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JPS6133438B2 - - Google Patents
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JPS6133438B2 - - Google Patents

Info

Publication number
JPS6133438B2
JPS6133438B2 JP12755379A JP12755379A JPS6133438B2 JP S6133438 B2 JPS6133438 B2 JP S6133438B2 JP 12755379 A JP12755379 A JP 12755379A JP 12755379 A JP12755379 A JP 12755379A JP S6133438 B2 JPS6133438 B2 JP S6133438B2
Authority
JP
Japan
Prior art keywords
vibrator
recess
backing material
conductive adhesive
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12755379A
Other languages
Japanese (ja)
Other versions
JPS5651194A (en
Inventor
Toshihiro Yamazoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12755379A priority Critical patent/JPS5651194A/en
Publication of JPS5651194A publication Critical patent/JPS5651194A/en
Publication of JPS6133438B2 publication Critical patent/JPS6133438B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Description

【発明の詳細な説明】 本発明は高周波の超音波探触子の構造に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a high frequency ultrasound probe.

最近、医療機器として働いている心境や腹部の
断層像をリアルタイムで見ることができる超音波
断層撮影装置が急速に普及してきている。これら
は無侵襲性、危険性なく生体の断層像を情報量多
く得られるという特徴を有しているからである。
超音波診断法には、パルス反射法、ドツプラ―
法、透過法等があるが現在多く実用化され需要も
多くなつているのはパルス反射法である。パルス
反射法の原理は超音波振動子(圧電素子)から
1MHz〜10MHzの超音波のパルスを出し、異る音
響インピーダンスをもつ組織(物質)の界面から
インピーダンス不整合によるエコーが返つてくる
のを同じ振動子で受信し、その受信信号の強弱で
ブラウン管に輝度変調をかけ、エコーの位置、強
さを表示することにより生体等の断層像を得るこ
とができるものである。
BACKGROUND ART Recently, ultrasonic tomography devices that can be used as medical devices to view tomographic images of the abdomen and the state of mind of working people in real time have been rapidly becoming popular. This is because these methods are non-invasive and can obtain tomographic images of a living body with a large amount of information without any danger.
Ultrasound diagnostic methods include pulse reflection method, Doppler
The pulse reflection method is currently in practical use and is in increasing demand. The principle of pulse reflection method is based on the ultrasonic vibrator (piezoelectric element).
An ultrasonic pulse of 1MHz to 10MHz is emitted, and echoes due to impedance mismatch are received from the interface of tissues (substances) with different acoustic impedances using the same transducer. By applying brightness modulation and displaying the position and intensity of echoes, it is possible to obtain tomographic images of living bodies, etc.

この超音波探触子においても重要な特性は感度
と分解能である。感度がよいということは出され
た信号に対してエコーの大きさが大きいというこ
とであり、分解能がいいということはエコーのも
つてくる情報量が多いということである。この分
解能を上げる為には二つのことが重要で一つは波
長を短くすることである。生体中の音速は約
1500m/sで1MHzの周波数であれば波長は1,
5mmとなる為小さな生体中の組織を見る為には周
波数を高くしてより波長を短くする必要がある。
一般的には2〜5MHzの周波数が使われる。もう
一つは発振及びエコーのパルスの減衰を速くする
ことである。一般に振動子(圧電素子)のQは高
い為、減衰を早くする為振動子とバツキング材と
呼ばれるゴム等で作られたQの低い材質のものに
貼りつけて使用する。このバツキング機は振動子
(圧電素子)の後方への音波をを吸収した生体か
らエコーとバツキング材側からのエコーが交わら
ないようにしている。また分解能を上げる為には
周波数を高くすると生体内での超音波の減衰が大
きくなりエコーの信号が小さくなるという欠点が
あつた。しかし制御電子回路の発達により周波数
が高くなつていくのが現状の傾向である。一方振
動子は周波数が高くなれば薄くする必要がある。
これは振動子の厚み方向の共振周波数を使用周波
数に合せる為である。また圧電特性、音響特性の
関係より振動子の厚みと巾の関係は0.6程度が一
番効率が高いことがわかつている。従つて周波数
が高くなれば振動子の厚みは5MHzで百数十μ巾
は200μ程度の非常に小さなものになつてしま
う。
The important characteristics of this ultrasonic probe are sensitivity and resolution. Good sensitivity means that the size of the echo is large relative to the emitted signal, and good resolution means that the echo carries a large amount of information. In order to increase this resolution, two things are important; one is to shorten the wavelength. The speed of sound in living organisms is approximately
If the frequency is 1MHz at 1500m/s, the wavelength is 1,
5 mm, so in order to see small tissues in living organisms, it is necessary to increase the frequency and shorten the wavelength.
Frequencies between 2 and 5 MHz are generally used. Another is to speed up the attenuation of oscillation and echo pulses. Generally, the Q of a vibrator (piezoelectric element) is high, so in order to speed up the damping, the vibrator and backing material are attached to a material with a low Q such as rubber. This bucking machine prevents echoes from the living body that have absorbed sound waves toward the rear of the vibrator (piezoelectric element) from intersecting with echoes from the bucking material side. Furthermore, increasing the frequency in order to increase the resolution has the disadvantage that the attenuation of the ultrasonic waves in the living body increases and the echo signal becomes smaller. However, the current trend is for frequencies to become higher due to the development of control electronic circuits. On the other hand, the higher the frequency, the thinner the vibrator needs to be.
This is to match the resonant frequency in the thickness direction of the vibrator to the operating frequency. Furthermore, from the relationship between piezoelectric characteristics and acoustic characteristics, it has been found that the highest efficiency is achieved when the relationship between the thickness and width of the vibrator is approximately 0.6. Therefore, as the frequency increases, the thickness of the resonator becomes 5 MHz and the width of 100-odd microns becomes very small, about 200 microns.

