JPS6136762B2 - - Google Patents
Info
- Publication number
- JPS6136762B2 JPS6136762B2 JP5401879A JP5401879A JPS6136762B2 JP S6136762 B2 JPS6136762 B2 JP S6136762B2 JP 5401879 A JP5401879 A JP 5401879A JP 5401879 A JP5401879 A JP 5401879A JP S6136762 B2 JPS6136762 B2 JP S6136762B2
- Authority
- JP
- Japan
- Prior art keywords
- acetylene
- catalyst
- compounds
- polymerization
- gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 80
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 80
- 239000003054 catalyst Substances 0.000 claims description 56
- 238000006116 polymerization reaction Methods 0.000 claims description 45
- 229920000642 polymer Polymers 0.000 claims description 41
- 239000002904 solvent Substances 0.000 claims description 24
- 150000002902 organometallic compounds Chemical class 0.000 claims description 21
- 150000003623 transition metal compounds Chemical class 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000000379 polymerizing effect Effects 0.000 claims description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
- 150000001875 compounds Chemical class 0.000 description 20
- 239000000463 material Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- -1 vanadine Chemical compound 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000010936 titanium Substances 0.000 description 9
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 8
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 6
- 229910052796 boron Inorganic materials 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 5
- 125000005843 halogen group Chemical group 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000012456 homogeneous solution Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- 150000003624 transition metals Chemical class 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LKUDPHPHKOZXCD-UHFFFAOYSA-N 1,3,5-trimethoxybenzene Chemical compound COC1=CC(OC)=CC(OC)=C1 LKUDPHPHKOZXCD-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000001334 alicyclic compounds Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 150000004703 alkoxides Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- CTNFGBKAHAEKFE-UHFFFAOYSA-N bis(2-methylpropyl)alumanyloxy-bis(2-methylpropyl)alumane Chemical compound CC(C)C[Al](CC(C)C)O[Al](CC(C)C)CC(C)C CTNFGBKAHAEKFE-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 150000002391 heterocyclic compounds Chemical class 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 239000013081 microcrystal Substances 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- AQRLNPVMDITEJU-UHFFFAOYSA-N triethylsilane Chemical compound CC[SiH](CC)CC AQRLNPVMDITEJU-UHFFFAOYSA-N 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- CMAOLVNGLTWICC-UHFFFAOYSA-N 2-fluoro-5-methylbenzonitrile Chemical compound CC1=CC=C(F)C(C#N)=C1 CMAOLVNGLTWICC-UHFFFAOYSA-N 0.000 description 1
- QYKABQMBXCBINA-UHFFFAOYSA-N 4-(oxan-2-yloxy)benzaldehyde Chemical compound C1=CC(C=O)=CC=C1OC1OCCCC1 QYKABQMBXCBINA-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- MXRNYNIJHVXZAN-UHFFFAOYSA-N CCO[Mg]CC Chemical compound CCO[Mg]CC MXRNYNIJHVXZAN-UHFFFAOYSA-N 0.000 description 1
- UIIPTSKEQHTPOK-UHFFFAOYSA-N CC[AlH]O[Al](CC)CC.Cl Chemical compound CC[AlH]O[Al](CC)CC.Cl UIIPTSKEQHTPOK-UHFFFAOYSA-N 0.000 description 1
- JQVAWAQPCKCFQX-UHFFFAOYSA-N CC[Zn](CC)(CC)CC Chemical compound CC[Zn](CC)(CC)CC JQVAWAQPCKCFQX-UHFFFAOYSA-N 0.000 description 1
- RNEVEVNPPDRJTB-UHFFFAOYSA-N C[AlH]O[Al](C)C.Cl Chemical compound C[AlH]O[Al](C)C.Cl RNEVEVNPPDRJTB-UHFFFAOYSA-N 0.000 description 1
- FKGWBSVLMDRGNG-UHFFFAOYSA-N C[Al](O[Al](CC(C)C)CC(C)C)C Chemical compound C[Al](O[Al](CC(C)C)CC(C)C)C FKGWBSVLMDRGNG-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical group OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- NXCNZUPSLFNAKV-UHFFFAOYSA-N alumanyloxy(tetradecyl)alumane Chemical compound CCCCCCCCCCCCCC[AlH]O[AlH2] NXCNZUPSLFNAKV-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical class OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- FOGKOKCRHYFGPM-UHFFFAOYSA-N bis(2-methylpropyl)alumanylium;dibutylazanide Chemical compound CCCC[N-]CCCC.CC(C)C[Al+]CC(C)C FOGKOKCRHYFGPM-UHFFFAOYSA-N 0.000 description 1
- YLYNVLJAZMTTIQ-UHFFFAOYSA-N butoxy(diethyl)alumane Chemical compound CCCC[O-].CC[Al+]CC YLYNVLJAZMTTIQ-UHFFFAOYSA-N 0.000 description 1
- VNQWVDUPMVNWEY-UHFFFAOYSA-M calcium;benzene;iodide Chemical compound [Ca+2].[I-].C1=CC=[C-]C=C1 VNQWVDUPMVNWEY-UHFFFAOYSA-M 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- KWTSZCJMWHGPOS-UHFFFAOYSA-M chloro(trimethyl)stannane Chemical compound C[Sn](C)(C)Cl KWTSZCJMWHGPOS-UHFFFAOYSA-M 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- INVPQTFQRFNBFL-UHFFFAOYSA-N dibutyl(chloro)borane Chemical compound CCCCB(Cl)CCCC INVPQTFQRFNBFL-UHFFFAOYSA-N 0.000 description 1
- VJRUISVXILMZSL-UHFFFAOYSA-M dibutylalumanylium;chloride Chemical compound CCCC[Al](Cl)CCCC VJRUISVXILMZSL-UHFFFAOYSA-M 0.000 description 1
- JKDSABTVILQKQF-UHFFFAOYSA-N dibutylazanide;diethylalumanylium Chemical compound CC[Al+]CC.CCCC[N-]CCCC JKDSABTVILQKQF-UHFFFAOYSA-N 0.000 description 1
- PKKGKUDPKRTKLJ-UHFFFAOYSA-L dichloro(dimethyl)stannane Chemical compound C[Sn](C)(Cl)Cl PKKGKUDPKRTKLJ-UHFFFAOYSA-L 0.000 description 1
