JPS6150754B2 - - Google Patents
Info
- Publication number
- JPS6150754B2 JPS6150754B2 JP6364881A JP6364881A JPS6150754B2 JP S6150754 B2 JPS6150754 B2 JP S6150754B2 JP 6364881 A JP6364881 A JP 6364881A JP 6364881 A JP6364881 A JP 6364881A JP S6150754 B2 JPS6150754 B2 JP S6150754B2
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- face
- groove
- grooves
- cutting blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010953 base metal Substances 0.000 claims description 62
- 238000005520 cutting process Methods 0.000 claims description 37
- 239000006061 abrasive grain Substances 0.000 claims description 15
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/123—Cut-off wheels having different cutting segments
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
【発明の詳細な説明】
この発明は切断刃、特にシリコン、ゲルマニウ
ム等の半導体、水晶、フエライト、ガラスその他
の硬脆物質の切断に適した切断刃に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cutting blade, and particularly to a cutting blade suitable for cutting semiconductors such as silicon and germanium, crystal, ferrite, glass, and other hard and brittle materials.
シリコンに代表される電子部品材料は、一般に
大きな素材から、切断、研削、ラツピング等の工
程を経て微小な部品へと加工される。上記切断加
工は、ブロツク状素材の外形を整えたうえで、薄
切り（スライシング）して行なわれている。 Electronic component materials, such as silicon, are generally processed from large materials into minute parts through processes such as cutting, grinding, and wrapping. The above-mentioned cutting process is performed by adjusting the outer shape of the block-shaped material and then slicing it into thin pieces.
ところで、スライシングされる電子部品材料は
一般に高品位であり、また非常に薄く切断される
ものであるから、切断刃は出来る限り薄くするほ
うが、精度上の点においても、また、切断ロス、
歩留りの点においても好ましい。この要請によく
合致した切断刃として、この発明者は、先に第４
図に示すような端面を有する切断刃を提案してい
る（以下「先行技術」と称する）。この切断刃
は、台金１の端面に少なくとも台金厚さの50％の
深さの溝２，２′を表裏にほぼ均等した数になる
よう穿ち、この溝部に砥粒３を電着ボンド等の砥
粒結合剤４によつて固着したものである。この切
断刃は、砥粒３が台金１に埋つているために、大
径の砥粒を使用しても切断刃の厚みが増えないの
で薄い切断刃の製作が容易となり、また切断ロス
が少なく、しかも切断速度が速くなる等の優れた
利点を有する。 By the way, the electronic component materials to be sliced are generally of high quality and are cut very thinly, so it is better to make the cutting blade as thin as possible in terms of accuracy and to reduce cutting loss.
It is also preferable in terms of yield. The inventor has previously developed a fourth cutting blade that meets this requirement.
A cutting blade having an end face as shown in the figure has been proposed (hereinafter referred to as "prior art"). This cutting blade is made by drilling grooves 2, 2' with a depth of at least 50% of the thickness of the base metal on the end face of the base metal 1 so that the numbers are approximately equal on both sides, and applying abrasive grains 3 to these grooves using an electrodeposition bond. It is fixed by an abrasive grain binder 4 such as. In this cutting blade, since the abrasive grains 3 are embedded in the base metal 1, the thickness of the cutting blade does not increase even if large-diameter abrasive grains are used, making it easy to manufacture thin cutting blades and reducing cutting loss. It has excellent advantages such as less cutting speed and faster cutting speed.
