JPS6137296B2 - - Google Patents
Info
- Publication number
- JPS6137296B2 JPS6137296B2 JP1691677A JP1691677A JPS6137296B2 JP S6137296 B2 JPS6137296 B2 JP S6137296B2 JP 1691677 A JP1691677 A JP 1691677A JP 1691677 A JP1691677 A JP 1691677A JP S6137296 B2 JPS6137296 B2 JP S6137296B2
- Authority
- JP
- Japan
- Prior art keywords
- crosslinking
- gas
- polyethylene
- composition
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004132 cross linking Methods 0.000 claims description 33
- 229920000098 polyolefin Polymers 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- -1 polyethylene Polymers 0.000 claims description 18
- 239000004698 Polyethylene Substances 0.000 claims description 14
- 229920000573 polyethylene Polymers 0.000 claims description 14
- 150000001451 organic peroxides Chemical class 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 150000007513 acids Chemical class 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 4
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 22
- 239000000203 mixture Substances 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 15
- 238000000465 moulding Methods 0.000 description 11
- 239000003431 cross linking reagent Substances 0.000 description 7
- 238000007872 degassing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000010382 chemical cross-linking Methods 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000009849 vacuum degassing Methods 0.000 description 2
- CCNDOQHYOIISTA-UHFFFAOYSA-N 1,2-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1C(C)(C)OOC(C)(C)C CCNDOQHYOIISTA-UHFFFAOYSA-N 0.000 description 1
- OIGWAXDAPKFNCQ-UHFFFAOYSA-N 4-isopropylbenzyl alcohol Chemical compound CC(C)C1=CC=C(CO)C=C1 OIGWAXDAPKFNCQ-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- IKLDJIXGIQCFFQ-UHFFFAOYSA-N [(6-diazonioiminocyclohexa-2,4-dien-1-ylidene)hydrazinylidene]azanide Chemical compound [N-]=[N+]=NC1=CC=CC=C1N=[N+]=[N-] IKLDJIXGIQCFFQ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- HABAXTXIECRCKH-UHFFFAOYSA-N bis(prop-2-enyl) butanedioate Chemical compound C=CCOC(=O)CCC(=O)OCC=C HABAXTXIECRCKH-UHFFFAOYSA-N 0.000 description 1
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 description 1
- BKXRKRANFLFTFU-UHFFFAOYSA-N bis(prop-2-enyl) oxalate Chemical compound C=CCOC(=O)C(=O)OCC=C BKXRKRANFLFTFU-UHFFFAOYSA-N 0.000 description 1
- UDTFMMZGEOHGNU-WAYWQWQTSA-N bis(prop-2-ynyl) (z)-but-2-enedioate Chemical compound C#CCOC(=O)\C=C/C(=O)OCC#C UDTFMMZGEOHGNU-WAYWQWQTSA-N 0.000 description 1
- NQXDCRARZBUWHX-UHFFFAOYSA-N bis(prop-2-ynyl) benzene-1,2-dicarboxylate Chemical compound C#CCOC(=O)C1=CC=CC=C1C(=O)OCC#C NQXDCRARZBUWHX-UHFFFAOYSA-N 0.000 description 1
- HZTNYDWTDTYXQC-UHFFFAOYSA-N bis(prop-2-ynyl) benzene-1,4-dicarboxylate Chemical compound C#CCOC(=O)C1=CC=C(C(=O)OCC#C)C=C1 HZTNYDWTDTYXQC-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- VOSUIKFOFHZNED-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,3,5-tricarboxylate Chemical compound C=CCOC(=O)C1=CC(C(=O)OCC=C)=CC(C(=O)OCC=C)=C1 VOSUIKFOFHZNED-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】
本発明は、ポリエチレンを主体としたポリオレ
フインポリマーの常圧架橋方法に係り、特にポリ
エチレンを主体としたポリマーの有機過酸化物等
の過酸化物を用いる常圧での化学架橋方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an atmospheric pressure crosslinking method for polyolefin polymers mainly composed of polyethylene, and in particular, a method for crosslinking polyolefin polymers mainly composed of polyethylene using peroxides such as organic peroxides. It relates to a crosslinking method.
架橋ポリオレフインは現在パイプ、チユーブ、
シート、フイルム、そして電気ケーブル被覆等に
広く用いられていて、ポリオレフインの架橋方法
もまた種々知られている。 Cross-linked polyolefins are currently used in pipes, tubes,
It is widely used in sheets, films, electrical cable coatings, etc., and various methods for crosslinking polyolefins are also known.