- RQJBGPOCHBZFCO-UHFFFAOYSA-L dichloroalumanylium;dimethylazanide Chemical compound [Cl-].[Cl-].CN(C)[Al+2] RQJBGPOCHBZFCO-UHFFFAOYSA-L 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- GTLMIIKASNFJDX-UHFFFAOYSA-N diethylalumanylium;dimethylazanide Chemical compound C[N-]C.CC[Al+]CC GTLMIIKASNFJDX-UHFFFAOYSA-N 0.000 description 1
- LWBWGOJHWAARSS-UHFFFAOYSA-N diethylalumanyloxy(diethyl)alumane Chemical compound CC[Al](CC)O[Al](CC)CC LWBWGOJHWAARSS-UHFFFAOYSA-N 0.000 description 1
- YNLAOSYQHBDIKW-UHFFFAOYSA-M diethylaluminium chloride Chemical compound CC[Al](Cl)CC YNLAOSYQHBDIKW-UHFFFAOYSA-M 0.000 description 1
- OENQCSSEPLJXEC-UHFFFAOYSA-N dihexylaluminum Chemical compound CCCCCC[Al]CCCCCC OENQCSSEPLJXEC-UHFFFAOYSA-N 0.000 description 1
- UQOCPIAAOSVOFK-UHFFFAOYSA-N dimethylalumanylium;dioctylazanide Chemical compound C[Al+]C.CCCCCCCC[N-]CCCCCCCC UQOCPIAAOSVOFK-UHFFFAOYSA-N 0.000 description 1
- GMNSEICSYCVTHZ-UHFFFAOYSA-N dimethylalumanyloxy(dimethyl)alumane Chemical compound C[Al](C)O[Al](C)C GMNSEICSYCVTHZ-UHFFFAOYSA-N 0.000 description 1
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 1
- LAWOZCWGWDVVSG-UHFFFAOYSA-N dioctylamine Chemical compound CCCCCCCCNCCCCCCCC LAWOZCWGWDVVSG-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 description 1
- 238000004108 freeze drying Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- CQRPUKWAZPZXTO-UHFFFAOYSA-M magnesium;2-methylpropane;chloride Chemical compound [Mg+2].[Cl-].C[C-](C)C CQRPUKWAZPZXTO-UHFFFAOYSA-M 0.000 description 1
- WRYKIHMRDIOPSI-UHFFFAOYSA-N magnesium;benzene Chemical compound [Mg+2].C1=CC=[C-]C=C1.C1=CC=[C-]C=C1 WRYKIHMRDIOPSI-UHFFFAOYSA-N 0.000 description 1
- VXWPONVCMVLXBW-UHFFFAOYSA-M magnesium;carbanide;iodide Chemical compound [CH3-].[Mg+2].[I-] VXWPONVCMVLXBW-UHFFFAOYSA-M 0.000 description 1
- DLPASUVGCQPFFO-UHFFFAOYSA-N magnesium;ethane Chemical compound [Mg+2].[CH2-]C.[CH2-]C DLPASUVGCQPFFO-UHFFFAOYSA-N 0.000 description 1
- FRIJBUGBVQZNTB-UHFFFAOYSA-M magnesium;ethane;bromide Chemical compound [Mg+2].[Br-].[CH2-]C FRIJBUGBVQZNTB-UHFFFAOYSA-M 0.000 description 1
- YCCXQARVHOPWFJ-UHFFFAOYSA-M magnesium;ethane;chloride Chemical compound [Mg+2].[Cl-].[CH2-]C YCCXQARVHOPWFJ-UHFFFAOYSA-M 0.000 description 1
- CYSFUFRXDOAOMP-UHFFFAOYSA-M magnesium;prop-1-ene;chloride Chemical compound [Mg+2].[Cl-].[CH2-]C=C CYSFUFRXDOAOMP-UHFFFAOYSA-M 0.000 description 1
- RYEXTBOQKFUPOE-UHFFFAOYSA-M magnesium;propane;chloride Chemical compound [Mg+2].[Cl-].CC[CH2-] RYEXTBOQKFUPOE-UHFFFAOYSA-M 0.000 description 1
- ZEIWWVGGEOHESL-UHFFFAOYSA-N methanol;titanium Chemical compound [Ti].OC.OC.OC.OC ZEIWWVGGEOHESL-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- SSAWPNVUGVLDQP-UHFFFAOYSA-N n-diethylalumanyl-n-ethylethanamine Chemical compound CC[N-]CC.CC[Al+]CC SSAWPNVUGVLDQP-UHFFFAOYSA-N 0.000 description 1
- GUHSGHQVNSDCNV-UHFFFAOYSA-N n-dimethylalumanyl-n-methylmethanamine Chemical compound CN(C)[Al](C)C GUHSGHQVNSDCNV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- KQJBQMSCFSJABN-UHFFFAOYSA-N octadecan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] KQJBQMSCFSJABN-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002370 organoaluminium group Chemical group 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- ANRQGKOBLBYXFM-UHFFFAOYSA-M phenylmagnesium bromide Chemical compound Br[Mg]C1=CC=CC=C1 ANRQGKOBLBYXFM-UHFFFAOYSA-M 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- RWWNQEOPUOCKGR-UHFFFAOYSA-N tetraethyltin Chemical compound CC[Sn](CC)(CC)CC RWWNQEOPUOCKGR-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- VXKWYPOMXBVZSJ-UHFFFAOYSA-N tetramethyltin Chemical compound C[Sn](C)(C)C VXKWYPOMXBVZSJ-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- DPNUIZVZBWBCPB-UHFFFAOYSA-J titanium(4+);tetraphenoxide Chemical compound [Ti+4].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 DPNUIZVZBWBCPB-UHFFFAOYSA-J 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- ORYGRKHDLWYTKX-UHFFFAOYSA-N trihexylalumane Chemical compound CCCCCC[Al](CCCCCC)CCCCCC ORYGRKHDLWYTKX-UHFFFAOYSA-N 0.000 description 1
- WXRGABKACDFXMG-UHFFFAOYSA-N trimethylborane Chemical compound CB(C)C WXRGABKACDFXMG-UHFFFAOYSA-N 0.000 description 1
- UKHQRARQNZOXRL-UHFFFAOYSA-N trimethyltin Chemical compound C[SnH](C)C UKHQRARQNZOXRL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- ABDKAPXRBAPSQN-UHFFFAOYSA-N veratrole Chemical compound COC1=CC=CC=C1OC ABDKAPXRBAPSQN-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- WXKZSTUKHWTJCF-UHFFFAOYSA-N zinc;ethanolate Chemical compound [Zn+2].CC[O-].CC[O-] WXKZSTUKHWTJCF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
- Polymerization Catalysts (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
Description
本発明は、成型加工性の良好なアセチレン高重
合体のゲル状物の製造法に関する。
遷移金属化合物と有機金属化合物からなる、い
わゆるチーグラー・ナツタ触媒を用いてアセチレ
ンを重合して得られるアセチレン高重合体は、電
子・電気素子として有用な有機半導体材料である
ことはすでに知られている。しかし、このように
して得られたアセチレン高重合体は、加熱しても
溶融せず、また加熱下では容易に酸化劣化を受け
るため、通常の熱可塑性樹脂の如き成形方法は用
いることができない。また、このアセチレン高重
合体を溶解する溶媒も今だ見い出されておらず、
従つて、アセチレン高重合体の実用的成形物を製
造する方法は、次の2方法に限られていた。
(イ) 粉末状アセチレン高重合体を加圧成形する方
法。
(ロ) 遷移金属化合物と有機金属化合物からなる触
媒系をトルエンの如き芳香族炭化水素またはヘ
キサデカンの如き脂肪族炭化水素に溶解してな
る触媒溶液と気体アセチレンの自由表面近傍の
界面または固体表面にこの触媒溶液を塗布した
表面で重合を行なつて膜状および繊維状アセチ
レン高重合体を製造する方法(特公昭48−
32581号)。
しかしながら前者の(イ)の方法では、機械的強度
の低い成形品しか得られず、また、後者の(ロ)の方
法では、形状が膜状および繊維状に限定されるば
かりか、それらの厚みが限定され、実質的には肉
厚の薄い膜状および繊維状の成形品しか得ること
ができない。
そこで 近年、これらの問題点を有しない新し
いアセチレン高重合体の製造方法が検討され、ア
セチレンをμ−(η1:η5−
cyclopentadienyl)−tris(η−
cyclopentadienyl)dititanium(Ti−Ti)
〔(C5H4)(C5H5)3Ti2〕なる触媒を用い、ヘキサン
を溶媒として重合するとゲル状のアセチレン高重
合体が得られることが提案された〔S・L・Hsu