上記切断刃を、内周刃、往復運動式鋼帯（固定
砥粒式マルチバンドソー）、高速走行エンドレス
バンドソー等に適応する場合、被切断物を精度よ
く、且つ能率よく切断するために、この切断刃は
台金及び刃先部にテンシヨンをかけ、刃先部に充
分な剛性をもたせ、切断抵抗による切断刃の撓み
を防止して使用に供される。このテンシヨンは大
きい程良好であり、たとえば、内周刃では台金が
破断する直前までテンシヨンをかけて使用され
る。しかし、上記切断刃において、たとえば、砥
粒を固着する電着ボンドとしてニツケルを用いた
場合、テンシヨンを過大にすると、しばしば溝側
壁５，５′において、電着ニツケルボンド４と台
金１が剥離を起す問題がある。また、この場合、
溝２，２′の底部と台金端面間の残部台金厚さｄ
は、台金１の厚みｔに比して局部的に薄くなるた
め、この部分に応力が集中して、台金の割れの起
点となり、充分なテンシヨンがかけられない問題
がある。 When the above-mentioned cutting blade is applied to internal blades, reciprocating steel strips (fixed abrasive type multi-band saws), high-speed running endless band saws, etc., in order to cut the workpiece with high precision and efficiency, it is necessary to The blade is used by applying tension to the base metal and the cutting edge to give the cutting edge sufficient rigidity to prevent the cutting blade from bending due to cutting resistance. The larger the tension, the better; for example, in the case of an inner peripheral cutter, tension is applied until just before the base metal breaks. However, in the above-mentioned cutting blade, when nickel is used as the electrodeposited bond for fixing the abrasive grains, if the tension is set too high, the electrodeposited nickel bond 4 and the base metal 1 often peel off at the groove side walls 5, 5'. There is a problem that causes Also, in this case,
Remaining base metal thickness d between the bottom of grooves 2 and 2' and the end face of the base metal
is locally thinner than the thickness t of the base metal 1, stress is concentrated in this area, which becomes the starting point for cracks in the base metal, and there is a problem that sufficient tension cannot be applied.
この発明は、上記従来の切断刃の欠点をなく
し、台金と砥粒結合剤の密着力を改善し、充分な
テンシヨンがかけられる切断刃を提供することを
目的とする。 The object of the present invention is to eliminate the drawbacks of the conventional cutting blades described above, improve the adhesion between the base metal and the abrasive binder, and provide a cutting blade that can be sufficiently tensioned.
この発明は、台金端面６から台金表面７にわた
る範囲及び台金端面６から台金裏面８にわたる範
囲に所要の深さをもち且つ台金端面６から奥行き
方向に所要の長さをもつた溝２，２′を形成し、
且つその溝２，２′を台金１の表裏両面７，８に
ほぼ均等した数になるよう適宜間隔をおいて配列
し、上記各溝２，２′に超硬度砥粒３を砥粒結合
剤４によつて固着した切断刃において、上記溝
２，２′の両側壁５，５′が台金端面６に達する部
分において台金１の表裏面と平行に引いた接線ｍ
が溝２，２′の奥所に接近する方向に傾斜し、且
つ上記溝２，２′の両側壁５，５′の間隔を台金端
面６から奥行き方向へ次第に狭くなるように形成
したものである。 This invention has a required depth in the range extending from the base metal end surface 6 to the base metal surface 7 and from the base metal end surface 6 to the base metal back surface 8, and has a required length in the depth direction from the base metal end surface 6. forming grooves 2, 2';
In addition, the grooves 2 and 2' are arranged at appropriate intervals on both the front and back surfaces 7 and 8 of the base metal 1 so that the numbers are approximately equal, and the superhard abrasive grains 3 are bonded to each of the grooves 2 and 2'. In the cutting blade fixed by the agent 4, a tangent line m drawn parallel to the front and back surfaces of the base metal 1 at the portion where both side walls 5, 5' of the grooves 2, 2' reach the base metal end surface 6.
is inclined in the direction approaching the depths of the grooves 2, 2', and the distance between the side walls 5, 5' of the grooves 2, 2' is formed so as to gradually narrow from the base metal end face 6 in the depth direction. It is.
以下、この発明を添付図面の実施例に基づいて
説明する。 Hereinafter, the present invention will be explained based on embodiments shown in the accompanying drawings.
第１図は、台金１の溝加工例を示し、上記溝
２，２′の両側壁５，５′の間隔が台金端面６から
奥行き方向へ次第に狭くなるように、溝形状を円
弧状としたものである。この場合、溝２，２′の
両側壁５，５′が台金端面６に達する部分におい
て台金１の表裏面と平行に引いた接線ｍが、溝
２，２′の奥所に接近する方向に傾斜し、図示の
角度αが90度未満となるよう形成してある。角度
αはできるだけ小さいこと、即ち溝における半径
Ｒを大きくし、且つ溝奥行きｌを小さくするほど
よい。 FIG. 1 shows an example of groove machining on the base metal 1. The groove shape is shaped into an arc so that the distance between the side walls 5, 5' of the grooves 2, 2' gradually narrows in the depth direction from the base metal end surface 6. That is. In this case, a tangent line m drawn parallel to the front and back surfaces of the base metal 1 at the portion where both side walls 5, 5' of the grooves 2, 2' reach the end surface 6 of the base metal approaches the deep part of the grooves 2, 2'. The angle α shown in the figure is less than 90 degrees. It is better that the angle α is as small as possible, that is, the radius R of the groove is larger and the groove depth l is smaller.
