JPS6140179B2 - - Google Patents
Info
- Publication number
- JPS6140179B2 JPS6140179B2 JP56065807A JP6580781A JPS6140179B2 JP S6140179 B2 JPS6140179 B2 JP S6140179B2 JP 56065807 A JP56065807 A JP 56065807A JP 6580781 A JP6580781 A JP 6580781A JP S6140179 B2 JPS6140179 B2 JP S6140179B2
- Authority
- JP
- Japan
- Prior art keywords
- low
- melting point
- density polyethylene
- laminated
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0875—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation
- B32B2310/0887—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/04—Polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Description
本発明は熱接着包装用積層材料の製造方法に関
し、更に詳述すれば耐熱性に優れ、例えばレトル
トパウチやボイル用小袋に用いて好適な押出しラ
ミネーシヨン法による熱接着包装用積層材料の製
造方法に関する。
従来よりポリエチレン等の熱接着性フイルム
と、例えばポリエステル、ポリアミドの如き耐熱
性合成樹脂フイルム及びアルミニウム箔とを積層
した積層材料(ラミネートフイルム)で比較的変
質し易い内容物を密封包装し、そのまま加熱殺菌
することにより長期間の保存を可能とする無菌包
装方法が広く行なわれているが、この包装に使用
するフイルムは殺菌の際に内容物と一緒に高温に
曝されるものであるから、優れた耐熱性が要求さ
れ、例えばレトルト殺菌等の高温処理を行なう場
合には、低融点の低密度ポリエチレンフイルムは
包装材料として使用し得ず、専ら融点が高く耐熱
性の良い高密度ポリエチレンフイルムもしくはポ
リプロピレンフイルムをシーラント材料とした積
層材料が使用されている。しかし、この積層材料
は押出しラミネーシヨン法で製造することができ
ず、基材フイルムの一面にイソシアネート系接着
剤溶液をコートした後、オーブンで溶剤を蒸発、
乾燥させ、次いでこの接着剤コート面に前記シー
ラント材料を押圧して接着させるドライラミネー
シヨン法でのみ製造し得るものであり、このため
製造速度が遅く、通常押出しラミネーシヨン法の
1/2以下であること、高価な接着剤を多く使用す
ること、更に残存溶剤により積層材料に溶剤臭が
残ること、及びイソシアネート系接着剤及びシー
ラント材料に有害物質が含まれていること等の問
題を有している。
本発明者らは上記問題を解決する目的で種々検
討しているうちに、低密度ポリエチレン等の融点
が85〜110℃程度の低融点合成樹脂フイルムに5
メガラド以下の低線量の放射線を照射すると、そ
の融点がほとんど変化しないにもかかわらず、こ
の低融点合成樹脂フイルムは、例えば130℃程度
の高温度においても引張り強度の低下やデラミネ
ーシヨン等を起すこともなく、耐熱性、熱接着性
等が著しく向上することを知見し、本発明をなす
に至つたものである。
即ち、本発明は押出しラミネーシヨン法によ
り、低密度ポリエチレン、中密度ポリエチレン、
エチレンとアクリル酸、メタクリル酸、酢酸ビニ
ル等との共重合体、アイオノマー樹脂又はこれら
のブレンド体等の低融点合成樹脂を加熱熔融して
これらのフイルムを押出しながら、基材、熱接着
膜等と積層することにより積層フイルムを高速度
で製造し、次いでこれに5メガラド以下の線量の
放射線を照射することにより、低密度ポリエチレ
ン層等の低融点合成樹脂層の融点をほとんど上昇
させることなくその耐熱性を改善でき、また耐デ
ラミネーシヨン性も良好で、このもので製造した
包装袋は高温ボイル殺菌又はレトルト殺菌等の高
温処理にも充分耐え得る上、製造速度が大きく大
量生産に好適な熱接着包装用積層材料の製造方法
を提供することを目的とするものである。
以下、本発明の一実施例につき図面を参照して
説明する。
第1図は本発明の実施に使用する共押出しラミ
ネート法による熱接着包装用積層材料の製造装置
の一例を示す概略側面図で、図中1a,1bはそ
れぞれ異なる融点の合成樹脂、例えば低密度ポリ
エチレン及び中密度ポリエチレンを加熱熔融して
押出す第1及び第2押出し機である。この押出し
機1a,1bの熔融樹脂吐出部はそれぞれアダプ
ター2a,2bによりTダイ3と連結されて公知
の共押出しラミネート装置を形成している。前記
