JPS6144895B2 - - Google Patents
Info
- Publication number
- JPS6144895B2 JPS6144895B2 JP11995581A JP11995581A JPS6144895B2 JP S6144895 B2 JPS6144895 B2 JP S6144895B2 JP 11995581 A JP11995581 A JP 11995581A JP 11995581 A JP11995581 A JP 11995581A JP S6144895 B2 JPS6144895 B2 JP S6144895B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- water
- acrylate
- parts
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 239000000178 monomer Substances 0.000 claims description 24
- 239000011342 resin composition Substances 0.000 claims description 14
- 229920001577 copolymer Polymers 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 3
- 125000001302 tertiary amino group Chemical group 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 150000002431 hydrogen Chemical group 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 239000003960 organic solvent Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 17
- -1 polypropylene Polymers 0.000 description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 16
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 15
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 239000003973 paint Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- NFTVTXIQFYRSHF-UHFFFAOYSA-N 1-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)C(C)OC(=O)C=C NFTVTXIQFYRSHF-UHFFFAOYSA-N 0.000 description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 11
- 238000000576 coating method Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000008399 tap water Substances 0.000 description 4
- 235000020679 tap water Nutrition 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pentâ4âenâ2âone Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 235000020354 squash Nutrition 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- UVTSQTMREZHBRA-CSKARUKUSA-N (e)-1-(6-methylpyridin-3-yl)-3-phenylprop-2-en-1-one Chemical compound C1=NC(C)=CC=C1C(=O)\C=C\C1=CC=CC=C1 UVTSQTMREZHBRA-CSKARUKUSA-N 0.000 description 1
- PINRHPDVUJVFDC-CMDGGOBGSA-N (e)-3-phenyl-1-pyridin-3-ylprop-2-en-1-one Chemical compound C=1C=CN=CC=1C(=O)\C=C\C1=CC=CC=C1 PINRHPDVUJVFDC-CMDGGOBGSA-N 0.000 description 1
- IZCXQDYKFFBERI-UHFFFAOYSA-N 1-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)C(C)OC(=O)C(C)=C IZCXQDYKFFBERI-UHFFFAOYSA-N 0.000 description 1
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- NLNUDODFFAWTHQ-UHFFFAOYSA-N 1-ethenyl-2,3-dihydropyrrole Chemical compound C=CN1CCC=C1 NLNUDODFFAWTHQ-UHFFFAOYSA-N 0.000 description 1
- ZCYXFITUYVYSJW-UHFFFAOYSA-N 1-ethenylisoquinoline Chemical compound C1=CC=C2C(C=C)=NC=CC2=C1 ZCYXFITUYVYSJW-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XUGNJOCQALIQFG-UHFFFAOYSA-N 2-ethenylquinoline Chemical compound C1=CC=CC2=NC(C=C)=CC=C21 XUGNJOCQALIQFG-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- VJOWMORERYNYON-UHFFFAOYSA-N 5-ethenyl-2-methylpyridine Chemical compound CC1=CC=C(C=C)C=N1 VJOWMORERYNYON-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NBICYCZLCAMSBG-UHFFFAOYSA-L [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O Chemical compound [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O NBICYCZLCAMSBG-UHFFFAOYSA-L 0.000 description 1
- XKXKHKMJDTUHMM-UHFFFAOYSA-J [Zr+4].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O Chemical compound [Zr+4].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O XKXKHKMJDTUHMM-UHFFFAOYSA-J 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- ZCGHEBMEQXMRQL-UHFFFAOYSA-N benzyl 2-carbamoylpyrrolidine-1-carboxylate Chemical compound NC(=O)C1CCCN1C(=O)OCC1=CC=CC=C1 ZCGHEBMEQXMRQL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000007333 cyanation reaction Methods 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- AQNSVANSEBPSMK-UHFFFAOYSA-N dicyclopentenyl methacrylate Chemical compound C12CC=CC2C2CC(OC(=O)C(=C)C)C1C2.C12C=CCC2C2CC(OC(=O)C(=C)C)C1C2 AQNSVANSEBPSMK-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- YGTXYHBZYODOKK-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate;phosphoric acid Chemical compound OP(O)(O)=O.CCOC(=O)C(C)=C YGTXYHBZYODOKK-UHFFFAOYSA-N 0.000 description 1
- LUCGNDPDLOAPJB-UHFFFAOYSA-N ethyl prop-2-enoate;phosphoric acid Chemical compound OP(O)(O)=O.CCOC(=O)C=C LUCGNDPDLOAPJB-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical group NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- UTSYWKJYFPPRAP-UHFFFAOYSA-N n-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCNC(=O)C=C UTSYWKJYFPPRAP-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Description
