JPS6140897B2 - - Google Patents
Info
- Publication number
- JPS6140897B2 JPS6140897B2 JP56141498A JP14149881A JPS6140897B2 JP S6140897 B2 JPS6140897 B2 JP S6140897B2 JP 56141498 A JP56141498 A JP 56141498A JP 14149881 A JP14149881 A JP 14149881A JP S6140897 B2 JPS6140897 B2 JP S6140897B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- base material
- nickel
- solar heat
- solution containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 79
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 42
- 238000010521 absorption reaction Methods 0.000 claims description 41
- 229910052759 nickel Inorganic materials 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 39
- 239000010949 copper Substances 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229960004643 cupric oxide Drugs 0.000 claims description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 238000011282 treatment Methods 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 18
- 239000006096 absorbing agent Substances 0.000 claims description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 13
- 229910001431 copper ion Inorganic materials 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 239000003929 acidic solution Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 239000007800 oxidant agent Substances 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 150000001879 copper Chemical class 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 claims description 3
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 2
- 229910001919 chlorite Inorganic materials 0.000 claims 1
- 229910052619 chlorite group Inorganic materials 0.000 claims 1
- 150000004679 hydroxides Chemical class 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000010408 film Substances 0.000 description 24
- 239000013078 crystal Substances 0.000 description 14
- 239000010409 thin film Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 239000011162 core material Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 229940112669 cuprous oxide Drugs 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229960002218 sodium chlorite Drugs 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- 230000005457 Black-body radiation Effects 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
- F24S70/00—Details of absorbing elements
- F24S70/20—Details of absorbing elements characterised by absorbing coatings; characterised by surface treatment for increasing absorption
- F24S70/25—Coatings made of metallic material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
- F24S70/00—Details of absorbing elements
- F24S70/20—Details of absorbing elements characterised by absorbing coatings; characterised by surface treatment for increasing absorption
