JPS6145367B2 - - Google Patents
Info
- Publication number
- JPS6145367B2 JPS6145367B2 JP55091487A JP9148780A JPS6145367B2 JP S6145367 B2 JPS6145367 B2 JP S6145367B2 JP 55091487 A JP55091487 A JP 55091487A JP 9148780 A JP9148780 A JP 9148780A JP S6145367 B2 JPS6145367 B2 JP S6145367B2
- Authority
- JP
- Japan
- Prior art keywords
- sensing element
- humidity sensing
- oxide film
- humidity
- capacitance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010407 anodic oxide Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 229910044991 metal oxide Inorganic materials 0.000 claims description 18
- 150000004706 metal oxides Chemical class 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000003795 desorption Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- -1 lithium chloride Chemical class 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Non-Adjustable Resistors (AREA)
Description
本発明は湿度検知素子の製造方法に関するもの
であり、さらに詳細には寸法精度を向上させると
ともに、固体電解質層および水蒸気透過性の導電
性電極形成の安定化、歩留り向上、量産性の向上
を図るものである。
最近、空調、電子部品の製造、農林、食品等の
工業において、特に湿度の制御と容易な計測が望
まれ始めた。特に、制御という点からは電気信号
により湿度を検知する方法が必要であり、その検
知方式として現在あるものは、塩化リチウムのよ
うな潮解性塩のイオン伝導の変化によるもの、マ
グネタイト、シリコン半導体の水分吸脱着による
抵抗変化式のもの、毛髪、ナイロン、スチレンの
ような繊維の水分吸脱着に伴う変形を応力素子、
マイクロスイツチなどと組み合わせたもの、カー
ボン、金属粉末等の導電性微粒子を含んだ有機樹
脂の樹潤性を利用したもの、α線吸収透過を利用
したものなどがある。
ところが、これらの中でイオン伝導を利用した
ものは経時変化が大きく、メンテナンスに手間ど
り、樹脂型のものは応答速度が遅く、α線利用の
ものは高価であり、またその他のものについても
いずれも精度、応答性、環境ガスの影響、測定可
能な湿度範囲、感度、耐熱性、ヒステリシス、経
時変化、価格等の点で一長一短である。
これに対し、本発明で言及する湿度検知素子は
誘電体性酸化膜の吸脱着による静電容量変化を検
知するものであり、その構成および原理は特開昭
54−1897号公報に詳細に述べられている。この内
容について若干の説明を行なう。
第1図に本発明に関する湿度検知素子の構成図
を示しておりタンタル、チタン、ニオブ、アルミ
ニウム、ハフニウムのような弁作用金属からなる
陽極基体1の上に陽極酸化により誘電体性陽極酸
化皮膜2を形成し、さらにこの誘電体性陽極酸化
皮膜2上の全面または一部に、例えば硝酸マンガ
ンのような熱分解性金属塩の熱分解によつて二酸
化マンガンのような半導体性金属酸化物層3を形
成し、そしてその上にカーボン、銀ペイントを用
いて水蒸気透過性の導電性電極4を形成した構造
である。
第2図にその具体的な構造の一例を示してお
り、5はタンタル線、6は酸化タンタル皮膜、7
は二酸化マンガン層、8は導電性電極、9は半
田、10は透孔11を有する有底筒状の金属ケー
ス、12はこの金属ケース11に接続固定した外
部リード線、13はハーメチツクシール部であ
る。
このようにして形成された湿度検知素子は相対
湿度に応じた空気中の水分を吸着し、この水分が
誘電体性陽極酸化皮膜2の対向電極として作用
し、高湿の場合には、この電極面積が増加するの
で、高静電容量が得られ、低湿の場合には逆に低
静電容量が信号として検出され、最終的に空気中
の相対湿度変化を静電容量変化として検知する湿
度検知素子になる。この方式の湿度検知素子は第
3図に示すように、0〜100%RHにわたつて測定
精度、感度も高く、第4図に示すように吸脱湿の
応答性も非常に優れている。このため、信号検出
のための周辺電気回路も簡単なものとなり、価格
も安価である。
このように本発明の言及する湿度検知素子は、
前述した従来のいかなる湿度検知素子よりも性
能、取扱い容易さの点で優れている。
本発明はこのような静電容量変化型の湿度検知
素子の静電容量特性のバラツキの安定化および感
湿特性の安定化、量産性の向上のための湿度検知
素子の製造方法に関するものであり、以下本発明
の内容を詳細に説明する。
本発明による湿度検知素子は、第5図に示す製
造工程によつて製造される。すなわち、陽極基体
に誘電体性陽極酸化皮膜を形成し、半導体性金属
酸化物を形成し、さらにカーボン層、および陰極
集電層を順次形成した後、高湿エージングし、こ
の構成物を組立した後完成品となる。
本発明は、このような湿度検知素子を精度良
く、バラツキを少なく製造し、湿度検知特性の安