しかしながら、ポリオレフインを、例えば、ジ
クミルパーオキサイド等の有機過酸化物で加熱架
橋すると、ポリオレフイン成形体中に気泡を生じ
る。これは商品価値を減じるばかりか、物性上の
問題点となることはよく知られている。例えば、
電線被覆中に生じているボイドは、絶縁破壊の原
因となる。 However, when polyolefin is thermally crosslinked with an organic peroxide such as dicumyl peroxide, bubbles are generated in the polyolefin molded article. It is well known that this not only reduces commercial value but also causes problems in physical properties. for example,
Voids occurring in the wire coating cause dielectric breakdown.
従つて、ポリオレフインの化学架橋において
は、上述の如き気泡の発生を抑止するため有機過
酸化物を含む組成物を例えば高圧熱媒体や、内圧
のかかり得る長いダイス中にて架橋が実施され
る。 Therefore, in chemical crosslinking of polyolefins, in order to suppress the generation of bubbles as described above, crosslinking is carried out using a composition containing an organic peroxide, for example, in a high-pressure heating medium or in a long die to which internal pressure can be applied.
これらの方法は、何れも、圧力下にて架橋する
ことを意味し、作業性が悪く、安全上も問題とな
り、また、多大の設備投資を要することは明らか
である。 All of these methods involve crosslinking under pressure, which results in poor workability and safety issues, and it is clear that they require a large investment in equipment.
本発明は、これらの欠点を解消するためなされ
たもので、鋭意研究を重ねた結果、常圧でもポイ
ドのない架橋体を得ることに成功した。 The present invention was made to eliminate these drawbacks, and as a result of extensive research, we succeeded in obtaining a crosslinked product free of voids even under normal pressure.
すなわち、本発明においては、ポリエチレンを
主体としたポリオレフインポリマーを加熱架橋す
るに際し、ポリオレフインに有機過酸化物と共
に、(1)次の気泡抑制剤(イ)ジまたはトリアリロキシ
−S−トリアジン類、(ロ)ジまたはトリアリルトリ
オキシ−S−トリアジン類、(ハ)ポリカルボン酸の
ポリアリルエステル類、(ニ)ポリビニルモノマー類
(ホ)2個以上のプロパルギル基を有するモノマー
類、の中から選ばれた1種または2種以上の化合
物を0.1〜5phr添加し、(2)加熱架橋にあたり、ポ
リエチレンを主体としたポリオレフイン架橋用組
成物中に含まれるガスをガス濃度を0.060c.c./g
以下となるようにガス抜き処理するとき、常圧の
加熱架橋においてもポイドのない架橋体が得られ
ることを見出した。 That is, in the present invention, when thermally crosslinking a polyolefin polymer mainly composed of polyethylene, (1) the following bubble suppressants (a) di- or triaryloxy-S-triazines, (ro) are added to the polyolefin together with an organic peroxide. ) di- or triallyltrioxy-S-triazines, (c) polyallyl esters of polycarboxylic acids, (d) polyvinyl monomers
(e) Adding 0.1 to 5 phr of one or more compounds selected from monomers having two or more propargyl groups, (2) For crosslinking polyolefin mainly composed of polyethylene during thermal crosslinking. The gas concentration of the gas contained in the composition is 0.060cc/g.
It has been found that when degassing is performed as follows, a crosslinked product free of voids can be obtained even in thermal crosslinking at normal pressure.
本発明による場合に、常圧においても気泡を生
じないで架橋が達成できる理由については、ポリ
エチレンを主体としたポリオレフインに添加され
た気泡抑制剤の作用により、有機過酸化物の分解
生成物、すなわち、メタン、アセトフエノン、ク
ミルアルコール等の中のあるものが、化学的にト
ラツプされてしまうことやまたは、気泡抑制剤の
副次的作用である架橋促進作用のため、マトリツ
クスの表面張力が増大し、気泡化が抑制されるこ
と等が考えられる。理由は明確ではないが、気泡
抑制剤を用いると、気泡の発生を防止することは
確実である。 In the case of the present invention, the reason why crosslinking can be achieved without producing bubbles even at normal pressure is that due to the action of the bubble suppressant added to the polyolefin mainly composed of polyethylene, the decomposition products of organic peroxides, i.e. , methane, acetophenone, cumyl alcohol, etc. may be chemically trapped, or the surface tension of the matrix may increase due to crosslinking promotion, which is a side effect of bubble suppressants. , it is thought that bubble formation is suppressed. Although the reason is not clear, it is certain that the use of a bubble suppressant will prevent the generation of bubbles.
