JPS6140930B2 - - Google Patents
Info
- Publication number
- JPS6140930B2 JPS6140930B2 JP56193897A JP19389781A JPS6140930B2 JP S6140930 B2 JPS6140930 B2 JP S6140930B2 JP 56193897 A JP56193897 A JP 56193897A JP 19389781 A JP19389781 A JP 19389781A JP S6140930 B2 JPS6140930 B2 JP S6140930B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- conductive
- lead
- electrodes
- support base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Description
【発明の詳細な説明】
本発明は赤外線検出素子に関するもので、リー
ド線を使用しないようにすることにより機械的な
振動に対して十分な強度をもたせ、高信頼性を実
現する赤外線検出素子を得ることを目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an infrared detection element, and provides an infrared detection element that has sufficient strength against mechanical vibration and achieves high reliability by not using lead wires. The purpose is to obtain.
一般に焦電型赤外線検出素子は、焦電係数の大
きな誘電体単結晶を、10〜30ミクロンと薄く研磨
した薄膜、あるいは焦電効果を有する高分子薄膜
の両面にAu、Ni−Cr、Al等の金属を蒸着し電極
とし、次に各電極にリード線を設けて構成し、赤
外線射照によつて素子が温度上昇し、この温度変
化による焦電効果として素子両面上の電極間に生
じる電圧を検出する。 In general, pyroelectric infrared detection elements are made by polishing a dielectric single crystal with a large pyroelectric coefficient to a thin film of 10 to 30 microns, or by coating both sides of a polymer thin film with a pyroelectric effect such as Au, Ni-Cr, Al, etc. The element is constructed by vapor-depositing metal to form electrodes, and then providing lead wires for each electrode.The temperature of the element increases due to infrared irradiation, and the voltage generated between the electrodes on both sides of the element as a pyroelectric effect due to this temperature change. Detect.
このような焦電型赤外線検出素子の従来例を第
１図に示す。図において、１は焦電効果を有する
薄膜素子で、両面に、Au、Ni−Cr、Al等の金属
電極２，２１が蒸着されている。５は熱伝導性の
悪い絶縁体の支持台、６は金属パツケージ、７，
７１はリード取り出し端子、１０は絶縁体であ
る。電極２，２１よりリード線８，８１を設ける
には、超音波ボンデイングや導電性接着剤により
あらかじめ素子１の電極２，２１にある長さのリ
ード線８，８１を取り出し、素子１の熱容量を増
やさない様に素子１を絶縁物で出来た支持台５の
上に、接着剤９で点接触保持した後、金属パツケ
ージ６のリード取り出し端子７，７１とリード線
８，８１とを、超音波ボンデイングや導電性接着
剤を用いて結線する方法が取られている。しか
し、超音波ボンデイングによる結線は、リード線
８，８１に超音波の圧力荷重を加えリード線８，
８１を極度に変形させて圧着することにより結合
しているため、リード線８，８１は結合部分が細
くなり機械的振動に対して非常に弱くなつてしま
う。 A conventional example of such a pyroelectric infrared detection element is shown in FIG. In the figure, reference numeral 1 denotes a thin film element having a pyroelectric effect, and metal electrodes 2 and 21 made of Au, Ni-Cr, Al, etc. are deposited on both sides. 5 is a support base made of an insulator with poor thermal conductivity, 6 is a metal package, 7,
71 is a lead extraction terminal, and 10 is an insulator. To provide the lead wires 8, 81 from the electrodes 2, 21, take out the lead wires 8, 81 of the same length from the electrodes 2, 21 of the element 1 in advance using ultrasonic bonding or conductive adhesive, and then set the heat capacity of the element 1. After holding the element 1 in point contact with the adhesive 9 on the support base 5 made of an insulator so as not to increase the number of parts, the lead take-out terminals 7, 71 of the metal package 6 and the lead wires 8, 81 are connected using ultrasonic waves. A method of connecting wires using bonding or conductive adhesive is used. However, connection by ultrasonic bonding involves applying an ultrasonic pressure load to the lead wires 8 and 81.
Since the lead wires 8 and 81 are connected by crimping after being extremely deformed, the connected portions of the lead wires 8 and 81 become thin and become extremely vulnerable to mechanical vibration.
