP 8946782A JP S6130029 B2 JPS6130029 B2 JP S6130029B2
- Authority
- JP
- Japan
- Prior art keywords
- film thickness
- crucible
- turntable
- film
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007740 vapor deposition Methods 0.000 claims description 8
- 238000007738 vacuum evaporation Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 34
- 239000011669 selenium Substances 0.000 description 10
- 238000001704 evaporation Methods 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 8
- 229910052711 selenium Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052714 tellurium Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000005019 vapor deposition process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000002390 rotary evaporation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Photoreceptors In Electrophotography (AREA)
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】
本発明は、とくに膜厚方向の成分比勾配が問題
となる光導電膜またその他の真空蒸着膜の製造に
適した真空蒸着装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus suitable for producing photoconductive films and other vacuum-deposited films in which component ratio gradients in the film thickness direction are particularly problematic.
従来、複数種の元素から光電膜を真空蒸着によ
り形成する場合、この膜を成分比の異なる多数の
層でもつて多層構造に形成することが行なわれて
いる。しかし、このような積層法では、各層の厚
みを十分に小さくしない限り、各層間で光の干渉
を生じる惧れがある。また、膜厚方向における成
分比勾配の規正が容易でなく、荷電キヤリアの移
動にばらつきを生じるなど、良好な光導電膜を得
難い欠点がある。 Conventionally, when a photoelectric film is formed from multiple types of elements by vacuum evaporation, the film is formed into a multilayer structure with a large number of layers having different component ratios. However, in such a lamination method, unless the thickness of each layer is made sufficiently small, there is a risk that light interference will occur between each layer. In addition, it is difficult to regulate the component ratio gradient in the film thickness direction, causing variations in the movement of charged carriers, making it difficult to obtain a good photoconductive film.
本発明の真空蒸着装置によると、第1の元素の
蒸発源と蒸着処理位置との間に第1のアイレス
を、そして、前記元素とは異な第2の元素の蒸発
源と前記蒸着処理位置との間に第2のアイレスを
それぞれ挿入自在に設け、前記第1および第2の
アイレスの各開口度を膜厚モニタからの信号にも
とづき選択的に制御することにより、両蒸発源か
ら前記蒸着処理位置へ向う蒸気流の量を制御する
のであつて、これを以下図面に示した実施例とと
もに詳しく説明する。 According to the vacuum evaporation apparatus of the present invention, the first airless is provided between the evaporation source of the first element and the evaporation processing position, and the evaporation source of the second element different from the above element is connected to the evaporation processing position. The vapor deposition process is performed from both evaporation sources by selectively controlling the opening degree of each of the first and second eyeres based on the signal from the film thickness monitor. The control of the amount of steam flow towards a location will be described in detail below in conjunction with the embodiments shown in the drawings.
第1図において、回転シヤフト1とともに一定
速度の回転をなすターンテーブル2は、その円周
に沿う板面領域に16個の円形の透孔3a,3b,
3c……3pを有し、蒸着膜厚検出用の透孔3a
を除く15個の透孔3b,3c……3p内には、15
個の被蒸着基板としてのガラス円板4b,4c…
…4pがそれぞれ嵌め込みにより装着されてい
る。ガラス円板4b,4c……4pは、撮像管の
フエースプレートとなるもので、その下面には透
明導伝電膜がすでに付設されており、この透明導
電膜の膜面上に光導電膜が真空蒸着される。 In FIG. 1, a turntable 2 that rotates at a constant speed together with a rotating shaft 1 has 16 circular through holes 3a, 3b,
3c...3p, and a through hole 3a for detecting the thickness of the deposited film
15 through holes 3b, 3c except for... 15 in 3p
Glass disks 4b, 4c... as individual deposition target substrates.
...4p are each attached by fitting. The glass disks 4b, 4c...4p serve as the face plates of the image pickup tube, and a transparent conductive film is already attached to the lower surface of the glass discs, and a photoconductive film is formed on the surface of the transparent conductive film. Vacuum deposited.