しかるに、ポリオレフインに有機過酸化物と気
泡抑制剤とを添加し、プレス成形機にてシートを
成形したり、また押出機にて電線被覆を行ない、
例えばシリコーン浴にて、加熱架橋を行なうと、
数多くはないが、大きなポイドが発生する。これ
は気泡抑制剤の添加にも拘らず、気泡発生の新た
な原因が生じていることを意味する。これは、押
出成形またはプレス成形中にポリエチレンを主体
としたポリオレフインマトリツクスに空気がその
圧力のため強制的に溶解させられたり、また、有
機過酸化物が分解し、分解生成物を生じたため、
マトリツクスが架橋温度に加熱されたとき、それ
らが溶解度を越えて、直ちに気泡化するためであ
ることを見出した。この原因を除去することによ
り、気泡抑制の効果は著しく改善され、5〓以上
のポイドは殆んど見出せない程になる。 However, by adding an organic peroxide and a bubble suppressant to polyolefin, and forming a sheet using a press molding machine, or coating electric wires using an extruder,
For example, when thermal crosslinking is performed in a silicone bath,
Although not many, large poids occur. This means that despite the addition of the bubble suppressant, a new cause of bubble generation is occurring. This is because air is forcibly dissolved in the polyolefin matrix mainly composed of polyethylene during extrusion molding or press molding due to the pressure, and the organic peroxide decomposes to produce decomposition products.
We have found that this is because when the matrices are heated to the crosslinking temperature, their solubility is exceeded and they immediately foam. By removing this cause, the bubble suppression effect is significantly improved, to the point where it is almost impossible to find any voids larger than 5〓.
本発明に用いられる気泡抑制剤は、次の如きも
のである。すなわち、
(イ) ジまたはトリアリロキシ−S−トリアジン類
であり、例えば、トリアリルシアヌレート、
2,4−ジアリロキシ−6−ドデシルアミノ−
S−トリアジン、2,4−ジアリロキシ−6−
ヘキサデシロキシ−S−トリアジン、2,4−
ジアリロキシ−6−ヘンエイコサニロキシ−S
−トリアジン、
(ロ) ジまたはトリアリルイソシアヌール酸類であ
り、例えば、トリアリルイソシアヌレート、
2,4−ジアリル−6−ドデシルアミノイソシ
アヌレート、2,4−ジアリル−6−モノプロ
ピルイソシアヌレート、2,4−ジアリル−6
−ヘンエイコサニルイソシアヌレート、
(ハ) ポリカルボン酸のポリアリルエステル類であ
り、例えば、トリメリツト酸トリアリルエステ
ル、トリメシン酸トリアリルエステル、ピロメ
リツト酸トリアリルエステル、6−カルボキシ
−2,4−ジアリロキシベンゼン、フタル酸ジ
アリルエステル、ベンゾフエノンテトラカルボ
ン酸トリアリルエステル、蓚酸ジアリル、こは
く酸ジアリル、アジピン酸ジアリル、
(ニ) ポリビニルモノマー類、例えば、ジビニルベ
ンゼン、
(ホ) 2個以上のプロパルギル基を有するモノマー
類であり、例えば、フタル酸ジプロパルギル、
テレフタル酸ジプロパルギル、マレイン酸ジプ
ロパルギル等がある。 The bubble suppressant used in the present invention is as follows. That is, (a) di- or triallyloxy-S-triazines, such as triallyl cyanurate,
2,4-diallyloxy-6-dodecylamino-
S-triazine, 2,4-diallyloxy-6-
Hexadecyloxy-S-triazine, 2,4-
Diaryloxy-6-heneicosaniloxy-S
- triazine, (b) di- or triallylisocyanuric acids, such as triallylisocyanurate,
2,4-diallyl-6-dodecylaminoisocyanurate, 2,4-diallyl-6-monopropyl isocyanurate, 2,4-diallyl-6
-heneicosanyl isocyanurate, (c) polyallyl esters of polycarboxylic acids, such as trimellitic acid triallyl ester, trimesic acid triallyl ester, pyromellitic acid triallyl ester, 6-carboxy-2,4- Diallyloxybenzene, diallyl phthalate, triallyl benzophenonetetracarboxylate, diallyl oxalate, diallyl succinate, diallyl adipate, (d) polyvinyl monomers, such as divinylbenzene, (e) two or more Monomers having a propargyl group, such as dipropargyl phthalate,
Examples include dipropargyl terephthalate and dipropargyl maleate.