ら、J・chem・Phys・、69(1)、106−111
(1978)〕。
しかしながら、この方法では非常に特殊な触媒
を用いているため、工業的にアセチレン高重合体
のゲル状物を製造する際、製造コストに対する触
媒コストの比率は著しく高くなつて不利である。
本発明者らは、以上の点に鑑みて、特殊な触媒
を用いることなく、成形性の良好なゲル状アセチ
レン高重合体の製造方法について種々検討した結
果、本発明に到達した。
即ち、本発明は、アセチレンを遷移金属化合物
と有機金属化合物を主成分とする触媒系を用いる
ことにより重合させてアセチレン高重合体を製造
する方法において、遷移金属化合物を重合溶媒1
に対して0.0001〜0.1モル濃度で使用し、且つ
予めアセチレンを溶解させた重合溶媒に触媒系を
添加するか、または触媒系のうちのいずれか一方
の触媒成分を含む重合溶媒にアセチレンを溶解さ
せた後、他の触媒成分を添加して重合を行なうこ
とを特徴とするアセチレン高重合体のゲル状物の
製造法に関する。
本発明でいうゲル状物とは、アセチレン高重合
体の繊維状微結晶(フイブリル)が絡みあつて、
溶媒に膨潤している状態のものであり、通常の架
橋したゲルとは本質的に異なるものである。
本発明の方法によれば、すでに当該業界におい
て広く用いられている触媒系を用いて容易にアセ
チレン高重合体のゲル状物を得ることができるか
ら、通常の加圧成形法によつて、機械的強度にす
ぐれた任意の形状で且つ任意の肉厚を持つた均一
な成形品を容易に製造することができるから工業
的に極めて有用である。
以下、本発明について詳細に説明する。
本発明において用いられる遷移金属化合物と
は、チタン、バナジン、クロム、鉄、コバルト、
タングステンおよびモリブデンの金属のハロゲン
原子あるいは炭素数が多くとも20個のアルキル
基、アルケニル基、アリル(aryl)基、アラルキ
ル基、アルコキサイド基、フエノキシド基、カル
ボン酸残基、シクロペンタジエニル基、アセチル
アセトン残基、一酸化炭素(カルボニル基)を有
する化合物ならびに該化合物とピリジン、トリフ
エニルフオスフインおよびジピリジル等の電子供
与性化合物との錯体である。
遷移金属化合物のうちでもチタン、バナジン、
鉄、クロムおよびコバルトの化合物が好ましく、
特にチタンの化合物が好ましい。
好ましい遷移金属化合物の代表例としては、一
般式が(1)〜(3)式で示される遷移金属化合物をあげ
ることができる。
Ti(OR)4 (1)
(Rは炭素数が多くとも20個のアルキル基または
アリル基(aryl))
M(acac)3 (2)
MO(acac)2 (3)
〔(acac)はアセチルアセトナート基、Mはチタ
ン、バナジン、鉄、クロムおよびコバルトの遷移
金属である〕
これらの遷移金属化合物の代表例としては、例
えばテトラメトキシチタニウム、テトラエトキシ
チタニウム、テトラn−プロポキシチタニウム、
テトライソプロポキシチタニウム、テトラn−ブ
トキシチタニウム、テトライソブトキシチタニウ
ム、テトラオクタデシロキシチタニウム、テトラ
フエノキシチタニウム、トリスアセチルアセトナ
ートチタニウム、トリスアセチルアセトナートバ
ナジウム、トリスアセチルアセトナート鉄、トリ
スアセチルアセトナートクロム、トリスアセチル
アセトナートコバルト、チタニウムオキシアセチ
ルアセトナート、バナジウムオキシアセチルアセ
トナート等があげられる。
本発明において用いられる有機金属化合物は周
期律表のA、B、BおよびB族の金属の
うち少なくとも一種の金属を有する有機金属化合
物であり、そのうちの一部の一般式は下式で示さ
れるものである。
MRn
〔ただし、Mは周期律表のA、B、B、ま
たはB族の金属であり、Rは炭素数が多くとも
20個のアルキル基、アルケニル基、アリル
(aryl)基、アラルキル基、アルコキサイド基、
フエノキシ基およびシクロペンタジエニル基から
なる群からえらばれた有機基または水素原子もし
くはハロゲン原子であり、それらは同一でも異種
でもよいが、それらのうち少なくとも一つは水素
原子または該有機基であり、nは該金属の最高原
子価数またはそれ以下の正の整数である〕
他の有機金属化合物としては、上記の有機金属
化合物と当モルのピリジン、トリフエニルホスフ
インまたはジエチルエーテルとの錯体および該有
機金属化合物1モルと多くとも2.0モルの水との
反応物ならびに二種の前記有機金属化合物の複塩
があげられる。
本発明において使用される有機金属化合物のう
ち、代表的なものとしては、マグネシウム、カル
シウム、亜鉛、ほう素、アルミニウム、ガリウ
ム、けい素およびすずを有する有機金属化合物で
あり、特に、マグネシウム、亜鉛、アルミニウム
およびすずの有機金属化合物が好ましく、とりわ
け、有機アルミニウム系化合物が好適である。該
有機アルミニウム系化合物の代表例としては、ト
リエチルアルミニウム、トリイソブチルアルミニ
ウム、トリヘキシルアルミニウム、ジエチルアル
ミニウムクロライド、ジ−n−ブチルアルミニウ
ムクロライド、エチルアルミニウムセスキクロラ
イド、ジエチルアルミニウムブトキシドおよびト
リエチルアルミニウムと水との反応生成物〔反応
割合1:0.5(モル比)〕があげられる。それ以外
の有機アルミニウム系化合物としては、アルミニ
ウム・シロキサレン系(Siloxalene)化合物、ア
ルミニウム・アマイド系化合物およびジアルモキ
サレン系化合物ならびに前記の有機アルミニウム
化合物を含む複塩があげられる。
本発明において有機金属化合物として使用され
るアルミニウム・シロキサレン系化合物の一般式
は下式で示されるものである。
〔ただし、R1、R2およびR3は同一でも異種でもよ
く、ハロゲン原子または炭素数が多くとも10個の
アルキル基もしくはアルコキシ基であり、R4は
炭素数が多くとも10個のアルキル基であり、R5
はハロゲン原子または炭素数が多くとも10個のア
ルキル基もしくはアルコキシ基あるいは一般式が
The present invention relates to a method for producing an acetylene polymer gel having good moldability. It is already known that acetylene polymers obtained by polymerizing acetylene using so-called Ziegler-Natsuta catalysts, which are composed of transition metal compounds and organometallic compounds, are organic semiconductor materials useful as electronic and electrical devices. . However, the acetylene polymer obtained in this way does not melt even when heated, and is easily subjected to oxidative deterioration under heating, so that the molding method used for ordinary thermoplastic resins cannot be used. Furthermore, a solvent that dissolves this acetylene high polymer has not yet been found.
Therefore, methods for producing practical molded articles of acetylene polymers have been limited to the following two methods. (a) A method of pressure molding a powdered acetylene polymer. (b) A catalyst solution prepared by dissolving a catalyst system consisting of a transition metal compound and an organometallic compound in an aromatic hydrocarbon such as toluene or an aliphatic hydrocarbon such as hexadecane and the interface near the free surface of gaseous acetylene or on a solid surface. A method for producing membranous and fibrous acetylene polymers by polymerizing on the surface coated with this catalyst solution (Japanese Patent Publication No. 1973-
No. 32581). However, with the former method (a), only a molded product with low mechanical strength can be obtained, and with the latter method (b), not only the shape is limited to membrane-like and fibrous-like shapes, but also the thickness is limited, and essentially only thin-walled membrane-like and fibrous molded products can be obtained. Therefore, in recent years, a new method for producing acetylene polymers that does not have these problems has been studied, and acetylene is
cyclopentadienyl)−tris(η−
cyclopentadienyl) dititanium (Ti−Ti)
It was proposed that a gel-like acetylene high polymer could be obtained by polymerizing using a catalyst [(C 5 H 4 )(C 5 H 5 ) 3 Ti 2 ] and hexane as a solvent [S・L・Hsu
et al., J. Chem. Phys., 69(1), 106-111.
(1978)]. However, since this method uses a very special catalyst, the ratio of catalyst cost to production cost is disadvantageous when industrially producing acetylene polymer gel. In view of the above points, the present inventors conducted various studies on a method for producing a gel-like acetylene polymer with good moldability without using a special catalyst, and as a result, they arrived at the present invention. That is, the present invention provides a method for producing an acetylene polymer by polymerizing acetylene using a catalyst system containing a transition metal compound and an organometallic compound as main components.