前記光導電膜がセレン(Se)とひ素(As)と
からなる場合、第1の元素たるSeが第1のルツ
ボ5内に納められ、第2の元素たるAsが第2の
ルツボ6内に納められる。第1および第2のルツ
ボ5,6は、それぞれの中心軸5a,6aが透孔
3aの中心部で交差するように傾斜配置されてお
り、中心軸5aの延長線上に第1の膜厚モニタ7
が設けられ、中心軸6aの延長線上に第2の膜厚
モニタ8が設けられている。すなわち、第1のル
ツボ5は透孔3aを通じて第1の膜厚モニタ7と
向き合い、第2のルツボ6は透孔3aを通じて第
2の膜厚モニタ8と向き合う。 When the photoconductive film is made of selenium (Se) and arsenic (As), the first element, Se, is placed in the first crucible 5, and the second element, As, is placed in the second crucible 6. It can be paid. The first and second crucibles 5 and 6 are arranged at an angle so that their central axes 5a and 6a intersect at the center of the through hole 3a, and the first film thickness monitor is located on an extension of the central axis 5a. 7
A second film thickness monitor 8 is provided on an extension of the central axis 6a. That is, the first crucible 5 faces the first film thickness monitor 7 through the through hole 3a, and the second crucible 6 faces the second film thickness monitor 8 through the through hole 3a.
ターンテーブル2は蒸着処理期間中、図示矢印
の方向へ回転するから、図示した透孔3aの位
置、つまり単一の蒸着処理位置Aに、その他の透
孔3b,3c……3pおよびガラス円板4b,4
c……4pが順次に送り込まれることになり、こ
の巡回動作が繰り返えされる。 During the vapor deposition process, the turntable 2 rotates in the direction of the arrow shown in the figure, so that the position of the illustrated through hole 3a, that is, the single vapor deposition process position A, the other through holes 3b, 3c, . . . 3p and the glass disc. 4b, 4
c...4p will be sent in sequence, and this cyclic operation will be repeated.
第1および第2のルツボ5,6は加熱用ヒータ
9,10によつて加熱され、加熱温度は各ルツボ
5,6の底部に設けられた熱電対11,12によ
つて検出される。また、両ルツボ5,6の周囲に
は円筒状のカバー13,14が設けられており、
カバー13,14および仕切り板15は、輻射熱
を遮断するとともに蒸気流の好ましくない方向へ
の発散を防止する。なお、カバー13,14およ
び仕切に板15は、必要により水や液体窒素等の
寒剤により冷却される。 The first and second crucibles 5 and 6 are heated by heaters 9 and 10, and the heating temperature is detected by thermocouples 11 and 12 provided at the bottom of each crucible 5 and 6. Further, cylindrical covers 13 and 14 are provided around both crucibles 5 and 6,
The covers 13, 14 and the partition plate 15 block radiant heat and prevent the vapor flow from dispersing in undesirable directions. Note that the covers 13 and 14 and the partition plate 15 are cooled with water or a cryogen such as liquid nitrogen, if necessary.
膜厚モニタ7,8は水晶振動子形の膜厚計から
なり、これを囲繞する第1および第2の筒状カバ
ー16,17は、それぞれに対応するルツボ5,
6からの蒸気のみを当該膜厚モニタ7,8に導く
ためのものであり、その内径を小さくして筒長を
大きくすればするほど他の蒸発源からの蒸気混入
を少なくすることができる。しかしその反面、膜
厚モニタの感度に低下をきたすので、蒸発材料に
応じて適当な内径および筒長に選ぶ必要がある。 The film thickness monitors 7 and 8 are composed of crystal oscillator type film thickness gauges, and the first and second cylindrical covers 16 and 17 surrounding the monitors are connected to the corresponding crucibles 5 and 8 respectively.
It is for guiding only the vapor from the evaporation source 6 to the film thickness monitors 7 and 8, and the smaller the inner diameter and the longer the cylinder length, the less the vapor from other evaporation sources can be mixed in. However, on the other hand, the sensitivity of the film thickness monitor decreases, so it is necessary to select an appropriate inner diameter and cylinder length depending on the material to be evaporated.
