JPS6147679B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic press apparatus for printed circuit boards. A so-called unit product board, which is formed by adhering a conductive metal foil onto an insulating substrate so as to obtain a desired circuit pattern, is generally manufactured by arranging a large number of unit printed boards having the same or multiple circuit patterns and simultaneously processing them. Each unit printed board is manufactured by press punching from the formed multi-sided printed board in accordance with the printing position of the circuit pattern, etc. Press punching of multi-panel printed circuit boards is different from press processing of general iron plates, etc., and requires stamping according to the printed circuit pattern. There is a need for a method and apparatus that can quickly and accurately position the press at a predetermined position, speed up the press cycle, and perform a large amount of press work in a short period of time. Further, since press equipment is dangerous, there is a desire for a method and apparatus that can make such work unmanned. This invention was made in order to cope with the above-mentioned circumstances. For example, when press punching a large amount of printed circuit boards such as multi-sided printed circuit boards, the invention can be automatically moved to the press position quickly and accurately without relying on human hands. The purpose of the present invention is to provide an automatic press device for printed circuit boards that can position, press, and obtain unit product substrates, significantly shorten press processing time, and manufacture a large amount of unit product substrates in a short amount of time. shall be. Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. First, in Figure 1 a, b, and c , 1
1 is the multi-panel printed circuit board. This board 11
For example, a plurality of circuit parts 17 unit printed circuit boards A ₁ , A ₂ , A ₃ , A ₄ , A having the same circuit pattern or multiple types of circuit patterns on a square or rectangular insulating substrate made of synthetic resin etc. ₅ , _B1 , _B2 , _B3 ,
B ₄ , C ₁ , C ₂ , C ₃ , ……, C ₆ etc. are formed into a sequence. Reference numeral 12 denotes a single-row, multiple-array printed board obtained by cutting the multi-sided printed board 11 . Here, the board
Each unit printed board on 12 has the same type of circuit pattern. In addition, single row multiple array printed circuit board 1
2, color difference marks M ₁ , M ₂ and N ₁ , which are sensed by color difference, are first and second detection marks that are attached simultaneously during printing on the multi-sided printed circuit board 11 .
N ₂ ,……N _o are formed. color difference mark
M ₁ and M ₂ are used for positioning the single-row multiple-array printed circuit board 12 before sending it to the press device, for example,
It is formed at the longitudinal end of the single-row, multiple-array printed circuit board 12 , approximately at the center of the surface on which the circuit section is formed. The color difference marks N ₁ , N ₂ , ......, _No are used to stop the positioning of each circuit section A ₁ , A ₂ , A ₃ , ......, A _o of the single-row multiple array printed circuit board 12 in the press machine. It is used to obtain the position, and is formed corresponding to each circuit section, for example, at one end in the same direction of each circuit and approximately at the center of the circuit section forming surface. Reference numeral 13 designates a unit product board in which a single-row, multiple-array printed board is positioned at a press position for each unit board, that is, for each circuit section, and is pressed. During press working, not only the unit product substrate 13 is divided, but also holes 15 for electrical component terminal connections are formed at predetermined positions on the conductive pattern 14 at the same time. Here, the single-row multiple array printed circuit board 12 as described above is used.
Regarding the apparatus for continuously and automatically obtaining each unit product substrate 13 from
This will be explained with reference to FIGS. 4a, 4b, and 5b, and 5 and 6. Figure 2 schematically shows the entire automatic press apparatus for printed circuit boards according to this embodiment. Figure a is a view from above, and figure b is a view of figure a seen in the direction of arrow _a . . Figure 3 specifically shows the preliminary stage, substrate supply device, substrate heating device, and substrate loading device (details will be described later) in Figure 2; Figure a is a view from above, Figure b is a view seen in the direction of arrow _a in the figure. FIG. 4 specifically shows the substrate positioning and feeding device (details will be described later) in _FIG . Figure c is a view seen in _two directions of arrow a in the figure. FIG. 5 specifically shows the mold and QDC-equipped substrate knockout device (details will be described later) in FIG. 2. FIG. 6 shows a part of the press device with a product take-out device (details will be described later) in FIG. 2. In the figure, reference numeral 20 denotes a preliminary stage for loading and preparing a large amount of the single-row multiple array printed circuit boards, a guide plate 201 for aligning the end faces when loading the boards, and a movement stage for moving the loaded boards to a board supply device to be described later. It consists of a device 202 and the like. Reference numeral 21 denotes a substrate supply device that reliably supplies the loaded substrates sent from the preliminary stage one by one to a heating device, which will be described later, and includes a lifter 211 that can raise the loaded substrates so that the upper surface of the loaded substrates is constant, and The level detector 212 detects when the number of loaded boards decreases,
A preliminary lifter 213 that loads substrates until the next loaded substrate can be received by the lifter 211, a preliminary level detector 214 that detects the top surface level of the lifter substrate while the preliminary lifter 213 is in operation, and a substrate supply section 2
It consists of 15 mag. 22 is the substrate 12 supplied from the supply device 21
This is a substrate heating device for heating the substrate 12 to a desired temperature, and includes a substrate heating heater 221, a moving device 222 for moving the substrate 12 backward, and the like. Reference numeral 23 denotes a feeding device that feeds the substrate 12 heated and sent out from the substrate heating device 22 into an alignment table 241 (details will be described later) to obtain a conveying posture for the press device (details will be described later). By combining the movements of the substrate feeding conveyor 231 that sends the substrate 12 to the alignment table side (to be described later) and the substrate feeding conveyor 231, the substrate 12 is surely loaded and placed on the alignment table A, and there is no interference between the substrates 12 and 12 when the alignment table is raised or lowered. It consists of a heating section control device 233 (see FIGS. 2a and 2b) that controls the functions of the loading section 232, the substrate feeding device 21 of the preliminary stage 20 , the substrate heating device 22 , and the substrate loading device 23 . Reference numeral 24 indicates an alignment table 24 for the single-row multiple array printed circuit board 12 placed on the alignment table 241.