第1及び第2押出し機1a,1bから押出された
熔融樹脂はTダイ3からフイルム状に押出されて
積層され、低密度ポリエチレンフイルム及び中密
度ポリエチレンフイルムが積層された積層フイル
ム4が連続的に製造される。
5はポリエステル、ポリアミド、ポリカーボネ
ート等の合成樹脂フイルムを単独で、もしくはこ
れらを積層し、又はこれら積層物とアルミニウム
箔等とを積層してなる基材6をロール状に巻いた
基材ウエブで、この基材ウエブ5から繰出された
基材6は進行方向前方に適宜配置されたアンカー
剤塗布機8でイソシアネート系のアンカー剤をコ
ートされた後、熱風オーブン9で乾燥され、次い
で前記第1及び第2押出し機1a,1bで押出さ
れた低密度ポリエチレン及び中密度ポリエチレン
フイルムと圧着積層されて、第2図に示したよう
に基材層11a、アンカーコート層11b、低密
度ポリエチレン層11c、中密度ポリエチレン層
11dよりなる積層体11が形成され、次いでこ
の積層体11は所定方向(矢印A方向)に走行
し、その前方に配設された電子線又はX線等の放
射線照射装置12により5メガラド以下の低線量
の放射線を照射されて、前記中密度ポリエチレン
フイルム層を熱接着層とする熱接着包装用積層材
料13が製造されるものである。なお、この場合
放射線としては電子線が装置の簡易さ等の点で特
に好ましい。照射線量は5メガラド以下、特に1
〜3メガラドとすることが好ましく、線量をこの
範囲に調節することにより低融点の積層フイルム
4の融点をほとんど変化させることなく耐熱性を
向上できるものである。このようにして製造され
た積層材料13は、更に第2ガイドロール14に
よりその進行方向を変更された後、巻取りロール
15に巻取られる。
上記方法で製造された熱接着包装材料13は適
当なる製袋機で所定箇所を熱接着することにより
製袋され、次いで内容物が充填された後、熱接着
により密封され、必要により高温ボイル殺菌、レ
トルト殺菌処理等が行なわれるものである。
本実施例においては積層材料の製造に際し、低
融点の低密度ポリエチレン及び中密度ポリエチレ
ンを用いて積層フイルムを得ると共に、これに基
材を積層するようにしたので、共押出しラミネー
シヨン法が採用できるようになり、ドライラミネ
ーシヨン法による場合のように接着剤の溶剤の乾
燥速度が製造の律速となることもなく、その製造
速度は大きく、通常のドライラミネーシヨン法に
よる場合の2倍以上とすることができ、大量生産
に適するものである。そして、本実施例において
はこの様にして得た積層体を放射線照射するもの
であるが、照射線量を5メガラド以下の低線量に
することにより、前記低密度ポリエチレン層及び
中密度ポリエチレン層の融点をほとんど上昇させ
ることなくこれらの耐熱性を著しく向上させるこ
とができ、このようにして製造した積層材料を包
装用に用いた場合には、レトルト及びボイル処理
等の高温殺菌処理に充分耐えることができ、高温
殺菌処理過程において密封包装が開封する等の事
故を確実に防止し得ると共に、積層材間の剥離
(デラミネーシヨン)もないものである。
なお、本実施例においては積層材料の製造方法
として共押出しラミネーシヨン法を用いたがこれ
に限られず、例えばフイルムサンドラミネーシヨ
ン法、ダブルラミネーシヨン法等の各種の押出し
ラミネーシヨン法が目的とする積層材料に応じて
適宜採用され得るものであり、また熱接着層も中
密度ポリエチレンに限られず、例えば低密度ポリ
エチレン、エチレンとアクリル酸、メタクリル
酸、酢酸ビニル等との共重合体、アイオノマー樹
脂又はこれらのブレンド体等を用いることもで
き、更に予めフイルム状にした高密度ポリエチレ
ン、ポリプロピレン等の熱接着性フイルムを積層
して形成することもできる。また更に、放射線照
射も本実施例のように積層工程に連続して行なう
ことなく、積層体を未照射のまま一旦巻取つた
後、巻取り状態でCo60等を用いてγ線又はX線照
射を行なつてもよい。
而して、本発明は少なくとも1種以上の熱可塑
性合成樹脂をそれぞれ加熱熔融すると共に、これ
らを薄膜状に押出して基材、熱接着フイルム等と
積層一体化する押出しラミネーシヨン法におい
て、前記熱可塑性合成樹脂の少なくとも1以上に
低融点合成樹脂を使用することにより、少なくと
も1以上の低融点合成樹脂層を有する積層体を製
造し、次いでこれに照射線量が5メガラド以下の
放射線を照射するものであるが、この場合積層体
の製造に押出しラミネーシヨン法を採用している
ので製造速度が大きいものである。そしてこのよ
うにして製造した積層体に照射線量が5メガラド
以下の放射線を照射することにより、低融点合成
樹脂層の融点を照射前とほぼ同等に保つたまま耐
熱性を向上させた積層材料を得ることができ、こ
れを包装材料として使用した場合、例えばレトル
ト処理やボイル殺菌処理等の高温処理に耐えるこ
とができ、デラミネーシヨン等の問題を生じるこ
ともない。また、低融点合成樹脂を熱接着層とし
て使用した場合には、その融点は放射線照射によ