定化、量産性の向上を図るために、L型形状に成
形加圧した導電帯に陽極基体をぶら下げて取付
け、その導電帯に取付けた陽極基体を一単位とし
て前述した第5図、すなわち誘電体性陽極酸化皮
膜形成工程、半導体性金属酸化物形成工程、さら
にカーボン層形成工程、陰極集電層形成工程、高
湿エージング工程の各製造工程を経た後、構成物
と導電帯を分離することを特徴とする製造方法で
ある。
ここで、本発明の湿度検知素子の湿度検知機構
を述べながら、湿度検知素子としての実用性を考
慮した場合、特に誘電体性酸化皮膜形成、半導体
性金属酸化物形成、カーボン層、陰極集電層形成
を精度よく、バラツキなく形成することの重要点
について述べる。
第6図は第1図の誘電体性陽極酸化皮膜2と、
半導体性金属酸化物層3との接触部分を拡大した
ものである。
この第6図に示すように、誘電体性陽極酸化皮
膜2と半導体性金属酸化物層3はaで示す範囲で
非接触部13となつており、bで示す範囲で接触
部14となつている。
今、相対湿度0%の雰囲気中に本発明の湿度検
知素子を配置した場合、半導体性金属酸化物層3
による水分吸収が0であるため、第6図の接触部
14のみの誘電体性陽極酸化皮膜2による静電容
量が検出できる。この時、半導体性金属酸化物層
3は、半導電性を有するため、容量取出用電極と
して作用する。
次に、本発明の湿度検知素子を湿気中に配置す
ると、半導体性金属酸化物層3が吸湿性を有する
ため、吸湿された水分が誘電体性陽極酸化皮膜2
の表面にまで達し、誘電体性陽極酸化皮膜2と半
導体性金属酸化物層3との非接触部13の表面に
到達する。この半導体性金属酸化物層3の吸湿水
分量は、空気中の相対湿度に比例するので誘電体
性陽極酸化皮膜2における水分被覆率は、相対湿
度に比例することになる。
このようにして、誘電体性陽極酸化皮膜2まで
到達した水分は、空気中の炭酸ガス、半導体性金
属酸化物層3中の金属イオン、その他の不純物を
含んでおり、それ自体電解質としての機能を持
ち、したがつて誘電体性陽極酸化皮膜2の接触部
14と非接触部13中の水分による被覆部とによ
る合成静電容量を取出すことができるのである。
このようにして、本発明の湿度検知素子は、空
気中の相対湿度の変化を静電容量の変化に変換す
る。
本発明の湿度検知素子の濃度−静電容量変換の
特性をバラツキなく正確に取り出すためには、陽
極基体1と導電性電極4との間の両電極間に検出
される静電容量を精度良く取り出す必要性があ
る。
この前述した両電極間の静電容量Cは次のよう
になる。
A:半導体性金属酸化物層3が接触していない誘
電体性陽極酸化皮膜2の全面積
B:半導体性金属酸化物層3が接触している誘電
体性陽極酸化皮膜2の全面積
ε:誘電体性陽極酸化皮膜2の誘電率
l:誘電体性陽極酸化皮膜2の厚さ
α:誘電体性陽極酸化皮膜2の非接触部13の水
分による被覆率
RH:相対湿度
とすると、誘電体性陽極酸化皮膜2の水分覆率α
が相対湿度RHに依存するので、
α∝RH
となり、また静電容量Cは、
C=ε/l(B+α・A)
∴C∝ε/l(B+RH・A)
となり、陽極基体1と導電性電極4との間の静電
容量Cは相対湿度RHに対して一義的かつ直線的
に定まる。第4図は、静電容量−相対湿度の関係
を示したものである。
本発明は、湿度検知素子の前述された陽極基体
1と導電性電極4の間の静電容量をバラツキなく
決められた任意の値で取り出すことを特徴とする
湿度検知素子の製造方法であり、具体的には第7
図に示すL型形状の導電帯15に陽極基体1を取
付けた後、第8図に示すように陽極基体1におけ
る誘電体性陽極酸化皮膜2の寸法a、半導体性金
属酸化物層3の寸法b、導電性電極4の寸法cを
導電帯15を使用して任意の値にコントロールし
ながら第5図に示す製造工程図にそつて順次製造
し、上述した誘電体性陽極酸化皮膜2の全面積を
精度良く形成し、誘電体性陽極酸化皮膜2の半導
体性金属酸化物層3との接触率、すなわち両者の
接触部14の誘電体性陽極酸化皮膜2の全面積に
対する割合、B/A+Bを、任意の値にコントロ
ールすることができる。本発明の製造方法を用い
れば、従来の方法に比較して前述した寸法a,
b,cの精度も極端に向上し、また陽極基体1と
導電性電極4の重合による短絡不良も極端に減少
し、静電容量Cの容量許容差も減少し任意の値の
静電容量を要求する電気回路へのマツチングも著
しく簡単になる。
次に、本発明の具体的な実施例について説明す
る。
径が1mmφ、長さ20mmのタンタル線を第9図
に示すようなL型形状に成形加圧したステンレス
導電帯16の側面に取付けた後、浸漬槽17内の
蓚酸および蓚酸水溶液25℃〜100℃で50Vの電圧
を印加して酸化皮膜を形成し、その後比重が1.5
の硝酸マンガン水溶液を塗布、熱分解により陽極
酸化皮膜上に二酸化マンガンの金属酸化物を形成
する。さらに、コロイダカーボンを含浸し乾燥す
ることにより二酸化マンガン上にカーボン層を形
成し、そのカーボン層上に銀ペイント層を形成す
る。このようにしてできた構成物を40℃、90%
RH条件下で50時間保持する。
このようにしてできた構成物と、第10図に示
すような1mmφのステンレス棒18に本発明のも
のと同じタンタル線を押圧し、第11図に示す工
程で製造した構成物と比較して見ると、表1のよ
うになる。
