JPS6145879B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a series of chip-shaped electronic components having a configuration in which a plurality of chip-shaped electronic components are distributed and held in the length direction of a tape, and a series of chip-shaped electronic components using this series of chip-shaped electronic components. The present invention relates to a method for supplying shaped electronic components.

Traditionally, most electronic components have lead wires attached to them. However, the recent trend in various electronic devices is to make them ultra-thin and ultra-small.
In order to respond to this trend, improvements have been made in various parts of electronic devices, and these improvements have spread to the point where the lead wires of electronic components occupy as little as possible. Chip-shaped electronic components without lead wires are advantageously used for this purpose. This is applied to, for example, a multilayer capacitor, and an external electrode is formed on a certain surface of the capacitor. Such chip-shaped electronic components are directly soldered to the wiring board via external electrodes, thereby being electrically and mechanically connected to the wiring board.

Feeding the chip-shaped electronic components to the wiring board as described above requires alignment, so it has been done manually or using a parts feeder. Therefore, the disadvantages are that it is complicated, difficult to automate, and low in certainty and reliability.

For this purpose, for example, a magazine system has been proposed. FIG. 1 is a perspective view of the magazine. In this method, a plurality of chip-shaped electronic components 2 are stored in a storage body 1.
Chip-shaped electronic components 2 are supplied by a magazine 3 in which electronic components are arranged side by side. This storage body 1
is made of aluminum or plastic, and has a fixed length.
However, with this method, the amount of pooled magazines 3 is small, and the magazines 3 must be replaced frequently. Even if the removal of chip-shaped electronic components 2 is automated, handling of the magazines 3 themselves is a problem. . Further, when automatically taking out the chip-shaped electronic component 2, it is necessary to directly feed out the electronic component 2, and a device for feeding and positioning is required. Furthermore, since adjacent chip-shaped electronic components are in contact with each other, the electronic component 2 may be damaged due to this contact.

Therefore, the main object of the present invention is to provide a chip-shaped electronic component having a form in which a plurality of chip-shaped electronic components are distributed and held in the length direction of an appropriate tape, which can solve the above-mentioned problems. An object of the present invention is to provide a series of tape-shaped electronic components and a method of supplying chip-shaped electronic components using this series of tape-shaped electronic components.

In summary, the chip-shaped electronic component series of the present invention includes a plurality of rectangular holes distributed in the length direction of a flexible tape, a projecting piece provided on the periphery of the hole, and a plurality of rectangular holes distributed in the length direction of a flexible tape. By bringing the side edges of the rectangular chip-shaped electronic component into elastic contact with the protrusion, the chip-shaped electronic component is positioned and held with its two adjacent sides pressed against the two adjacent sides of the rectangular hole. It is something that

To summarize, the method for supplying chip-shaped electronic components of the present invention prepares a series of chip-shaped electronic components as described above, and moves the tape included in the series of chip-shaped electronic components in the length direction to supply chip-shaped electronic components. This is a supply method in which components are sequentially transferred, and the chip-shaped electronic components thus transferred are taken out at a predetermined position and placed on a printed circuit board or the like.

Other objects and features of the present invention will become more apparent from the detailed description given below with reference to the drawings.

FIGS. 2 to 4 are diagrams for explaining an embodiment of a series of chip-shaped electronic components of the present invention,
Fig. 2 is a plan view showing a part of the tape, Fig. 3 is a plan view showing part of a series of chip-like electronic parts in which the tape holds chip-like electronic parts, and Fig. 4 is a plan view showing the same line as shown in Fig. 3. - FIG.

Tape 4 for holding chip-shaped electronic component 2
is made of, for example, paper, resin, or metal. Holes 5 are formed in this tape 4. Note that the general chip-shaped electronic component 2 is often rectangular, and therefore the shape of the hole 5 is selected to be similar to the shape of the chip-shaped electronic component 2. hole 5
A projecting piece 6 is formed extending from the periphery of the hole 5 toward the center of the hole 5 . Here, the protruding piece 6 is a rectangular hole 5.
It is formed to protrude from one corner of the.
One chip-shaped electronic component 2 is placed in each hole 5 with its direction and front and back sides determined. At this time, the protruding piece 6 elastically contacts the corner portion of the chip-shaped electronic component 2 while being slightly deformed. Then, the two adjacent sides 7 and 8 of the rectangular chip-shaped electronic component 2 are pressed by the elasticity of the protruding piece 6 and come into contact with the corresponding two adjacent sides 9 and 10 of the rectangular hole 5. According to the arrangement state of the chip-shaped electronic component 2 in the hole 5, the chip-shaped electronic component 2 is always attached to the tape 4.
It will be positioned at a certain position. In addition, as shown in FIG. 4, the tape 4
It is preferable that the thickness of the chip-shaped electronic component 2 be made thicker than that of the chip-shaped electronic component 2 in order to realize stable holding.