第２図は、台金１の他の溝加工例を示し、上記
溝２，２′の両側壁５，５′の間隔を台金端面６か
ら奥行き方向へ次第に狭くなるように、溝形状を
台形としたものである。この場合、台金端面６と
台形の斜辺がなす角度αは小さいほどよい。 FIG. 2 shows another example of groove machining on the base metal 1, in which the groove shape is changed so that the distance between the side walls 5, 5' of the grooves 2, 2' becomes gradually narrower in the depth direction from the base metal end surface 6. It is trapezoidal. In this case, the smaller the angle α between the base metal end face 6 and the oblique side of the trapezoid, the better.
第３図は、台金１の他の好ましい溝加工例を示
し、基本的には上述の第２図に示す実施例と同様
に溝形状を台形としたものであるが、この第３図
に示す実施例の場合には、さらに溝側壁５を図示
の如く階段状の複数段としている。 FIG. 3 shows another preferable example of groove machining on the base metal 1. Basically, the groove shape is trapezoidal as in the embodiment shown in FIG. 2 above. In the case of the embodiment shown, the groove side wall 5 is further formed into a plurality of stepped steps as shown in the figure.
上記の溝２，２′は、図示のように台金１の表
裏に交互に形成するほか、溝２，２′を二つおき
に台金１の表裏に形成してもよく、要は表裏に平
均して配列されればよい。この溝２，２′はフオ
トエツチング法又は放電加工法等によつて形成す
る。 The above-mentioned grooves 2, 2' may be formed alternately on the front and back sides of the base metal 1 as shown in the figure, or grooves 2, 2' may be formed every other two on the front and back sides of the base metal 1; It is sufficient if they are arranged on average. The grooves 2, 2' are formed by photoetching, electric discharge machining, or the like.
尚、第４図は溝２，２′にダイヤモンド等の超
硬度砥粒３を電着ボンド等の砥粒結合剤４によつ
て固着せしめた状態を示す台金端面６側の一部断
面図である。 FIG. 4 is a partial cross-sectional view of the base metal end face 6 side showing a state in which superhard abrasive grains 3 such as diamond are fixed to the grooves 2 and 2' with an abrasive grain binder 4 such as electrodeposited bond. It is.
この発明は以上のように構成されるので、次の
如き効果がある。この発明による切断刃は前述の
如く台金及び刃先部にテンシヨンＦ−F′をかけ
て使用に供されるものである。このテンシヨンＦ
−F′は、台金端面６とほぼ平行にかけられる
が、この発明による切断刃は、溝２，２′の両側
壁５，５′の間隔を台金端面６から奥行き方向へ
次第に狭くなるように形成されているので、台金
端面６と溝側壁５，５′とは傾斜し、そのため溝
側壁５，５′にかかるテンシヨンＦ−F′は分散さ
れることになる。したがつて、この発明による切
断刃は、大きなテンシヨンＦ−F′をかけても、
溝側壁５，５′において台金１と砥粒結合剤４の
剥離が起こりにくい。このことは、第５図イ，ロ
に示すように、例えば二つの棒状体を接着する場
合、第５図イのようにテンシヨンＦ−F′に垂直
な断面で接着したものより、第５図ロのようにテ
ンシヨンＦ−F′に対し接着面が斜めになるよう
にすれば、接着面積が大きくなつて接着面にかか
る力を分散することができ、大きなテンシヨンに
耐えるようになることを考えれば容易に理解し得
る。第１図に示す実施例において円弧状の溝２，
２′における円弧の半径Ｒを大きくし、且つ溝奥
行きｌを小さくするほど、また、第２図に示す実
施例において台金端面６と台形の斜辺のなす角度
αが小さいほど台金端面６と溝側壁５，５′とが
傾斜することになり、溝側壁５，５′における台
金１と砥粒結合剤４の接着面積が増し接着面にか
かる力を分散させることができるので、より大き
なテンシヨンＦ−F′に耐える切断刃を得ること
ができる。さらに、第３図の実施例のように溝側
壁５，５′を複数段に形成した場合には、溝側壁
５，５′における台金１と砥粒結合剤の接着面積
が極めて広くなり、台金１と砥粒結合剤４の剥離
が生じない極めて良好な切断刃を得ることができ
る。 Since the present invention is configured as described above, it has the following effects. As described above, the cutting blade according to the present invention is used with tension F-F' applied to the base metal and the cutting edge. This tension F
-F' is applied almost parallel to the end face 6 of the base metal, but the cutting blade according to the present invention is designed so that the distance between the side walls 5, 5' of the grooves 2, 2' becomes gradually narrower in the depth direction from the end face 6 of the base metal. Since the base metal end face 6 and the groove side walls 5, 5' are inclined, the tension F-F' applied to the groove side walls 5, 5' is dispersed. Therefore, even if a large tension F-F' is applied to the cutting blade according to the present invention,
Peeling of the base metal 1 and the abrasive grain binder 4 at the groove side walls 5, 5' is less likely to occur. This means that, as shown in Figures 5A and 5B, for example, when two rod-like bodies are glued together, the cross section in Figure 5 Consider that if the bonding surface is made oblique to the tension F-F' as shown in (b), the bonding area will become larger and the force applied to the bonding surface will be dispersed, making it possible to withstand large tensions. can be easily understood. In the embodiment shown in FIG.