The present invention relates to a method for manufacturing a humidity sensing element, and more specifically, it improves dimensional accuracy, stabilizes the formation of a solid electrolyte layer and water vapor permeable conductive electrodes, improves yield, and improves mass productivity. It is something. BACKGROUND ART Recently, humidity control and easy measurement have become particularly desirable in industries such as air conditioning, electronic component manufacturing, agriculture and forestry, and food products. In particular, from a control point of view, a method of detecting humidity using electrical signals is required, and the current detection methods include one based on changes in the ionic conduction of deliquescent salts such as lithium chloride, one using magnetite, and one using silicon semiconductors. Resistance change type due to moisture adsorption and desorption, stress element that suppresses deformation due to moisture absorption and desorption of fibers such as hair, nylon, and styrene.
There are those that are combined with microswitches, those that utilize the resinous properties of organic resins containing conductive fine particles such as carbon and metal powder, and those that utilize α-ray absorption and transmission. However, among these, those that use ionic conduction have a large change over time and are difficult to maintain, resin-based ones have a slow response speed, those that use alpha rays are expensive, and other types will eventually deteriorate. Both have advantages and disadvantages in terms of accuracy, response, influence of environmental gases, measurable humidity range, sensitivity, heat resistance, hysteresis, change over time, price, etc. In contrast, the humidity sensing element referred to in the present invention detects changes in capacitance due to adsorption and desorption of a dielectric oxide film, and its structure and principle are based on the
It is described in detail in Publication No. 54-1897. I will give some explanation regarding this content. FIG. 1 shows a configuration diagram of a humidity sensing element according to the present invention, in which a dielectric anodic oxide film 2 is formed by anodic oxidation on an anode substrate 1 made of a valve metal such as tantalum, titanium, niobium, aluminum, or hafnium. A semiconductor metal oxide layer 3 such as manganese dioxide is formed on the entire or part of the dielectric anodic oxide film 2 by thermal decomposition of a thermally decomposable metal salt such as manganese nitrate. , and a water vapor permeable conductive electrode 4 is formed thereon using carbon and silver paint. Figure 2 shows an example of its specific structure, where 5 is a tantalum wire, 6 is a tantalum oxide film, and 7 is a tantalum wire.