FIG. 5 is a plan view showing another embodiment of the chip-shaped electronic component series of the present invention. The embodiment shown here is similar to the previous embodiment except that two protrusions 6 extending from the periphery of the hole 5 are provided. These two projecting pieces 6, 6 are arranged separately on two adjacent sides of the rectangular hole 5, respectively. Also in this embodiment, the two sides 7 and 8 of the chip-shaped electronic component 2
are pressed and positioned along the two sides 9 and 10 of the hole 5, respectively, so the chip-shaped electronic component 2 is always held at a constant position on the tape 4.

FIG. 6 is a sectional view showing still another embodiment of the chip-shaped electronic component series of the present invention. The embodiment shown here is characterized in that an inclined surface 11 is formed on one side of the protruding piece 6 provided in relation to the hole 5. This inclined surface 11 is provided to facilitate press-fitting of the chip-shaped electronic component 2 into the hole 5. When the tape 4 is made of paper, for example, such an inclined surface 11 can be formed by giving an appropriate shape to the cutting blade used for press cutting to form the holes 5 and the protrusions 6. It can easily be made as a by-product of cutting.

FIG. 7 and FIG. 8 are sectional views showing still other embodiments of the chip-shaped electronic component series of the present invention. In the embodiment shown in FIG. 7, a first additional tape 12 is joined along one side of the tape 4, thereby closing one opening of the hole 5. Other parts are similar to the embodiment shown in FIGS. 2 to 4. The embodiment shown in FIG.
In addition to the embodiment shown in FIG. 7, a second additional tape 13 is bonded to the other side of the tape 4. In this way, the hole 5 formed in the tape 4
The opening will be closed at both ends.

If one or both openings of the holding space for the chip-shaped electronic component 2 are closed by stacking a plurality of tapes as described above, the chip-shaped electronic component 2 can be made more stable.
A holding state is obtained.

Next, with reference to FIG. 9, a method for taking out and supplying chip-shaped electronic components from the chip-shaped electronic component series configured as described above will be described. Note that FIG. 9 is intended for the case of the chip-shaped electronic component series shown in FIG. 8.

FIG. 9 is a schematic diagram of a feeding device for explaining an embodiment of the chip-shaped electronic component feeding method of the present invention. The chip-shaped electronic component chain 100 configured as described above is wound into a roll, and the component reel 101
is held rotatably. A series of chip-shaped electronic components 100 pulled out from this reel 101 in the direction of an arrow 102 is guided by a guide 103 and transferred to a conveying device 10.
4. This conveyance device 104 includes a belt conveyor 105 that operates intermittently, and a plurality of protrusions 106 are provided on the circumferential surface of the belt conveyor 105 at equal intervals. The protrusion 106 fits into a feed hole (not shown) provided in the chip-shaped electronic component series 100, and the chip-shaped electronic component series 100 is moved along the arrow 107.
This is to ensure movement in the direction. Note that although the fitting between the protrusion 106 and the feed hole was used to transfer the chip-shaped electronic component series 100, there is no particular need for such a configuration. It may also be transported by a pair of feed rollers. In this case, the feed hole is not necessary, and it is preferable to form irregularities on the feed roller side to prevent slipping. A pressing member 108 facing the upper surface of the belt conveyor 105 is heated downward by a spring.
will be provided. This pressing member 108 is the protrusion 10
This is to ensure the fit between the hole 6 and the sprocket hole. As mentioned above, the second additional tape 13 is located above the chip-shaped electronic component series 100, and in order to peel off and pull up the second additional tape 13, the pulling roller 110 moves onto the conveyor 10.
5 at an appropriate position on the second additional tape 1
3 is wound around this pulling roller 10 and is indicated by arrow 1.
It is pulled up in the 11 direction and wound onto a take-up reel 112 located above. This take-up reel 11
2 is given an appropriate rotational force, and this force causes the second additional tape 13 to be attached to the chip-shaped electronic component series 1.
It is forcibly removed from 00. A suction chuck 11 is located close to the above-mentioned pulling roller 110.
3 is provided. This suction chuck 113 holds the chip-shaped electronic component 2 by vacuum suction, and it repeats upward, horizontal, and downward movements to attach the chip-shaped electronic component 2 to a printed circuit board (not shown) or the like. supply. In this way, the remaining chip-shaped electronic component series 100 from which the chip-shaped electronic component 2 has been extracted is sent in the direction of the arrow 115 via the guide 114.