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The present invention relates to a water-dilutable resin composition that can be cured by heating at room temperature or low temperature. In the paint, coating, and adhesive industries, there is a strong desire for resource-saving and energy-saving paints and adhesives as well as pollution-free products due to the recent rise in oil prices. Conventionally, thermosetting acrylic resins contain glycidyl groups, N-methylolamide groups, amide groups, carboxyl groups, hydroxyl groups, etc. as pendant groups, and these are blended with amino resins, epoxy resins, etc. Depending on the temperature, 150â
It is used by curing reaction at higher temperatures. On the other hand, in fields where high-temperature treatment is not possible for building materials such as plastics, wood, concrete, and metal materials such as those used for automobile repair, so-called lacquers, which are made by using nitrified cotton, cellulose acetate butyrate, etc. in combination with acrylic resins and alkyd resins, are used. A type of paint that dries naturally is used. Such paints have drawbacks such as poor solvent resistance and poor weather resistance, and are unsuitable for fields that require high-performance coatings. Another drawback is that the amount of organic solvent in the paint is large, making it difficult to paint. Additionally, phthalic acid enamels and urethane paints are used in some applications. Phthalic acid enamels have problems with coating performance such as dryness and hardness, while urethane paints can provide high-quality coating properties, but there are problems with the toxicity of the isocyanate used, ease of handling, and price. On the other hand, water-based paints have problems such as slow drying, poor water resistance, poor corrosion resistance, and low hardness compared to organic solvent-based paints, and various improvements are being considered. Adhesives, particularly those used to bond polypropylene films to paper or printing paper, include resins such as chlorinated polypropylene, ethylene-vinyl acetate copolymers, rosin esters, polyurethanes, toluene, Examples include those dissolved in an organic solvent such as ethyl acetate, and those obtained by adding a polyisocyanate compound as a curing agent to this solution. During normal use, these organic solvent-based adhesives have a nonvolatile content of 15 to 30% by weight, and after being applied to an object, 70 to 85% by weight of the organic solvent is evaporated and dried, and then applied to other adherends. However, the organic solvents volatilized during the drying process are a major cause of air pollution, which has become a serious social problem, so there is a strong desire to reduce the amount of organic solvents used as much as possible. The present invention solves these problems. That is, the present invention comprises (a) 3 to 20 parts by weight of an ethylenically unsaturated monomer having a tertiary amino group, (B) 3 to 20 parts by weight of an ethylenically unsaturated monomer having a carboxyl group, ( C) General formula () (However, in the formula, R is hydrogen, a lower alkyl group, or a halogen, R' is a divalent organic group, and n is 0 or 1.) Dicyclopentadiene derivatives 5-
30 parts by weight, and (D) a copolymer obtained by copolymerizing 30 to 89 parts by weight of another ethylenically unsaturated monomer copolymerizable with component (A), (B) or (C). The present invention relates to a water-dilutable resin composition comprising a combination of 98 to 60 parts by weight of a neutralized resin and 2 to 40 parts by weight of a water-dilutable epoxy resin. The resin composition according to the present invention can be cured by heating at room temperature or low temperature (heating at 40 to 80°C). Examples of the ethylenically unsaturated monomer having a tertiary amino group, which is component (A) of the present invention, include N.N-dimethylaminoethyl acrylate, N.N-diethylaminoethyl acrylate, and N.N-dimethylaminoethyl acrylate. methacrylate, N/N-diethylaminoethyl methacrylate, vinylpyridine,
Vinylpyrroline, vinylquinoline, vinylisoquinoline, Nã»N-dimethylamino vinyl ether, 2-(Nã»N-dimethylamino)-4-vinylpyridine, trans-1ã»2-dipyridylethylene, 2-methyl-5-vinylpyridine , 3-cinnamoylpyridine, 2-methyl-5-cinnamoylpyridine, 4,4-diamino-2-vinyl-5
- Meliazine etc. The amount used is 3 to 20
The amount by weight is preferably 5 to 15 parts by weight; too little amount will result in insufficient curability, while too much amount will not only reduce water resistance but also shorten pot life. Examples of the ethylenically unsaturated monomer having a carboxyl group as component (B) include acrylic acid, methacrylic acid, maleic acid, fumaric acid, and itaconic acid. The amount used is 3 to 20 parts by weight, preferably 4 to 8 parts by weight.