これらの気泡抑制剤の添加量は、0.1〜5phrが
使用される。この中でも特に好ましい気泡抑制効
果を奏する化合物は、前記(イ)および(ハ)の化合物で
あり、中でも(イ)の化合物が好ましい。気泡抑制効
果が架橋促進作用としては、3個以上の二重結合
を有する化合物が好ましいが、熱老化性を考慮す
ると2個の二重結合を有する化合物の方が好まし
いと言える。また、両者を併用することも場合に
よつては効果があり、例えばトリアリルシアヌレ
ートとジエチレングリコールジアクリレートとが
用いられる。 The amount of these bubble suppressants added is 0.1 to 5 phr. Among these, compounds exhibiting a particularly preferable bubble suppressing effect are the compounds (a) and (c) above, and the compound (a) is particularly preferable. Compounds having three or more double bonds are preferable in terms of the bubble suppressing effect and crosslinking promoting effect, but in consideration of heat aging properties, compounds having two double bonds are more preferable. In some cases, it may be effective to use both in combination; for example, triallyl cyanurate and diethylene glycol diacrylate are used.
次に、本発明においてガス抜きとは、架橋用組
成物の成形中において成形用機内を減圧に保ち組
成物中に含まれているガス成分主とそして酸素、
窒素あるいは混練工程中に生じた揮発性低沸点の
液体成分を前記組成物中から除去するものであ
り、含有するガス量をできる限り減ずることによ
り気泡化を防止することができるものである。し
かして架橋用組成物中に含まれるガス量は次の如
き測定法により求めたガス量が1gの組成物当り
0.060c.c.以下、望ましくは0.055c.c.以下、さらに望
ましくは0.045c.c.以下になるまで除去することが
望ましいものである。ここでガス量を測定するに
はガスを導入するためのガラス管付容器内を十分
に真空にしておき、架橋用組成物を80〜100℃に
30分加熱しながら真空下で略々完全に前記組成物
中のガス分を脱離させ、このガスを拡散ポンプに
よつて定容積系に導いて測定することができる。
なお容器内の圧力は例えばマクレオド真空計で読
みとることができる。真空度(ガス圧)とその容
積から標準状態でのガス量を求めることができ
る。 Next, in the present invention, degassing refers to keeping the inside of the molding machine at reduced pressure during molding of the crosslinking composition to remove the main gas components contained in the composition and oxygen.
Nitrogen or volatile low-boiling liquid components generated during the kneading process are removed from the composition, and bubbling can be prevented by reducing the amount of gas contained as much as possible. However, the amount of gas contained in the crosslinking composition was determined by the following measuring method per 1 g of the composition.
It is desirable to remove the amount to 0.060 cc or less, preferably 0.055 cc or less, and even more preferably 0.045 cc or less. To measure the amount of gas here, make a sufficient vacuum in the container with the glass tube for introducing the gas, and heat the crosslinking composition to 80 to 100℃.
The gas in the composition is almost completely desorbed under vacuum while heating for 30 minutes, and this gas can be introduced into a constant volume system using a diffusion pump for measurement.
Note that the pressure inside the container can be read using, for example, a Macleod vacuum gauge. The amount of gas under standard conditions can be determined from the degree of vacuum (gas pressure) and its volume.
また、本発明における架橋用組成物中からガス
成分あるいは低沸点液体成分を除去する方法は、
1)架橋用組成物用の成形用機内を減圧に保つこ
とによつて該組成物よりガス抜きを行なうもので
ある。この減圧成形による方法については成形せ
んとする前記組成物を100mmHg以下望ましくは
80mmHg以下、さらに望ましくは60mmHg以下に
保つものであり、ガス成分等の拡散を促進するこ
とから温度は高い程望ましく、通常は前記組成物
の温度は樹脂の軟化温度より10℃以上高いことが
望ましい。しかし架橋剤、発泡剤の分解温度以下
に保持することが必要である。 In addition, the method for removing gas components or low boiling point liquid components from the crosslinking composition in the present invention is as follows:
1) Gas is removed from the crosslinking composition by maintaining the inside of the molding machine at reduced pressure. In this vacuum molding method, the composition to be molded is desirably 100 mmHg or less.
It is maintained at 80 mmHg or less, more preferably 60 mmHg or less, and the higher the temperature is, the more desirable it is to promote the diffusion of gas components, etc. Usually, it is desirable that the temperature of the composition is at least 10°C higher than the softening temperature of the resin. . However, it is necessary to maintain the temperature below the decomposition temperature of the crosslinking agent and blowing agent.
また、加熱時間は使用する樹脂、含有するガス
成分、加熱温度、成形物の厚さ等により異なるも
のであるが、通常2〜30分特に5〜20分の範囲で
行なうことが望ましい。 Further, the heating time varies depending on the resin used, the gas components contained, the heating temperature, the thickness of the molded product, etc., but it is usually desirable to carry out the heating in the range of 2 to 30 minutes, particularly 5 to 20 minutes.