りほとんど変化せず、低融点を保持し続けている
ので、シール特性も変化しない特長を有する。ま
た本発明によれば積層体に放射線を照射している
ので製造された積層材料は完全に無菌化される特
長をあわせて持つものである。
以下、実施例により本発明を更に詳細に説明す
る。
実施例 1
厚さ15μのポリアミドフイルムの片面にイソシ
アネート系のアンカー剤をコートし、その上に共
押出しラミネーシヨン法により厚さ20μの低密度
ポリエチレン層及び厚さ40μの中密度ポリエチレ
ン層を積層し、次いでこれを中密度ポリエチレン
層の側から300KV、65mAの照射条件で3メガラ
ドの電子線を照射して熱接着包装用積層材料を得
た(本発明品)。この積層材料を用いて製袋し、
これにミートソースを充填、包装したものを98℃
で40分間加熱処理を行なつた。この包装材(積層
材料)の諸性質を測定した結果を第1表に示し
た。なお、比較のために電子線を照射する以下は
同様に処理した包装材の測定結果を比較例として
併記した。
The present invention relates to a method for manufacturing a laminated material for thermal adhesive packaging, and more specifically, a method for manufacturing a laminated material for thermal adhesive packaging using an extrusion lamination method, which has excellent heat resistance and is suitable for use in, for example, retort pouches and small bags for boiling. Regarding. Conventionally, contents that are relatively susceptible to deterioration are sealed and packaged using a laminated material (laminate film) made by laminating a heat-adhesive film such as polyethylene, a heat-resistant synthetic resin film such as polyester or polyamide, and aluminum foil, and then heated as is. Aseptic packaging methods that enable long-term storage by sterilization are widely used, but the film used for this packaging is exposed to high temperatures along with the contents during sterilization, so it is not suitable for For example, when high-temperature processing such as retort sterilization is required, low-density polyethylene film with a low melting point cannot be used as a packaging material, and high-density polyethylene film or polypropylene with a high melting point and good heat resistance must be used. Laminated materials are used that use film as a sealant material. However, this laminated material cannot be manufactured by extrusion lamination, and after coating one side of the base film with an isocyanate adhesive solution, the solvent is evaporated in an oven.
It can only be manufactured by dry lamination, which involves drying and then pressing the sealant material onto the adhesive-coated surface, which slows down the manufacturing process and usually makes it easier to use extrusion lamination.