第1のルツボ5と蒸着処理位置Aとの間に挿入
自在に設けられた箱形の第1のアイレス18はそ
の天板部18aに、ルツボ中心軸5aの延長線を
深く入り込ませることのできるくさび状の開口1
9を有している。また、第2のルツボ6と蒸着処
理位置Aとの間に挿入自在に設けられた箱形の第
2のアイレス20はその天板部20aに、ルツボ
中心軸6aの延長線を深く入り込ませることので
きるくさび状の開口21を有している。したがつ
て、第1および第2のアイレス18,20を図示
矢印の方向へ移動させると、その移動量に応じて
両蒸発源から蒸着処理位置Aへ向う蒸気流の量を
制御することができる。なお、両アイレスト1
8,20の回転中心は、ターンテーブル2の回転
中心と同転である。 The box-shaped first eyeless 18, which is freely inserted between the first crucible 5 and the vapor deposition processing position A, allows the extension line of the crucible central axis 5a to deeply penetrate into the top plate portion 18a. wedge-shaped opening 1
It has 9. In addition, the box-shaped second eyeless 20, which is freely inserted between the second crucible 6 and the vapor deposition processing position A, has an extension line of the crucible central axis 6a deeply inserted into its top plate portion 20a. It has a wedge-shaped opening 21 that can be opened. Therefore, when the first and second eyeres 18, 20 are moved in the direction of the arrow shown in the figure, the amount of vapor flow from both evaporation sources toward the vapor deposition processing position A can be controlled according to the amount of movement. . In addition, both eye rests 1
The rotation centers of 8 and 20 are the same as the rotation center of the turntable 2.
第1図に示す構体は、第2図に示すようにベル
ジヤ22内に納められ、ベルジヤ22外から駆動
制御を受ける。ギヤー機構23は、第1および第
2のアイレスト18,20を駆動させるためのも
ので、真空ポンプおよび真空弁25は、ベルジヤ
22内を真空に保つためのものである。また、筒
状カバー16,17は仕切り板26にとりつけら
れており、第1,第2のルツボ5,6およびカバ
ー13,14は台座27にとにつけられており、
仕切り板28には蒸気導入筒29がとりつけられ
ている。 The structure shown in FIG. 1 is housed within a bell gear 22 as shown in FIG. 2, and is driven and controlled from outside the bell gear 22. The gear mechanism 23 is for driving the first and second eyerests 18 and 20, and the vacuum pump and vacuum valve 25 are for keeping the inside of the bell gear 22 in a vacuum. Further, the cylindrical covers 16 and 17 are attached to the partition plate 26, and the first and second crucibles 5 and 6 and the covers 13 and 14 are attached to the pedestal 27,
A steam introduction cylinder 29 is attached to the partition plate 28.
前述のように構成された真空蒸着装置によつ
て、たとえば90原子%Se,10原子%As組成の薄
膜を形成するには、ベルジヤ22内を1×
10-6Torr以下の真空度に保ち、ターンテーブル
2を30r.p.mの速度で回転させ、ヒータ9,10
に加熱電流を通じる。このとき、第1および第2
のアイレス18,20はともに相互接近してお
り、開口度は零であるが、両ルツボ5,6からの
蒸発が略一定の速度となつた時点で相反方向へ移
動させると、第1および第2のアイレス18,2
0の開口度が徐々に大きくなる。 In order to form a thin film having a composition of, for example, 90 atomic % Se and 10 atomic % As using the vacuum evaporation apparatus configured as described above, the inside of the bell gear 22 is 1×
While keeping the degree of vacuum below 10 -6 Torr, turntable 2 is rotated at a speed of 30rpm, and heaters 9 and 10 are turned on.
A heating current is passed through. At this time, the first and second
The eyelets 18 and 20 of the crucibles 5 and 6 are both close to each other, and the degree of opening is zero. 2 Eyeless 18,2
The opening degree of 0 gradually increases.
これによつて、ターンテーブル2に嵌め込まれ
ている15個のガラス円板のそれぞれに、Seおよ
びAsが同時に真空蒸着されていくことになる。
そして、ターンテーブル2が一回転する都度、第
1および第2の膜厚モニタ7,8から、Seおよ
びAsの実質的蒸着量に比例した大きさのデータ
信号が送り出されるから、この2種のデータ信号
によるSe対Asが原子比換算で9対1になるよう
に両アイレツト18,20を移動させてその開口
度を調整すればよい。ただし、両アイレツト1
8,20の開口度制御だけでは十分に調整しきれ
ないときは、伴用手段として、ヒータ9,10に
流れる電流の大きさを制御してもよい。 As a result, Se and As are simultaneously vacuum-deposited onto each of the 15 glass discs fitted into the turntable 2.