This is a board positioning and feeding device that obtains a predetermined transport attitude on the board 1, transports it to the press device 27 , and feeds each unit printed board one after another to a predetermined press position. This device 24 consists of a suitably mounted substrate 12.
can be positioned within a certain range,
and can be raised and lowered, and the substrate 1
An alignment table 241 that can suction and fix the substrate 12 and, in combination with the mark reading output of a first mark detection device to be described later, obtain the optimum conveyance posture of the substrate 12 with respect to the press device 27 . Two sets of first mark detection devices 242a and 242b that can detect 12 first detection marks and output information on how far the detection mark position is from the reference position, and an optimal conveyance posture for the press device. The printed circuit board 12 thus obtained can be held and conveyed toward the press device while continuously outputting conveyance distance information, and when each unit printed circuit board reaches the optimal press position, it can be stopped reliably, and it is possible to mutually Two transparent substrate holding and conveying devices 243a and 243b are configured so as not to interfere with each other during conveyance and reverse conveyance, and are provided corresponding to each unit printed circuit board when the substrate 12 is being conveyed. It consists of a second mark detection device 244 that detects the second detection marks N ₁ , N ₂ , . . . , _No. Reference numeral 25 denotes a mold for press punching each unit printed circuit board and processing the desired external shape and electronic component mounting holes, etc., and is capable of processing each unit printed circuit board into a unit product board 13 , By combining the unit product substrate 13 with a knockout device and a press device, which will be described later, it is possible to separate the unit product substrate 13 from the mold at a desired time in the press cycle. Reference numeral 26 denotes a substrate knock-out device with a QDC (Quick Die Changer) that allows the pressing mold 25 to be replaced immediately and can apply force to separate the pressed unit product substrate 13 from the mold 25 . , a guide pin 261 for mold positioning, and a clamper 26 for fixing the mold.
2. It consists of a hydraulic cylinder 263 that generates a knockout force, a separately provided hydraulic pressure generator (not shown), and the like. 27 It is possible to automatically press each unit printed board based on the board transport positioning information, give a peeling command for the unit product board 13 to the mold 25 via the board knock-out device 26 , and remove the unit product board 13 from the mold 25 . It is a press device with a product take-out device that receives the unit product substrate 13 , and the press section main body 27
1. Knockout detection device 272 for confirming that the product substrate has been peeled off from the mold, unit product substrate 13
A product take-out device 273 that receives the product and takes it out from the press body 271, a light safety device 274 (not shown) that prevents danger during the press cycle, and a press device.
27 , a knock-out device 26 with QDC, and a press device control section 75 (see FIG. 2a), which is an electric circuit for controlling a scrap processing device to be described later. 28 is a scrap processing device that finely breaks the remaining outer frame after dividing each unit printed circuit board in the single-row multiple array printed circuit board 12 , and a pick-up conveyor 281 (FIG. 2 b reference),
It consists of teeth 282 that crush the outer frame. Reference numeral 29 is a main control device that controls the operation of the substrate positioning and feeding device 24 and gives appropriate operation commands to the substrate loading device 23 , substrate heating device 22 , substrate feeding device 21 , and press device 27 , and is composed of an electric circuit. be. In this control device 29 , the main control sections related to the operations characteristic of the present invention are a first mark detection reading and alignment table operation command section 291, a second mark reading and conveyance distance detection, calculation, and command section. 292, mark reading limitation control section 293, conveyance amount correction section 294, substrate supply heating input command section 295, press operation command section 96, scrap processing operation command section 297, substrate positioning and feeding device sequence control section 298, etc. The operation in the above configuration will be explained. First, perform the following steps as a preparation step. First, a mold 25 that can process a unit printed board into a desired unit product board 13 is correctly attached to a predetermined position of the QDC-equipped board knockout device 26 and the press device 27 . This is done as follows. The mold 25 has two guide holes for mold positioning located a predetermined distance apart from its center position. The clamper 262 of the substrate knock-out device 26 with QDC is attached to the substrate knock-out device 26 with QDC in an open state and the upper mold and lower mold separately or in a combined state of the upper mold and lower mold, and is used to guide the positioning of the mold 25 . Guide pin 261 provided corresponding to the hole Mold 25
The mold 25 is aligned with the QDC-attached substrate knock-out device 26 by inserting it into the QDC. After that, the clamper 262 is closed, and the mold 25 and QDC-equipped substrate knockout device are removed.