The catalyst system is added to a polymerization solvent in which acetylene is dissolved in advance, or the acetylene is dissolved in a polymerization solvent containing one of the catalyst components of the catalyst system. The present invention relates to a method for producing a gel-like product of an acetylene polymer, which is characterized in that the polymerization is carried out by adding other catalyst components. The gel-like material referred to in the present invention is a material in which fibrous microcrystals (fibrils) of acetylene high polymer are entangled,
It is in a state swollen in a solvent, and is essentially different from a normal crosslinked gel. According to the method of the present invention, a gel-like product of acetylene polymer can be easily obtained using a catalyst system already widely used in the industry. It is extremely useful industrially because uniform molded products of any shape and wall thickness with excellent mechanical strength can be easily produced. The present invention will be explained in detail below. The transition metal compounds used in the present invention include titanium, vanadine, chromium, iron, cobalt,
Tungsten and molybdenum metal halogen atoms or alkyl groups, alkenyl groups, aryl groups, aralkyl groups, alkoxide groups, phenoxide groups, carboxylic acid residues, cyclopentadienyl groups, acetylacetone with at most 20 carbon atoms residue, a compound having carbon monoxide (carbonyl group), and a complex of this compound with an electron-donating compound such as pyridine, triphenylphosphine, and dipyridyl. Among transition metal compounds, titanium, vanadine,
Compounds of iron, chromium and cobalt are preferred;
Particularly preferred are titanium compounds. Representative examples of preferred transition metal compounds include transition metal compounds whose general formulas are represented by formulas (1) to (3). Ti(OR) 4 (1) (R is an alkyl group or allyl group (aryl) having at most 20 carbon atoms) M(acac) 3 (2) MO(acac) 2 (3) [(acac) is acetyl acetonate group, M is a transition metal of titanium, vanadine, iron, chromium, and cobalt. Typical examples of these transition metal compounds include, for example, tetramethoxytitanium, tetraethoxytitanium, tetran-propoxytitanium,
Tetraisopropoxytitanium, tetra n-butoxytitanium, tetraisobutoxytitanium, tetraoctadecyloxytitanium, tetraphenoxytitanium, trisacetylacetonate titanium, trisacetylacetonate vanadium, trisacetylacetonate iron, trisacetylacetonate Examples include chromium, cobalt trisacetylacetonate, titanium oxyacetylacetonate, vanadium oxyacetylacetonate, and the like. The organometallic compound used in the present invention is an organometallic compound containing at least one metal from group A, B, B, and B of the periodic table, and the general formula of some of them is represented by the following formula. It is something. MRn [However, M is A, B, B, or a metal from Group B of the periodic table, and R is a metal with a maximum number of carbon atoms.
20 alkyl groups, alkenyl groups, allyl groups, aralkyl groups, alkoxide groups,
An organic group selected from the group consisting of a phenoxy group and a cyclopentadienyl group, or a hydrogen atom or a halogen atom, which may be the same or different, but at least one of them is a hydrogen atom or the organic group. , n is the highest valence number of the metal or a positive integer less than that.] Other organometallic compounds include complexes of the above organometallic compound and equimolar amounts of pyridine, triphenylphosphine, or diethyl ether; Mention may be made of reactants of 1 mol of said organometallic compound with at most 2.0 mol of water as well as double salts of two of said organometallic compounds. Among the organometallic compounds used in the present invention, typical ones include those containing magnesium, calcium, zinc, boron, aluminum, gallium, silicon, and tin. Organometallic compounds of aluminum and tin are preferred, and organoaluminium-based compounds are particularly preferred. Typical examples of the organoaluminum compounds include triethylaluminum, triisobutylaluminum, trihexylaluminum, diethylaluminum chloride, di-n-butylaluminum chloride, ethylaluminum sesquichloride, diethylaluminium butoxide, and the reaction of triethylaluminum with water. The product [reaction ratio 1:0.5 (molar ratio)] is mentioned. Examples of other organoaluminum compounds include aluminum siloxalene compounds, aluminum amide compounds, dialmoxalene compounds, and double salts containing the above organoaluminum compounds. The general formula of the aluminum-siloxalene compound used as the organometallic compound in the present invention is shown by the following formula. [However, R 1 , R 2 and R 3 may be the same or different and are a halogen atom or an alkyl group or alkoxy group having at most 10 carbon atoms, and R 4 is an alkyl group having at most 10 carbon atoms. and R 5
is a halogen atom, an alkyl group or alkoxy group having at most 10 carbon atoms, or a general formula of
【式】または[expression] or
【式】
(ただし、R6、R7およびR8は同一でも異種でもよ
く、前記のR1、R2およびR3と同一であり、nは
10以下の正の整数)で表わされる置換基である〕
本発明において用いられるアルミニウム・シロ
キサレン系化合物のうち、代表的なものとして
は、トリメチルジメチル−シロキサレン、トリメ
チルジエチル−シロキサレン、トリメチルジ−n
−プロピル−シロキサレン、トリメチル−ジイソ
ブチル−シロキサレン、トリメチルジオクチル−
シロキサレン、トリクロロジメチル−シロキサレ
ン、ジメチルエチルジエチル−シロキサレン、ト
リメトキシジメチル−シロキサレン、トリエチル
ジメチル−シロキサレン、トリメチルジメトキシ
−シロキサレン、トリメチルジメトキシ−シロキ
サレンおよびトリメトキシジクロロ−シロキサレ
ンがあげられる。
また、本発明において有機金属化合物として使
われるアルミニウム・アマイド系化合物の一般式
は下式で示されるものである。
(ただし、R1、R2およびR3は同一でも異種でもよ
く、水素原子または炭素数が多くとも10個のアル
キル基であり、R4はハロゲン原子または炭素数
が多くとも10個のアルキル基である)
本発明において使用されるアルミニウム・アマ
イド系化合物のうち、代表的なものとしては、ジ
エチルアルミニウムジメチルアミド、ジエチルア
ルミニウムジエチルアミド、ジメチルアルミニウ
ムジメチルアミド、ジメチルアルミニウムジ−n
−ブチルアミド、ジエチルアルミニウムジ−n−
ブチルアミド、ジクロロアルミニウムジメチルア
ミド、ジメチルアルミニウムジオクチルアミド、
ジイソブチルアルミニウムジ−n−ブチルアミド
およびジヘキシルアルミニウムジオクチルアミド
があげられる。
本発明において有機金属化合物として用いられ
ジアルキサン系化合物の一般式は下式で示される
ものである。
(ただし、R1、R2およびR3は同一でも異種でもよ
く、ハロゲン原子または炭素数が多くとも10個の
アルキル基もしくはアルコキシ基であり、R4は
炭素数が多くとも10個のアルキル基である)
本発明において使用されるジアルモキサン系化
合物のうち、代表的なものとしては、テトラメチ
ルジアルモキサン、テトラエチルジアルモキサ
ン、テトライソブチルジアルモキサン、1・1−
ジメチル−3・3−ジエチルジアルモキサン、テ
トライソブチルジアルモキサン、1・1−ジメチ
ル−3・3−ジイソブチルジアルモキサン、テト
ラデシルジアルモキサン、塩化トリメチルジアル
モキサンおよび塩化トリエチルジアルモキサンが
あげられる。
本発明において使われる有機金属化合物のうち
有機アルミニウム化合物以外の有機金属化合物の
代表例としては、ジエチルマグネシウム、塩化エ
チルマグネシウム、ヨウ化メチルマグネシウム、