Each time the turntable 2 makes one revolution, the first and second film thickness monitors 7 and 8 send out data signals whose magnitude is proportional to the actual amount of Se and As deposited. Both eyelets 18 and 20 may be moved to adjust their apertures so that the ratio of Se to As determined by the data signal is 9 to 1 in terms of atomic ratio. However, both eyelets 1
When the opening degree control of 8 and 20 is insufficient for sufficient adjustment, the magnitude of the current flowing through the heaters 9 and 10 may be controlled as a companion means.
膜厚モニタ7,8からのデータ信号を演算し、
この演算結果にもとづく信号をアイレス駆動部ま
たはヒータ電流制御部に短時間でフイードバツク
させるのに、コンピユータを利用するのが好まし
い。ただし、所定成分比の演算値を前もつて計算
しておき、この演算値となるように前記アイレス
駆動部またはヒータ電流制御部を手動操作しても
よく、この場合はコンピユータを要しない。手動
操作では、たとえば、ペンレコーダを用い、その
記録紙に蒸着予定量を示す制御曲線を予め描いて
おく。そして、膜厚センサの出力信号を前記ペン
レコーダに与え、ペンレコーダの出力ペン指示が
前記制御曲線と一致するようにアイレス駆動部ま
たはヒータ伝流制御部を操作すればよい。 Calculates data signals from film thickness monitors 7 and 8,
It is preferable to use a computer to feed back a signal based on the result of this calculation to the eyeless drive section or the heater current control section in a short time. However, the calculated value of the predetermined component ratio may be calculated in advance, and the eyeless drive section or the heater current control section may be manually operated to obtain the calculated value, and in this case, a computer is not required. In manual operation, for example, a pen recorder is used to draw a control curve indicating the expected amount of vapor deposition on the recording paper in advance. Then, the output signal of the film thickness sensor is given to the pen recorder, and the eyeless drive section or the heater current control section is operated so that the output pen instruction of the pen recorder matches the control curve.
Seを主成分とし、テルル(Te)が膜厚方向に
特定の分布で添加されている厚さ4μmの薄膜を
形成する場合には、第1および第2のルツボ5,
6にSeおよびTeをそれぞれ充填しておき、ベル
ジヤ22内を1×10-6Torr以下の真空度に保
つ。ターンテーブル2を30r.p.mの速度で回転さ
せつつ、前述と同様に第1および第2のアイレス
ト18,20の各開口度および要すればヒータ
9,10に流れる電流を膜厚モニタ7,8からの
信号にもとづき制御し、SeおよびTeの蒸着量を
調整する。そして、蒸着膜厚の総計が4μmに達
した時点で両アイレス18,20の開口度を零に
する。 When forming a thin film with a thickness of 4 μm containing Se as the main component and tellurium (Te) added in a specific distribution in the film thickness direction, the first and second crucibles 5,
6 is filled with Se and Te, respectively, and the inside of the bell gear 22 is maintained at a vacuum level of 1×10 -6 Torr or less. While rotating the turntable 2 at a speed of 30 rpm, the film thickness monitors 7 and 8 monitor the opening degrees of the first and second eyerests 18 and 20 and, if necessary, the current flowing through the heaters 9 and 10. The amount of Se and Te deposited is adjusted based on the signal from the Then, when the total thickness of the deposited film reaches 4 μm, the opening degree of both the eyeres 18 and 20 is made zero.