- F24S70/225—Details of absorbing elements characterised by absorbing coatings; characterised by surface treatment for increasing absorption for spectrally selective absorption
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/40—Solar thermal energy, e.g. solar towers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electroplating Methods And Accessories (AREA)
Description
ãã®çºæã¯ã倪éœç±æž©æ°Žåšãªã©ã«çšãããã倪
éœç±åžåäœã®è£œæ³ã«é¢ãããã®ã§ããã
倪éœãšãã«ã®ãŒã®åžåäœãšããŠã¯ãå¯èŠå
åã
ãã³è¿èµ€å€é åã®é»ç£æ³¢ã«å¯Ÿããåžåçãé«ãã
ãããèµ€å€é åã§ã®æŸå°çã®äœããã®ãèŠæ±ãã
ãã
åŸæ¥ã倪éœãšãã«ã®ãŒãè¯å¥œã«åžåãããã€èµ€
å€é åã§ã®ç±æŸå°ãå°ãªã被èïŒäžè¬ã«éžæåžå
èãšåŒã°ããïŒã衚é¢ã«åœ¢æããŠãªã倪éœç±åžå
äœãçš®ã
èãåºãããŠããããã®ãããªéžæåžå
èãšããŠã¯é
žå第ïŒé
ïŒCU2OïŒè¢«èãé
žå第ïŒ
é
ïŒCUOïŒè¢«èãªã©ã®é
žåé
被èãåºãç¥ãã
ãŠããã
ããããªãããäžèšé
žåé
ãããªãéžæåžåè
ãåºæè¡šé¢ã«åœ¢æããåŸæ¥ã®å€ªéœç±åžåäœã¯ãäž
è¬ã«èç±æ§ãæªããããããšãã°äœ¿çšäžãç±åªäœ
ãå°éãããªãç¶æ
ã§å€ªéœå
ã«æããããªã©ã®ã
ãããšãã«ãã200âãã®é«æž©ã«éããããšãã
ããå£åãèµ·ããããã®ãããè¿èµ€å€åïŒæ³¢é·
0.7ã2.5ãã¯ãã³ïŒã§ã®åžåçãäœäžããã»ãã
äžå°ã®é
æåãé
žåãããŠéžæåžåèã®èåãæ¬¡
第ã«å¢å ãããããèµ€å€é åã«ãããç±æŸå°ãå¢
倧ãããšãããããªåé¡ãçããããšãå€ãã€
ãã
çºæè
ãã¯ããã®ãããªåé¡ã®ãã¡ãèåå¢å
ã®åé¡ã解決ãããããååŠçããã³ç±çã«å®å®
ãªéå±åºæã®è¡šé¢ã«é
ãŸãã¯é
åéãããªãèè
å±€ã圢æãããã®èèå±€ãé
žååŠçããããšã«ã
ã€ãŠéžæåžåèåãè¡ãªãããšãèãåºãããé
ãŸãã¯é
åéã®èèå±€ã®é
æåããã¹ãŠé
žåãã
ãŠããã°ãäžå°ãå®å®ã§ãããããã¯ãèåãå¢
å ããããšããªããèµ€å€é åã«ãããç±æŸå°ãå¢
倧ããããšããªãããã§ãããçºæè
ãã¯ãå®å®
ãªéå±åºæãšããŠå
šäœãããã¯è¡šé¢ã®ã¿ãããã±
ã«ãããªãåºæãçšããããšãšããããã«æ§èœã®
è¯ã倪éœç±åžåäœãåŸãããç ç©¶ãéããããã®
éçšã§ãããã±ã«è¡šé¢ã®åŸ®çްæ§é ã倪éœç±ã®åžå
çã倧ããããããšãèŠåºãããã®ãããªåŸ®çްæ§
é ã广çã«ã€ããåŸãæ¹æ³ãæ¢çŽ¢ããçµæãã€
ãã«ãã®çºæã«å°éããã
ãã®çºæã¯ã以äžã®ãããªäºæ
ã«éã¿ãªããã
ãã®ã§ã倪éœç±ã®åžåçãé«ãããã€èç±æ§ã«ã
ããã倪éœç±åžåäœã广çã«ã€ããåŸã補æ³ã
æäŸãããã®ã§ãããããã«ã€ããŠä»¥äžã«èª¬æã
ãã
ãã®çºæã«ããã倪éœç±åžåäœã®è£œæ³ã¯ãå°ãª
ããšã衚é¢ãããã±ã«ã§ã§ããåºæã®è¡šé¢ã«ãé
ã€ãªã³ãå«ãé
žæ§æº¶æ¶²ãæ¥è§ŠãããŠãäžèšåºæã®
衚é¢ããšããã³ã°ãããšå
±ã«ãã®è¡šé¢ã«é
ãæåº
ããããã®ã®ã¡ãåºæè¡šé¢ã®é
ã¡ããå±€ã«å¯Ÿãé
ž
ååŠçãè¡ãªããé
žå第ïŒé
ã®éžæåžåèãšãã
ããšãç¹åŸŽãšããã
ãã®è£œæ³ã«ãããŠã¯ãéå±åºæãšããŠãå
šäœã
ããã±ã«ãŸãã¯è¡šé¢ã«ããã±ã«èèãæã€åºæã
ããªãã¡å°ãªããšã衚é¢ãããã±ã«ã§ã§ããåºæ
ãçšãããããã±ã«èèãæã€åºæã®è¯æã¯ã©ã®
ãããªãã®ã§ãããããéå±çã®ç±äŒå°åºŠã®é«ã
ãã®ã奜ãŸãããããã±ã«èèã¯ãã¡ããæ³ïŒç
空èžçæ³ïŒã¹ããã¿ãªã³ã°æ³ãªã©ã®æ¹æ³ãçšããŠ
圢æãããã
äžèšããã±ã«åºæïŒããã±ã«èèãæã€åºæã
å«ãïŒã«é
ã®ç¡é»è§£ã¡ãããè¡ãªããããã«åæ
åŠçãæœããŠåºæè¡šé¢ã®é
ã¡ããå±€ãé
žå第ïŒé
ãããªãéžæåžåèãšããããã®ããã«ããã®çº
æã¯ãéžæåžåèãšãªãé
ãããã¯é
åéã®èè
å±€ãé
ã®ç¡é»è§£ã¡ããã«ãã€ãŠã€ãããšããã«ç¹
城ãããã
é
ã¡ããå·¥çšã§ã¯ãããã±ã«åºæãé
ã€ãªã³ã
å«ãé
žæ§æº¶æ¶²ã«æµžæŒ¬ãããªã©ããŠãåºæè¡šé¢ã«é
ã€ãªã³ãå«ãé
žæ§æº¶æ¶²ãæ¥è§Šãããããã«ããã
ãªãããã®åã«ãããã±ã«åºæè¡šé¢ã«ååŠçã
ããšãã°åžç¡é
žãªã©ã®åžé
žã§ããã±ã«è¡šé¢ã掻æ§
åãããªã©ããŠãããŠãããããšã¯å¿è«ã§ããã
åºæè¡šé¢ã«é
ãå«ãé
žæ§æº¶æ¶²ãæ¥è§Šãããšã
NiãšCuã®ã€ãªã³ååŸåã®å·®ã«åºã¥ããããã±ã«
衚é¢ã溶ãã埮现ãªå¹åžæ§é ãã§ãããïŒç²é¢
åïŒãšãšãã«ãåºæè¡šé¢ã«é
ãæåºããŠãé