塩化アリル(aryl)マグネシウム;塩化ノルマル
プロピルマグネシウム、第三級−ブチルマグネシ
ウムクロライド、臭化フエニルマグネシウム、ジ
フエニルマグネシウム、エチル・エトキシマグネ
シウム、ジメチル亜鉛、ジエチル亜鉛、ジエトキ
シ亜鉛、ヨウ化フエニルカルシウム、塩化ジブチ
ルホウ素、ジボレイン、トリメチルホウ素、トリ
エチルシラン、四水素化ケイ素、トリエチルシリ
コーンハイドライド、テトラメチルスズ、テトラ
エチルスズ、塩化トリメチルスズ、二塩化ジメチ
ルスズ、水素化トリメチルスズ、臭化エチルマグ
ネシウムとエチルエーテルとの錯体およびジエチ
ル亜鉛と水との反応生成物〔H2O/Zn(C2H5)2
<2.0(モル比)〕などがあげられる。
さらに、本発明において使用される有機化合物
としては、二種の上記有機化合物の複塩(たとえ
ば、リチウムアルミニウムテトラハイドライド、
カルシウムテトラエチル亜鉛)があげられる。
本発明を実施するにあたり、これらの有機金属
化合物は一種のみを使用してもよく、二種以上を
併用してもよい。
遷移金属化合物に対する有機金属化合物の使用
割合は、特に制限されないが、一般には遷移金属
化合物の遷移金属に対する有機金属化合物の割合
は、モル比で1〜100の範囲内であることが好ま
しい。
これら遷移金属化合物と有機金属化合物に、必
要に応じて第3成分を組み合せて使用し、重合体
収率、重合速度等を制御することもできる。第3
成分としては、含酸素化合物、例えばアルコー
ル、過酸化物、カルボン酸、酸無水物、酸クロラ
イド、エステル、ケトン等が代表例としてあげら
れるが、その他含窒素化合物、含イオウ化合物、
含ハロゲン化合物、分子状ヨウ素、その他のルイ
ス酸等も用いることができる。第3成分の使用量
は、遷移金属に対して多くとも20倍モルである。
本発明において用いられる重合溶媒としては、
触媒系と反応して触媒系を失活させないものであ
ればいかなる有機溶媒でも使用できる。これら有
機溶媒の具体例としては、脂肪族または芳香族炭
化水素、脂肪族または芳香族エーテル系化合物、
ハロゲン化脂肪族またはハロゲン化芳香族炭化水
素、脂肪族または芳香族カルボン酸エステル、脂
環式化合物および複素環式化合物等があげられる
が、これらのうちでも脂肪族または芳香族炭化水
素、脂肪族または芳香族エーテル系化合物、脂環
式化合物および複素環式化合物の使用が特に好ま
しい。これら化合物の代表例としては、例えばペ
ンタン、ヘキサン、ヘプタン、オクタン、ノナ
ン、デカン、ドデカン、シクロヘキサン、テトラ
ハイドロフラン、ジオキサン、ジエチルエーテ
ル、エチルメチルエーテル、ベンゼン、トルエ
ン、キシレン、エチルベンゼン、メチルフエニル
エーテル(アニソール)、エチルフエニルエーテ
ル、ジフエニルエーテル、ジメトキシベンゼン、
1・3・5−トリメトキシベンゼン、クロルベン
ゼン、ジクロロベンゼン、安息香酸メチル、安息
香酸エチル等をあげることができる。これらの化
合物は、一種または二種以上混合して使用しても
よい。
本発明のアセチレン高重合体のゲル状物を得る
ためには、触媒系のうちの遷移金属化合物の濃度
が重合溶媒1に対して0.0001〜0.1モル、好ま
しくは0.001〜0.1モルの範囲でアセチレンの重合
を行うことが必要であり、遷移金属化合物の濃度
が重合溶媒1に対して0.1モル以上では、成形
性の良好なゲル状物を得ることは困難であり、一
方、遷移金属化合物の濃度が重合溶媒1に対し
て0.0001モル以下ではアセチレン高重合体の大部
分は粉末状となつてしまう。
触媒溶液は、均一であつても不均一であつても
差支えないが、触媒除去の容易な点からは、触媒
溶液は均一であることが好ましい。
本発明の重合反応における触媒系およびアセチ
レンの添加順序は、次のとおりである。即ち、予
めアセチレンを溶解させた重合溶媒に触媒系を添
加するか、または触媒系のうちのいずれか一方の
触媒成分を含む重合溶媒にアセチレンを溶解させ
た後、他の触媒成分を添加し、次いで重合させる
アセチレンを吹き込んで重合反応を行なわせるこ
とによつてアセチレン高重合体のゲル状物を得る
ことができる。
上記の方法によらず、アセチレンを溶解させて
いない重合溶媒に触媒系を添加して、そこにアセ
チレンガスを吹き込んだ場合、膜状や塊状のアセ
チレン高重合体が生成して、アセチレン高重合体
のゲル状物を得ることは困難である。
重合溶媒に対するアセチレンの溶解量は、特に
制限はないが、重合溶媒への飽和溶解量まで溶解
しておくことが好ましい。
重合温度は、特に制限されないが、通常は−
100℃〜300℃が好ましく、取り扱い上の容易な点
からは−80℃〜200℃が特に好ましい。
本発明においては、重合温度、触媒系の調製条
件によつて生成アセチレン高重合体の立体構造を
制御することができるが、一般的には重合温度が
低いと可撓性のあるシス含量の多いアセチレン高
重合体が生成し、重合温度が高いとトランス含量
の多いアセチレン高重合体が生成する。重合時の
アセチレンガスの圧力は特に制限はないが、実用
的には10気圧以下で行うことが好ましい。
重合して得られたアセチレン高重合体のゲル状
物から触媒を除去する方法としては、通常の除去
方法、例えば触媒を溶解する有機溶媒で洗滌する
方法等が用いられるが、特に触媒を除去しないで
用いても差支えない。
このようにして得られたアセチレン高重合体の
ゲル状物は、加圧成形して容易に任意の形状と肉
厚を有する均一成形品とすることができる。ま
た、ゲル状物を凍結乾燥して得られる多孔質アセ
チレン高重合体を加圧成形して任意の形状と肉厚
を有する成形品とすることもできる。
本発明の製造方法により得られるアセチレン高
重合体は、その電気的性質を利用することによ
り、例えば電気抵抗素子、感熱素子、感光素子等
の電子機器の部品を製造するための有機半導体材
料として有用である。
以下、実施例によつて本発明をさらに詳しく説
明する。
実施例 1
窒素ガスで完全に置換した1のガラス製反応
器に、重合溶媒として常法にしたがつて精製した
トルエン200mlを仕込んだ。−78℃に冷却して真空
ポンプで系内の窒素ガスを除去した後、1気圧の
アセチレンガスを吹き込んでアセチレンを飽和溶
解量だけ溶解させた。次いで触媒としてテトラブ
トキシチタニウム2.94ミリモルおよびトリエチル
アルミニウム7.34ミリモルを順次に−78℃で仕込
んで触媒溶液を調製した。触媒溶液は均一溶液で
あつた。
−78℃に反応器を冷却したままで、1気圧の圧
力の精製アセチレンガスを吹き込んだ。重合反応
の初期に系全体は寒天状になつた。アセチレンガ
ス圧を1気圧に保つたままで24時間重合反応をそ
のまま継続した。系は赤紫色を呈した寒天状であ
つた。重合終了後、未反応のアセチレンガスを除
去し、系の温度を−78℃に保つたまま200mlの精
製トルエンで4回繰り返し洗滌した。洗滌後も溶
液はやや褐色をおび、触媒は完全に除去されなか
つた。トルエン中で膨潤したゲル状アセチレン重
合体は、繊維状微結晶(フイブリル)が絡み合つ
たチツプ状であり、粉末状や塊状のポリマーは生
成していなかつた。
このゲル状物をクロムメツキしたフエロ板には
さみ、室温、100Kg/cm2の圧力でプレス成形したと
ころ赤褐色の金属光沢をしたアセチレン高重合体
の可撓性のあるフイルムが得られた。
このフイルムは電気伝導度(直流四端子法)が
20℃で9.4×10-7Ω-1・cm-1のp型半導体であつ
た。
実施例 2
実施例1において、重合溶媒として用いたトル
エンの代りにn−ヘプタンを用いた以外は、実施
例1と全く同じ触媒系を用い、実施例1と全く同
様の方法でアセチレンの重合を行ない、実施例1
と同様のゲル状物を得た。
得られたゲル状物を実施例1と同様な方法で加
圧成形して、可撓性のあるフイルムを得た。
比較例 1
実施例1において、予めトルエンにアセチレン
を溶解させなかつた以外は、実施例1と同じ触媒
系で実施例1と全く同様にアセチレンの重合を行
なつた。重合初期に重合溶媒表面に薄い重合体の
膜が生成し、24時間重合後も重合溶媒表面のアセ
チレン高重合体の膜厚が厚くなつただけでゲル状
物は得られなかつた。
実施例 3
窒素ガスで完全に置換した1のガラス製反応
器に、重合溶媒として常法にしたがつて精製した
アニソール200ml、触媒としてテトラブトキシチ
タニウム0.294ミリモルを仕込み、−78℃に冷却し
て真空ポンプで系内の窒素ガスを除去した後、1
気圧のアセチレンガスを吹き込んでアセチレンを
飽和溶解量だけ溶解させた。次いでトリイソブチ
ルアルミニウム1.50ミリモルを仕込んで触媒溶液
を調製した。触媒溶液は均一溶液であつた。
反応器の温度を室温に戻し、1気圧の圧力の精
製アセチレンガスを吹き込んだ。重合反応を開始
してから10分後に系全体が寒天状のゲル状物にな
つた。24時間アセチレンガスの圧力を1気圧に保
つたままで重合を続けた。系全体は黒褐色を呈し
た寒天状であつた。重合反応終了後、未反応のア
セチレンガスを除去し、メタノールとトルエンの
1:5(容積比)の混合溶媒200mlで4回繰り返
して洗滌した。
得られたゲル状物は、実施例1と同様なゲル状
物であり、実施例1と同様に加圧成形したとこ
ろ、均一なフイルムが得られた。このフイルムは
電気伝導度が2.5×10-6Ω-1・cm-1のP型半導体で
あつた。
実施例 4
実施例1で用いた触媒成分テトラブトキシチタ
ニウムとトリエチルアルミニウムの代りに、トリ
スアセチルアセトナートチタニウム5.0ミリモル
およびトリエチルアルミニウム25.0ミリモルを用
いた以外は、実施例1と全く同様に触媒の調製お
よびアセチレンの重合を行なつて、実施例1と同
様なゲル状物を得た。
実施例 5
実施例1で用いた触媒成分テトラブトキシチタ
ニウムとトリエチルアルミニウムの代りに、トリ
スアセチルアセトナート鉄5.0ミリモルおよびト
リイソブチルアルミニウム15.0ミリモルを用いた
以外は、実施例1と全く同様に触媒の調製および
アセチレンの重合を行ない、実施例1と同様なゲ
ル状物を得た。
実施例 6
実施例3で用いた触媒成分テトラブトキシチタ
ニウムとトリイソブチルアルミニウムの代りに、
トリスアセチルアセトナートクロミウム0.5ミリ
モルおよびトリイソブチルアルミニウム2.5ミリ
モルを用いた以外は、実施例3と同様に触媒の調
製およびアセチレンの重合を行ない、実施例3と
同様なゲル状物を得た。
比較例 2
窒素ガスで完全に置換した1のガラス製反応
容器に、重合溶媒として常法にしたがつて精製し
たトルエン200mlを仕込み、−78℃に冷却して、真
空ポンプで系内の窒素ガスを除去した後、1気圧
のアセチレンガスを吹き込んで、アセチレンを飽
和溶解量だけ溶解させた。次いで触媒としてテト
ラブトキシチタニウム0.01ミリモルおよびトリエ
チルアルミニウム0.1ミリモルを順次に−78℃で
仕込んで触媒溶液を調製した。触媒溶液は均一溶
液であつた。反応器を液体窒素で冷却して系中の
窒素ガスを真空ポンプで排気した。
−78℃に反応器を冷却したままで1気圧の圧力
の精製アセチレンガスを吹き込んだ。重合開始と
共に黒褐色のアセチレン高重合体が粉末状で析出
し始めた。アセチレンガスの圧力を1気圧に保つ
たままで−78℃で24時間重合反応を行なつたが、
得られたアセチレン高重合体は粉末状であつた。
この粉末状アセチレン高重合体を精製トルエン
200mlで4回繰り返して洗滌した後、真空乾燥し
て粉末状アセチレン高重合体を得た。
この粉末状アセチレン高重合体をクロムメツキ
したフエロ板にはさんで、室温で100Kg/cm2の圧力
でプレス成形したところ、得られた成形品は極め
て脆く、フイルム状では得られなかつた。
比較例 3
窒素ガスで完全に置換した1のガラス製容器
に、重合溶媒として常法にしたがつて精製したト
ルエン200mlを仕込み、−78℃に冷却して、真空ポ
ンプで系内の窒素ガスを除去した後、1気圧のア
セチレンガスを吹き込んで、アセチレンを飽和溶
解量だけ溶解させた。次いで触媒としてテトラブ
トキシチタニウム40ミリモルおよびトリエチルア
ルミニウム80ミリモルを順次に仕込んで触媒溶液
を調製した。触媒溶液は均一溶液であつた。
得られた触媒溶液を用いて実施例1と全く同様
にしてアセチレンの重合を行なつたところ、アセ
チレン高重合体の一部はゲル状物ではあつたが、
大部分のアセチレン高重合体は固い塊の高重合体
で相分離を起していた。
実施例1と同様に後処理をし、次いで実施例1
と同様に加圧成形したところ、均一なフイルムは
得られなかつた。[Formula] (However, R 6 , R 7 and R 8 may be the same or different, and are the same as R 1 , R 2 and R 3 above, and n is
(a positive integer of 10 or less)] Representative examples of the aluminum-siloxalene compounds used in the present invention include trimethyldimethyl-siloxalene, trimethyldiethyl-siloxalene, and trimethyldi-n
-Propyl-siloxsalene, trimethyl-diisobutyl-siloxsalene, trimethyldioctyl-