以上のように、本発明の真空蒸着装置は、蒸気
圧の異なる多元素系薄膜を多源回転蒸着法により
形成するものであるが、複数種の元素蒸気を膜厚
モニタからの信号にもとづき量制御して被蒸着面
上で混合させるため、膜厚方向の成分比勾配を任
意に制御でき、しかも、完全に連続した勾配とな
すことができる。また、多数の膜を同一条件下で
精度よく高能率で形成することができ、従来のフ
ラツシング蒸着法に比べて欠陥の少ない蒸着膜を
得ることができる。その上、蒸着速度が安定化す
るため、膜の電気的欠陥がほとんどみられず、光
の干渉の問題もないので、とくに撮像管もしくは
撮像素子の光導電膜、受光素子または干渉フイル
タ等の製造に適用して頗るすぐれた効果を得るこ
とができる。 As described above, the vacuum evaporation apparatus of the present invention forms multi-element thin films with different vapor pressures by the multi-source rotary evaporation method. Since the mixture is controlled and mixed on the surface to be deposited, the component ratio gradient in the film thickness direction can be arbitrarily controlled and can be made to be a completely continuous gradient. Further, a large number of films can be formed with high precision and high efficiency under the same conditions, and a deposited film with fewer defects can be obtained compared to the conventional flushing vapor deposition method. Furthermore, since the deposition rate is stabilized, there are almost no electrical defects in the film and there is no problem of light interference, which is particularly useful for the production of photoconductive films for image pickup tubes or image sensors, photodetectors, interference filters, etc. It can be applied to obtain excellent effects.
第1図は本発明を実施した真空蒸着装置の要部の
斜視図、第2図は同装置の側断面図である。
2……ターンテーブル、3a……蒸着膜厚検出
用透孔、3b〜3p……被蒸着基板装着用透孔、
5,6……ルツボ、7,8……膜厚モニタ、1
8,20……アイレス、A……蒸着処理位置。
FIG. 1 is a perspective view of the main parts of a vacuum evaporation apparatus embodying the present invention, and FIG. 2 is a side sectional view of the same apparatus. 2...Turntable, 3a...Through hole for detecting the thickness of the deposited film, 3b to 3p...Through hole for mounting the substrate to be vapor deposited,
5, 6... Crucible, 7, 8... Film thickness monitor, 1
8, 20...Airless, A...Vapor deposition processing position.
Claims (1)
多数の透孔とを円周に沿う板面領域に有し一定速
度で回転するターンテーブル、前記透孔の通過位
置に設定された単一の蒸着処理位置に向き合うよ
うに前記ターンテーブルの下方に配置された第1
および第2のルツボ、前記第1および第2のルツ
ボにそれぞれ向き合うように前記ターンテーブル
の上方に配置された第1および第2の膜厚モニ
タ、前記第1のルツボと前記蒸着処理位置との間
に挿入自在に配置されて前記第1の膜厚モニタの
出力信号にもとづき開口度が制御される第1のア
イレスならびに前記第2のルツボと前記蒸着処理
位置との間に挿入自在に配置されて前記第2の膜
厚モニタの出力信号にもとづき開口度が制御され
る第2のアイレスを備えてなることを特徴とする
真空蒸着装置。1. A turntable that rotates at a constant speed and has a through hole for detecting the thickness of a deposited film and a large number of through holes for mounting a substrate to be deposited on a plate surface area along the circumference, and is set at a position where the through holes pass through. A first one disposed below the turntable so as to face a single deposition processing position.
and a second crucible, first and second film thickness monitors disposed above the turntable so as to face the first and second crucibles, respectively, between the first crucible and the vapor deposition processing position. a first eyeless that can be inserted freely between the second crucible and the vapor deposition processing position, the opening degree of which is controlled based on the output signal of the first film thickness monitor; A vacuum evaporation apparatus comprising a second eyeless whose opening degree is controlled based on the output signal of the second film thickness monitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8946782A JPS58207369A (en) | 1982-05-26 | 1982-05-26 | Vacuum deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8946782A JPS58207369A (en) | 1982-05-26 | 1982-05-26 | Vacuum deposition device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58207369A JPS58207369A (en) | 1983-12-02 |
| JPS6130029B2 true JPS6130029B2 (en) | 1986-07-10 |
Family
ID=13971509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8946782A Granted JPS58207369A (en) | 1982-05-26 | 1982-05-26 | Vacuum deposition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58207369A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010121215A (en) * | 2010-01-14 | 2010-06-03 | Semiconductor Energy Lab Co Ltd | Deposition apparatus and deposition method |
-
1982
- 1982-05-26 JP JP8946782A patent/JPS58207369A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58207369A (en) | 1983-12-02 |
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