1/2 or less, the use of a large amount of expensive adhesive, residual solvents that leave a solvent odor in laminated materials, and isocyanate adhesives and sealant materials containing harmful substances. I have a problem. The inventors of the present invention have conducted various studies to solve the above problems, and have found that low-melting point synthetic resin films such as low-density polyethylene, which have a melting point of about 85 to 110 degrees Celsius,
Although the melting point hardly changes when irradiated with radiation at a low dose of megarad or less, this low-melting point synthetic resin film suffers from a decrease in tensile strength and delamination even at temperatures as high as 130°C. It was discovered that heat resistance, thermal adhesion, etc. were significantly improved without any problems, and this led to the present invention. That is, the present invention uses an extrusion lamination method to produce low density polyethylene, medium density polyethylene,
While heating and melting low melting point synthetic resins such as copolymers of ethylene and acrylic acid, methacrylic acid, vinyl acetate, etc., ionomer resins, or blends thereof, and extruding these films, the base material, thermal adhesive film, etc. By laminating layers to produce a laminated film at high speed, and then irradiating it with radiation at a dose of 5 megarads or less, the heat resistance of the low-melting point synthetic resin layer, such as the low-density polyethylene layer, can be improved without increasing its melting point. It also has good delamination resistance, and packaging bags made with this material can withstand high-temperature treatments such as high-temperature boil sterilization or retort sterilization. The object of the present invention is to provide a method for producing a laminated material for adhesive packaging. Hereinafter, one embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view showing an example of an apparatus for producing a laminated material for thermally adhesive packaging by the coextrusion lamination method used in the implementation of the present invention. In the figure, 1a and 1b are synthetic resins with different melting points, such as low density These are first and second extruders that heat and melt and extrude polyethylene and medium density polyethylene. The molten resin discharge portions of the extruders 1a and 1b are connected to a T-die 3 by adapters 2a and 2b, respectively, to form a known coextrusion laminating device. The molten resin extruded from the first and second extruders 1a and 1b is extruded into a film from a T-die 3 and laminated, and a laminated film 4 in which a low-density polyethylene film and a medium-density polyethylene film are laminated is continuously formed. Manufactured in 5 is a base material web made by winding a base material 6 made of a synthetic resin film such as polyester, polyamide, polycarbonate alone, a laminate thereof, or a laminate thereof and an aluminum foil etc. into a roll; The base material 6 fed out from the base material web 5 is coated with an isocyanate-based anchoring agent by an anchoring agent applicator 8 appropriately disposed forward in the direction of travel, dried in a hot air oven 9, and then dried in a hot air oven 9. The low-density polyethylene and medium-density polyethylene films extruded by the second extruders 1a and 1b are laminated by pressure bonding, and as shown in FIG. A laminate 11 made of the density polyethylene layer 11d is formed, and then this laminate 11 travels in a predetermined direction (direction of arrow A) and is exposed to radiation irradiation equipment 12 such as electron beams or X-rays disposed in front of the laminate 11. A laminated material 13 for thermally adhesive packaging having the medium-density polyethylene film layer as a thermally adhesive layer is manufactured by irradiating with radiation at a low dose of megarad or less. In this case, as the radiation, an electron beam is particularly preferable in view of the simplicity of the apparatus. The irradiation dose is less than 5 megarads, especially 1