ãäž»
æåãšããèèå±€ãã§ããã
ããã§çšããé
ã€ãªã³ãå«ãé
žæ§æº¶æ¶²ãšããŠ
ã¯ãç¡«é
žé
CuSO4ïŒç¡é
žé
CuïŒNO3ïŒ2ãŸã
ã¯å¡©åé
CuCl2ã®ãã¡ã®å°ãªããšãïŒçš®ã®é
å¡©
ãå«ã¿ããã€PHã1.0以äžã®ãã®ãçšããã®ãæ
ã奜ãŸãããæµžæŒ¬æéã¯ãé
žæ§æº¶æ¶²ã®æ§è³ªçã«å¿
ããããã±ã«è¡šé¢ãå
åç²é¢åãããããé©åœã«
決ããå¿
èŠãããã
ãã®ããã«ãããã±ã«åºæè¡šé¢ãç²é¢åããŠã
ãã°ãåŸããã倪éœç±åžåäœã®å
åŠçç¹æ§ã«èã
ãå€åãäžããæ§èœãåäžãããã®ã§ããããã
ã第ïŒå³ãçšããŠèª¬æããã
第ïŒå³ã¯ãããã±ã«åºæïŒ£ãšãããã«åçš®ã®åŠ
çãæœããŠåŸã詊æïŒ¡ïŒïŒ¢ïŒïŒ€ã®å
åŠçç¹æ§ãã
ãããã°ã©ãã§ããã
ããã±ã«åºæïŒ£ã¯æ¬¡ã®ããã«ããŠã€ããããã
ã®ã§ãããè¯æãšããŠå·å»¶éŒæ¿ãçšããããã«å
ã¿ïŒãã¯ãã³ïŒ10-6mã以äžãÎŒããšç¥ãïŒã®ã
ãã±ã«ã¡ãããè¡ãªã€ããçšããã¡ããæ¶²ã®çµæ
ãã€ãã«ç€ºãã
ç¡«é
žããã±ã« 240gïŒ
å¡©åããã±ã« 45gïŒ
硌 é
ž 30gïŒ
ãµãã«ãªã³ 0.5ã1.5gïŒ
ãã«ããªã³ ïŒãïŒc.c.ïŒ
詊æïŒ€ã¯ãããã±ã«åºæïŒ£ã®è¡šé¢ã«ãåã¿0.18
ÎŒã®é
žå第ïŒé
èèã圢æãããã®ã§ããããã®
詊æïŒ€ã¯æ¬¡ã®ããã«ããŠã€ãããããã·ã¢ã³åé
ãäž»æåãšããã¡ããæ¶²ãçšããããã±ã«åºæïŒ£
ã«åã¿0.2ÎŒã®é
ã¡ãããè¡ãªã€ããããã§ã¯ã
ããã±ã«åºæïŒ£ã®ç²é¢åãè¡ãªãããªããããã«
äºå¡©çŽ é
žãããªãŠã ïŒNaClO2ïŒ40gïŒæ°Žé
žåãã
ãªãŠã ïŒNaOHïŒ90gïŒæ°Ž1000gãããªãåæåŠç
æ¶²äžã«90âã§ïŒåéæµžæŒ¬ããé
žååŠçãè¡ãªã€
ãã
詊æïŒ¢ãããã±ã«åºæïŒ£ã®è¡šé¢ã«ãåã¿0.18ÎŒ
ã®é
žå第ïŒé
èèã圢æãããã®ã§ãããããã®
å Žåãããã±ã«åºæïŒ£ã®è¡šé¢ãç²é¢åããããã
ãªãã¡ãããã±ã«åºæïŒ£ãïŒïŒ
ç¡é
žïŒåžžæž©ïŒã«ïŒ
åéæµžæŒ¬ããŠãã®è¡šé¢ã掻æ§åããã€ãã«50gïŒ
ã®å¡©åé
ãå«ã氎溶液ïŒPH1.0以äžïŒåžžæž©ïŒã«
ïŒåéæµžæŒ¬ãããããã«ãã€ãŠãåã¿0.2ÎŒã®é
èèã圢æãããã®åŸè©ŠæïŒ€ãšåãããã«ããŠé
ž
ååŠçãè¡ãªã€ãã
詊æïŒ¡ã¯ã€ãã®ããã«ããŠã€ãããããã®ã§ã
ããããªãã¡ã詊æïŒ¢ãïŒééïŒ
å¡©é
žïŒåžžæž©ïŒäž
ã«ïŒåéæµžæŒ¬ããŠãããã±ã«åºæïŒ£è¡šé¢ã®é
žå第
ïŒé
ãæº¶è§£ããåãé€ãããããã§ã¯ã溶åºãã
é
žå第ïŒé
ãåã³é
ãšããŠåºæè¡šé¢ã«åæåºããª
ãããã«æ³šæããããŸã浞挬æéãé·ããªããªã
ããã«ããã
詊æïŒ¡ã¯ãããã±ã«åºæïŒ£ãšåæ§ã«ããã±ã«è¡š
é¢ãæã€ãã®ã§ããããããã±ã«åºæïŒ£ã«æ¯ã¹å€ª
éœç±åžååã§ã®åžåçãéåžžã«é«ããããã¯ãã
ãã±ã«è¡šé¢ãé
ã¡ããã®éã«ç²é¢åãããããã§
ããã
ãã®ãããªç²é¢åããã±ã«è¡šé¢ãäžå°ãšããŠæ
ã€è©ŠæïŒ¢ã¯ãç²é¢åãããªãããã±ã«è¡šé¢ãäžå°
ãšããŠæã€è©ŠæïŒ€ã«æ¯ã¹ãŠå€ªéœç±åžåçãããã
ãŠé«ãããã®ããã«ãããã±ã«åºæè¡šé¢ãç²é¢å
ãããŠã埮现ãªå¹åžãæã€ããã«ãªããšã倪éœç±
åžåäœã®åžåçãé«ããªãã®ã§ããã
é
ãäž»æåãšããèèå±€ã®é
žååŠçã¯ãã€ãã®
ãããªåæåŠçã§è¡ãªãã®ããããããªãã¡ãã
ã®é
žååŠççšåæåŠçæ¶²ã¯ãé
žåå€ãšã¢ã«ã«ãªæ·»
å å€ãšã®æ··å氎溶液ããŸãã¯ãã®æ··å氎溶液ã«é
ã€ãªã³ãæ·»å ãããã®ã§ãããé
žåå€ãšããŠã¯ã
äºå¡©çŽ é
žãããªãŠã ïŒNaClO2ïŒïŒæ¬¡äºå¡©çŽ é
žãã
ãªãŠã ïŒNaClOïŒïŒéç¡«é
žã«ãªãŠã ïŒK2S2O8ïŒïŒ
éç¡«é
žãããªãŠã ïŒNa2S2O8ïŒïŒéç¡«é
žã¢ã³ã¢ã
ãŠã ãïŒNH4ïŒ2S2O8ããªã©ã®äºå¡©çŽ é
žå¡©ïŒæ¬¡äºå¡©çŽ
é
žå¡©ãŸãã¯éç¡«é
žå¡©ãçšããããã¢ã«ã«ãªæ·»å å€
ãšããŠã¯æ°Žé
žåãããªãŠã ïŒNaOHïŒïŒæ°Žé
žåã«
ãªãŠã ïŒKOHïŒãªã©ãçšãããããé
žåå€ãšã
ãŠNaClO2ãããŸãã¢ã«ã«ãªæ·»å å€ãšããŠNaOH
ãçšããã®ãå®çšçã«æãããããŠãããåæåŠ
çæ¶²äžã®é
žåå€ãšã¢ã«ã«ãªæ·»å å€ã®å«æéã¯ãæ°Ž
1000gã«å¯Ÿããæ·»å éãã¢ã«ã«ãªæ·»å å€xgãé
žå
å€ygãšãããšãã€ãã®ïŒåŒãåæã«æºè¶³ããã
ããªéãšããã
ïœâŠ125
ïœâ§15
ïœâŠïŒïŒïŒïŒïŒïœâïŒ
åæåŠçæ¶²äžã®é
ã€ãªã³æ¿åºŠã¯500ppm以äžãš
ããã®ã广çã§ãããé
ã€ãªã³ãå¿
ãããå«ãŸ
ããå¿
èŠã¯ãªãããäžèšæ¿åºŠç¯å²ã®é
ã€ãªã³ã®å
åšã«ãããCuOéžæåžåèã®å
åŠçç¹æ§ãåäž