このように小さな薄い振動子をバツキング材に
貼り合せてより作り易い構造のものと提供するの
が本考案の目的である。以下図面にもとづいて本
発明の実施例および従来例を説明する。第1図は
探触子の一般的な構造で1は表面と裏面に電極2
をもつ素子分割された複数個の圧電素子よりなる
振動子でバツキング材3に貼りつけてある。電極
からの電気接続は上面5アース電極の共通電極と
しバツキング材側からリード4で個々の電極に接
続されている。又作り方からして一枚の圧電振動
子をバツキング材に貼り合せて後カツターでm分
割する為バツキング材にも6のような溝がついて
いる。そして電気信号は相隣り合う振動子数個を
並列振動させて使うのが一般的である。従つてリ
ード4は数個単位で接続して使う。個々のリード
である4は圧電振動子が小さくなると非常に小さ
くしなければならずフラツトケーブル等の小さな
薄いものが今まで使用されていた。しかし小さく
なれば限度がある。
An object of the present invention is to provide a structure that is easier to manufacture by bonding such a small, thin vibrator to a backing material. Embodiments of the present invention and conventional examples will be described below based on the drawings. Figure 1 shows the general structure of a probe. 1 shows electrodes 2 on the front and back sides.
The vibrator is made of a plurality of piezoelectric elements divided into elements and is attached to the backing material 3. Electrical connections from the electrodes are made using a common electrode of the ground electrode 5 on the top surface, and are connected to the individual electrodes from the backing material side with leads 4. In addition, because of the way it is made, a single piezoelectric vibrator is pasted onto a backing material and then divided into m sections using a cutter, so the backing material also has grooves like the number 6. Generally, electrical signals are generated by vibrating several adjacent oscillators in parallel. Therefore, the leads 4 are used by connecting several leads. The individual leads 4 must be made very small as the piezoelectric vibrator becomes smaller, and small and thin leads such as flat cables have been used until now. However, there is a limit to how small it can be.

小さくなつても製作可能にしたのが本発明の超
音波探触子で第2図,第3図,第4図に一実施例
を示し説明する。第2図はバツキング材7の斜視
図で、振動子の貼り合せする面8に複数のくぼみ
9を最初に形成しておく。10はくぼみ9に連通
して形成されたリード取りだしのくぼみである。
The ultrasonic probe of the present invention can be manufactured even if it is small, and an embodiment thereof is shown and explained in FIGS. 2, 3, and 4. FIG. 2 is a perspective view of the backing material 7, in which a plurality of depressions 9 are first formed on the surface 8 to which the vibrator is bonded. Reference numeral 10 denotes a lead extraction recess formed in communication with the recess 9.