It is preferable to set the dose to ~3 megarads, and by adjusting the dose within this range, the heat resistance can be improved without substantially changing the melting point of the laminated film 4 having a low melting point. The laminated material 13 manufactured in this manner is further changed in its traveling direction by the second guide roll 14 and then wound onto the winding roll 15. The heat-adhesive packaging material 13 produced by the above method is made into a bag by heat-bonding predetermined points using a suitable bag-making machine, then filled with contents, sealed by heat-bonding, and sterilized by high-temperature boiling if necessary. , retort sterilization treatment, etc. In this example, when manufacturing the laminated material, a laminated film was obtained using low-melting-point low-density polyethylene and medium-density polyethylene, and the base material was laminated on this, so a coextrusion lamination method could be adopted. As a result, the drying speed of the adhesive solvent does not determine the manufacturing rate as is the case with the dry lamination method, and the manufacturing speed is high, more than twice that of the normal dry lamination method. It is suitable for mass production. In this example, the laminate thus obtained is irradiated with radiation, and by reducing the irradiation dose to a low dose of 5 megarads or less, the melting points of the low density polyethylene layer and the medium density polyethylene layer are lowered. The heat resistance of these materials can be significantly improved with almost no increase in temperature, and when the laminated material produced in this way is used for packaging, it can withstand high temperature sterilization treatments such as retort and boiling. It is possible to reliably prevent accidents such as opening of a sealed package during the high-temperature sterilization process, and there is no peeling (delamination) between the laminated materials. In this example, a coextrusion lamination method was used as the method for producing the laminated material, but the method is not limited to this, and various extrusion lamination methods such as a film sandwich lamination method and a double lamination method may be used. It can be adopted as appropriate depending on the laminated material, and the thermal adhesive layer is not limited to medium density polyethylene, for example, low density polyethylene, copolymers of ethylene and acrylic acid, methacrylic acid, vinyl acetate, etc., ionomer resins, or It is also possible to use a blend of these materials, or to form a film by laminating heat-adhesive films made of high-density polyethylene, polypropylene, etc. in advance. Furthermore, radiation irradiation is not performed continuously in the lamination process as in this example, but after the laminate is wound up without being irradiated, it is exposed to γ-rays or X-rays using Co 60 etc. in the wound state. Irradiation may also be performed. Accordingly, the present invention provides an extrusion lamination method in which at least one thermoplastic synthetic resin is heated and melted, extruded into a thin film, and laminated and integrated with a base material, a heat-adhesive film, etc. A laminate having at least one low melting point synthetic resin layer is manufactured by using a low melting point synthetic resin as at least one of the plastic synthetic resins, and then irradiated with radiation at a dose of 5 megarads or less. However, in this case, the extrusion lamination method is used to manufacture the laminate, so the manufacturing speed is high. By irradiating the thus produced laminate with radiation at a dose of 5 megarads or less, a laminate material with improved heat resistance can be produced while maintaining the melting point of the low-melting point synthetic resin layer almost the same as before irradiation. When used as a packaging material, it can withstand high-temperature treatments such as retort treatment and boil sterilization treatment, and does not cause problems such as delamination. Furthermore, when a low melting point synthetic resin is used as the thermal adhesive layer, its melting point hardly changes due to radiation irradiation, and since it continues to maintain its low melting point, it has the advantage that its sealing properties do not change. Further, according to the present invention, since the laminate is irradiated with radiation, the produced laminate material also has the feature of being completely sterilized. Hereinafter, the present invention will be explained in more detail with reference to Examples. Example 1 One side of a 15μ thick polyamide film was coated with an isocyanate anchoring agent, and a 20μ thick low density polyethylene layer and a 40μ thick medium density polyethylene layer were laminated thereon by coextrusion lamination. Then, this was irradiated with an electron beam of 3 megarads under irradiation conditions of 300 KV and 65 mA from the side of the medium density polyethylene layer to obtain a laminated material for thermal adhesive packaging (product of the present invention). Bags are made using this laminated material,
This is filled with meat sauce and packaged at 98℃.