26 is fixed. Since the QDC-attached substrate knockout device 26 and the press device 27 are originally manufactured in a fixed manner, the mold 2
The alignment and fixing of step 5 is completed. Second, first mark detection devices 242a and 242b detect the first detection marks M ₁ and M ₂ according to the size of the single-row plural printed circuit boards 12 , and second mark detection devices 242a and 242b detect the second detection marks. The position of the mark detection device 244 of No. 2 is determined. Thirdly, in order to limit the distance range for detecting the second detection mark on the single-row multiple array board 12 , the main controller 29 uses a sample board to limit the distance range.
Read and memorize. For example, as shown in FIG .
(Refer to Figure 1b) When printing confirmation number letters, etc. used when printing a board are written, this is done to prevent erroneous detection of such numbers, letters, etc. as second detection marks. , first, the range where the second mark detection device detects the second detection mark before the first of the second detection marks on the sample substrate, that is, the left side of N ₁ in FIG. Scrape off the range between the first and second detection marks, that is, the character numbers between _N1 and _N2 in Figure 1b,
Input to the matching table 241. In this state, the substrate positioning and feeding device 24 performs reading and storing operations.
In other words, the operation is similar to the normal operation, the _details of which will be described later. : The distance between the first and second second detection marks, that is, the pitch between N ₁ and N ₂ in Figure 1 b, is stored, : The third and subsequent second detection marks For , the mark is read from the position where the mark was read immediately before, and the mark is read only in the vicinity of a certain limited range where the pitch between N ₁ and N ₂ is memorized, and the second detection mark is read from the beginning. The number of
Remember the number n in Figure 1b. During this second detection mark reading and storing operation, only the substrate positioning and feeding device 24 operates, and the substrate heating device 22 operates.
, the press device 27, etc. do not operate, and confirmation of positioning at the press position is performed by stopping each unit printed board at a predetermined press position for several seconds. Single row multiple array printed circuit board memorized in this way
The pitch between each unit printed circuit board in 12 , that is, the pitch in FIG.
The pitch between N ₁ and N ₂ and the number of unit printed circuit boards in the single-row multiple array printed circuit boards 12 , that is, n in FIG . It is confirmed whether the information is the same as the actual information on the corresponding single-row multiple array printed circuit board 12 , and if the information is incorrect, the above-mentioned reading and storing operations are repeated until the main controller reads and stores the correct information. The fourth step in the preparation stage is the single-row multiple array printed circuit board.
A large quantity of 12 is loaded onto a preliminary stage 20 with its right side and rear surface abutting against a guide plate 201 and with their end surfaces substantially aligned. When the loading is completed, by pressing the push button switch for connecting the electric circuit for loading confirmation, the heating section control device 233 is activated and the loaded substrates are guided to the substrate supplying device 21 by the moving device 202. The loaded substrate guided to a predetermined position of the substrate supply device 21 is raised by a lifter 211 until the upper surface position of the loaded substrate rises to a position where the substrate level detector 212 operates. In the fifth preparatory step, the product take-out device 273 of the press device 27 and the QDC-attached substrate knock-out device 26 are activated. Up to this point, the operations for the preparatory stage have been completed, but it goes without saying that at the beginning of the preparatory stage, electricity is applied to the heater 221 for heating the substrate to raise the temperature, and when the heater rises to a predetermined temperature, the preparatory stage ends. . Next, when an automatic press start command is given to the main controller 29 , all the devices start operating.
At this time, the main controller 29 is configured so that if any one of the preparation steps described above is neglected, the operation will not start. When the main control device 29 receives the automatic press start command, it issues a substrate supply command to the substrate supply device 21 , and the substrate supply device 21 receives the topmost substrate of the stacked substrates.
Only one sheet of 12 is peeled off and sent to the substrate heating device 22 . The substrate heating device 22 heats the substrate to an optimum temperature when press punching the substrate. If the substrate 12 can be easily pressed without heating, it is simply passed over a heater without heating. The heated substrate 12 is transferred to the substrate loading device 2
The substrate loading device 23 loads the substrate 12 in three directions.
When it reaches a predetermined position on the substrate feeding conveyor 231, it waits until a substrate feeding command is received from the main controller 29 . Now, in the case of the first board, the board input command has already been issued, so the first board
2 reaches a predetermined position on the substrate feeding conveyor 231, the feeding operation begins immediately. When the loading operation starts here, the loading operation of supplying the next loaded board to the heating device 22 is performed by the substrate loading conveyor 23.
1 rotates, the input unit 232 extends toward the alignment table 241 of the substrate positioning and feeding device 24 , and once the substrate is placed on the alignment table 241, the input unit returns while the substrate input and feed conveyor 231 continues to rotate, and the alignment table 241. Single-row multiple array printed circuit boards 12 are placed on the alignment table 241, and the board loading device 2
When the input unit 232 of No. 3 returns, the substrate positioning and feeding device 24 starts operating. Consistency table 24
1, when the substrate 12 is placed and the loading unit 232 returns to a place where it does not interfere with the lifting of the alignment table 241, it starts to rise to the first detection mark reading position, and at the same time, the substrate 12 is placed on the alignment table 241. Temporarily position within the range using a pusher pin, and when the temporary positioning is completed, move the alignment table 24 by suction.
Fix it to 1. The substrate 12 is the alignment table 241
The alignment table 241 is temporarily positioned within a certain range above and fixed to the alignment table 241 by suction, and the alignment table 241 reaches its upper limit, and the first detection mark of the single-row multiple array printed circuit board 12 has shifted from the reference position. The amount is detected by the first mark detection devices 242a, 242b.