ããããšãå®éšçã«ç¢ºããããããåæåŠçæ¶²äž
ãžã®é
ã€ãªã³ã®æ·»å æ¹æ³ã¯èªç±ã§ãã€ããããšã
ã°ç¡«é
žé
ïŒCuSO4ïŒïŒç¡é
žé
ïŒCuïŒNO3ïŒ2ïŒïŒå¡©
åé
ïŒCuCl2ïŒãªã©é
å¡©ã®æ°Žæº¶æ¶²ãåŸ®éæ·»å ãã
ãšããæ¹æ³ã«ãã€ãŠãããããŸãéå±é
ãåæåŠ
çæ¶²äžã«æµžæŒ¬ãããã®æ¶²ã§åŠçããããšã«ãã€ãŠ
é
ã€ãªã³ãå¢å ããããšããæ¹æ³ã«ãã€ãŠãã
ãã
ãã®ãããªåæåŠçæ¶²ãçšããŠé
žååŠçãæœã
ã°ãåèšé
ãŸãã¯é
åéãããªãèèå±€ã¯ãé·åŸ
æ¹åã®é·ãïŒãã€ãšãé·ãéšåã®é·ãïŒãã»ãŒ
0.6ã2.0ÎŒã®ãããããç¹ç¶ç¶ãªããèç¶ãåã
ãé
žå第ïŒé
çµæ¶ãããªãéžæåžåèãšãªããç¹
ç¶ç¶ãªããèç¶ã®çµæ¶ã¯ãäžã€ã®ç¹ç¶ç¶ãªããè
ç¶çµæ¶ããå¥ã®ç¹ç¶ç¶ãªããèç¶çµæ¶ãæé·ãã
ããšãããããããã€ãŠããã®ãããªå Žåã«ã¯ã
é·åŸæ¹åé·ãã¯ãåã
ã®çµæ¶ã§ã¿ãããšã«ãªãã
ãã®ãããªçµæ¶ã®é·åŸæ¹åé·ããæã€éžæåžå
èã¯åžåçã倧ããããã®çç±ã¯æ¬¡ã®ãšããã§ã
ããé
žå第ïŒé
çµæ¶ãããªãéžæåžåèã§ã¯äžè¬
ã«ã0.7Ό以äžã®æ³¢é·ã®ããããè¿èµ€å€é åã§ã®
åžåçãäœäžãããããã®äœäžã®åºŠåãã¯éžæåž
åèã®èåãåŸ®å°æ§é ã«ãã€ãŠå€§ãã圱é¿ããã
çµæ¶ã®é·åŸæ¹åé·ãã0.6Ό以äžã®ãã®ãæãäœ
äžãå°ãªããããã¯ãè¿èµ€å€é åïŒæ³¢é·0.7ã2.5
ÎŒïŒã®å
ã«å¯Ÿããäžèšçµæ¶ã®é·ãã0.3Ό以äžã§
ããã°å¹ŸäœåŠçã«å¹³ããªé¢ãšãªããã0.6Ό以äž
ã§ããã°å€éåå°ãèµ·ãããŠåžåçãåäžããã
ãã§ããããšèããããããªããå®éšã®çµæã§
ã¯ãäžèšçµæ¶é·ã0.6ã2.0ÎŒã®ç¯å²ã«ãããŠã¯ã
ãã以äžåžåçãåäžããããšã¯ãªãã€ããéžæ
åžåèäžã«é
ïŒCuïŒãŸãã¯é
žå第ïŒé
ïŒCu2OïŒ
ãæ®çãããšã䜿çšäžã«å£åããã®ã§ãäžèšé
žå
åŠçã¯å
åã«è¡ãªãå¿
èŠããããããããåŸ®éæ®
çãããšããŠã倧ããªåœ±é¿ã¯ãªãã
CuOå±€ã«Cu2OãååšããŠããå Žåã«ã€ããŠè¿°
ã¹ããšããã®å Žåã«ã¯åæç¹æ§ã¯éåžžã«è¯ãã
Cu2Oãååšãããšãè¿èµ€å€åã§ã®åžåçãé«ã
ãªãããã§ãããããããç±ïŒ150ã200âïŒãå
ãããšããã®Cu2Oã¯CuOã«å€åããŠããã®ãšã
ã«ã¯ç¹ç¶ç¶ãããã¯èç¶ã§ãªãç²ç¶ã®çµæ¶ã«ãª
ããå£åãæ¿ãããªãããã®ãããæåããç¹ç¶
ç¶ãããã¯èç¶ã®CuOã®ã¿ãããªãå Žåã«æ¯
ããçµå±ãè¿èµ€å€åã§ã®åžåçãæªããªãã
CuOå±€äžã«Cuãæ®ã€ãŠãããšãè¿èµ€å€åã§ã®åž
åçã®äœäžãèµ·ããããšã¯å¿è«ãèåå¢ã«ããæŸ
å°çã®å¢å€§ãèµ·ããã
éžæåžåèã®åã¿ã¯ã0.03ã1.0ÎŒãšããã®ã
奜ãŸããããã®èåã¯ãéåžžãé»è§£ç°å
æ³ãªã©ã«
ãã€ãŠåŽå®ãããããã空éãªããå¹åžã®ãªãå¹³
ããªå±€ã®åã¿ã«æç®ããŠããããããã®ã§ããã
éžæåžåèã®åã¿ã0.03ÎŒæªæºã§ããã°ã倪éœç±
ã®åžåçãå°ãããªããéã«1.0ÎŒãããåãã
ããšæŸå°çã倧ãããªããé»è²ãã€ã³ããšåãã
ãã«ãªããç·åçã«ã¿ãŠåžåå¹çãäœäžããã
ã€ãã«ããã®çºæã®å®æœäŸããã³æ¯èŒäŸã«ã€ã
ãŠèª¬æããã
ã宿œäŸããã³æ¯èŒäŸã
å·å»¶éŒæ¿è¡šé¢ã«ãNiSO4ã»7H2O 300gïŒïŒ
NiCl2ã»6H2O 50gïŒïŒH3BO3 50gïŒãå«ãã¯
ããæµŽãçšãã黿µå¯åºŠ3AïŒdm2ïŒã¡ããæé
15åã®æ¡ä»¶ã§ããã±ã«ã¡ãããæœããåã¿ïŒÎŒã®
ããã±ã«ã¡ããå±€ã圢æããã
ã€ãã«ããã®ããã±ã«ã¡ãããããåºæã5wt
ïŒ
âHNO3ïŒåžžæž©ïŒã«ïŒåéæµžæŒ¬ããŠæŽ»æ§åãã
第ïŒè¡šã®æ¡ä»¶ã§ãããããããã±ã«ã¡ããå±€ã®è¡š
é¢ã«é
ã¡ããå±€ã圢æããããã®éãæ¯èŒäŸïŒã§
ã¯ããã±ã«è¡šé¢ãç²é¢åãããŠããããŸãæ¯èŒäŸ
ïŒã§ãç²é¢åããªãããªãã€ãããã®åŸãåŸãã
ãé
ã¡ããåºæããNaClO2 70gïŒNaOH 90gïŒ
æ°Ž1000gãããªã液枩95âã®åæåŠçæ¶²ã«10åé
浞挬ããŠé
žååŠçãè¡ãªãã第ïŒè¡šã«ç€ºããã
ãªãé
žå第ïŒé
ïŒCuOïŒãããªãéžæåžåèã
åºæè¡šé¢ã«ããªãã倪éœç±åžåäœãåŸããå倪éœ
ç±åžåäœã®å
åŠçç¹æ§ã¯ç¬¬ïŒè¡šã«ç€ºãéãã§ãã€
ãã
The present invention relates to a method for manufacturing a solar heat absorber used in solar water heaters and the like. As an absorber of solar energy, it has a high absorption rate for electromagnetic waves in the visible light region and near-infrared region.