1 is a manganese dioxide layer, 8 is a conductive electrode, 9 is solder, 10 is a bottomed cylindrical metal case having a through hole 11, 12 is an external lead wire connected and fixed to this metal case 11, and 13 is a hermetic seal. Department. The humidity sensing element formed in this manner adsorbs moisture in the air according to the relative humidity, and this moisture acts as a counter electrode for the dielectric anodic oxide film 2, and in the case of high humidity, this electrode Since the area increases, a high capacitance is obtained, and in the case of low humidity, a low capacitance is detected as a signal, and finally humidity detection detects changes in relative humidity in the air as changes in capacitance. Become an element. As shown in FIG. 3, this type of humidity sensing element has high measurement accuracy and sensitivity over the 0 to 100% RH range, and as shown in FIG. 4, it also has excellent moisture absorption and desorption responsiveness. Therefore, the peripheral electric circuit for signal detection is simple and the price is low. In this way, the humidity sensing element referred to in the present invention is
It is superior to any of the conventional humidity sensing elements mentioned above in terms of performance and ease of handling. The present invention relates to a method of manufacturing a humidity sensing element for stabilizing variations in capacitance characteristics, stabilizing moisture sensitivity characteristics, and improving mass productivity of such a capacitance variable humidity sensing element. Hereinafter, the contents of the present invention will be explained in detail. The humidity sensing element according to the present invention is manufactured by the manufacturing process shown in FIG. That is, after forming a dielectric anodic oxide film on an anode substrate, forming a semiconducting metal oxide, and sequentially forming a carbon layer and a cathode current collecting layer, high-humidity aging was performed to assemble this structure. It will then become a finished product. In order to manufacture such a humidity sensing element with high precision and less variation, stabilize the humidity sensing characteristics, and improve mass production, the present invention has developed an anode substrate by attaching an anode substrate to a conductive band formed and pressed into an L shape. The anode substrate attached to the conductive band is shown in FIG. 5 as a unit, that is, the dielectric anodic oxide film formation step, the semiconducting metal oxide formation step, the carbon layer formation step, and the cathode current collecting layer. This manufacturing method is characterized by separating the constituent and the conductive band after passing through each manufacturing process of a forming process and a high-humidity aging process. Here, while describing the humidity sensing mechanism of the humidity sensing element of the present invention, when considering its practicality as a humidity sensing element, in particular, the formation of a dielectric oxide film, the formation of a semiconducting metal oxide, the carbon layer, and the cathode current collection. We will discuss the important points of forming layers accurately and without variation. FIG. 6 shows the dielectric anodic oxide film 2 of FIG. 1,
This is an enlarged view of the contact portion with the semiconductor metal oxide layer 3. As shown in FIG. 6, the dielectric anodic oxide film 2 and the semiconductor metal oxide layer 3 form a non-contact area 13 in the area indicated by a, and a contact area 14 in the area indicated by b. There is. Now, when the humidity sensing element of the present invention is placed in an atmosphere with a relative humidity of 0%, the semiconductor metal oxide layer 3
Since the moisture absorption by the dielectric film 2 is zero, the capacitance due to the dielectric anodic oxide film 2 of only the contact portion 14 shown in FIG. 6 can be detected. At this time, since the semiconductor metal oxide layer 3 has semiconductivity, it acts as an electrode for taking out the capacitance. Next, when the humidity sensing element of the present invention is placed in humidity, since the semiconductor metal oxide layer 3 has hygroscopicity, the absorbed moisture is transferred to the dielectric anodic oxide film 2.