The larger the radius R of the arc at 2' and the smaller the groove depth l, and the smaller the angle α between the base metal end face 6 and the hypotenuse of the trapezoid in the embodiment shown in FIG. Since the groove side walls 5, 5' are inclined, the bonding area between the base metal 1 and the abrasive grain binder 4 on the groove side walls 5, 5' increases, and the force applied to the bonding surface can be dispersed. A cutting blade that can withstand tension F-F' can be obtained. Furthermore, when the groove side walls 5, 5' are formed in multiple stages as in the embodiment shown in FIG. An extremely good cutting blade in which the base metal 1 and the abrasive binder 4 do not separate can be obtained.
「実験例」
この発明の効果を確認するために、以下のよう
な比較実験を行なつた。"Experimental Example" In order to confirm the effects of the present invention, the following comparative experiment was conducted.
各試料は内周刃として12インチブレード、外径
304.8φ、内径102φ、台金厚み0.1mmの
SUS304EH材で製作し、溝の形状が第６図から第
８図に示す３通りのものを製作した。これらをそ
れぞれ試料１〜３と称する。各試料の溝の寸法は
次の通りである。 Each specimen has a 12-inch blade as the inner circumferential edge, and an outer diameter
304.8φ, inner diameter 102φ, base metal thickness 0.1mm.
It was made from SUS304EH material, and three types of groove shapes were manufactured as shown in Figures 6 to 8. These are referred to as samples 1 to 3, respectively. The dimensions of the grooves of each sample are as follows.
試料１ ａ：５mm ｄ：２mm
ｂ：1.5mm ｅ：0.75R
ｃ：１mm
試料２ ａ：５mm ｄ：１mm
ｂ：２mm ｅ：1.5R
ｃ：0.5mm
試料３ ａ：５mm ｃ：0.65mm
ｂ：0.95ｍ ｄ：1.6R
なお、各試料とも溝の数は64、溝の深さは55μ
ｍである。 Sample 1 a: 5mm d: 2mm b: 1.5mm e: 0.75R c: 1mm Sample 2 a: 5mm d: 1mm b: 2mm e: 1.5R c: 0.5mm Sample 3 a: 5mm c: 0.65mm b: 0.95 m d: 1.6R The number of grooves in each sample is 64, and the depth of the grooves is 55μ.
It is m.
上記各試料につき、まず溝部に砥粒を固定しな
い状態で台金が破壊するまでのテンシヨン値を測
定した。テンシヨンの測定は、第９図に示す２点
P1，P2即ち内周からｆ（５mm）だけ離れた点を含
む円周上で、ｇ（５mm）だけ離れた２点のうち１
点に加重をかけ、他の１点に変位計を設置して測
定し、加重に対する変位の割合によつてテンシヨ
ン値を表わす。一般には、50μｍの変位に対する
加重値で表わす。 For each of the above samples, the tension value until the base metal broke was first measured without abrasive grains fixed in the groove. Tension is measured at two points shown in Figure 9.
P 1 , P 2 , that is, one of the two points separated by g (5 mm) on the circumference that includes the point f (5 mm) away from the inner circumference.
A weight is applied to one point, a displacement meter is installed at another point, and the measurement is performed, and the tension value is expressed as the ratio of the displacement to the weight. Generally, it is expressed as a weighted value for a displacement of 50 μm.