減圧成形の具体的方法として例えば次のような
ものがある。 Examples of specific methods of vacuum molding include the following.
(1) 押出機内を減圧にする方法:
これは押出機のバレルに真空用の脱気孔をあ
けて外部からポンプにて減圧にすることができ
るし、材料投入用のホツパー部を密閉形式とし
て、ホツパーに取付けた脱気孔よりポンプにて
減圧することにより、押出機内を減圧に保つこ
ともできる。(1) Method of reducing the pressure inside the extruder: This can be done by opening a vacuum degassing hole in the extruder barrel and using a pump to reduce the pressure from the outside, or by sealing the hopper for material input. The inside of the extruder can also be kept at a reduced pressure by using a pump to reduce the pressure through the degassing hole attached to the hopper.
(2) 金型内を減圧にする方法:
金型を用いて成形する場合に金型に真空びき
用の脱気孔を取付けポンプにて減圧に保ちなが
ら成形する。(2) Method of reducing the pressure inside the mold: When molding using a mold, attach a deaeration hole for vacuuming to the mold and use a pump to maintain the reduced pressure while molding.
(1),(2)何れの場合も真空びき用の脱気孔より溶
融した樹脂が系外へ出ないように注意しなければ
ならない。それには、真空用の孔部と樹脂とが直
接接しないように孔を取付けるか、孔部と樹脂の
間に介在物を置くことにより避けることができ
る。 In either case (1) or (2), care must be taken to ensure that molten resin does not leak out of the system through the vacuum degassing hole. This can be avoided by installing the hole so that the vacuum hole and the resin do not come into direct contact with each other, or by placing an object between the hole and the resin.
本発明における減圧は成形機内の圧力が100mm
Hg以下、0.1mmHg以上であるが望ましくは80
mmHg以下、0.1mmHg以上、さらに好ましく
は、60mmHg以下、0.1mmHg以上である。化学
架橋剤に害をなす微量の酸素を除くため、低圧に
なるほど好ましいが0.1mmHgより低圧に減圧す
ると架橋剤等の添加剤が蒸散するため好ましくな
い。 In the present invention, the pressure inside the molding machine is 100 mm.
Hg or less, 0.1mmHg or more, but preferably 80
mmHg or less, 0.1 mmHg or more, more preferably 60 mmHg or less, 0.1 mmHg or more. In order to remove trace amounts of oxygen that can harm the chemical crosslinking agent, the lower the pressure, the more preferable it is, but reducing the pressure below 0.1 mmHg is not preferable because additives such as the crosslinking agent will evaporate.
また、ガス抜きの別の方法としては、2)架橋
用組成物の熱処理である。熱処理は、例えば、押
出機から押出された成形物をそのまま100〜150℃
の熱媒体中に導き、5〜30分熱処理を行ない、組
成物中に含まれるガス量を0.060c.c./g以下とす
る。熱媒体は、熱風や、シリコーン、グリセリン
等が一般的である。また、赤外線等の間熱方式に
より加熱ガス抜きを行なうこともある。この間に
おいて、架橋剤を分解させないよう注意する必要
がある。 Another method for degassing is 2) heat treatment of the crosslinking composition. For example, heat treatment is performed on the molded product extruded from the extruder at 100 to 150°C.
The composition is introduced into a heating medium and heat-treated for 5 to 30 minutes to reduce the amount of gas contained in the composition to 0.060 cc/g or less. The heat medium is generally hot air, silicone, glycerin, or the like. Further, heating gas may be degassed using an intermittent heating method such as infrared rays. During this time, care must be taken not to decompose the crosslinking agent.
本発明でいうポリエチレンを主体としたポリオ
レフインポリマーとは高密度ポリエチレン、低密
度ポリエチレンなどのポリエチレン単独又はこれ
らポリエチレンにポリプロピレレン、ポリブテン
−1等のオレフイン系重合体、エチレン−プロピ
レン共重合体、エチレン−ブテン共重合体、エチ
レン−酢酸ビニル共重合体、エチレン−アクリル
酸エステル共重合体等のオレフイン系共重合体を
混合させた混合物を指すものである。 In the present invention, the polyolefin polymer mainly composed of polyethylene refers to polyethylene alone such as high-density polyethylene and low-density polyethylene, or to these polyethylenes, olefin polymers such as polypropylene and polybutene-1, ethylene-propylene copolymers, ethylene-propylene copolymers, etc. It refers to a mixture of olefin copolymers such as butene copolymer, ethylene-vinyl acetate copolymer, and ethylene-acrylic acid ester copolymer.
