JPS6145716B2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a material to be plated (hereinafter referred to as a work).
This is a device that performs partial plating by spraying a plating liquid onto specific minute parts of a workpiece, and is capable of simultaneously processing a large number of precise minute part platings in extremely narrow places, such as the lead frame of an integrated circuit element, and is capable of processing a large number of precise minute part platings at the same time, especially in extremely narrow places such as the lead frame of an integrated circuit element. In response to this, the head equipped with a large number of masking masks and plating liquid spray nozzles, and the feeder that supplies plating liquid to each nozzle at a constant speed, are freely replaceable, allowing high efficiency and high quality partial plating of various large quantities of workpieces. The present invention relates to a plating liquid flow rate adjustable partial plating device that allows processing.

Generally, the ends of lead frames for integrated circuit elements (ICs) are partially plated with precious metals such as gold and silver for bonding purposes. In particular, since the above-mentioned lead frame has multiple poles, there are many plating processing parts per product, and in addition, it is necessary to process a wide variety of products in large quantities due to its marketability.

Therefore, if plating is applied to areas other than those that are truly necessary, the amount of precious metal consumed as a whole will increase and the cost will increase.

For this reason, when partially plating such a work, it is common to minimize the plating area in order to suppress the consumption of precious metals, and to process the work using a multi-nozzle system.

However, in the case of the conventional partial plating means, only a mask for masking the workpiece and a nozzle for spraying the plating liquid are multiplied. However, simply connecting a large number of nozzles in parallel to the plating liquid supply pipe will not work.
Since there is a difference in the flow rate or flow rate of the plating liquid between the nozzles, it becomes difficult to perform plating with uniform quality.

For this reason, it is desirable to adjust the flow path inedance for each nozzle in advance, but since the plating device is integrated, the entire device must be changed each time the type of workpiece is changed, which takes time to set up the work. There was a problem that there were too many.

Furthermore, it is necessary to prepare in advance a partial plating device section corresponding to the number of types of workpieces, and there is also a problem in that the manufacturing cost of the plating device itself increases, and the equipment cost increases.

Furthermore, even if the part (mask or nozzle) that is most easily worn out in this partial plating apparatus is damaged, it is not easy to repair, resulting in maintenance problems.

The present invention has been made in view of the above problems.
A positioning head equipped with a nozzle corresponding to the plating part while masking the part to be plated on the workpiece, and a flow path communicating with the nozzle and the plating liquid supply pipe, and controlling the flow rate of the plating liquid in this flow path. The system consists of a feeder equipped with a flow rate adjustment section, which can be detached and replaced, and the plating liquid is sprayed onto each plating part of the workpiece at a constant velocity, allowing precise partial plating to be performed in large quantities with high efficiency under high quality control. In addition, we have developed a partial plating device with a plating fluid flow rate adjustment type that allows for quick setup depending on the type of workpiece, easy manufacturing and maintenance of the device, and low cost partial plating combined with processing costs. It is intended for the purpose of providing.

Embodiments of the present invention will be described below with reference to FIG.

A mask 3 in which a through hole 2 corresponding to a portion of the workpiece 1 to be plated is formed is detachably attached to a mantle 4 so that the mantle 4 can be sealed tightly.

Further, nozzles 5 communicating with the outside are arranged in parallel at the bottom of the mantle 4 at positions corresponding to the respective through holes 2,
The head A is configured together with the mask 3,
A side wall of the mantle 4 is connected with an evacuation pipe 6 that communicates with an intake mechanism (not shown), and the mantle 4 is connected to the side wall of the mantle 4 as described below.
Allows negative pressure inside.

On the other hand, a housing 7 that is detachable from the bottom of the mantle 4 is attached.
Inside the nozzle 5, there is a flow path that can communicate with the nozzle 5, for example, a guide tube 8 that can be connected to the nozzle 5.
The rear end of each guide pipe 8 is connected to a plating liquid supply pipe 9 to form a feeder B.

Further, a flow velocity adjusting section is provided, in which a rectifier plate 10, which can be adjusted from the outside, is rotatably attached to each of the guide tubes 8, so that the cross-sectional area of the flow path within the guide tube 8 can be adjusted to an arbitrary value. It is as follows.