Heat treatment was performed for 40 minutes. Table 1 shows the results of measuring various properties of this packaging material (laminated material). For comparison, the measurement results of packaging materials treated in the same manner as below, which were irradiated with electron beams, are also shown as comparative examples.
【表】【table】
【表】
第1表から明らかなように電子線照射を行なつ
た本発明品は低密度ポリエチレン層の融点が高く
なることなくその耐熱性が向上しているのに対
し、電子線照射を行なわなかつた比較品は加熱処
理によりヒートシール強度及び膜接着強度が低下
し、また外観も悪化し商品価値を損なうものであ
つた。なお、共押出し法で製造した積層材を用い
て同様の測定を行なつた場合もほぼ同様の結果が
得られた。
実施例 2
イソシアネート系接着剤を用いて厚さ12μのポ
リエチレンテレフタレートフイルムに厚さ9μの
アルミニウム箔をドライラミネーシヨン法で積層
した基材のアルミニウム箔面にイソシアネート系
のアンカー剤をコートし、このコート面に厚さ20
μのエチレン−アクリル酸の共重合体フイルムを
押出して積層すると共に、イソフレーシヨン法に
より製造した厚さ40μの高密度ポリエチレンフイ
ルムをフイルムサンド法により積層し一体化し
た。次いで、これを高密度ポリエチレン層の側か
ら実施例と同一条件で電子線を照射して熱接着包
装用積層材料を得た(本発明品)。この積層材料
を用いて製袋し、カレー食品を充填、包装したも
のを120℃で30分間レトルト殺菌処理を行なつ
た。この包装材(積層材料)の諸性質を装定した
結果を第2表に示した。また比較のために電子線
を照射する以外は同様に処理した包装材の測定結
果を比較例として併記した。[Table] As is clear from Table 1, the product of the present invention subjected to electron beam irradiation has improved heat resistance without increasing the melting point of the low density polyethylene layer, whereas the product subjected to electron beam irradiation has improved heat resistance. The heat-sealing strength and film adhesion strength of the comparative product were reduced by heat treatment, and the appearance also deteriorated, impairing its commercial value. In addition, almost the same results were obtained when similar measurements were performed using a laminate manufactured by coextrusion. Example 2 An isocyanate-based anchoring agent was coated on the aluminum foil surface of a base material in which a 9μ-thick aluminum foil was laminated on a 12μ-thick polyethylene terephthalate film using an isocyanate-based adhesive using a dry lamination method. Thickness 20 on the face
An ethylene-acrylic acid copolymer film having a thickness of 40 μm was extruded and laminated, and a high-density polyethylene film having a thickness of 40 μm produced by an isoflation method was laminated and integrated by a film sanding method. Next, this was irradiated with an electron beam from the high-density polyethylene layer side under the same conditions as in the examples to obtain a laminated material for thermal adhesive packaging (product of the present invention). A bag was made using this laminated material, filled with curry food, and packaged, and then subjected to retort sterilization treatment at 120°C for 30 minutes. The results of various properties of this packaging material (laminated material) are shown in Table 2. For comparison, the measurement results of packaging materials treated in the same manner except for irradiation with electron beams are also shown as comparative examples.
【表】
* 膜切れを起した。
第2表から明らかなように、電子線照射を行な
つた本発明品は低融点のエチレン−アクリル酸共
重合体を中間層に有するにもかかわらずレトルト
処理に充分耐え得、処理後のシール強度及び膜接
着強度は極めて良好なものであるのに対し、電子
線照射を行なつていない比較品はレトルト処理に
よりデラミネーシヨン等を生じ、使用に耐え得な
いものであつた。
実施例 3
厚さ12μのポリエチレンテレフタレートフイル
ムにイソシアネート系のアンカー剤をコートし、
このコート面に押出しラミネーシヨン法により厚
さ60μの低密度ポリエチレンを積層して一体化し
た。次いで、これを低密度ポリエチレン層の側か
ら300KV、65mAの照射条件で3メガラドの電子
線を照射して熱接着包装用積層材料を得た(本発
明品)。この積層材料を用いて製袋し清浄綿を充
填、包装したものを120℃で30分間レトルト殺菌
処理を行なつた。この包装材(積層材料)の諸性
質の測定結果を第3表に示した。なお、比較のた
めに電子線を照射する以外は同様に処理した包装
材の測定結果を比較例として併記した。[Table] * Membrane breakage occurred.
As is clear from Table 2, the products of the present invention subjected to electron beam irradiation can withstand retort processing well despite having a low-melting point ethylene-acrylic acid copolymer in the intermediate layer, and can be sealed after processing. While the strength and film adhesion strength were extremely good, a comparative product that had not been subjected to electron beam irradiation suffered delamination and the like due to retort treatment and was unusable. Example 3 A polyethylene terephthalate film with a thickness of 12μ was coated with an isocyanate-based anchoring agent,
A 60μ thick low-density polyethylene was laminated and integrated on this coated surface using an extrusion lamination method. Next, this was irradiated with an electron beam of 3 megarads under irradiation conditions of 300 KV and 65 mA from the low-density polyethylene layer side to obtain a laminated material for thermal adhesive packaging (product of the present invention). A bag was made using this laminated material, filled with clean cotton, and packaged, and then subjected to retort sterilization treatment at 120°C for 30 minutes. Table 3 shows the measurement results of various properties of this packaging material (laminated material). For comparison, the measurement results of a packaging material treated in the same manner except for irradiation with an electron beam are also shown as a comparative example.