It becomes possible to read by. The first mark detection reading and matching table operation command section 291 of the main control device 29 performs matching based on the detection outputs of the two second mark detection devices 242a and 242b until the detection outputs each reach a predetermined value. Controls the drive device for table 241. The driving control of the alignment table 241 is performed in order to obtain the optimum conveyance posture of the single-row plurality of printed circuit boards 12 with respect to the press device 27 , and this is performed in the following manner. In FIGS. 7a to 7c, the solid line D indicates the press device 2.
7 or a line parallel to it. It is now assumed that the single-row, multiple-array printed circuit boards 12 temporarily positioned on the matching table 241 are positioned relative to the virtual line D, for example, as shown in FIG. 7a. The first mark detection reading and alignment table operation command unit 291 is connected to the first mark detection device 242.
calculate the gap between the marks M ₁ and M ₂ and the virtual line from the detection outputs of a and 242b, and calculate the direction in which the gap between the mark M ₁ and the virtual line D or the mark M ₂ and the virtual line is larger or smaller; In the case of the example shown in FIG. 7a, the alignment table 241 is rotated in the _X6 direction shown in the figure.
The distances between the mark M ₁ and the imaginary line D and between the mark M ₂ and the imaginary line D are made equal. In other words, between the mark M ₁ and the virtual line D and the mark
The alignment table 241 is rotated until the distance between M ₂ and the imaginary line D becomes equal to the state shown in FIG. 7b. Next, the distance between the marks M ₁ and M ₂ and the imaginary line D is eliminated, that is, the ends of the marks M ₁ and M ₂ are aligned on the imaginary line D, respectively, as shown in FIG. In the case of example b, the alignment table 241 is moved in parallel in the _X3 direction shown in the figure, and the position shown in FIG.
put it in a state like this. As a result, the press device 27 and the single-row, multiple-array printed circuit boards 12 are parallel to each other, and their center lines are aligned. In other words, the press device 27 is used to perform accurate press processing.
This means that the optimum transport posture for the single-row, multiple-array printed circuit boards 12 has been obtained. When driving the alignment table 241, if the stop position accuracy is still not sufficient after one series of operations is completed, the same operation may be performed again or several times until sufficient stop position accuracy is achieved. Just repeat. Driving the matching table 241 in this manner has the following advantages. That is, when bringing the single-row multiple array printed circuit board 12 in the state shown in FIG. _7a to the state shown in FIG. Shift the alignment table 241 in the direction _{of arrow}
A control method has also been considered in which the alignment table is rotated in the direction of arrow _X6 in the figure centering on the mark _M2 side so as to match the mark M2, but this method causes the following problems. It is a single row multiple array printed circuit board
12 is temporarily positioned in a state where the mark _M1 approaches the virtual line D, contrary to the state shown in FIG. 7a,
After the alignment table 241 has been moved in the direction of arrow _X3 in the figure, it must now be rotated in the direction of arrow _X5 in the figure, centering on the mark _M1 side. In other words, in this control method, the rotation centers of the alignment table 241 must be provided at two locations on the mark M ₁ and M ₂ sides, and the drive mechanism for the alignment table 241 becomes complicated. However, in this case, consistency table 2
41 may be provided only on one mark side, but in this method, consider the case where the mark on the side where the rotation center is provided is farther from the virtual line D than the mark on the opposite side. However, since the distance to move the alignment table 241 in the direction of arrows X ₃ ←→X ₄ and the distance to rotate it in the direction of arrows X _{5 ←} → This has the disadvantage that the drive control range must be set large. On the other hand, if the drive is controlled as in this embodiment, the center of rotation of the alignment table 241 is 1
Furthermore, since the center of rotation does not have to be set near the mark M ₁ or M ₂ , the drive control range of the alignment table 241 can be set very small, which has the advantage of shortening the positioning time. When the positioning is completed as described above, one of the substrate holding and conveying devices 243a and 243b grips one end of the single-row and multiple-array printed circuit boards 12 on the alignment table 241, and a vacuum chamber for fixing the alignment table 241 and the substrates 12 When the alignment table 241 and the substrate 12 are unfixed by cutting the substrate 12, and the alignment table 241 is lowered to a position where it does not interfere with the transfer, the substrate holding and transfer device 243a (or 243b) moves the single-row multiple-array printed substrates 12 . The paper is conveyed while being held in the direction of the press device 27 while outputting the conveyance distance information. The single-row, multiple-array printed circuit boards 12 held and conveyed by the substrate holding and conveying device 243a (or 243b) are first unit printed substrates before reaching the press device 27 .
A second detection mark N ₁ corresponding to A ₁ is detected by the second mark detection device 244 . When the conveyance distance detection and calculation command section 292 obtains the detection output of the first mark _N1 of the second detection marks by the second mark detection device 244, it detects the clamping,
The first second detection mark N ₁ is detected so that the first unit printed circuit board, that is, the circuit part A ₁ of the single-row multiple array printing being conveyed, can be stopped at a predetermined position of the press device 27 . The substrate holding and conveying device 24 transports the single-row, multiple-array printed circuit boards 12 by a predetermined distance from the position to the press device 27 .