Mention may be made of siloxsalene, trichlorodimethyl-siloxsalene, dimethylethyldiethyl-siloxsalene, trimethoxydimethyl-siloxsalene, triethyldimethyl-siloxsalene, trimethyldimethoxy-siloxsalene, trimethyldimethoxy-siloxsalene and trimethoxydichloro-siloxsalene. Further, the general formula of the aluminum amide compound used as the organometallic compound in the present invention is shown by the following formula. (However, R 1 , R 2 and R 3 may be the same or different and are a hydrogen atom or an alkyl group having at most 10 carbon atoms, and R 4 is a halogen atom or an alkyl group having at most 10 carbon atoms. Among the aluminum amide compounds used in the present invention, typical examples include diethylaluminum dimethylamide, diethylaluminum diethylamide, dimethylaluminum dimethylamide, dimethylaluminum di-n
-butyramide, diethylaluminium di-n-
butylamide, dichloroaluminum dimethylamide, dimethylaluminum dioctylamide,
Mention may be made of diisobutylaluminum di-n-butylamide and dihexylaluminum dioctylamide. The general formula of the dialxane compound used as the organometallic compound in the present invention is shown by the following formula. (However, R 1 , R 2 and R 3 may be the same or different and are a halogen atom or an alkyl group or alkoxy group having at most 10 carbon atoms, and R 4 is an alkyl group having at most 10 carbon atoms. Among the dialmoxane compounds used in the present invention, representative ones include tetramethyldialumoxane, tetraethyldialumoxane, tetraisobutyldialumoxane, and 1.1-
Dimethyl-3,3-diethyldialumoxane, tetraisobutyldialumoxane, 1,1-dimethyl-3,3-diisobutyldialumoxane, tetradecyldialumoxane, trimethyldialumoxane chloride and triethyldialumoxane chloride can give. Among the organometallic compounds used in the present invention, typical examples of organometallic compounds other than organoaluminum compounds include diethylmagnesium, ethylmagnesium chloride, methylmagnesium iodide,
Allyl magnesium chloride; normal propylmagnesium chloride, tertiary-butylmagnesium chloride, phenylmagnesium bromide, diphenylmagnesium, ethyl ethoxymagnesium, dimethylzinc, diethylzinc, diethoxyzinc, phenylcalcium iodide, dibutylboron chloride, diborein, trimethylboron, triethylsilane, silicon tetrahydride, triethylsilicone hydride, tetramethyltin, tetraethyltin, trimethyltin chloride, dimethyltin dichloride, trimethyltin hydride, ethylmagnesium bromide and ethyl ether Complexes and reaction products of diethylzinc and water [H 2 O/Zn(C 2 H 5 ) 2
<2.0 (molar ratio)]. Further, as the organic compound used in the present invention, double salts of two types of the above-mentioned organic compounds (for example, lithium aluminum tetrahydride,
calcium (tetraethylzinc). In carrying out the present invention, these organometallic compounds may be used alone or in combination of two or more. Although the ratio of the organometallic compound to the transition metal compound used is not particularly limited, it is generally preferable that the ratio of the organometallic compound to the transition metal of the transition metal compound is within the range of 1 to 100 in terms of molar ratio. A third component can be used in combination with these transition metal compounds and organometallic compounds, if necessary, to control the polymer yield, polymerization rate, etc. Third
Typical examples of the components include oxygen-containing compounds such as alcohols, peroxides, carboxylic acids, acid anhydrides, acid chlorides, esters, and ketones, as well as other nitrogen-containing compounds, sulfur-containing compounds,
Halogen-containing compounds, molecular iodine, other Lewis acids, etc. can also be used. The amount of the third component used is at most 20 times the mole of the transition metal. The polymerization solvent used in the present invention includes:
Any organic solvent can be used as long as it does not react with and deactivate the catalyst system. Specific examples of these organic solvents include aliphatic or aromatic hydrocarbons, aliphatic or aromatic ether compounds,
Examples include halogenated aliphatic or halogenated aromatic hydrocarbons, aliphatic or aromatic carboxylic acid esters, alicyclic compounds, and heterocyclic compounds, among which aliphatic or aromatic hydrocarbons, aliphatic It is particularly preferable to use aromatic ether compounds, alicyclic compounds and heterocyclic compounds. Typical examples of these compounds include pentane, hexane, heptane, octane, nonane, decane, dodecane, cyclohexane, tetrahydrofuran, dioxane, diethyl ether, ethyl methyl ether, benzene, toluene, xylene, ethylbenzene, methyl phenyl ether. (anisole), ethyl phenyl ether, diphenyl ether, dimethoxybenzene,
Examples include 1,3,5-trimethoxybenzene, chlorobenzene, dichlorobenzene, methyl benzoate, and ethyl benzoate. These compounds may be used alone or in combination of two or more. In order to obtain the acetylene polymer gel of the present invention, the concentration of the transition metal compound in the catalyst system should be in the range of 0.0001 to 0.1 mol, preferably 0.001 to 0.1 mol, based on 1 mol of the polymerization solvent. Polymerization is necessary, and if the concentration of the transition metal compound is 0.1 mol or more per 1 mole of polymerization solvent, it is difficult to obtain a gel-like material with good moldability. If the amount is less than 0.0001 mol per 1 mol of the polymerization solvent, most of the acetylene high polymer will be in powder form. The catalyst solution may be homogeneous or non-uniform, but from the viewpoint of easy catalyst removal, it is preferable that the catalyst solution be homogeneous. The order of addition of the catalyst system and acetylene in the polymerization reaction of the present invention is as follows. That is, the catalyst system is added to a polymerization solvent in which acetylene has been dissolved in advance, or the acetylene is dissolved in a polymerization solvent containing one of the catalyst components of the catalyst system, and then the other catalyst component is added, Next, acetylene to be polymerized is blown into the system to cause a polymerization reaction, thereby obtaining a gel-like product of an acetylene high polymer. Regardless of the above method, if a catalyst system is added to a polymerization solvent in which acetylene is not dissolved and acetylene gas is blown into it, a film-like or lump-like acetylene high polymer will be formed, and the acetylene high polymer will be It is difficult to obtain a gel-like material. The amount of acetylene dissolved in the polymerization solvent is not particularly limited, but it is preferable to dissolve the acetylene up to a saturated amount in the polymerization solvent. The polymerization temperature is not particularly limited, but is usually -