In addition, the through hole 2 and nozzle 5 in the head A,
The arrangement pattern of the guide tube 8 of the feeder B is preferably the same as a combination of plating patterns of several types of workpieces 1.

For example, as shown in FIG. 2, it is convenient to arrange both in a matrix so that the nozzle 5 and the guide tube 8 can communicate with each other.

In the configuration described above, first, the housing 7 of the feeder B to be paired with the mantle 4 of the head A, in which the mask 3 corresponding to the workpiece 1 is disposed, is connected, and the rear end of the nozzle 5 and the guide are connected. The pipe 8 is brought into communication,
Mask 3 is brought into close contact with work 1.

On the other hand, by driving the suction mechanism, the inside of the mantle 4 is brought into a negative pressure state, and under this condition, the plating liquid pressurized to a predetermined pressure is supplied from the plating liquid supply pipe 9 to the guide pipe 8 to the nozzle 5. send.

As a result, the workpiece 1 is passed through the through hole 2 of the mask 3.
The plating liquid is injected into the area and the part can be plated. However, if there is a negative pressure inside the mantle 4, the used and surplus plating liquid will flow out of the mantle 4 from the exhaust pipe 6 in a gas-liquid mixture. As a result, a high-quality plating layer is plated in an extremely short time as a result of the forcible removal and fresh plating liquid is always injected near the through hole 2, and by forcibly removing the excess plating liquid, this plating layer is removed. This prevents the liquid from infiltrating the periphery of the masked workpiece and causing halation, making it possible to perform precise and minute plating.

In addition, during the plating process, the internal flow cross-sectional area of each guide tube 8 can be arbitrarily varied (increase/decrease flow path resistance) by adjusting the rotation of each rectifier plate 10 provided on the guide tube 8 by a predetermined amount from the outside. By adjusting the unused guide tubes 8 with the straightening plate 10 horizontal and fully closed [shown with diagonal lines in FIG. The plating liquid is injected at a constant velocity that compensates for the difference in liquid pressure, etc. Therefore, even if the plating time is controlled at a constant level, all the parts to be plated can be uniformly plated, and the yield and workability can be significantly improved.

Incidentally, in the conventional multi-part plating device, only the plating time is managed, and as the conditions of each nozzle are different as mentioned above, it is very difficult to form a uniform plating layer on all the parts to be plated.

In addition, when changing the type of workpiece 1, either operate the flow rate adjustment section of the guide pipe 8 of the feeder B to inject the plating liquid only from the predetermined nozzle 5, or
It is only necessary to replace feeder B and/or head A, making setup extremely easy.

Furthermore, even if the nozzle 5, mask 3, flow rate adjustment part, etc. are damaged, head A or feeder B
It is possible to repair or replace either of them.

Of course, during manufacturing, the head A and feeder B can be divided and processed separately, making it easier to manufacture more precise ones.

In addition, in the case of electrolytic plating, nozzle 5 of head A
Of course, the workpiece 1 is used as the anode of the DC power supply and the workpiece 1 is used as the cathode.

Next, the second embodiment of the feeder is shown in Figure 3a and Figure 3.
This will be explained based on figure b.

A predetermined number of guide holes 22 corresponding to the nozzles 5 are bored in the bottom of the mantle 4 and the detachable casing 21 to form a flow path. A removable sliding plate 23 is inserted.

The sliding plate 23 has wide slits 24 formed at positions corresponding to the respective guide holes 22, and horizontal grooves 25 having a V-shaped cross section or a dovetail shape are carved on both inner walls of the slits 24. , an adjustment plate 2 in which a hole 26 that can communicate with the guide hole 22 is bored.
7 is removably inserted.

The diameter of the hole 26 of the adjustment plate 27 is determined according to the flow path resistance of the guide hole 22 which is a flow path, as in the previous embodiment, and an arbitrary number of adjustment plates corresponding to the workpiece 1 are prepared in advance. 27 is prepared and placed, and when the workpiece 1 is changed, the adjustment plate 27 is removed and replaced.

In this case as well, the flow rate of the plating liquid can be controlled by adjusting the cross-sectional area (resistance) of each flow path formed by the guide hole 22 to the nozzle 5 by adjusting the opening degree of the hole 26 of the adjustment plate 27. , each nozzle 5 can inject the plating liquid onto the workpiece at a constant speed.