Parts by weight. If the amount used is too small, sufficient water dilutability will not be obtained and, furthermore, the curing reaction will be slow, which poses a practical problem. If there is too much, the water resistance will be poor and the pot life will be shortened. The dicyclopentadiene derivative represented by the general formula () as component (C) can be obtained by numbering the dicyclopentenyl group carbon atoms in the compound as shown in the following general formula ().
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奜ãŸããã¯ã¢ã«ãã¬ã³åºãŸãã¯[Formula] is bonded to the 8th or 9th position. Here, R' is a divalent organic group having 1 to 18 carbon atoms, preferably 2 to 12 carbon atoms. R' is preferably an alkylene group or
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æ¥æŸçœ®ä¹Ÿç¥åŸç¹æ§ã枬å®ãããIt is a group represented by [Formula]. Here, R'' and R are alkylene groups having 2 or more carbon atoms, and R'' and R may be the same or different, and m is an integer of 1 or more. Component (C) includes dicyclopentenyl acrylate, dicyclopentenyl methacrylate, dicyclopentenyl-α-chloroacrylate, dicyclopentenoxyethyl acrylate, dicyclopentenoxyethyl methacrylate, dicyclopentenoxypropyl acrylate, Dicyclopentenoxyalkyl acrylate or methacrylate such as cyclopentenoxypropyl methacrylate, acrylic ester or methacrylic ester of polyalkylene glycol dicyclopentenyl monoether such as acrylic ester or methacrylic ester of diethylene glycol dicyclopentenyl monoether There is. The amount of component (C) used is 5 to 30 parts by weight, preferably 7 to 20 parts by weight. If the amount used is too small, the drying properties, corrosion resistance, and moisture resistance will be poor when the resin composition according to the present invention is used as a paint, and the initial adhesive strength will be insufficient when used as an adhesive. If the amount used is too large, the towability will be poor when used as a paint, and the adhesive strength will be reduced when used as an adhesive. Furthermore, the viscosity of the resin increases, resulting in extremely poor workability. Component (D) includes ethylenically unsaturated monomers copolymerizable with component (A), (B) or (C), such as methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, Isobutyl acrylate, 2-
Alkyl acrylates such as ethylhexyl acrylate; methyl methacrylate; ethyl methacrylate; n-propyl methacrylate; vinyl esters of saturated monobasic acids such as vinyl acetate, vinyl propionate, vinyl stearate, epoxy group-containing unsaturated monomers such as glycidyl acrylate and glycidyl methacrylate, cyanation of acrylonitrile, methacrylonitrile, etc. vinyl, acrylamide,
Unsaturated amides such as methacrylamide, N-methylolacrylamide, N-butoxymethylacrylamide, 2-hydroxyethyl acrylate,
Hydroxyalkyl acrylates such as 2-hydroxypropyl acrylate, hydroxyalkyl methacrylates such as 2-hydroxyethyl methacrylate and 2-hydroxypropyl methacrylate, phosphoric acid group-containing unsaturated monomers such as ethyl acrylate phosphate and ethyl methacrylate phosphate, acetic acid Examples include vinyl esters of saturated monobasic acids such as vinyl and vinyl propionate, which may be used singly or in combination of two or more. In some cases, it is also possible to use a polyfunctional ethylenically unsaturated monomer such as ethylene glycol diacrylate in an amount of 0 to 2 parts by weight. Among the copolymerizable ethylenically unsaturated monomers used as component (D), alkyl acrylate, alkyl methacrylate,
Styrenic monomers are preferred. Furthermore, the monomer having a reactive functional group other than a double bond is preferably used in a proportion of 0 to 30% by weight, particularly in a proportion of 0 to 10% by weight based on the total amount of components (A) to (D). Preferably used in If there is too much of a monomer having such a reactive functional group, the coating film properties (water resistance, moisture resistance, chemical resistance, etc.) tend to deteriorate when used as a coating material. Further, in order to improve adhesion, it is preferable to use hydroxyalkyl acrylate, hydroxyalkyl methacrylate, unsaturated amide, etc. among monomers having such reactive functional groups.