【表】
第3表から明らかなように、電子線照射をする
ことにより低密度ポリエチレンを有する本発明品
は改質されて120℃、30分間のレトルト処理に充
分耐え得るものとなるのに対し、電子線照射をし
ていない比較品はデラミネーシヨンを生じ使用に
耐え得ないものであつた。また更に、比較品はレ
トルト処理により低密度ポリエチレン層が清浄綿
と融着していたのに対し、本発明品はそのような
不都合は生じていなかつた。[Table] As is clear from Table 3, the product of the present invention containing low density polyethylene is modified by electron beam irradiation and becomes able to withstand retort treatment at 120°C for 30 minutes. Comparative products that were not irradiated with electron beams suffered from delamination and could not withstand use. Furthermore, while the comparative product had a low-density polyethylene layer fused to the clean cotton due to retort treatment, the product of the present invention had no such problem.
第1図は本発明の実施に使用する積層材料の製
造装置の一例を示す概略側面図、第2図は同装置
により製造した放射線照射前の積層体の拡大側面
断面図である。
1a……第1押出し機、1b……第2押出し
機、3……Tダイ、4……積層フイルム、6……
基材、10……圧着ローラー、11……積層体、
12……放射線照射装置、13……熱接着包装用
積層材料。
FIG. 1 is a schematic side view showing an example of a laminated material manufacturing apparatus used in carrying out the present invention, and FIG. 2 is an enlarged side sectional view of a laminated body manufactured by the same apparatus before radiation irradiation. 1a...First extruder, 1b...Second extruder, 3...T die, 4...Laminated film, 6...
Base material, 10... pressure roller, 11... laminate,
12...Radiation irradiation device, 13...Laminated material for thermal adhesive packaging.
Claims (1)
熔融すると共に薄膜状に押出し基材、熱接着性フ
イルム等を積層一体化する押出しラミネーシヨン
法において、前記熱可塑性合成樹脂の少なくとも
1以上を低融点合成樹脂とすることにより、少な
くとも1以上の低融点合成樹脂層を有する積層体
を製造し、次いでこれに照射線量が5メガラド以
下の放射線を照射することを特徴とする、前記低
融点合成樹脂層の融点を放射線照射前とほぼ同等
に保つたままその耐熱性を向上させた耐熱性熱接
着包装用積層材料の製造方法。 2 低融点合成樹脂が低密度ポリエチレン、中密
度ポリエチレン、エチレン−酢酸ビニル共重合
体、エチレン−メタクリル酸共重合体、エチレン
−アクリル酸共重合体、又はアイオノマー樹脂で
ある特許請求の範囲第1項記載の製造方法。 3 放射線が電子線である特許請求の範囲第1項
又は第2項記載の製造方法。[Scope of Claims] 1. In an extrusion lamination method in which one or more thermoplastic synthetic resins are heated and melted and then extruded into a thin film, a base material, a thermally adhesive film, etc. are laminated and integrated. A laminate having at least one or more low-melting point synthetic resin layer is manufactured by using at least one or more of the low-melting point synthetic resin layers, and then irradiated with radiation having an irradiation dose of 5 megarads or less, A method for producing a heat-resistant laminated material for thermal adhesive packaging, in which the heat resistance of the low-melting point synthetic resin layer is improved while keeping the melting point of the layer substantially equal to that before radiation irradiation. 2. Claim 1, wherein the low melting point synthetic resin is low density polyethylene, medium density polyethylene, ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-acrylic acid copolymer, or ionomer resin. Manufacturing method described. 3. The manufacturing method according to claim 1 or 2, wherein the radiation is an electron beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6580781A JPS57180640A (en) | 1981-04-30 | 1981-04-30 | Production of laminated material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6580781A JPS57180640A (en) | 1981-04-30 | 1981-04-30 | Production of laminated material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57180640A JPS57180640A (en) | 1982-11-06 |
| JPS6140179B2 true JPS6140179B2 (en) | 1986-09-08 |
Family
ID=13297661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6580781A Granted JPS57180640A (en) | 1981-04-30 | 1981-04-30 | Production of laminated material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57180640A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000045957A (en) * | 1998-12-30 | 2000-07-25 | 백승희 | Method for preparing reflection plate for advertising light box |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3997383A (en) * | 1975-03-10 | 1976-12-14 | W. R. Grace & Co. | Cross-linked amide/olefin polymeric laminates |
-
1981
- 1981-04-30 JP JP6580781A patent/JPS57180640A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57180640A (en) | 1982-11-06 |
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