本発明の架橋は、必要に応じて、公知の架橋剤
と本発明に係る気泡抑制剤とを共に添加したポリ
エチレンを主体とするポリオレフインポリマーを
ガス抜きし、加熱することにより行なうこともで
きる。前記の橋剤として、ジクミルパーオキサイ
ド、2,5−ジメチル−2,5−ジ(ターシヤリ
ブチルパーオキシ)ヘキサン、2,5−ジメチル
−2,5−ジ(ターシヤリブチルパーオキシ)ヘ
キシン−3、1,3−ビス(ターシヤリブチルパ
ーオキシ)イソプロピルベンゼン等の有機過酸化
物、1,10−デカンビススルフオンアジド、m−
フエニレンジアザイドの如きアジド化合物等があ
る。架橋剤の添加量としては、0.01〜3phrが通常
用いられる。 The crosslinking of the present invention can also be carried out, if necessary, by degassing and heating a polyolefin polymer mainly composed of polyethylene to which a known crosslinking agent and a bubble suppressant according to the present invention have been added. As the crosslinking agent, dicumyl peroxide, 2,5-dimethyl-2,5-di(tertiarybutylperoxy)hexane, 2,5-dimethyl-2,5-di(tertiarybutylperoxy)hexane - Organic peroxides such as 3,1,3-bis(tertiarybutylperoxy)isopropylbenzene, 1,10-decanebissulfonazide, m-
Examples include azide compounds such as phenylene diazide. The amount of crosslinking agent added is usually 0.01 to 3 phr.
本発明の架橋は、勿論加圧下にても行なえる
が、常圧下で加熱することによつて行なうことが
できる。加熱は赤外線、熱風、窒素ガスまたは、
シリコーンオイル、グリセリン浴、塩浴、メタル
バスにより180℃〜300℃の温度で行なう。 The crosslinking of the present invention can of course be carried out under pressure, but it can also be carried out by heating under normal pressure. Heating can be done using infrared rays, hot air, nitrogen gas or
It is carried out at temperatures of 180°C to 300°C using silicone oil, glycerin bath, salt bath, and metal bath.
加熱架橋は、ポリオレフイン成形体に比重が近
い液体中で行なうと、加熱架橋中に変形や偏心が
起らないため好ましく、比重が2.5以下のシリコ
ーン浴や塩浴等が望ましい。しかして、本発明に
係る気泡抑制剤を用いると、架橋促進作用がある
ため、一層変形偏心が妨げられ好ましい。 Heat crosslinking is preferably carried out in a liquid having a specific gravity close to that of the polyolefin molded article, since deformation and eccentricity do not occur during heat crosslinking, and silicone baths, salt baths, etc. having a specific gravity of 2.5 or less are preferable. Therefore, when the bubble suppressant according to the present invention is used, since it has a crosslinking promoting effect, deformation eccentricity is further prevented, which is preferable.
本発明にて用いるポリオレフインには50重量%
以下の他の熱可塑性樹脂、ゴム、炭酸カルシウ
ム、タルク、ガラス繊維等の無機充填材、公知の
難熱剤、公知の抗酸化剤、顔料等を添加すること
もできる。 The polyolefin used in the present invention contains 50% by weight.
The following other thermoplastic resins, rubber, calcium carbonate, talc, inorganic fillers such as glass fibers, known heat retardants, known antioxidants, pigments, etc. can also be added.
以下本発明をさらに実施例について説明する。 The present invention will be further described below with reference to Examples.
実施例 1
低密度ポリエチレン(MI=1.0)に、ジクミル
パーオキサイド1.5phr、トリアリルシアヌレート
0.7phrを添加し、120℃のオーブンロールにて混
練し、120℃の蒸熱プレスにて厚さ3mmのシート
状に成形した。この成形したプレス板を直ちに
120℃で30分熱風恒温槽にてガス抜き処理した。
このプレス板のガス濃度は0.04c.c./gであつた。
また一方、成形直後のプレス板のガス含有濃度は
0.10c.c./gであつた。これらのプレス板を50×50
mmに切り、210℃の温度のソルトバスに5分間保
持し、架橋を行なつたところ、ガス抜き処理をし
たものは、気泡が見られず、また成形直後のガス
抜き処理をしないものは直径2mmの粗大なボイド
が数個認められた。なお、両者のゲル分率は何れ
も90%であつた。本実施例1において、本発明の
顕著な効果が認められた。Example 1 Low density polyethylene (MI=1.0), dicumyl peroxide 1.5phr, triallyl cyanurate
0.7 phr was added, kneaded using oven rolls at 120°C, and formed into a sheet with a thickness of 3 mm using a steam press at 120°C. Immediately remove this formed press plate.