and reaches the surface of the non-contact portion 13 between the dielectric anodic oxide film 2 and the semiconductor metal oxide layer 3. Since the amount of moisture absorbed by the semiconductor metal oxide layer 3 is proportional to the relative humidity in the air, the moisture coverage in the dielectric anodic oxide film 2 is proportional to the relative humidity. The moisture that has reached the dielectric anodic oxide film 2 in this way contains carbon dioxide gas in the air, metal ions in the semiconductor metal oxide layer 3, and other impurities, and functions as an electrolyte in itself. Therefore, the combined capacitance of the contact portion 14 of the dielectric anodic oxide film 2 and the portion covered by moisture in the non-contact portion 13 can be extracted. In this way, the humidity sensing element of the present invention converts changes in relative humidity in the air into changes in capacitance. In order to accurately extract the concentration-capacitance conversion characteristics of the humidity sensing element of the present invention without variation, it is necessary to accurately calculate the capacitance detected between the anode substrate 1 and the conductive electrode 4. There is a need to take it out. The above-mentioned capacitance C between the two electrodes is as follows. A: Total area of the dielectric anodic oxide film 2 with which the semiconducting metal oxide layer 3 is not in contact B: Total area ε of the dielectric anodic oxide film 2 with which the semiconducting metal oxide layer 3 is in contact: Dielectric constant l of dielectric anodic oxide film 2: Thickness α of dielectric anodic oxide film 2: Coverage rate by moisture of non-contact portion 13 of dielectric anodic oxide film 2 RH: relative humidity, dielectric Moisture coverage α of anodic oxide film 2
depends on the relative humidity RH, so α∝RH, and the capacitance C is C=ε/l(B+α・A) ∴C∝ε/l(B+RH・A), and the anode substrate 1 and conductivity The capacitance C between the electrode 4 and the electrode 4 is determined uniquely and linearly with respect to the relative humidity RH. FIG. 4 shows the relationship between capacitance and relative humidity. The present invention is a method for manufacturing a humidity sensing element, which is characterized in that the capacitance between the above-described anode substrate 1 and the conductive electrode 4 of the humidity sensing element is taken out at a predetermined arbitrary value without variation, Specifically, the seventh
After attaching the anode substrate 1 to the L-shaped conductive band 15 shown in the figure, as shown in FIG. b. While controlling the dimension c of the conductive electrode 4 to an arbitrary value using the conductive band 15, the conductive electrode 4 is manufactured in sequence according to the manufacturing process diagram shown in FIG. The contact rate of the dielectric anodic oxide film 2 with the semiconducting metal oxide layer 3, that is, the ratio of the contact portion 14 between the two to the total area of the dielectric anodic oxide film 2, B/A+B can be controlled to any value. If the manufacturing method of the present invention is used, the dimensions a,
The accuracy of b and c is also extremely improved, short-circuit failures due to polymerization between the anode substrate 1 and the conductive electrode 4 are extremely reduced, and the capacitance tolerance of capacitance C is also reduced, making it possible to achieve any value of capacitance. Matching to the required electrical circuit is also significantly easier. Next, specific examples of the present invention will be described. After attaching a tantalum wire with a diameter of 1 mmφ and a length of 20 mm to the side of the pressurized stainless steel conductive band 16 shaped into an L shape as shown in FIG. An oxide film is formed by applying a voltage of 50V at ℃, and then the specific gravity becomes 1.5.
A manganese nitrate aqueous solution is applied, and a metal oxide of manganese dioxide is formed on the anodic oxide film by thermal decomposition. Furthermore, a carbon layer is formed on the manganese dioxide by impregnating and drying colloidal carbon, and a silver paint layer is formed on the carbon layer. The composition made in this way was heated to 40℃ and 90%
Hold for 50 hours under RH conditions. Comparing the structure made in this way with a structure manufactured by pressing the same tantalum wire as the one of the present invention on a stainless steel rod 18 of 1 mmφ as shown in FIG. 10 by the process shown in FIG. It looks like Table 1.