Furthermore, as component (D), a copolymer of components (A) to (D) has a glass transition point of 30 to 70, which is particularly preferable for paints.
â, hard monomers (a) such as methyl methacrylate, ethyl methacrylate, and styrene and soft monomers (b) such as ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate are mixed into (a)/ It is particularly preferable to use (b) in a weight ratio of 80/20 to 50/50. Components (A), (B), (C) and (D) can be obtained by copolymerizing by solution polymerization, bulk polymerization, etc., using well-known methods. The polymerization temperature is approximately 50 to 150â,
As a polymerization catalyst, benzoyl peroxide, t
- Peroxides such as butyl peroxide and cumene hydroperoxide, azobisisobutyronitrile, azobisisobutyl-valeronitrile, etc. can be used, and the amount used is 0.1 to 100 parts by weight of the total monomer amount. 5 parts by weight. Molecular weight regulators such as mercaptan, carbon tetrachloride, and carbon tetrabromide can also be used if necessary. It is preferable to carry out the copolymerization in the presence of a water-soluble organic solvent because after the polymerization, the copolymer can be neutralized without being isolated and used as it is in the resin composition of the present invention. In this case, the water-soluble organic solvent is preferably used so that the copolymer concentration is 30 to 70% by weight. Examples of the water-soluble organic solvent include ethanol, isopropyl alcohol, isobutanol, methyl cellosolve, ethyl cellosolve, isopropyl cellosolve, butyro cellosolve, 3-methyl-3-methoxybutanol, methyl carbitol, ethyl carbitol, butyl carbitol, and the like. Can be used alone or in combination of two or more. The copolymer thus obtained is neutralized with a neutralizing agent to obtain a neutralized resin (). The degree of neutralization is preferably such that the pH is about 8-11. Examples of the neutralizing agent include amine compounds such as trimethylamine, triethylamine, and dimethylaminoethanol, and ammonia, with amine compounds being preferred. Water may be added during neutralization. As the epoxy resin (), one that can be diluted with water can be used. Here, "water dilutable" means that it is soluble in a mixed solvent of water/water-soluble organic solvent=5/5 to 8/2 (weight ratio). Examples of the epoxy resin () include glycerol polyglycidyl ether, trimethylolethane polyglycidyl ether, trimethylolpropane polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, sorbitol polyglycidyl ether, etc. to alcohol,
It is possible to use an epoxy resin, etc., which are adducted with ethylene oxide or propylene oxide and then epoxidized at the terminal. The epoxy resin of the present invention may partially contain a compound having only one epoxy group per molecule in an amount of 10% by weight or less, preferably 5% by weight or less. Neutralized resin () and epoxy resin () are
The weight ratio of ()/() is 98/2 to 60/40, preferably 95/5 to 80/20.
If ()/() exceeds 98/2, curing will be insufficient and sufficient coating properties or adhesive properties will not be obtained, while if it is less than 60/40, initial drying properties or initial adhesive strength will decrease. In the present invention, it is preferable that the neutralized resin () and the epoxy resin () are mixed for the first time at the time of use to form a resin composition. If mixed in advance, it will harden more easily during storage. It is preferable to mix the neutralized resin () with water and/or a water-soluble organic solvent in advance. In this case, water/
It is preferable that the water-soluble organic solvent is dissolved in a mixed solvent of 80/20 (weight ratio) or less. If the solid content is too high, the viscosity will be high and workability will be reduced, and if the solid content is too low, the resin concentration will be too low. A mixed solvent of water and a water-soluble organic solvent has a ratio of water/water-soluble organic solvent of 80/
If it exceeds 20, it is undesirable because it tends to separate into a solvent phase and a resin phase. Water/water-soluble organic solvent weight ratio 50/50
It is preferable to set the ratio above, particularly preferably 70/30 to 60/40. The epoxy resin (2) is preferably used as it is or dissolved in a water-soluble organic solvent. In the resin composition according to the present invention, the weight ratio of water/water-soluble organic solvent is 80/20 or less, preferably 80/20 or less.