Degassing was performed in a hot air constant temperature bath at 120°C for 30 minutes.
The gas concentration of this press plate was 0.04 cc/g.
On the other hand, the gas content concentration of the press plate immediately after forming is
It was 0.10cc/g. These press plates are 50x50
When cross-linked by cutting into mm pieces and holding them in a salt bath at a temperature of 210℃ for 5 minutes, no air bubbles were observed in the ones that had been degassed, and those that had not been degassed immediately after molding had a diameter of Several 2 mm coarse voids were observed. In addition, the gel fraction of both was 90%. In Example 1, remarkable effects of the present invention were observed.
実施例 2
低密度ポリエチレン(MI=1.0)に、ジクミル
パーオキサイド1.5phrと、2,4−ジアリロキシ
−6−ドデシルアミノ−S−トリアジン0.9phrと
を添加し、40mmφ押出機にて直径2mmのロツド状
に成形した。この押出機のホツパー部を気密に保
つように蓋を取付け、またホツパーに真空引き用
のノズルを付け、真空ポンプにて引きつつ押出し
を行なつた。この方法によるときの真空度は15mm
Hgであつた。このロツドのガス含有濃度は0.03
c.c./gであつた。このロツドを連続的に温度250
℃のシリコーン油浴に導き架橋を行なつたとこ
ろ、ボイドを発生することなく架橋処理を行なう
ことができた。断面は殆んど真円に近い形状をし
ており変形が殆んど見られなかつた。Example 2 1.5 phr of dicumyl peroxide and 0.9 phr of 2,4-diallyloxy-6-dodecylamino-S-triazine were added to low-density polyethylene (MI=1.0), and a 2 mm diameter extruder was added using a 40 mmφ extruder. It was molded into a rod shape. A lid was attached to the hopper of this extruder to keep it airtight, and a vacuum nozzle was attached to the hopper, and extrusion was performed while being pulled by a vacuum pump. The degree of vacuum when using this method is 15mm
It was Hg. The gas content concentration of this rod is 0.03
It was cc/g. This rod is continuously heated to 250℃.
When cross-linking was carried out by introducing the sample into a silicone oil bath at 0.degree. C., the cross-linking treatment could be carried out without generating voids. The cross section had a nearly perfect circular shape, and almost no deformation was observed.
比較例
前記実施例2において、気泡抑制剤を含まない
他は、全く同一の組成のポリエチレンを同一のホ
ツパーを用い同一の方法にて押出した。このロツ
ドのガス含有濃度は0.03c.c./gであつた。このロ
ツドを同様に同一の装置にて架橋処理を行なつた
ところ、多数のボイドを有する架橋ロツドしか得
られなかつた。また、断面はa/b=1.4の楕円
状であつた。Comparative Example In Example 2, polyethylene of exactly the same composition as in Example 2 except that it did not contain a bubble suppressant was extruded using the same hopper and the same method. The gas content concentration of this rod was 0.03 cc/g. When this rod was similarly crosslinked using the same apparatus, only a crosslinked rod having a large number of voids was obtained. Further, the cross section was an ellipse with a/b=1.4.
これから見ても前記実施例2では、本発明の顕
著な効果が認められる。 Even from this point of view, the remarkable effects of the present invention can be recognized in Example 2.
実施例 3
低密度ポリエチレン(MI=2.0)に、1,3−
ビス−(ターシヤリブチルパーオキシイソプロピ
ル)ベンゼン1.0phrと、トリアリルイソシアヌレ
ート0.3phrと、ジエチレングリコールジメタクリ
レート0.5phrとを添加し、通常の40mmφ直径の押
出機にて実施例2と同様にして真空引き処理を施
こしながらロツドを押出した。押出されたロツド
を連続的に赤外線加熱炉に導き、120℃の温度に
て10分間加熱され、直ちに温度220℃のソルトバ
スに導かれ加熱架橋された。この架橋されたロツ
ドは、全く気泡を含まず、断面に真円に近かつ
た。なお、赤外線加熱炉を出た直後のロツドのガ
ス含有濃度は0.03c.c./gと低かつた。本実施例3
においても本発明の顕著な効果が認められた。Example 3 Low density polyethylene (MI=2.0) with 1,3-
Add 1.0 phr of bis-(tertiarybutylperoxyisopropyl)benzene, 0.3 phr of triallyl isocyanurate, and 0.5 phr of diethylene glycol dimethacrylate, and vacuum in the same manner as in Example 2 using an ordinary extruder with a diameter of 40 mm. The rod was extruded while performing a pulling process. The extruded rod was continuously introduced into an infrared heating furnace and heated at a temperature of 120°C for 10 minutes, and immediately introduced into a salt bath at a temperature of 220°C for thermal crosslinking. This crosslinked rod contained no bubbles and had a nearly perfect circle in cross section. The gas content concentration of the rod immediately after leaving the infrared heating furnace was as low as 0.03 cc/g. Example 3
The remarkable effects of the present invention were also observed in the following cases.