【表】
以上の結果を湿度検知素子における相対湿度−
静電容量特性として第12図、第13図に示して
いる。
また、第10図による方法では、ステンレス棒
18の曲がり、ねじれ等によつて浸漬精度が、ば
らつくことに加え、各製造工程における浸漬によ
る液の這い上がり等を加えると、表2に示すよう
に相対湿度50%RHにおける静電容量幅は、本発
明に比べて著しくバラツクと同時に、短絡故障も
著しく増大する。[Table] The above results are expressed as relative humidity in the humidity sensing element.
The capacitance characteristics are shown in FIGS. 12 and 13. In addition, in the method shown in FIG. 10, the immersion accuracy varies due to bending, twisting, etc. of the stainless steel rod 18, and when liquid creeps up due to immersion in each manufacturing process, etc. are added, as shown in Table 2. The capacitance width at a relative humidity of 50% RH is significantly different from that of the present invention, and at the same time, short-circuit failures are also significantly increased.
【表】
以上の結果からわかるように本発明の方法で製
造した湿度検知素子は、第12図のようにバラツ
キが非常に小さく、言い換えれば、電気回路が要
求する任意の傾きが取り出せ、回路へのマツチン
グ調整等も比較的簡単となり、量産性の向上、歩
留りの向上を図り、安価で互換性のある湿度検知
素子が得られる。
このように本発明は、上述した条件を満足する
湿度検知素子を造るために不可欠な条件であり、
その工業的価値は大である。[Table] As can be seen from the above results, the humidity sensing element manufactured by the method of the present invention has very small variations as shown in Figure 12. In other words, it is possible to obtain any slope required by the electric circuit, and Matching adjustment and the like are also relatively simple, improving mass productivity and yield, and providing inexpensive and compatible humidity sensing elements. As described above, the present invention is an essential condition for producing a humidity sensing element that satisfies the above-mentioned conditions.
Its industrial value is great.
第1図は本発明に係る湿度検知素子の基本構成
を示す断面図、第2図は同素子の具体例を示す断
面図、第3図は同素子の静電容量−相対湿度特性
を示す特性図、第4図は同素子の吸脱湿応答特性
を示す特性図、第5図は本発明による湿度検知素
子の製造工程を示す工程図、第6図は本発明の湿
度検知素子の誘電体性陽極酸化皮膜と半導体性金
属酸化物層の状態を示す拡大図、第7図は本発明
による製造方法で用いるL型形状の導電帯を示す
斜視図、第8図は同方法における効果を説明する
ための湿度検知素子の断面図、第9図は本発明の
製造方法における要部工程の状態を示す概略図、
第10図は本発明の製造方法と比較するための比
較例における要部工程の状態を示す概略図、第1
1図は同比較例における工程を示す工程図、第1
2図および第13図はそれぞれ本発明による製造
方法と、本発明と比較するための比較例とにおけ
る静電容量−湿度特性を示す特性図である。
1……陽極基体、2……誘電体性陽極酸化皮
膜、3……半導体性金属酸化物層、4……導電性
電極、15……導電帯。
FIG. 1 is a cross-sectional view showing the basic structure of a humidity sensing element according to the present invention, FIG. 2 is a cross-sectional view showing a specific example of the same element, and FIG. 3 is a characteristic showing the capacitance-relative humidity characteristic of the same element. Figure 4 is a characteristic diagram showing the moisture absorption and desorption response characteristics of the same element, Figure 5 is a process diagram showing the manufacturing process of the humidity sensing element according to the present invention, and Figure 6 is a dielectric material of the humidity sensing element according to the present invention. FIG. 7 is a perspective view showing an L-shaped conductive band used in the manufacturing method of the present invention, and FIG. 8 explains the effects of the method. FIG. 9 is a schematic diagram showing the state of main steps in the manufacturing method of the present invention,
FIG. 10 is a schematic diagram showing the state of main steps in a comparative example for comparison with the manufacturing method of the present invention,
Figure 1 is a process diagram showing the steps in the same comparative example.
FIG. 2 and FIG. 13 are characteristic diagrams showing capacitance-humidity characteristics in the manufacturing method according to the present invention and a comparative example for comparison with the present invention, respectively. DESCRIPTION OF SYMBOLS 1... Anode substrate, 2... Dielectric anodic oxide film, 3... Semiconductor metal oxide layer, 4... Conductive electrode, 15... Conductive band.