As described above, in the chip-shaped electronic component supply method of the present invention, the chip-shaped electronic component 2 is transferred by first moving the tape of the chip-shaped electronic component series 100 in its length direction. Then, the chip-shaped electronic components 2 that have been transported to a predetermined position are taken out one by one against the elasticity of the projection piece 6.
It is placed on a printed circuit board or the like.

As described above, according to the chip-shaped electronic component series of the present invention, the chip-shaped electronic components are always reliably held at a fixed position on the tape, so that, for example, the chip-shaped electronic components can be supplied during automatic mounting. will always be brought to the correct location,
A highly reliable mount can be achieved.
Further, since a large number of chip-shaped electronic components can be held along the tape, even such a large number of chip-shaped electronic components can be stored compactly. Also,
Compared to the conventional magazine system, it is possible to significantly increase the amount of chip-shaped electronic components pooled, so it is possible to save labor for automatic mounting work. Furthermore, the casing can be directly connected to the production process of chip-shaped electronic components, simplifying the process up to shipping. Furthermore, the production process of the series of chip-shaped electronic components and the process of mounting them onto a printed circuit board or the like can be performed in series. Furthermore, the quantity of chip-shaped electronic components can be determined based on the length of the tape, which facilitates process control. In addition, since the chip-shaped electronic components are stored individually one by one without wobbling, it is possible to avoid deterioration or damage to the chip-shaped electronic components not only during transportation but also during mounting. .

Further, according to the chip-shaped electronic component supply method of the present invention, even if the chip-shaped electronic component is very small and is relatively complicated to handle, it is held in advance on the tape, so the tape can be moved. This allows chip-shaped electronic components to be transferred one by one, and the handling of supply of chip-shaped electronic components becomes extremely simple. Since the chip-shaped electronic component held on the tape is always held at a fixed position on the tape, accurate automatic mounting can be performed, and the reliability of the automatic mounting process is further improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional magazine.
2 to 4 are diagrams for explaining an embodiment of a series of chip-shaped electronic components of the present invention, in which FIG. 2 is a plan view showing a part of the tape, and FIG. 3 is a plan view showing a part of the tape. FIG. 4 is a plan view showing a part of a series of chip-shaped electronic components holding electronic components, and FIG. 4 is a sectional view taken along the line - in FIG. 3. FIG. 5, FIG. 6, FIG. 7, and FIG. 8 are a plan view, a cross-sectional view, a cross-sectional view, and a cross-sectional view, respectively, for explaining other embodiments of the chip-shaped electronic component series of the present invention. . 9th
The figure is a schematic diagram of a feeding device for explaining an embodiment of the chip-shaped electronic component feeding method of the present invention. In the figure, 4 is a tape, 5 is a hole, 6 is a protrusion,
7 and 8 are the sides of the chip-shaped electronic parts, 9 and 10 are the sides of the hole, 100 is a series of chip-shaped electronic parts, 104 is a conveying device, and 113 is a suction chuck.

Claims (1)

[Claims] 1. A plurality of rectangular holes are formed distributed in the length direction of a flexible tape, and a rectangular chip-shaped electronic component is arranged in the rectangular hole, and in this state, Projections extending toward the center of the hole are formed on the other two sides of the hole so that the two adjacent sides of the rectangular chip-shaped electronic component are pressed against the two adjacent sides of the hole, and The chip-shaped electronic component is placed in the rectangular hole, and the protruding pieces elastically abut against the side edges of the chip-shaped electronic component, so that two adjacent sides of the rectangular chip-shaped electronic component are A series of chip-shaped electronic components are positioned and held along two adjacent sides of the rectangular hole. 2 A plurality of rectangular holes are formed distributed in the length direction of the flexible tape, a rectangular chip-shaped electronic component is placed in the rectangular hole, and the rectangular chip-shaped electronic component is placed in this state. The other two sides of the hole are pressed so that the two adjacent sides of the hole are pressed against the two adjacent sides of the hole.
A protruding piece extending toward the center of the hole is formed, the rectangular chip-shaped electronic component is placed in the rectangular hole, and the protruding piece elastically abuts a side edge of the chip-shaped electronic component. Therefore, prepare a series of chip-shaped electronic components in which two adjacent sides of the rectangular chip-shaped electronic component are positioned and held along two adjacent sides of the rectangular hole, and roll the tape in the length direction. the chip-shaped electronic components are sequentially transferred accordingly, and the chip-shaped electronic components that have been transported to a predetermined position are taken out against the elasticity of the protrusion and placed on a printed circuit board or the like. A method for supplying chip-shaped electronic components.