It is used after being dissolved in a mixed solvent of 20 to 50/50, particularly preferably 70/30 to 60/40. When the ratio exceeds 80/20, the resin phase and solvent phase tend to separate. Further, in order to reduce the amount of organic solvent used, it is preferable to use a ratio of 50/50 or more. Further, the amount of solvent is adjusted so that the resin solid content is 30 to 60% by weight. If it exceeds 60% by weight, the viscosity increases and workability decreases, which is not preferable. If it is less than 30% by weight, the resin viscosity will be low, which is not preferred in practice. In the resin composition according to the present invention, lead naphthenate, zinc naphthenate, cobalt naphthenate, zirconium naphthenate, lead octate, cobalt octenoate, zirconium octenoate, etc. are added to the neutralized resin () as a metal dryer. with the amount of metal
Preferably, it is added in an amount of 0.01 to 1% by weight. It is preferable to add the metal dryer to the neutralized resin (2) in advance, or add it at the time of mixing the neutralized resin (2) and the epoxy resin (2). Note that the resin composition according to the present invention exhibits excellent coating film properties and adhesive properties even without the addition of a metal dryer. The resin composition according to the present invention may optionally contain a water-soluble or water-dispersible acrylic resin, a water-soluble or water-dispersible alkyd resin, a water-dispersible vinyl acetate polymer or copolymer, rosin, rosin ester, ceramics, etc. etc. can be combined. The paint obtained using the resin composition of the present invention can be applied by dipping, brushing, spraying, roll coating, etc.
Can be applied to surfaces such as paper, textiles, plastics, ceramics, iron, and non-ferrous metals. Production Example 1 100g of isopropyl alcohol is placed in a 500ml flask equipped with a stirrer, thermometer, reflux condenser, dropping funnel, and inert gas inlet, and the temperature of the flask is raised to 80°C under a nitrogen gas stream. Next, 8 g of N.N-dimethylaminoethyl acrylate, 5 g of methacrylic acid, 10 g of dicyclopentenyl acrylate, 10 g of styrene, 37 g of methyl methacrylate, and 30 g of butyl acrylate as unsaturated monomers, and 1.5 g of azobisisobutyronitrile as a catalyst were mixed. The dissolved liquid is uniformly dropped into the flask from the dropping funnel over a period of 2 hours. After the dropwise addition was completed, the mixture was kept at 80° C. for another 3 hours to complete polymerization and synthesize a copolymer. The polymerization rate was 98% by weight or more.
Thereafter, the pH was adjusted to 10 with triethylamine, and 50 g of tap water was added. The resulting neutralized resin solution had a nonvolatile content of 41% by weight and a viscosity of 8 poise at 25°C. Production Example 2 In the same manner as in Example 1, N.
N-dimethylaminoethyl acrylate 15g, methacrylic acid 5g, dicyclopentenyl acrylate 10g, styrene 10g, methyl methacrylate
Using 30g and 30g of butyl acrylate,
A neutralized resin was synthesized. The prepared neutralized resin solution had a nonvolatile content of 40% by weight and a viscosity of 9.5 poise at 25°C. Production Example 3 In the same manner as in Example 1, N.
8 g of N-dimethylaminoethyl acrylate, 10 g of methacrylic acid, 10 g of dicyclopentenyl acrylate, 10 g of styrene, 32 g of methyl methacrylate
A neutralized resin was synthesized using g and 30 g of butyl acrylate. The prepared neutralized resin solution had a nonvolatile content of 40.5% by weight and a viscosity of 9 poise. Production Example 4 In the same manner as in Example 1, N.
N-dimethylaminoethyl acrylate 8g, methacrylic acid 5g, dicyclopentenyl acrylate 20g, styrene 10g, methyl methacrylate 27
A neutralized resin was synthesized using g and 30 g of butyl acrylate. The prepared neutralized resin solution had a nonvolatile content of 41% by weight and a viscosity of 12 poise. Comparative Production Example 1 In the same manner as in Example 1, 10 g of methacrylic acid and dicyclopentenyl acrylate were used as unsaturated monomers.