The temperature is preferably 100°C to 300°C, and particularly preferably -80°C to 200°C for ease of handling. In the present invention, the steric structure of the acetylene polymer produced can be controlled by adjusting the polymerization temperature and the preparation conditions of the catalyst system, but in general, the lower the polymerization temperature, the higher the flexible cis content. An acetylene high polymer is produced, and if the polymerization temperature is high, an acetylene high polymer with a high trans content is produced. Although there is no particular restriction on the pressure of acetylene gas during polymerization, it is practically preferable to carry out the polymerization at a pressure of 10 atmospheres or less. The catalyst can be removed from the acetylene polymer gel obtained by polymerization by the usual removal methods, such as washing with an organic solvent that dissolves the catalyst, but it does not specifically remove the catalyst. There is no problem in using it. The acetylene polymer gel obtained in this manner can be easily molded under pressure into a uniform molded article having any desired shape and wall thickness. Furthermore, a porous acetylene polymer obtained by freeze-drying a gel-like material can be pressure-molded to form a molded article having an arbitrary shape and wall thickness. By utilizing its electrical properties, the acetylene polymer obtained by the production method of the present invention is useful as an organic semiconductor material for producing parts of electronic devices such as electrical resistance elements, heat-sensitive elements, photosensitive elements, etc. It is. Hereinafter, the present invention will be explained in more detail with reference to Examples. Example 1 200 ml of toluene purified in a conventional manner as a polymerization solvent was charged into a glass reactor 1 that was completely purged with nitrogen gas. After cooling to -78°C and removing nitrogen gas from the system using a vacuum pump, 1 atm of acetylene gas was blown into the system to dissolve acetylene in a saturated amount. Next, as a catalyst, 2.94 mmol of tetrabutoxytitanium and 7.34 mmol of triethylaluminum were sequentially charged at -78°C to prepare a catalyst solution. The catalyst solution was a homogeneous solution. While the reactor remained cooled to -78°C, purified acetylene gas at a pressure of 1 atmosphere was bubbled through. At the beginning of the polymerization reaction, the entire system became agar-like. The polymerization reaction was continued for 24 hours while maintaining the acetylene gas pressure at 1 atm. The system was agar-like with a reddish-purple color. After the polymerization was completed, unreacted acetylene gas was removed, and the system was repeatedly washed four times with 200 ml of purified toluene while maintaining the temperature at -78°C. Even after washing, the solution remained slightly brownish and the catalyst was not completely removed. The gel-like acetylene polymer swollen in toluene was in the form of chips with intertwined fibrous microcrystals (fibrils), and no powder or lump-like polymer was produced. When this gel-like material was sandwiched between chromium-plated ferro plates and press-molded at room temperature under a pressure of 100 kg/cm 2 , a flexible film of acetylene high polymer with a reddish-brown metallic luster was obtained. This film has electrical conductivity (DC four terminal method) of
It was a p-type semiconductor with a resistance of 9.4×10 -7 Ω -1 cm -1 at 20°C. Example 2 Acetylene polymerization was carried out in the same manner as in Example 1 using the same catalyst system as in Example 1, except that n-heptane was used instead of toluene as the polymerization solvent. Conduct, Example 1
A gel-like substance similar to that was obtained. The obtained gel-like material was pressure-molded in the same manner as in Example 1 to obtain a flexible film. Comparative Example 1 Acetylene was polymerized in exactly the same manner as in Example 1 using the same catalyst system as in Example 1, except that acetylene was not dissolved in toluene in advance. A thin polymer film was formed on the surface of the polymerization solvent at the initial stage of polymerization, and even after 24 hours of polymerization, only the film of acetylene high polymer on the surface of the polymerization solvent became thicker, and no gel-like material was obtained. Example 3 200 ml of anisole purified in a conventional manner as a polymerization solvent and 0.294 mmol of tetrabutoxytitanium as a catalyst were placed in a glass reactor (1) completely purged with nitrogen gas, cooled to -78°C, and vacuum-evacuated. After removing nitrogen gas from the system with a pump, 1
Acetylene gas was blown at atmospheric pressure to dissolve acetylene in a saturated amount. Next, 1.50 mmol of triisobutylaluminum was charged to prepare a catalyst solution. The catalyst solution was a homogeneous solution. The temperature of the reactor was returned to room temperature, and purified acetylene gas at a pressure of 1 atmosphere was blown into the reactor. Ten minutes after starting the polymerization reaction, the entire system turned into an agar-like gel. Polymerization was continued for 24 hours while maintaining the acetylene gas pressure at 1 atm. The entire system was agar-like with a blackish brown color. After the polymerization reaction was completed, unreacted acetylene gas was removed, and the product was washed four times with 200 ml of a mixed solvent of methanol and toluene at a ratio of 1:5 (volume ratio). The obtained gel-like material was the same gel-like material as in Example 1, and when it was pressure-molded in the same manner as in Example 1, a uniform film was obtained. This film was a P-type semiconductor with an electrical conductivity of 2.5×10 -6 Ω -1 ·cm -1 . Example 4 A catalyst was prepared and prepared in exactly the same manner as in Example 1, except that 5.0 mmol of titanium trisacetylacetonate and 25.0 mmol of triethylaluminum were used instead of the catalyst components tetrabutoxytitanium and triethylaluminum used in Example 1. A gel-like material similar to that in Example 1 was obtained by polymerizing acetylene. Example 5 A catalyst was prepared in exactly the same manner as in Example 1, except that 5.0 mmol of iron trisacetylacetonate and 15.0 mmol of triisobutylaluminum were used instead of the catalyst components tetrabutoxytitanium and triethylaluminum used in Example 1. Then, acetylene was polymerized to obtain a gel-like material similar to that in Example 1. Example 6 Instead of the catalyst components tetrabutoxytitanium and triisobutylaluminum used in Example 3,