Controls the operation of 3. In this way, the first circuit section _A1 is pressed into the press device 27.
When the press operation command section 296 issues a press command to the press apparatus control section 275, the press apparatus 27 starts the press operation. When the press device 27 starts the press operation, the product take-out device 273 moves backward in conjunction with the press cycle so as not to interfere with the lowering of the press die 25 and the like. The press operation is similar to that of a normal printed circuit board press, and at the bottom dead center of the press, the frame and holes of the board are punched out using the die 25 , and the product with the holes punched is inserted with the punch of the die into the punched hole. While still inside, the press cycle reaches near the top dead center along with the upper mold of the mold. On the other hand, as mentioned above, the product take-out device 273 is retracted to the rear in conjunction with the press cycle so as not to interfere with the lowering of the press mold, etc., but when the mold moves upward after punching the substrate. On the contrary, it moves forward in conjunction with the press cycle, and when it returns to near the top dead center of the press cycle, it has come out to a position where it can sufficiently receive the product substrate in the upper die even if it is dropped. In this state, the hydraulic cylinder 263 of the substrate knockout device 26 with QDC works, and the mold 25
The unit product substrate in the upper mold is peeled off from the mold 25 . The product substrate peeled off from the mold 25 falls downward and rides on the product receiving device 273. While this unit product substrate is peeled off from the mold 25 and falling, the knock-out detection device 2
72, the substrate is detected and it is confirmed whether the product substrate has been surely peeled off from the mold. Press device 27
In this way, the first circuit part _A1 is pressed, the product board is taken out from the mold 25 , placed on the take-out device 273, stopped at the top dead center again, and pressed for the next press. Wait for instructions. On the other hand, in the substrate holding and conveying device 24 , the second mark detection device 244 detects the first second detection mark _N1 of the single-row multiple array printed circuit board being conveyed in the direction of the press device 27 , While the first circuit section A ₁ is being transported to a predetermined position on the press, the second second detection mark, the third second detection mark......the second detection mark with the m number up to the mark (where m<n),
Detected by the second mark detection device 244, the detected position is stored as distance information from a certain point by the second mark reading and conveyance distance detection calculation command unit 292,
After the completion of the positioning and stop pressing of _A1 , the second and subsequent circuit parts _A2 , _A3 ...... _An are used to transport them to a predetermined position on the press. Now, the first circuit section A ₁ of the single-row multiple-array printed circuit board 12 has been pressed as described above, and the unit product board 13 can be peeled off from the mold 25 and placed on the product take-out device 273. After that, the second sheet of circuit section _A2 is pressed, but the process of transporting and stopping the second circuit section _A2 section to the predetermined position of the press is the same as for the first sheet. Then, the single-row multi-array printed circuit board is held between the substrates by a predetermined distance from the position where the second mark detection device 244 detects the second second detection mark stored as described above to the press device. After the press processing of the first circuit section _A1 is completed by the conveyance device, the circuit section A1 is conveyed. At this time, the distance from the first circuit section A ₁ to the second circuit section A ₂ will be transported.
During this process, the (m+1)th second detection mark may be detected by the second mark detection device 244, and the detected position may be stored as distance information from a certain point. Of course, depending on the size of the single-row multi-array printed circuit board 12 and the number of unit boards therein, the first circuit section _A1 may detect all the second detection marks when the press device stops at a predetermined position. However, in some cases, the detected position is memorized. When the second circuit section A ₂ stops at a predetermined position in the press device 27 , it begins pressing in the same way as the first circuit section A ₁ . The unit product board 13 obtained in this manner is placed on the product take-out device 273, and when pressing the second circuit section _A2 , the product take-out device 273 retreats to the rear. The unit product board 13 obtained from the circuit section _A1 is discharged backward and taken out. 2nd circuit section A ₂
However, the unit product board 13 that was pressed and punched out in the same manner as the first circuit section A ₁ reached near the top dead center together with the upper mold, and the product ejecting device 273
When the product comes forward to a position sufficient to receive the product, the product is separated from the upper mold and dropped, detecting that the unit product substrate 13 has been separated from the mold 25 ,
It gets on the product take-out device 273. Next, the press processing of the third circuit section _A3 is carried out in the same manner, and the press processing and removal are performed in the same manner up to the nth sheet. In this way, after the press working of all the circuit parts in the single-row, multiple-array printed circuit board 12 is completed, the board holding and conveying device 243a (or 243b) releases the clamping of the single-row, multiple-array printed circuit board 12 , with only its outer frame remaining. , it returns to the initial direction, but at this time,
Another substrate holding and conveying device 243b (or 243a) holds the next substrate 12 , and the press device
It is evacuated upward so that it does not interfere with conveyance in the 27th direction, and returns to the initial direction. At this time, if there is an obstacle when evacuating upward at the point where the last press is finished and the clamping of the outer frame is released, it may be possible to return to a certain extent and then evacuate upward. Further, when the press processing is completed and the single-row multiple-array printed circuit board 12 is left with only the outer frame, when the clamping is released, a scrap processing command is issued by the scrap processing operation command section 297, and the scrap processing command is issued by the scrap processing operation command section 297 , 2
81 to the scrap processing teeth 282, the scraps are cut into fine scraps by passing between the rotating teeth, and disposed of in a separately provided receiving box or the like. On the other hand, the first single-row multiple-array printed circuit board 12 is
It is placed on the alignment table 241, and the press device 2
7, the second single-row multiple array printed circuit board 1
2 is heated by the substrate heating device 2 by the substrate supply device 21 .