10g, styrene 10g, methyl methacrylate 40g
and 30 g of butyl acrylate to synthesize a neutralized resin. The prepared neutralized resin solution had a nonvolatile content of 41% by weight and a viscosity of 7 poise. Comparative Production Example 2 In the same manner as in Example 1, N.
A neutralized resin was synthesized using 8 g of N-dimethylaminoethyl acrylate, 5 g of methacrylic acid, 10 g of styrene, 47 g of methyl methacrylate, and 30 g of butyl acrylate. The prepared neutralized resin solution had a nonvolatile content of 40% by weight and a viscosity of 5 poise. Comparative Production Example 3 In the same manner as in Example 1, N.
N-dimethylaminoethyl acrylate 8g, methacrylic acid 2g, dicyclopentenyl acrylate 10g, styrene 10g, methyl methacrylate 40g
A copolymer was synthesized using 30 g of butyl acrylate. This copolymer is triethylamine
Cloudiness occurred when tap water was added after adjusting the pH to 10, and there was no water dilutability. Examples 1 to 4 and Comparative Examples 1 to 2 Trimethylolpropane, a water-dilutable polyfunctional epoxide compound, was added to 85 parts by weight (solid content) of the resin prepared in Production Examples 1 to 4 and Comparative Production Examples 1 to 2. 15 parts by weight of polyglycidyl ether is blended, and cobalt naphthenate is distributed as a metal dryer so that the amount of metal is 0.05 parts per 100 parts by weight (solid content) of the neutralized resin solution, and water dilution according to the present invention is performed. A possible resin composition was obtained. Furthermore, titanium white was blended so that the blended resin (solid content)/titanium white = 60/40 (weight ratio) to create white enamel. The properties of this white enamel are shown in Table 1. In addition,
When testing properties, the base material is Bonderite #1077
Using a treated steel plate, everything except drying is done at room temperature5.
Characteristics were measured after drying in the sun.
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æã衚ïŒã«ç€ºãã[Table] Production Example 5 Charge 100 g of isopropyl alcohol into a 500 ml flask equipped with a stirrer, thermometer, reflux condenser, dropping funnel, and inert gas inlet, and heat the flask to 80°C under a nitrogen gas stream. Next, as unsaturated monomers, 15 g of N.N-dimethylaminoethyl acrylate, 5 g of methacrylic acid, 10 g of dicyclopentenyl acrylate, and butyl acrylate were added.
Mixing 32 g and 40 g of methyl methacrylate and 2 g of azobisisobutyronitrile as a catalyst,
Pour the dissolved liquid evenly into the flask from the dropping funnel.
Drip for an hour. After the dropwise addition was completed, the mixture was kept at 80° C. for another 3 hours to complete the polymerization and synthesize a copolymer. The polymerization rate was 98% by weight or more. After this, the pH was adjusted to 10 with triethylamine, and 50 g of tap water was added. The resulting neutralized resin solution had a nonvolatile content of 41% and a viscosity of 25%.
It was 3 poise at â. Production Example 6 In the same manner as in Example 1, N.
A neutralized resin was synthesized using 15 g of N-dimethylaminoethyl acrylate, 5 g of methacrylic acid, 20 g of dicyclopentenyl acrylate, 30 g of butyl acrylate, and 30 g of methyl methacrylate. The prepared neutralized resin solution has a non-volatile content of
41% by weight, and the viscosity was 5 poise at 25°C. Production Example 7 In the same manner as in Example 1, N.
A neutralized resin was synthesized using 10 g of N-dimethylaminoethyl acrylate, 10 g of methacrylic acid, 10 g of dicyclopentenyl acrylate, 30 g of butyl acrylate, and 40 g of methyl methacrylate. This prepared neutralized resin solution contains non-volatile content.
40.5% by weight, and the viscosity was 3.5 poise at 25°C. Comparative Production Example 3 In the same manner as in Example 1, N.
A neutralized resin was synthesized using 15 g of N-dimethylaminoethyl acrylate, 5 g of methacrylic acid, 40 g of butyl acrylate, and 40 g of methyl methacrylate. The prepared neutralized resin solution had a nonvolatile content of 41% by weight and a viscosity of 1.5 poise at 25°C. Comparative Production Example 4 In the same manner as in Example 1, 10 g of methacrylic acid and dicyclopentenyl acrylate were used as unsaturated monomers.