Moreover, it is required to have low emissivity in the infrared region. Conventionally, various solar heat absorbers have been devised that have coatings on their surfaces that absorb solar energy well and emit little heat in the infrared region (generally called selective absorption coatings). As a selective absorption film, a cuprous oxide (CU 2 O) film or a cupric oxide film is used.
Copper oxide coatings such as copper (CUO) coatings are widely known. However, conventional solar heat absorbers in which a selective absorption film made of copper oxide is formed on the surface of a base material generally have poor heat resistance, so that they may be exposed to sunlight without conducting a heat medium during use. As a result, temperatures can sometimes reach temperatures as high as 200°C, causing deterioration. Therefore, near-infrared region (wavelength
0.7 to 2.5 microns), the absorption rate decreases, and
Since the underlying copper component is oxidized and the thickness of the selective absorption film gradually increases, problems such as increased heat radiation in the infrared region often occur. Among these problems, in order to solve the problem of increased film thickness, the inventors formed a thin film layer of copper or copper alloy on the surface of a chemically and thermally stable metal base material. We devised a method of forming a selective absorption film by oxidizing the layer. This is because if all the copper components in the copper or copper alloy thin film layer are oxidized, the underlying layer is stable, so the film thickness will no longer increase, and heat radiation in the infrared region will not increase. The inventors decided to use a base material whose entire or only surface is made of nickel as a stable metal base material, and conducted repeated research to obtain a solar heat absorber with even better performance. In the process, they discovered that the fine structure of the nickel surface increases the absorption rate of solar heat, and as a result of searching for a method to effectively create such a fine structure, they finally arrived at this invention. This invention was made in view of the above circumstances, and provides a manufacturing method that can effectively produce a solar heat absorber that has a high solar heat absorption rate and excellent heat resistance. This will be explained below. The method for manufacturing a solar heat absorber according to the present invention includes etching the surface of the base material and depositing copper on the surface by contacting an acidic solution containing copper ions with at least the surface of a base material made of nickel. After that, the copper plating layer on the surface of the base material is subjected to an oxidation treatment to form a selective absorption film of cupric oxide. In this manufacturing method, the metal substrate is made entirely of nickel or has a thin nickel film on its surface;
That is, a base material whose at least the surface is made of nickel is used. The core material of the base material having the nickel thin film may be any material, but it is preferably a material with high thermal conductivity such as metal. The nickel thin film is formed using methods such as plating, vacuum evaporation, and sputtering. The above-mentioned nickel base material (including a base material having a nickel thin film) is electrolessly plated with copper and further subjected to a chemical conversion treatment to form the copper plating layer on the surface of the base material into a selective absorption film made of cupric oxide. As described above, the present invention is characterized in that the thin film layer of copper or copper alloy, which becomes the selective absorption film, is formed by electroless plating of copper. In the copper plating step, the nickel base material is immersed in an acidic solution containing copper ions to bring the surface of the base material into contact with the acidic solution containing copper ions. Before that, the surface of the nickel base material is pretreated.
Of course, the nickel surface may be activated with a dilute acid such as dilute nitric acid. When an acidic solution containing copper comes into contact with the surface of the base material,
Based on the difference in ionization tendency between Ni and Cu, the nickel surface melts, forming a fine uneven structure. Along with this (roughening), copper is deposited on the surface of the base material, forming a thin film layer containing copper as the main component. The acidic solution containing copper ions used here includes at least one copper salt selected from copper sulfate CuSO 4 , copper nitrate Cu(NO 3 ) 2 or copper chloride CuCl 2 and has a pH of 1.0 or less. Most preferably, it is used. The immersion time must be appropriately determined depending on the properties of the acidic solution, etc. so that the nickel surface is sufficiently roughened. In this way, by roughening the surface of the nickel base material, the optical properties of the resulting solar heat absorber are significantly changed and its performance is improved. This will be explained using FIG. FIG. 1 is a graph showing the optical characteristics of nickel base material C and samples A, B, and D obtained by subjecting it to various treatments. Nickel base material C was made as follows. A cold-rolled steel plate was used as the core material, and nickel plating was applied to the core material to a thickness of 5 microns (10 -6 m, hereinafter abbreviated as "Ό"). The composition of the plating solution used is shown below. Nickel sulfate 240g / Nickel chloride 45g / Boric acid 30g / Satucharin 0.5-1.5g / Formalin 1-2 c.c. / Sample D was coated on the surface of nickel base material C with a thickness of 0.18
A cupric oxide thin film of Ό is formed. This sample D was made as follows. Using a plating solution containing copper cyanide as the main component, nickel base material C
Copper plating was applied to a thickness of 0.2Ό. here,
The surface of the nickel base material C is not roughened. Further, oxidation treatment was carried out by immersing it at 90° C. for 5 minutes in a chemical conversion treatment solution consisting of 40 g of sodium chlorite (NaClO 2 ), 90 g of sodium hydroxide (NaOH), and 1000 g of water. Sample B also has a thickness of 0.18Ό on the surface of nickel base material C.