実施例 4
前記実施例2に用いたと同一のホツパー付き押
出機を用いて外径3.0mmの撚合わせ軟銅体上に、
ポリエチレン100重量部に対して、ジクミルパー
オキサイド1.2phrと、2,4−ジアリロキシ−6
−ドデシルアミノ−S−トリアジン0.8phrとの割
合にて、均一に混練した架橋用ポリエチレン組成
物を被覆厚さ1.0mmに押出被覆した。これを温度
210℃に加熱したグリセリン浴に浸漬させて架橋
させたところ被覆層に全く気泡を発生させずに、
架橋度90%の架橋ポリエチレン絶縁ケーブルを製
造できた。なお、ガス抜きを行なわないで同一の
組成物を押出被覆、架橋させたものは、多数の粗
大なボイドを有していた。本実施例4において
も、本発明の顕著な効果が認められた。Example 4 Using the same extruder with a hopper as used in Example 2, a twisted annealed copper body with an outer diameter of 3.0 mm was
1.2 phr of dicumyl peroxide and 2,4-diallyloxy-6 per 100 parts by weight of polyethylene
A crosslinking polyethylene composition uniformly kneaded at a ratio of 0.8 phr to -dodecylamino-S-triazine was extrusion coated to a coating thickness of 1.0 mm. This temperature
When cross-linked by immersing it in a glycerin bath heated to 210℃, no bubbles were generated in the coating layer.
We were able to manufacture a cross-linked polyethylene insulated cable with a degree of cross-linking of 90%. In addition, the same composition was extrusion coated and crosslinked without degassing, and it had many coarse voids. Also in Example 4, the remarkable effects of the present invention were observed.
Claims (1)
リマーを加熱架橋するに際し、ポリマーに有機過
酸化物と共に (1) 次の気泡抑制剤 (イ) ジまたはトリアリロキシ−S−トリアジン
類 (ロ) ジまたはトリアリルイソシアヌール酸類 (ハ) ポリカルボン酸のポリアリルエステル類 (ニ) ポリビニルモノマー類 (ホ) 2個以上のプロパルギル基を有するモノマ
ー類の中から選ばれた1種または2種以上の
化合物を0.1〜5phr添加し、 (2) 加熱架橋にあたりポリマー組成物中に含まれ
るガスをガス抜き処理することを特徴とするポ
リオレフインの常圧架橋方法[Claims] 1. When thermally crosslinking a polyolefin polymer mainly composed of polyethylene, (1) the following bubble suppressant (a) di- or triaryloxy-S-triazines (b) di- or triaryloxy-S-triazines are added to the polymer together with an organic peroxide. or triallylisocyanuric acids (c) polyallyl esters of polycarboxylic acids (d) polyvinyl monomers (e) one or more compounds selected from monomers having two or more propargyl groups (2) a method for atmospheric pressure crosslinking of polyolefins, characterized by adding 0.1 to 5 phr of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1691677A JPS53102355A (en) | 1977-02-18 | 1977-02-18 | Crosslinking of polyolefin under atmospheric pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1691677A JPS53102355A (en) | 1977-02-18 | 1977-02-18 | Crosslinking of polyolefin under atmospheric pressure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53102355A JPS53102355A (en) | 1978-09-06 |
| JPS6137296B2 true JPS6137296B2 (en) | 1986-08-22 |
Family
ID=11929446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1691677A Granted JPS53102355A (en) | 1977-02-18 | 1977-02-18 | Crosslinking of polyolefin under atmospheric pressure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53102355A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284696A (en) * | 1989-04-25 | 1990-11-22 | Hitachi Plant Eng & Constr Co Ltd | Batch activated sludge treatment equipment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6058445A (en) * | 1983-09-08 | 1985-04-04 | Showa Denko Kk | Polypropylene composition |
| JP6051043B2 (en) * | 2012-12-27 | 2016-12-21 | 東洋ゴム工業株式会社 | Rubber composition |
-
1977
- 1977-02-18 JP JP1691677A patent/JPS53102355A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284696A (en) * | 1989-04-25 | 1990-11-22 | Hitachi Plant Eng & Constr Co Ltd | Batch activated sludge treatment equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53102355A (en) | 1978-09-06 |
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