Claims (1)
からなる複数個の陽極基体をぶら下げて取付け、
この導電帯に取付けた複数個の陽極基体を一単位
として誘電体性陽極酸化皮膜、半導体性金属酸化
物層および水蒸気透過性の導電性電極を順次積層
形成するそれぞれの工程を実施した後、導電帯よ
り分離することを特徴とする湿度検知素子の製造
方法。 2 弁作用金属がタンタル、チタン、ニオブ、ア
ルミニウム、ハフニウムの中から選ばれたもので
あることを特徴とする特許請求の範囲第1項に記
載の湿度検知素子の製造方法。 3 陽極基体が弁作用金属線であることを特徴と
する特許請求の範囲第1項に記載の湿度検知素子
の製造方法。[Claims] 1. A plurality of anode substrates made of a valve metal are hung and attached to a conductive band formed into an L-shape,
After carrying out the steps of successively laminating a dielectric anodic oxide film, a semiconducting metal oxide layer, and a water vapor permeable conductive electrode using the plurality of anode substrates attached to this conductive band as one unit, the conductive A method for manufacturing a humidity sensing element, characterized in that it is separated from a band. 2. The method for manufacturing a humidity sensing element according to claim 1, wherein the valve metal is selected from tantalum, titanium, niobium, aluminum, and hafnium. 3. The method for manufacturing a humidity sensing element according to claim 1, wherein the anode substrate is a valve metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9148780A JPS5717101A (en) | 1980-07-03 | 1980-07-03 | Method of producing moisture detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9148780A JPS5717101A (en) | 1980-07-03 | 1980-07-03 | Method of producing moisture detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5717101A JPS5717101A (en) | 1982-01-28 |
| JPS6145367B2 true JPS6145367B2 (en) | 1986-10-07 |
Family
ID=14027763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9148780A Granted JPS5717101A (en) | 1980-07-03 | 1980-07-03 | Method of producing moisture detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5717101A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3524727A1 (en) * | 1985-07-11 | 1987-01-22 | Dornier Gmbh Lindauer | METHOD FOR PULLING THREADS IN PROTECTIVE WEAVING MACHINES THROUGH THE WEB TRAY AND WHICH IT IS RETURNED, WITH CLAMPING EQUIPMENT FOR THE SPRING GRIPPERS |
| JPH0820394B2 (en) * | 1987-10-19 | 1996-03-04 | 日本パーカライジング株式会社 | Humidity sensor |
-
1980
- 1980-07-03 JP JP9148780A patent/JPS5717101A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5717101A (en) | 1982-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4305112A (en) | Capacitance humidity sensing element | |
| US4041437A (en) | Humidity sensor | |
| CA1116237A (en) | Humidity sensor of capacitance change type | |
| JPH0242429B2 (en) | ||
| CN106680333A (en) | Humidity sensitive capacitor and manufacturing method thereof | |
| JPS6145367B2 (en) | ||
| US4344062A (en) | Humidity sensor element | |
| US3574681A (en) | Aluminum oxide humidity sensor | |
| US4765870A (en) | Method of manufacture of an electric moisture-content sensor | |
| CN1037041C (en) | Inorganic thin film humidity-sensitive element with high performance and its producing method | |
| US4156268A (en) | Humidity sensing element and method of manufacture thereof | |
| JPS6145369B2 (en) | ||
| CN206557144U (en) | A kind of humicap | |
| JPS6145366B2 (en) | ||
| JPS5843894B2 (en) | Manufacturing method of humidity sensing element | |
| JPS6140124B2 (en) | ||
| JPS59123B2 (en) | Manufacturing method of humidity sensing element | |
| JP3314509B2 (en) | NOx gas sensing semiconductor and method of manufacturing the same | |
| JPH0720080A (en) | Humidity sensor | |
| JPS6151735B2 (en) | ||
| JPS6151263B2 (en) | ||
| JPS6049863B2 (en) | Humidity detection element | |
| JPS6230484B2 (en) | ||
| JPH06118045A (en) | Humidity sensor | |
| JPS6130211B2 (en) |