The feeder B according to the above two embodiments both adjusts the cross-sectional area of the flow path for supplying the plating liquid and controls the flow rate of the plating liquid in a dispersive manner.
In the embodiment shown in the figure, the flow rate of the plating liquid is controlled centrally in all nozzles 5 and the flow paths by adjusting the flow path length.

Next, this embodiment will be described. Components having the same configuration as those described above will be denoted by the same reference numerals and the explanation will be omitted.

A housing 31 that can be detachably attached to the mantle 4 is provided with branch pipes 32 that can communicate with each nozzle 5, and each branch pipe 32 is connected to a plating liquid supply pipe via a chamber 33 formed at the bottom thereof. 9, and a tapered pipe 34 is installed within the chamber 33 at right angles to the branch pipe 32.

The inclination angle of the tapered pipe 34 is determined depending on the flow path impedance and the load on the nozzle 5. For example, as shown in FIG. The length of the flow path is long from the branch pipe 32 to the nozzle 5 via the outer periphery of the pipe 34, and conversely, the length of the flow path is shorter in the case of a smaller diameter as shown in FIG. 5b.

Therefore, by appropriately selecting the flow path length, the plating liquid flow rate from each nozzle 5 can be made constant.

Further, the mask 3 of the head A can also be configured as follows.

For example, as shown in FIGS. 6a and 6b, an arbitrary number of horizontal grooves 42 communicating with the through holes 2 and the outside of the mask 3 are formed in the mask body 41, and outside air is channeled through the outer mantle 4.
This can prevent the solution injected from the nozzle 5 from stagnation and improve efficiency and precision.

In this case, the lower side of the through hole 2 is formed with an umbrella-shaped tapered portion 43, and the horizontal groove 42 is also formed in a positional relationship that causes a couple to act on the plating liquid column injected from the through hole 2. This makes it possible to form a liquid column in a spiral shape and prevent the plating liquid from spreading.

Furthermore, as shown in FIG. 7, by forming an arbitrary number of vertical grooves 52 in the mask body 51 on the outer periphery of the through hole 2, which communicate with the outside and run parallel to the nozzle 5, the plating liquid is sprayed from the nozzle 5. A columnar airflow is formed around the outer circumference of the column by the introduced outside air, the lateral pressure of the plating liquid column is reduced, and the used plating liquid that is about to be diffused is sucked into this columnar airflow or brought into direct contact with it. Forced transfer can be eliminated.

This eliminates the phenomenon of back pressure caused by solution stagnation near the through hole 2, and allows fresh plating solution to be constantly injected at high speed, allowing efficient continuous processing.

As described above, the head A and the feeder B can have various embodiments, but the present invention is not limited to the workpiece to be plated. It can also be applied to peeling and pickling of plating resist films, reverse plating, degreasing, etc., as disclosed in ``And Apparatus Therefor''.

In this case, in the above embodiment, the workpieces are the respective surface-treated materials, and the plating solutions are respectively plating resist film stripping solution, metal stripping electrolytic solution, strong acid solution, electrolytic solution, electrolytic degreasing solution, and dipping. Although a degreasing liquid or the like is used, the specific means for each of the various surface treatments are the same as those in the above invention, so a description thereof will be omitted.

As explained above, according to the present invention, a feeder having a function of supplying plating liquid to each nozzle at a constant speed is detachably disposed in a head having a function of positioning a workpiece and spraying a plating liquid. Because of this, it has the following effects.

(1) The entire device has a divided structure, which makes it easy to manufacture the mask and nozzle parts, which are difficult to process, and also allows for easy repair, inspection, and replacement, so equipment costs are low.

(2) Since the plating liquid jetting speed from each nozzle can be adjusted in accordance with the workpiece, maintenance is easy as the head can be operated simply by replacing the head.

(3) When inspecting, repairing or replacing easily damaged masks and nozzles, use only the head (or only the feeder when repairing and replacing the feeder)
This makes maintenance easy and naturally reduces maintenance costs.

(4) The plating liquid jet flow rate from each nozzle can be set at a constant speed and finely adjusted according to the nozzle load and flow path impedance corresponding to the workpiece, so it is possible to perform multi-point plating on a variety of workpieces. Not only can plating with uniform quality be achieved, the processing time can be shortened, and precise partial plating can be performed on a mass-produced basis under advanced quality control, which, together with the reduction in consumption of the plating base material, is extremely effective. The plating processing cost can be reduced.