2 and is heated. While the first single-row multiple-array printed circuit board 12 is controlled in attitude, held by one of the board holding and transport devices 243a and 243b, and transported toward the press device 27 and pressed, the alignment table 241 Feeding device
23 to the position where the substrate 12 can be loaded, and the board supply input command section 295 of the main controller 29
issues a board loading command to the loading unit 23 , and the loading unit 23
The single-row multiple array printed circuit boards 12 heated by the heating device 22 are placed on the alignment table 241 . The second single-row multi-array printed circuit board is placed on the alignment table 241, and when the input section 23 returns, the alignment table 241 rises in the same way as the first one, and the input substrates are aligned. The two first mark detection devices 2 are temporarily positioned within a certain range on the table 241 and fixed to the alignment table 241 by suction.
42a and 242b detect the first marks M ₁ and M ₂ , and rotate and move the alignment table 241 in parallel until the detection output reaches each predetermined value, thereby forming a single row and multiple arrays for the press device. The optimum posture of the printed circuit board 12 is obtained. When the second single-row, multiple-array printed circuit board 12 is positioned on the alignment table 241, the substrate holding and transporting device 243a that grips and transports the first board
(or 243b), another substrate holding and transporting device 243b (or 243a) holds the substrate whose posture has been controlled on the alignment table 241. Once the substrate is clamped, the alignment table 241
is the substrate holding and conveying device 243b (or 243
The substrate holding device 243b (or 243a) lowers the substrate 12 to a place where it does not interfere with the transfer of the substrate 12 in a).
However, at this time, if the previous first single-row multiple-array printed circuit board 12 is still being transported to the press device and pressed, all of the first single-row multiple-array printed circuit board 12 The unit printed board is pressed,
The first substrate holding and transporting device 24 that was holding it
3a (or 243b) is retracted upward so as not to interfere with the transport of the next substrate holding and transporting device 243b (or 243a), and then transporting the second substrate 12 toward the press device 27 . During the conveyance to the press device 27 , the second detection mark N ₁ ,
N ₂ , ......, _{No are} transferred to the second mark detection device 24
4, and press the press device from the detected position.
Control the substrate holding and conveying device 243b (or 243a) so that it feeds a predetermined distance up to No. 27 and then stops. When it stops, press each circuit section and press the unit product substrate.
13 , and after pressing up to the nth sheet, the outer frame is scraped and transferred to the substrate holding and conveying device 2.
43b (or 243a) performs an operation of retracting upward and returning to its original position in the same manner as in the case of the first sheet. Note that the single-row multiple array printed circuit boards 12 are held on the alignment table 241 by the substrate holding and conveying device 243a (or 243b), and the alignment table 24
When the substrate 1 is lowered and the substrate is transported, the end of the substrate 12 on the side that is not held is not bent, and the substrate 12 is transported to the press device 27 so that it can be transferred to the upper surface of the lower mold of the mold 25 of the press machine. As shown in FIG.
Of course, it is installed in a place that does not interfere with the transportation of step 3b), and when the board 12 is being transported,
It moves on this support. Thereafter, the single-row multiple array printed circuit boards 12 are successively put into the alignment table 241 in the same manner, and the next board 1
2 to the substrate heating device 22 , and aligning table 2.
41 is raised, the substrate 12 is temporarily positioned on the alignment table 241, fixed with vacuum, aligned, and the two substrate holding and conveying devices 243a,
243b, the alignment table 241 is alternately clamped and released from the alignment table 241.
is lowered, conveyed toward the press machine, positioned, and stopped, presses each circuit section, takes out the product, cuts and destroys the scrap frame, and the substrate holding and conveying device 243a (or 243b) retreats upward. By repeating the operation of returning to the original position, single-row multiple array printed circuit boards are created one after another.
12 , a pressed unit product substrate 13 can be obtained. By the way, the mark reading limitation control section 293
has the following functions: That is, when pressing a plurality of single-row, plural-array printed circuit boards 12 ,
The position of each unit printed board in each single-row multiple array printed board 12 is the same as that of all boards.
12 , it falls within a certain range. In other words, the pitches of the second detection marks N ₁ , N ₂ , . . . , N _o do not deviate greatly. Therefore, for example, as mentioned in the third preparatory step,
Even if the second mark detection device 244 is activated due to a printed matter other than the detection mark or a foreign object such as a piece of metal between the second detection marks _N1 and _N2 , the detected object will be detected by the correct one. 2 detection mark N ₁ ,
It is determined that it is not N ₂ , ......, _No. Also, originally, the second detection marks N ₁ , N ₂ , ......
..., _No. When the second detection mark N ₁ , N ₂ , ......, _No. It is determined that the circuit part is not suitable for press processing into a product, and the board is passed through the board conveyance without being press processed. In other words, if you mark out the second mark corresponding to the circuit part that is not suitable for use as a product, you can pass it through without pressing it.