また、リード取り出し端子７，７１と素子１と
は絶縁物で出来た支持台５で金属パツケージ６と
一体となつているので機械的な振動が与えられた
時の動きは同じであるがリード取り出し端子７，
７１と素子１とを結んでいるリード線８，８１に
対する衝撃の影響はかならずしも同一とは限ら
ず、超音波ボンデイングや導電性接着剤で結線し
た結合部分は振動の衝撃が一点に加わるため切断
したり、結合部分からリード線８，８１がはずれ
たりして素子１の電極２，２１間に生じる電圧を
検出することが不可能となつてしまう。 In addition, since the lead extraction terminals 7, 71 and the element 1 are integrated with the metal package 6 on the support base 5 made of an insulator, the movement when mechanical vibration is applied is the same, but the lead extraction terminals 7 and 71 and the element 1 are terminal 7,
The effects of impact on the lead wires 8 and 81 that connect 71 and element 1 are not necessarily the same, and the bonded portions connected using ultrasonic bonding or conductive adhesive may not be cut because the vibration impact is applied to one point. Otherwise, the lead wires 8, 81 may come off from the joint, making it impossible to detect the voltage generated between the electrodes 2, 21 of the element 1.
本発明は、以上のような欠点を除去したもの
で、リード線を使用せず、素子及びリード取り出
し端子、パツケージを一体にするようにマウント
することにより機械的振動に対して性能を向上し
た赤外線検出素子を提供しようとするものであ
る。 The present invention eliminates the above-mentioned drawbacks.The present invention eliminates the use of lead wires and mounts the element, lead extraction terminal, and package as one body, thereby improving the performance against mechanical vibration. The present invention aims to provide a detection element.
第２図に本発明の一実施例を示す。図中第１図
と同一部分には同一符号を付して説明を省略す
る。なお、赤外線受光側の電極２としては赤外線
の吸収係数の大きな金属を、反対側の電極２１と
しては赤外線の反射係数の大きな金属を使用する
とよい。５０は略中央部の素子１を配する部分に
穴５１を穿つた熱伝導性の悪い絶縁体で作製した
支持台で、その上に互いに独立した導電性パター
ン４，４１が形成されている。この支持台５０を
リード取り出し端子７，７１に挿入し、リード取
り出し端子７，７１と導電性パターン４，４１と
を半田付けにより電気的に導通させて固定する。
焦電効果を有する誘電体単結晶あるいは高分子薄
膜による素子１の両面にAu、Ni−Cr、Al等の金
属を薄く蒸着し電極２，２１を設け、絶縁体支持
台５０の表面上で導電性パターン４１と電極２１
とを導電性接着剤３１で電気的に導通させて装着
する。さらに薄膜状素子１の赤外線受光側の電極
２も導電性パターン４と導電性接着剤３で電気的
に導通させると赤外線検出素子を完成する。ま
た、この導電性接着剤３の代りに短かい金線を使
用して導電性パターン４と電極２とをボンデイン
グにより結線し導電性接着剤等でボンデイング部
分をモールドしてもよい。この様にすることによ
り熱的にも分離した上、十分な強度をもつた素子
の接着が可能となる。 FIG. 2 shows an embodiment of the present invention. Components in the figure that are the same as those in FIG. Note that it is preferable to use a metal with a large absorption coefficient of infrared rays as the electrode 2 on the infrared receiving side, and a metal with a large reflection coefficient of infrared rays as the electrode 21 on the opposite side. Reference numeral 50 denotes a support base made of an insulator with poor thermal conductivity, with a hole 51 bored in the approximately central portion where the element 1 is arranged, and conductive patterns 4 and 41 independent of each other are formed on the support base. This support base 50 is inserted into the lead extraction terminals 7, 71, and the lead extraction terminals 7, 71 and the conductive patterns 4, 41 are electrically connected to each other by soldering and fixed.
Electrodes 2 and 21 are provided by thinly vapor-depositing metals such as Au, Ni-Cr, and Al on both sides of the element 1, which is made of a dielectric single crystal or polymer thin film that has a pyroelectric effect, and is conductive on the surface of the insulator support 50. sexual pattern 41 and electrode 21
and are electrically connected with each other using a conductive adhesive 31. Further, when the electrode 2 on the infrared receiving side of the thin film element 1 is electrically connected to the conductive pattern 4 using the conductive adhesive 3, an infrared detecting element is completed. Further, instead of the conductive adhesive 3, a short gold wire may be used to connect the conductive pattern 4 and the electrode 2 by bonding, and the bonding portion may be molded with the conductive adhesive or the like. By doing so, it becomes possible to bond the elements with sufficient strength while also thermally separating them.