A gel-like material similar to Example 3 was obtained by preparing a catalyst and polymerizing acetylene in the same manner as in Example 3, except that 0.5 mmol of trisacetylacetonatochromium and 2.5 mmol of triisobutylaluminum were used. Comparative Example 2 200 ml of toluene purified in a conventional manner was charged as a polymerization solvent into the glass reaction vessel of 1, which had been completely purged with nitrogen gas, cooled to -78°C, and the nitrogen gas in the system was removed using a vacuum pump. After removing 1 atm of acetylene gas, acetylene was dissolved in a saturated amount. Next, as a catalyst, 0.01 mmol of tetrabutoxytitanium and 0.1 mmol of triethylaluminum were sequentially charged at -78°C to prepare a catalyst solution. The catalyst solution was a homogeneous solution. The reactor was cooled with liquid nitrogen, and the nitrogen gas in the system was exhausted using a vacuum pump. Purified acetylene gas at a pressure of 1 atmosphere was blown into the reactor while cooling it to -78°C. As the polymerization began, a dark brown acetylene polymer began to precipitate in the form of a powder. The polymerization reaction was carried out at -78°C for 24 hours while maintaining the acetylene gas pressure at 1 atm.
The obtained acetylene high polymer was in powder form. This powdered acetylene high polymer is purified toluene.
After repeated washing with 200 ml four times, vacuum drying was performed to obtain a powdered acetylene high polymer. When this powdered acetylene high polymer was sandwiched between chromium-plated ferro plates and press-molded at a pressure of 100 kg/cm 2 at room temperature, the molded product obtained was extremely brittle and could not be obtained in the form of a film. Comparative Example 3 200 ml of toluene purified in a conventional manner as a polymerization solvent was placed in the glass container 1 that had been completely purged with nitrogen gas, cooled to -78°C, and nitrogen gas in the system was removed using a vacuum pump. After removal, 1 atm of acetylene gas was blown into the solution to dissolve acetylene in a saturated amount. Next, 40 mmol of tetrabutoxytitanium and 80 mmol of triethylaluminum were sequentially charged as a catalyst to prepare a catalyst solution. The catalyst solution was a homogeneous solution. When acetylene was polymerized using the obtained catalyst solution in exactly the same manner as in Example 1, some of the acetylene high polymer was in the form of a gel.
Most of the acetylene polymers were solid lumps with phase separation. Post-treatment was carried out in the same manner as in Example 1, and then Example 1
When pressure molding was carried out in the same manner as above, a uniform film could not be obtained.
Claims (1)
物を主成分とする触媒系を用いることにより重合
させてアセチレン高重合体を製造する方法におい
て、遷移金属化合物を重合溶媒1に対して
0.0001〜0.1モル濃度で使用し、且つ予めアセチ
レンを溶解させた重合溶媒に触媒系を添加する
か、または触媒系のうちのいずれか一方の触媒成
分を含む重合溶媒にアセチレンを溶解させた後、
他の触媒成分を添加して重合を行なうことを特徴
とするアセチレン高重合体のゲル状物の製造法。1. In a method for producing an acetylene polymer by polymerizing acetylene using a catalyst system containing a transition metal compound and an organometallic compound as main components, the transition metal compound is added to 1 part of the polymerization solvent.
After adding the catalyst system to a polymerization solvent used at a molar concentration of 0.0001 to 0.1 and in which acetylene has been previously dissolved, or dissolving acetylene in a polymerization solvent containing the catalyst component of one of the catalyst systems,
1. A method for producing a gel-like product of an acetylene high polymer, which comprises performing polymerization by adding other catalyst components.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5401879A JPS55145711A (en) | 1979-05-04 | 1979-05-04 | Preparation of gellike material of high-molecular acetylene polymer |
| GB8036773A GB2058096B (en) | 1979-03-29 | 1980-03-28 | Process for preparing gel-like composition of acetylene high polymer and process for fabrication thereof |
| PCT/JP1980/000053 WO1980002143A1 (en) | 1979-03-29 | 1980-03-28 | Process for preparing gel-like composition of acetylene high polymer,and process for fabrication thereof |
| DE19803041421 DE3041421C2 (en) | 1979-03-29 | 1980-03-28 | Process for the production of both an easily moldable mass from an acetylene high polymer and a porous acetylene high polymer |
| EP80900610A EP0026235B1 (en) | 1979-03-29 | 1980-10-23 | Process for molding an acetylene high polymer and process for fabrication thereof |
| US06/301,890 US4410640A (en) | 1979-03-29 | 1981-09-11 | Process for producing a gel-like composition of a high polymer of acetylene, and process for molding said composition |
| US06/755,210 US4596852A (en) | 1979-03-29 | 1985-07-12 | Process for producing a gel-like composition of a high polymer of acetylene, and process for molding said composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5401879A JPS55145711A (en) | 1979-05-04 | 1979-05-04 | Preparation of gellike material of high-molecular acetylene polymer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55145711A JPS55145711A (en) | 1980-11-13 |
| JPS6136762B2 true JPS6136762B2 (en) | 1986-08-20 |
Family
ID=12958835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5401879A Granted JPS55145711A (en) | 1979-03-29 | 1979-05-04 | Preparation of gellike material of high-molecular acetylene polymer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55145711A (en) |
-
1979
- 1979-05-04 JP JP5401879A patent/JPS55145711A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55145711A (en) | 1980-11-13 |
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