When the outer frame scrap is destroyed, it is also destroyed at the same time. This is done, for example, as follows. As was done in the third preparatory step described above, the position where the first second detection mark N ₁ is read is used as distance information from a certain point, and the pitch between N ₁ and N ₂ is used as the distance. This is stored as information, and on the board that is actually transported for press processing, the first and second detection marks _N1 are marks that can only be read within a limited narrow range relative to the initially memorized distance. The second and subsequent detection marks N ₂ are determined to be valid, and the second and subsequent detection marks are determined to be _{N 1 memorized} from the mark read immediately before.
Only marks that are read when sent over a narrow range of distances between and _N2 are judged to be valid. If the mark cannot be read within the effective range, the circuit portion corresponding to the mark that should be within the range is not pressed. In this way, the mark reading limitation control section 293 is provided, and the second detection marks N ₁ , N ₂ , ......, _No
This second detection mark is placed near the point where the
By setting it so that when N ₁ , N ₂ , ......., _No can not be detected, the corresponding circuit section is not pressed and the next circuit section is pressed.
Even if there is a defect in one of the circuit parts, that is, one of the unit printed circuit boards, there is no need to stop each time, and the efficiency of the press work can be improved.
Accidents such as defective unit product boards being mixed into products can also be eliminated. On the other hand, the second
A configuration has been considered in which if the marks N ₁ , N ₂ , ......, _No are not detected, the device stops operating and generates a warning.
With such a configuration, there is a risk that the press working time will be longer, and there is also a risk that defective products will be mixed into the product. Further, the conveyance amount correction section 294 has the following functions. That is, the second detection mark N ₁ provided corresponding to each circuit section of the single-row multiple-array printed circuit board 12 ,
Even if _efforts are made to ensure that the marks are placed on _the same line as the correct center position of each circuit section, slight deviations in dimension may occur, and , second mark detection device 2
44 may not always be placed in the correct position as originally planned. In other words, an error may occur in the predetermined distance between the second mark detection device 244 and the press device 27 . In this case or due to other factors, problems may occur if the single-row, multiple-array printed circuit board 12 is not correctly stopped at a predetermined press position. Therefore, in order to absorb the above-mentioned dimensional changes, the second mark detection device 244 is used.
The second detection marks N ₁ , N ₂ for a predetermined distance from the time when the second mark is read to the press device.
_...... It is possible to set No uniformly or separately for each second detection mark by adding a correction amount to the amount to be sent a predetermined distance after reading the mark. By doing this, it is possible to obtain products with high dimensional accuracy, and conversely, in the case of printed circuit boards, the printing does not necessarily leave only the conductor parts such as copper on the insulating material, but also the insertion of electronic components. In some cases, we may use resist printing to prevent solder from reaching unnecessary areas when soldering, etc. to join conductor parts and electronic components.
In such cases, printing is performed several times on one substrate, but if the printing several times is slightly shifted from the desired position, it is necessary to print at an intermediate position between the printings.
It is necessary to shift the positioning of the press device 27 and the single-row multiple array printed circuit board 12 so that the press-processed holes are aligned. Even in such a case, the conveyance amount correction section 294 can perform correction. The substrate positioning and feeding device sequence controller 298 is a portion that controls the operation of the substrate positioning and feeding device section 24 . According to the invention described above in detail, the following effects can be achieved. First, unit product substrates 13 can be obtained continuously and automatically from a large number of single-row, multiple-array printed substrates 12 . The reason for this is that single-row multiple-array printed circuit boards
For every 12 units, two first detection marks are attached to obtain the optimum posture with respect to the press device 27 , and a second detection mark is attached to each unit printed circuit board to stop it at the press position, and these are optically detected. It is possible to read it with a reading device and position it at the desired press position, and also to supply the substrate,
This is because the pressed product is also taken out mechanically. On the other hand, most conventional substrate press working methods involve positioning using guide holes and guide pins. That is, at least two guide holes are drilled in each unit board of a single-row, multiple-array printed circuit board, guide pins are provided in the mold of the press machine, and the guide holes are manually inserted into and removed from the guide pins of the mold for positioning. Using the method used for pressing, drilling at least two guide holes for single-row multiple printed circuit boards and positioning them at a location different from the pressing device,
The method used was to feed the material into a press. This method has disadvantages in that it requires a step of forming guide holes in addition to the step of forming the circuit section on the board, resulting in poor work efficiency and requiring a separate device for the process. Further, in the former case, the operator must directly touch the press device to perform the work, which is dangerous, and in the latter case, the work efficiency is low because manual positioning is required. When performing automatic and continuous pressing of printed circuit boards, when the target board is converted, it requires a minimum step time, resulting in good work efficiency. The reason for this is that each single-row multiple-array printed circuit board 12 has a first detection mark for positioning and a second detection mark for positioning.