In this case, the surface of the nickel base material C was roughened. In other words, nickel base material C is diluted with 5% nitric acid (at room temperature) for 1
Activate the surface by soaking for a minute, then add 50g/
The sample was immersed in an aqueous solution containing copper chloride (pH 1.0 or less, room temperature) for 5 minutes. In this way, a copper thin film with a thickness of 0.2 ÎŒm was formed, and then oxidation treatment was performed in the same manner as Sample D. Sample A was prepared as follows. That is, sample B was immersed in 5% by weight hydrochloric acid (at room temperature) for 1 minute to dissolve and remove cupric oxide on the surface of nickel base material C. Here, care was taken to prevent the eluted cupric oxide from re-precipitating as copper on the surface of the substrate, and the immersion time was not made too long. Sample A has a nickel surface like nickel base material C, but has a much higher absorption rate in the solar heat absorption region than nickel base material C. This is because the nickel surface was roughened during copper plating. Sample B, which has such a roughened nickel surface as its base, has a much higher solar heat absorption rate than sample D, which has a non-roughened nickel surface as its base. In this way, when the surface of the nickel base material is roughened and has fine irregularities, the absorption rate of the solar heat absorber increases. The oxidation treatment of the thin film layer containing copper as a main component is preferably carried out by the following chemical conversion treatment. That is, this chemical conversion treatment liquid for oxidation treatment is a mixed aqueous solution of an oxidizing agent and an alkaline additive, or a mixed aqueous solution to which copper ions are added, and as the oxidizing agent,
Sodium chlorite (NaClO 2 ), sodium hypochlorite (NaClO), potassium persulfate (K 2 S 2 O 8 ),
Chlorites, hypochlorites, or persulfates such as sodium persulfate (Na 2 S 2 O 8 ) and ammonium persulfate [(NH 4 ) 2 S 2 O 8 ] are used, and as alkaline additives, Sodium hydroxide (NaOH), potassium hydroxide (KOH), etc. are used. NaClO2 as oxidizing agent and NaOH as alkaline additive
It is practically best to use The content of oxidizing agent and alkaline additive in the chemical treatment solution is
Assuming that the amounts added to 1000g are xg of the alkaline additive and yg of the oxidizing agent, the amounts should be such that they simultaneously satisfy the following three equations. xâŠ125 yâ§15 yâŠ25/24x-5 It is effective to set the copper ion concentration in the chemical conversion treatment liquid to 500 ppm or less. Although it is not necessarily necessary to include copper ions, it has been experimentally confirmed that the presence of copper ions in the above concentration range improves the optical properties of the CuO selective absorption film. The method of adding copper ions to the chemical conversion treatment solution was free. For example, it may be possible to add a trace amount of an aqueous solution of copper salt such as copper sulfate (CuSO 4 ), copper nitrate (Cu(NO 3 ) 2 ), or copper chloride (CuCl 2 ), or by adding metallic copper to the chemical conversion treatment solution. Alternatively, the copper ions may be increased by immersing the material in water and treating it with this solution. If oxidation treatment is performed using such a chemical conversion treatment solution, the thin film layer made of copper or copper alloy will have a length in the long axis direction (the length of the longest part) of approximately
The selective absorption film is made of cupric oxide crystals having a diameter of 0.6 to 2.0 ÎŒm and approximately fibrous or leaf-like. Regarding fibrous or foliar crystals, other fibrous or foliar crystals may grow from one fibrous or foliar crystal. Therefore, in such a case,
The length in the major axis direction is determined for each individual crystal. A selective absorption film having such a length in the long axis direction of the crystal has a high absorption rate. The reason is as follows. In general, a selective absorption film made of cupric oxide crystals has a reduced absorption rate in the so-called near-infrared region with a wavelength of 0.7Ό or more, but the degree of this reduction depends on the thickness and microstructure of the selective absorption film. greatly influenced,
The decrease is the least when the length of the crystal in the major axis direction is 0.6Ό or more. This is in the near-infrared region (wavelength 0.7 to 2.5
If the length of the crystal is 0.3Ό or less, it will be a geometrically flat surface, but if it is 0.6Ό or more, multiple reflections will occur and the absorption rate will improve. Conceivable. In addition, according to the experimental results, when the crystal length is in the range of 0.6 to 2.0Ό,
The absorption rate did not improve any further. Copper (Cu) or cuprous oxide (Cu 2 O) in the selective absorption film
If it remains, it will deteriorate during use, so the above oxidation treatment must be carried out sufficiently. However, even if a small amount remains, it will not have a major effect. Regarding the case where Cu 2 O is present in the CuO layer, the initial characteristics are very good in this case.
This is because the presence of Cu 2 O increases the absorption rate in the near-infrared region. However, when subjected to heat (150 to 200°C), this Cu 2 O changes to CuO, and in this case, it becomes granular crystals instead of fibrous or leaf-like, and the deterioration becomes severe. Therefore, the absorption rate in the near-infrared region ends up being worse than when it is made of only fibrous or leaf-like CuO from the beginning.
If Cu remains in the CuO layer, not only the absorption rate in the near-infrared region will decrease, but also the emissivity will increase due to the increase in film thickness. The thickness of the selective absorption membrane is preferably 0.03 to 1.0Ό. Since this film thickness is usually determined by the electrolytic cyclic method, it is expressed in terms of the thickness of a flat layer without voids or irregularities.