A neutralized resin was synthesized using 10 g of methacrylate, 40 g of butyl acrylate, and 40 g of methyl methacrylate.
This prepared solution of neutralized resin has a non-volatile content of 41.5
The viscosity in weight percent was 3.8 poise at 25°C. Comparative Production Example 5 A copolymer was synthesized in the same manner as in Example 1 using 10 g of N.N-dimethylaminoethyl acrylate, 10 g of dicyclopentenyl acrylate, 40 g of butyl acrylate, and 40 g of methyl methacrylate. This copolymer becomes cloudy when diluted with tap water after being neutralized with triethylamine.
It was not dilutable with water. Examples 5 to 7 and Comparative Examples 3 to 4 Synthesis in Production Examples 5 to 7 and Comparative Production Examples 3 to 4,
Add 10 parts by weight of epoxy resin (trimethylolpropane triglycidyl ether) to 90 parts by weight (solid content) of the prepared neutralized resin solution, and mix with water/isopropyl alcohol = 1/1 (weight ratio) to make it non-volatile. It was adjusted to 25% by weight. After applying this adjusted adhesive composition to polypropylene film,
The polypropylene film was dried at 0.degree. C., and the polypropylene film was thermocompression bonded to the cardboard using a roller press at that temperature. The test results are shown in Table 2.
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ç匷床ãèæ°Žæ¥çæ§çã®æ¥çç¹æ§ãåªããã[Table] The resin composition of the present invention uses less solvent and can be cured at room temperature or by low-temperature heating. It has excellent coating properties such as hardness, moisture resistance, water resistance, and hardness, and when used as an adhesive, it has excellent adhesive properties such as initial adhesive strength and water-resistant adhesiveness.
Claims (1)
ååéäœïŒã20éééšã (B) ã«ã«ããã·ã«åºãæãããšãã¬ã³æ§äžé£œåå
éäœïŒã20éééšã (C) äžè¬åŒïŒïŒ ïŒãã ããåŒäžãïŒ²ã¯æ°ŽçŽ ãäœçŽã¢ã«ãã«åºãŸ
ãã¯ããã²ã³ã§ãããRâ²ã¯äºäŸ¡ã®ææ©åºã§ã
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30éééšã ããã³ (D) (A)ã(B)ãŸãã¯(C)æåãšå ±éåå¯èœãªä»ã®ãšã
ã¬ã³æ§äžé£œååéäœ30ã89éééšãå ±éåãã
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éš ãçµã¿åãããŠãªãæ°Žåžéå¯èœãªæš¹èçµæç©ã[Scope of Claims] 1 (A) 3 to 20 parts by weight of an ethylenically unsaturated monomer having a tertiary amino group, (B) 3 to 20 parts by weight of an ethylenically unsaturated monomer having a carboxyl group, (C) General formula () (However, in the formula, R is hydrogen, a lower alkyl group, or a halogen, R' is a divalent organic group, and n is 0 or 1.) Dicyclopentadiene derivatives 5-
30 parts by weight, and (D) a copolymer obtained by copolymerizing 30 to 89 parts by weight of another ethylenically unsaturated monomer copolymerizable with component (A), (B) or (C). A water-dilutable resin composition comprising a combination of 98 to 60 parts by weight of a neutralized resin () and 2 to 40 parts by weight of a water-dilutable epoxy resin ().
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11995581A JPS5821409A (en) | 1981-07-29 | 1981-07-29 | Water-miscible resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11995581A JPS5821409A (en) | 1981-07-29 | 1981-07-29 | Water-miscible resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5821409A JPS5821409A (en) | 1983-02-08 |
| JPS6144895B2 true JPS6144895B2 (en) | 1986-10-04 |
Family
ID=14774331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11995581A Granted JPS5821409A (en) | 1981-07-29 | 1981-07-29 | Water-miscible resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5821409A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01266126A (en) * | 1988-04-19 | 1989-10-24 | Dainippon Ink & Chem Inc | Curable resin composition |
-
1981
- 1981-07-29 JP JP11995581A patent/JPS5821409A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5821409A (en) | 1983-02-08 |
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