This is because they each have a detection mark, and by optically detecting them and controlling the device, positioning to the press machine can be performed. In contrast, in the conventional automatic press method, one end of the multi-sided board was positioned at a certain position using holes in the board and guide pins, and then placed in the press using numerical control or mechanical control. However, a numerical control program is required for each target board, and the mechanical positioning method requires preparation for this purpose. When automatically pressing printed circuit boards, each circuit section can be accurately positioned on the press machine, resulting in high-quality products. The reason for this is that each single-row, multiple-array printed circuit board 12 is provided with first and second detection marks for positioning in the press at the same time as the circuit section is formed. The relative discrepancy between the second detection mark and the second detection mark is very small, and the press processing of the board is often performed after heating, so even if thermal expansion occurs, the mark position will be adjusted accordingly. Since it expands, there is no relative positional shift between the circuit section and the mark even when heated, and positioning is performed by detecting the mark, so accurate positioning is possible. In addition, by being able to correct the conveyance amount, even if the relative position of the circuit section to the mark position is incorrect, it can be corrected, resulting in highly precisely processed products. I can do things. On the other hand, the numerical control positioning method described above cannot absorb errors if the dimensions of each board change due to thermal changes or if the spacing of each circuit part of each multi-panel board is out of order. It is possible to shorten the manufacturing time for substrate products. The reason for this is that the substrate holding and conveying device 243
There are two sets of a and 243b, so while one is holding the board, positioning it for transfer to the press machine, and pressing it, the other is holding the board for the next press and waiting for the previous board. Once pressing is completed, you can immediately move on to pressing other substrates.Also, since the second detection mark for positioning to the press is read at a position unrelated to the press operation, There is no need for an operation to prevent the mark detection device 244 of No. 2 from interfering with the press machine. On the other hand, the conveyance section is
If only one mark detection device 24 is provided, time will be wasted for the return time, and the second mark detection device 24
4 is a position related to the operation of the press machine, that is, in the case of an automatic positioning method configured such that when the second mark detection device 244 detects the second detection mark, that position becomes the stop position of the substrate with respect to the press. , it is no longer necessary to memorize the mark reading position, but instead the second mark detection device must be evacuated to a position that is not related to the press operation before the press machine starts operating. Only a waste of time. As described above, according to the present invention, when press working a printed circuit board, it is possible to automatically and continuously position each circuit part to the mark position accurately, perform press work, and take out the product. At the same time, it is possible to provide an automatic press device for printed circuit boards that can significantly shorten press time and improve work efficiency.

[Brief explanation of the drawing]

Figures 1a, b, and c are diagrams showing a multi-sided printed circuit board, a single-row multiple-array printed circuit board, and a unit product board, respectively, and Figure 2 schematically shows an embodiment of an automatic press apparatus for printed circuit boards according to the present invention. Figure 3 is a view from above, Figure b is a side view, and Figure 3 is a view from above.
Figure 4 is a diagram specifically showing a part of the figure. Figure a is a view seen from above, Figure b is a side view, Figure 4 is a diagram specifically showing another part, and Figure a is a diagram specifically showing another part. Figure b is a side view, Figure c is a front view as seen in the substrate transport direction, Figure 5 is a diagram specifically showing another part, and Figure 6 is another diagram. Figure 7 a, b, c is a diagram specifically showing the parts, and Figure 4 a, b,
FIG. 4 is a diagram for explaining part of the operation of the part shown in FIG. 12 ...Single row multiple array printed circuit board, _M1 , _M2 ...
First detection mark, A ₁ , A ₂ ...... A _o ... circuit section, N ₁ , N ₂ , ......, _No ... second detection mark, 13 ... unit product board, 20 ...Preliminary stage, 21 ...Substrate feeding device, 22 ...Substrate heating device, 23 ...Substrate loading device, 24 ...Substrate positioning and feeding device, 241...Aligning table, 24
2a, 242b...first mark detection device, 24
3a, 242b...Substrate holding and conveying device, 244...
... second mark detection device, 25 ... mold, 26 ...
...Substrate knockout device with QDC, 27 ...
Press device with product take-out device, 28 ... Scrap processing device, 29 ... Main control device.

Claims (1)

[Claims] 1. One unit printed board or a plurality of unit printed boards are printed in a row, and a first detection mark is provided to obtain a desired conveyance attitude relative to the press position, and the unit printed board is stopped at the press position. a printed circuit board on which a second detection mark is formed at the same time as printing the unit printed circuit board; a heating means for heating the printed circuit board to a desired temperature; and an alignment table on which the printed circuit board is placed. a first substrate supply means in which a plurality of printed circuit boards are disposed and sequentially supplies the plurality of printed circuit boards to the heating means; and a first substrate supply means for sequentially supplying the plurality of printed circuit boards to the heating means, and placing the printed circuit board heated by the heating means on the alignment table. a second substrate supply means for detecting the first detection mark from the printed circuit board placed on the alignment table; and a first mark detection means for detecting the first detection mark from the printed circuit board placed on the alignment table; table driving means for driving the alignment table to obtain a desired conveying posture of the printed circuit board placed on the alignment table with respect to the press position; a conveyance means that is provided with a plurality of conveyance units capable of conveying the printed circuit board to the press position so as to be able to carry out continuous conveyance operations without interfering with each other, and conveys the printed circuit board in the desired conveyance posture to the press position; a second mark detection that is provided at a position unrelated to press working of the printed circuit board and detects the second detection mark on the printed circuit board when the printed circuit board is conveyed to the press position by the conveyance means; means and this second
means for controlling the conveyance operation of the conveyance means so that the unit printed circuit board is stopped at the press position based on the output of the mark detection means and substrate conveyance distance information of the conveyance means; Pressing means for pressing the unit printed circuit board once positioned at the position to obtain a unit product board;
An automatic press apparatus for printed circuit boards, comprising means for peeling off the pressed unit product substrate from a press mold and taking it out from the press means in conjunction with the press operation of the press means.