If the thickness of the selective absorption film is less than 0.03Ό, the absorption rate of solar heat will be small. On the other hand, if it is thicker than 1.0Ό, the emissivity will increase, similar to black paint, and the overall absorption efficiency will decrease. Next, examples and comparative examples of the present invention will be described. [Example and Comparative Example] 300 g of NiSO 4 7H 2 O/,
Using a Watts bath containing NiCl 2 6H 2 O 50g/, H 3 BO 3 50g/, current density 3A/dm 2 , plating time
Nickel plating was applied for 15 minutes to form a nickel plating layer with a thickness of 5 ÎŒm. Next, 5wt of this nickel-plated base material
Activated by immersing in %-HNO 3 (room temperature) for 1 minute,
A copper plating layer was formed on the surface of the nickel plating layer under the conditions shown in Table 1. At this time, the nickel surface was not roughened in Comparative Example 1, and was not roughened in Comparative Example 2 as well. After that, the obtained copper plating base material was treated with 70g of NaClO 2 , 90g of NaOH,
The substrate was oxidized by immersion in a chemical conversion solution containing 1000 g of water at a temperature of 95°C for 10 minutes, and a selective absorption film made of cupric oxide (CuO) as shown in Table 2 was provided on the surface of the substrate. Obtained a solar heat absorber. The optical properties of each solar heat absorber were as shown in Table 3.
ã衚ããtableã
ã衚ããtableã
ã衚ããtableã
ã衚ã
(泚) åã¿ã®è©Šé𿹿³ã¯åŸèš
[Table] (Note) The thickness test method is described later.
ã衚ã
(泚) åžåçãæŸå°çã®è©Šé𿹿³ã¯åŸèš
第ïŒè¡šããããããããã«ã宿œäŸã¯ããã
ããæ¯èŒäŸã«æ¯ã¹åæç¹æ§ã§ã®åžåçãé«ãããŸ
ããèç±æ§ã«ããããŠãããããé«åžåçãä¿
ã¡ããã®å£åãèŠãããªãã
以äžã®èª¬æããæãããªããã«ããã®çºæã«ã
ãã倪éœç±åžåäœã®è£œæ³ã«ããã°ã倪éœç±ã®åžå
å¹çãè¯å¥œã§ãèç±æ§ã«ãããã倪éœç±åžåäœã
ããŸã補é ããããšãã§ããã®ã§ããã
第ïŒè¡šïŒç¬¬ïŒè¡šã®è©Šé𿹿³ã¯æ¬¡ã®ãšããã§ã
ãã
ïŒè©Šé𿹿³ïŒ
é
ã¡ããåïŒäžå€®è£œäœæè£œé»è§£åŒèååŽå®åšã
䜿çšããã
CuOèåïŒå®é»æµç°å
æ³ãçšããã
çµæ¶é·ïŒCuO圢æåæïŒCuOçµæ¶ããŸã ããª
ãšãïŒã«é»åé¡åŸ®é¡åçã«ããé·åŸæ¹
åã®é·ããæž¬å®ãããCuOçµæ¶ã¯ã
æéïŒæ¹¿åºŠã«é¢ä¿ãªããåæåŠçæ¶²ã®
çµæã«ããå®ãŸãã®ã§ããã®æ¹æ³ã«ã
ã€ãŠããã
ïŒâ«ïŒïŒïŒ ïŒïŒïŒã¯å€ªéœå
ã®ã¹ãã¯ãã«é åã0.3ã2
.5
ÎŒã«95ïŒ
ååšããããšã«åºã¥ãïŒ
ããã§Î±ïŒåžåçïŒå€ªéœå
šãšãã«ã®ãŒã«å¯Ÿã
ãïŒ
αãïŒæ³¢é·Î»ã§ã®åžåç
ãïŒå€ªéœå
ã®æ³¢é·Î»ã®æŸå°åŒ·åºŠ
ããã§ÎµïŒæŸå°çïŒé»äœæŸå°å
šãšãã«ã®ãŒã«å¯Ÿ
ããïŒ
ãTïŒ150ïŒ150âã®é»äœããã®æ³¢é·Î»ã®
æŸå°åŒ·åºŠ
εãïŒæ³¢é·Î»ã®æŸå°çïŒé»äœã«å¯ŸããïŒ
ãªããèµ€å€åå
å
床èšã§èµ€å€åã®åå°çãã
枬å®ããεãïŒïŒâλãšããã[Table] (Note) The test methods for absorption rate and emissivity are described later.As can be seen from Table 3, all of the examples have higher absorption rates in their initial characteristics than the comparative examples. In addition, because it has excellent heat resistance, it maintains a high absorption rate and does not show any deterioration. As is clear from the above description, according to the method for manufacturing a solar heat absorber according to the present invention, it is possible to successfully produce a solar heat absorber with good solar heat absorption efficiency and excellent heat resistance. The test methods in Tables 2 and 3 are as follows. (Test method) Copper plating thickness: An electrolytic film thickness gauge manufactured by Chuo Seisakusho was used. CuO film thickness: Constant current ring method was used. Crystal length: At the early stage of CuO formation (when CuO crystals are mottled), the length in the major axis direction was measured using an electron micrograph. CuO crystal is
This method may be used because it is determined by the composition of the chemical conversion treatment liquid regardless of time and humidity. (â« 2.5 0.3 means that the spectral range of sunlight is 0.3 to 2
.Five
Based on 95% presence in ÎŒ) where α: Absorption rate (relative to total solar energy) αã: Absorption rate at wavelength λ Iã: Radiation intensity at wavelength λ of sunlight Here, ε: Emissivity (relative to the total energy of black body radiation) Sã T = 150; Radiation intensity at wavelength λ from a black body at 150â ε = Emissivity at wavelength λ (relative to black body) In addition, infrared spectroscopy The reflectance Pã in the infrared region was measured with a photometer, and it was set as εã=1âPλ.
第ïŒå³ã¯ãããã±ã«åºæã®è¡šé¢ç¶æ
ãå
åŠçç¹
æ§ã«åãŒã圱é¿ã説æããããã®ã°ã©ãã§ããã
FIG. 1 is a graph for explaining the influence of the surface condition of a nickel base material on optical properties.