以上の様に本発明は焦電効果を有する薄膜の両
面に金属電極を設け、両方の電極を表面に独立し
た導電性パターンを有する絶縁体支持台に導電性
接着剤で独立して接着することにより、リード線
を使用せず、リード部分を薄膜状の素子と一体に
することにより機械的な振動に対して十分強度を
もたせることができ、信頼度の高い赤外線検出素
子を提供するものである。 As described above, the present invention provides metal electrodes on both sides of a thin film having a pyroelectric effect, and adheres both electrodes independently using a conductive adhesive to an insulator support having independent conductive patterns on the surface. By integrating the lead part with a thin film element without using lead wires, it is possible to provide sufficient strength against mechanical vibrations, providing a highly reliable infrared detection element. .
第１図は従来の赤外線検出素子の断面図、第２
図は本発明の一実施例における赤外線検出素子の
断面図である。
１……焦電効果を有する薄膜素子、２，２１…
…電極、３，３１……導電性接着剤、４，４１…
…導電性パターン、５……支持台、６……金属パ
ツケージ、７，７１……リード取り出し端子、
８，８１……リード線、９……絶縁性接着剤、１
０……絶縁体、５０……支持台、５１……穴。
Figure 1 is a cross-sectional view of a conventional infrared detection element, Figure 2 is a sectional view of a conventional infrared detection element.
The figure is a cross-sectional view of an infrared detection element in one embodiment of the present invention. 1... Thin film element having pyroelectric effect, 2, 21...
...electrode, 3,31...conductive adhesive, 4,41...
... Conductive pattern, 5 ... Support stand, 6 ... Metal package, 7, 71 ... Lead extraction terminal,
8, 81... Lead wire, 9... Insulating adhesive, 1
0... Insulator, 50... Support stand, 51... Hole.
Claims (1)
ジに、複数の導電性パターンを形成した絶縁体支
持台を固定し、前記端子と導電性パターンをそれ
ぞれ電気的に接続し、上記支持台上に両面に電極
を形成した焦電効果を有する薄膜素子を設け、こ
の薄膜素子の各電極を上記導電性パターンに導電
性接着剤で接着したことを特徴とする赤外線検出
素子。1. An insulator support base on which a plurality of conductive patterns are formed is fixed to a package having a plurality of lead extraction terminals, the terminals and the conductive patterns are electrically connected, and electrodes are placed on both sides of the support base. 1. An infrared detecting element comprising: a thin film element having a pyroelectric effect formed thereon; each electrode of the thin film element being adhered to the conductive pattern with a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56193897A JPS5895224A (en) | 1981-12-01 | 1981-12-01 | Infrared ray detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56193897A JPS5895224A (en) | 1981-12-01 | 1981-12-01 | Infrared ray detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5895224A JPS5895224A (en) | 1983-06-06 |
| JPS6140930B2 true JPS6140930B2 (en) | 1986-09-11 |
Family
ID=16315557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56193897A Granted JPS5895224A (en) | 1981-12-01 | 1981-12-01 | Infrared ray detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5895224A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064516A (en) * | 2006-09-06 | 2008-03-21 | Hioki Ee Corp | Infrared sensor and method of manufacturing infrared sensor |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645859Y2 (en) * | 1985-02-22 | 1994-11-24 | ティーディーケイ株式会社 | Infrared detector |
| JPH049560Y2 (en) * | 1985-02-28 | 1992-03-10 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620490B2 (en) * | 1973-08-21 | 1981-05-14 | ||
| JPS54141690A (en) * | 1978-04-26 | 1979-11-05 | Murata Manufacturing Co | Infrared ray detector and making method thereof |
| JPS6025557Y2 (en) * | 1979-08-07 | 1985-07-31 | 三洋電機株式会社 | Pyroelectric infrared detection element |
-
1981
- 1981-12-01 JP JP56193897A patent/JPS5895224A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064516A (en) * | 2006-09-06 | 2008-03-21 | Hioki Ee Corp | Infrared sensor and method of manufacturing infrared sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5895224A (en) | 1983-06-06 |
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