[Brief explanation of the drawing]

The figures relate to an embodiment of the plating liquid flow rate adjustable partial plating device of the present invention. Fig. 1 is a longitudinal sectional view showing the configuration of the head and feeder, and Fig. 2 shows the through hole and the structure of the head mask. An explanatory diagram showing an example of the arrangement of the nozzle of the feeder, Fig. 3a is a longitudinal sectional view showing another embodiment of the feeder, Fig. 3b is a plan view of the same, and Fig. 4 is a longitudinal sectional view of the third embodiment of the feeder. , Figure 5a is a cross-sectional view taken along the same line as above, Figure 5b is
6a is a longitudinal sectional view showing a head mask according to another embodiment, and 6b is a sectional view taken along the line 6.
This figure is a plan view of the above mask, and FIG. 7 is a longitudinal sectional view showing a third embodiment of the head mask. 1...Work, 2...Through hole, 3...Mask, 4
... Mantle, 5 ... Nozzle, 6 ... Exclusion pipe, 7,
21, 31... Housing, 8... Guide tube, 9... Plating liquid supply pipe, 10... Rectifying plate, 22... Guide hole, 23... Sliding plate, 24... Slit, 25...
...Horizontal groove, 26... Hole, 27... Adjustment plate, 32...
...Branch pipe, 33...Chamber, 34...Tapered tube, 41, 51...Mask body, 42...Horizontal groove, 43...Tapered part, 52...Vertical groove, A...
Head, B...feeder.

Claims (1)

[Scope of Claims] 1. A mask having an arbitrary number of through holes for positioning the plating portion, a mantle that is sealed when the mask is attached, and a mantle disposed inside the mantle so as to face the through holes. The head configured with a nozzle is provided with a flow rate adjusting section that forms a flow path that can communicate with the nozzle and the plating liquid supply pipe in a housing that communicates with the plating liquid supply pipe, and controls the flow rate of the plating liquid in this flow path. This is a partial plating device with a plating liquid flow rate adjustment type, which is formed by connecting feeders with the same configuration in a detachable and replaceable manner. 2. Claim 1, characterized in that an air intake mechanism is connected to the mantle of the head to create a negative pressure inside the mantle, and used or surplus plating liquid is forcibly discharged to the outside. Partial plating device with adjustable plating liquid flow rate. 3. The plating liquid flow rate adjustable partial plating apparatus according to claim 2, wherein the mask of the head prevents outside air from being introduced except where it is in close contact with the material to be plated. 4. The plating liquid flow rate adjustable partial plating device according to claim 2, wherein an arbitrary number of outside air introduction grooves parallel to the nozzle are bored in the head mask in the vicinity of the through hole. 5 A horizontal outside air introduction groove is bored in the head mask in the tangential direction of the through hole, and this outside air introduction groove and the through hole are communicated so that the outside air introduced into the plating liquid column injected from the nozzle can be The plating liquid flow rate adjustable partial plating device according to claim 2, characterized in that a force is applied. 6. According to any one of claims 1 to 5, the number of flow channels of the feeder corresponds to the number of nozzles, and the flow rate adjusting sections are distributed and arranged for each flow channel. The plating liquid flow rate adjustable partial plating device described above. 7. Claim 1, characterized in that the number of channels of the feeder corresponds to the number of nozzles, and the base of the feeder is concentrated to form a main channel, and a flow velocity adjusting section is disposed in this main channel. A plating liquid flow rate adjustable partial plating device according to any one of items 1 to 5. 8. The plating liquid flow rate adjustable partial plating device as set forth in claim 6, wherein the flow rate adjusting section is provided with a rectifying plate that can be adjusted externally to vary the cross-sectional area of the flow path. 9. The plating liquid flow rate adjustable partial plating according to claim 6, characterized in that the flow rate adjusting section is provided with a removably adjustable adjusting plate in which a hole for determining the cross-sectional area of the flow path is formed. Device. 10. The plating liquid flow rate adjusting type according to claim 7, wherein the flow rate adjusting section has a tapered pipe arranged in the main flow path to determine the length of each flow path in accordance with the load of the flow path. Partial plating device.