Claims (1)
é¢ã«ãé ã€ãªã³ãå«ãé žæ§æº¶æ¶²ãæ¥è§ŠãããŠãäž
èšåºæã®è¡šé¢ããšããã³ã°ãããšå ±ã«ãã®è¡šé¢ã«
é ãæåºããããã®ã®ã¡ãåºæè¡šé¢ã®é ã¡ããå±€
ã«å¯Ÿãé žååŠçãè¡ãªããé žå第ïŒé ã®éžæåžå
èãšããããšãç¹åŸŽãšãã倪éœç±åžåäœã®è£œæ³ã ïŒ é ã€ãªã³ãå«ãé žæ§æº¶æ¶²ããç¡«é žé ïŒç¡é ž
é ããã³å¡©åé ã®äžããéžã°ããå°ãªããšã
ïŒçš®ã®é å¡©ãå«ã¿ããã€PHã1.0以äžã®ãã®ã§ã
ãç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé èšèŒã®å€ªéœç±åžåäœã®è£œ
æ³ã ïŒ é ã¡ããå±€ã«å¯Ÿããé žååŠçããåæåŠçæ¶²
ãšããŠãäºå¡©çŽ é žå¡©ïŒæ¬¡äºå¡©çŽ é žå¡©ããã³éç¡«é ž
å¡©ã®äžããéžã°ããå¡©ãããªãé žåå€ãæ°Žé žåã
ããªãŠã ããã³æ°Žé žåã«ãªãŠã ã®äžããéžã°ãã
æ°Žé žåç©ãããªãã¢ã«ã«ãªæ·»å å€ããã³ïŒã
500ppmã®é ã€ãªã³ãå«ã¿ããã€æ°Ž1000gã«å¯Ÿã
ãã¢ã«ã«ãªæ·»å å€ã®æ·»å éãxgãé žåå€ã®æ·»å
éãygãšãããšããããïœïŒïœãäžèšã®ïŒåŒã
åæã«æºè¶³ããç¯å²å ã«ããæ°Žæº¶æ¶²ãçšããŠè¡ãª
ãããç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé ãŸãã¯ç¬¬ïŒé èšèŒã®
倪éœç±åžåäœã®è£œæ³ã ïœâŠ125 ïœâ§15 ïœâŠïŒïŒïŒïŒïŒïœâïŒ[Claims] 1. An acidic solution containing copper ions is brought into contact with the surface of a base material at least the surface of which is made of nickel, etching the surface of the base material and depositing copper on this surface, and then . A method for producing a solar heat absorber, characterized in that a copper plating layer on the surface of a base material is subjected to oxidation treatment to form a selective absorption film of cupric oxide. 2. The acidic solution containing copper ions contains at least one copper salt selected from copper sulfate, copper nitrate, and copper chloride, and has a pH of 1.0 or less. Manufacturing method for solar heat absorbers. 3 Oxidation treatment for the copper plating layer is carried out using an oxidizing agent consisting of a salt selected from chlorite, hypochlorite and persulfate, sodium hydroxide and potassium hydroxide as a chemical conversion treatment liquid. Alkaline additives consisting of selected hydroxides and 0-
Use an aqueous solution that contains 500 ppm of copper ions, and where x and y are within a range that simultaneously satisfies the following three formulas, where xg is the amount of alkaline additive added and yg is the amount of oxidizing agent added to 1000 g of water. A method for manufacturing a solar heat absorber according to claim 1 or 2. xâŠ125 yâ§15 yâŠ25/24x-5
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56141498A JPS5843357A (en) | 1981-09-07 | 1981-09-07 | Manufacture of solar heat absorber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56141498A JPS5843357A (en) | 1981-09-07 | 1981-09-07 | Manufacture of solar heat absorber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5843357A JPS5843357A (en) | 1983-03-14 |
| JPS6140897B2 true JPS6140897B2 (en) | 1986-09-11 |
Family
ID=15293333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56141498A Granted JPS5843357A (en) | 1981-09-07 | 1981-09-07 | Manufacture of solar heat absorber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5843357A (en) |
-
1981
- 1981-09-07 JP JP56141498A patent/JPS5843357A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5843357A (en) | 1983-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2369620A (en) | Method of coating cupreous metal with tin | |
| US4511614A (en) | Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same | |
| EP0146152B1 (en) | Solderable palladium-nickel coatings | |
| US4163083A (en) | Process for improving corrosion resistant characteristics of chrome plated aluminum and aluminum alloys | |
| US3726771A (en) | Process for chemical nickel plating of aluminum and its alloys | |
| US3489657A (en) | Process for producing solderable aluminum materials | |
| JPS61253383A (en) | Formation of black film | |
| Patel et al. | Optimization and thermal degradation study of black nickel solar collector coatings | |
| JPS6140897B2 (en) | ||
| JP3247517B2 (en) | Plating method of titanium material | |
| US3505181A (en) | Treatment of titanium surfaces | |
| JPS59107069A (en) | Non-electrolytic direct gold plating on vacuum evaporation ceramic | |
| JPS60211097A (en) | Electrochemical and chemical coating methods for niobium | |
| JPS6138783B2 (en) | ||
| JP2962496B2 (en) | Magne-based alloy plating method | |
| JPH0280582A (en) | Base material having black body film and production of base material fitted with black body film thereof | |
| US4904353A (en) | Optically black cobalt surface | |
| JPS6311429B2 (en) | ||
| JPH06256963A (en) | Electroless Ni-Sn-P alloy plating solution | |
| CN101736329A (en) | Polyimide film activation solution and method for metalizing polyimide film | |
| JPS5858296A (en) | Method for plating stainless steel blank with gold | |
| JPH04311575A (en) | Method for treating and conditioning surface of magnesium alloy | |
| JPS6046186B2 (en) | Activation method for amorphous metal surfaces | |
| WO2005014881A2 (en) | Production method of substrate with black film and substrate with black film | |
| KR102641511B1 (en) | Electroless plating solution and method of copper electroplating |