第3図は電極11a,11bが両面に設けられ
た振動子11をバツキング材7に貼り合せた時の
断面図で導電接着剤で貼り合せ、くぼみ9、くぼ
み10にも導電接着剤12が十分埋まるようにし
ておく。第4図は振動子11をカツターで分割し
た時の断面図でカツターの溝13はバツキング材
7の表面より深くくぼみ10の底より浅くきざん
である。この溝13はくぼみ10に対し少くとも
一つ設ける。図では二つ設けてある。このように
すれば振動子11の下部電極の電気接続は図の場
合3ケ分一度に接続でき、くぼみ10にリード線
をともにうめ込めば外部に出力をとりだすことが
できる。
FIG. 3 is a cross-sectional view of the vibrator 11, which has electrodes 11a and 11b on both sides, and is bonded to the backing material 7, and is bonded with a conductive adhesive. Keep it filled. FIG. 4 is a sectional view when the vibrator 11 is divided by a cutter, and the grooves 13 of the cutter are cut deeper than the surface of the backing material 7 and shallower than the bottom of the depression 10. At least one groove 13 is provided for each depression 10. In the figure, two are provided. In this way, three electrical connections of the lower electrodes of the vibrator 11 can be made at once in the case shown in the figure, and if the lead wires are buried in the recess 10, the output can be taken out to the outside.

このように本発明はバツキング材にくぼみを設
ける構造にすることにより従来不可能であつた形
状まで小形化が可能となり又比較的簡単に小型の
探触子を得ることができるものである。
As described above, the present invention makes it possible to miniaturize the probe to a shape that was previously impossible by providing a structure in which the backing material is provided with a recess, and it is also possible to obtain a small-sized probe relatively easily.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は超音波探触子の一般的な構造を示す斜
視図、第2図、第3図、第4図は本発明の一実施
例における超音波探触子を示すものであり、第2
図はバツキング材の斜視図、第3図、第4図は同
超音波探触子の断正面図である。 7…バツキング材、8…振動子貼り合せ面、
9,10…くぼみ、11…振動子、11a,11
b…電極、12…導電接着材、13…溝。
FIG. 1 is a perspective view showing the general structure of an ultrasound probe, and FIGS. 2, 3, and 4 show an ultrasound probe according to an embodiment of the present invention. 2
The figure is a perspective view of the backing material, and FIGS. 3 and 4 are cross-sectional views of the same ultrasonic probe. 7... Bucking material, 8... Vibrator bonding surface,
9, 10... recess, 11... vibrator, 11a, 11
b... Electrode, 12... Conductive adhesive, 13... Groove.

Claims (1)

【特許請求の範囲】 1 バツキング材の振動子貼り付け面にくぼみを
形成し、このくぼみに導電接着剤を満し、上下両
面に電極を設けた振動子を上記振動子貼り付け面
に載置して接着し、上記振動子に上記くぼみに対
し少くとも一つ上記導電接着剤にまで達する溝を
形成したことを特徴とする超音波探触子。 2 上記くぼみに連通してリード線挿入用のくぼ
みを形成し、このくぼみにも導電接着剤を入れて
リード線を取付けることを特徴とする特許請求の
範囲第1項記載の超音波探触子。
[Claims] 1. A recess is formed on the vibrator attachment surface of the backing material, the recess is filled with a conductive adhesive, and a vibrator with electrodes provided on both upper and lower surfaces is placed on the vibrator attachment surface. An ultrasonic probe characterized in that the transducer is bonded to the conductive adhesive, and the transducer is formed with at least one groove that reaches the conductive adhesive in each of the recesses. 2. The ultrasonic probe according to claim 1, wherein a recess for inserting a lead wire is formed in communication with the recess, and a conductive adhesive is also placed in this recess to attach the lead wire. .
JP12755379A 1979-10-03 1979-10-03 Ultrasonic probe Granted JPS5651194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12755379A JPS5651194A (en) 1979-10-03 1979-10-03 Ultrasonic probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12755379A JPS5651194A (en) 1979-10-03 1979-10-03 Ultrasonic probe

Publications (2)

Publication Number Publication Date
JPS5651194A JPS5651194A (en) 1981-05-08
JPS6133438B2 true JPS6133438B2 (en) 1986-08-01

Family

ID=14962851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12755379A Granted JPS5651194A (en) 1979-10-03 1979-10-03 Ultrasonic probe

Country Status (1)

Country Link
JP (1) JPS5651194A (en)

Also Published As

Publication number Publication date
JPS5651194A (en) 1981-05-08

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