〔測定結果１〕
試料 １，２
溝の先端（台金端面）に微小クラツクが現われ
る際のテンシヨン値：250〜290g／50μｍ
試料 ３
テンシヨン値350g／50μｍまで溝部近傍には
クラツクが発生せず、それ以上のテンシヨンでは
ブレード外周部の張りあげ機構部分から大きく裂
けた。[Measurement results 1] Samples 1 and 2 Tension value at which minute cracks appear at the tip of the groove (base metal end face): 250 to 290 g/50 μm Sample 3 No cracks appear near the groove until the tension value is 350 g/50 μm. At higher tensions, the tensioning mechanism on the outer periphery of the blade was severely torn.
次に、各試料の溝部に320／400番のダイヤモン
ド砥粒を電着法により二層に固着し、同様のテン
シヨンテストを行つた。 Next, two layers of No. 320/400 diamond abrasive grains were fixed in the grooves of each sample by electrodeposition, and the same tension test was conducted.
〔測定結果２〕
試料１ 190〜230g／50μｍ（溝の先端に微小ク
ラツクが現われる際のテンシヨン値）
試料２ 220〜290g／50μｍ（同上）
試料３ 350g／50μｍ（内周部の微小クラツク
は発生せず、台金外周部において破壊す
る際のテンシヨン値）
〔実験結果の考案〕
溝形状により台金のテンシヨン値が大きく変る
こと、及び発明のもの（試料３）は他のものに比
べ大きなテンシヨン（台金の強度限界まで）をか
けることができることが判明した。[Measurement results 2] Sample 1 190-230g/50μm (tension value when micro-cracks appear at the tip of the groove) Sample 2 220-290g/50μm (same as above) Sample 3 350g/50μm (micro-cracks at the inner periphery do not occur) (The tension value when the base metal breaks at the outer periphery of the base metal without breaking) [Description of experimental results] The tension value of the base metal changes greatly depending on the groove shape, and the one of the invention (sample 3) has a larger tension than the other ones. It was found that it was possible to apply the same strength (up to the strength limit of the base metal).
第１図は本発明による切断刃台金の一部を示す
平面図、第２図は台金の他の例の一部を示す平面
図、第３図は台金の好ましい例の一部を示す斜視
図、第４図は本発明による切断刃の一部断面図、
第５図イ，ロはこの発明の作用を示す説明図、第
６図から第８図は実験例における切断刃溝形状の
一部拡大平面図、第９図は実験例における測定点
を示す切断刃の平面図である。
１……台金、２，２′……溝、３……超硬度砥
粒、４……砥粒結合剤、５……溝側壁、６……台
金端面、７……台金表面、８……台金裏面。
FIG. 1 is a plan view showing a part of the cutting blade base metal according to the present invention, FIG. 2 is a plan view showing a part of another example of the base metal, and FIG. 3 is a plan view showing a part of a preferred example of the base metal. FIG. 4 is a partial sectional view of the cutting blade according to the present invention;
5A and 5B are explanatory diagrams showing the action of the present invention, FIGS. 6 to 8 are partially enlarged plan views of the cutting blade groove shape in the experimental example, and FIG. 9 is a cutting diagram showing the measurement points in the experimental example. FIG. 3 is a plan view of the blade. 1... Base metal, 2, 2'... Groove, 3... Super hard abrasive grain, 4... Abrasive grain binder, 5... Groove side wall, 6... Base metal end face, 7... Base metal surface, 8...Back side of base metal.
Claims (1)
端面から台金裏面にわたる範囲に所要の深さをも
ち、且つ台金端面から奥行き方向に所要の長さを
もつた溝を形成し、且つその溝を台金の表裏両面
にほぼ均等した数になるよう適宜間隔をおいて配
列し、上記各溝に超硬度砥粒を砥粒結合剤によつ
て固着した切断刃において、上記溝の両側壁が台
金端面に達する部分において台金の表裏面と平行
に引いた接線が、溝奥所に接近する方向に傾斜
し、且つ上記両側壁の間隔が台金端面から奥行き
方向へ次第に狭くなるよう形成されていることを
特徴とする切断刃。1 Form a groove with the required depth in the range from the base metal end face to the base metal surface and from the base metal end face to the base metal back face, and the required length in the depth direction from the base metal end face, and In a cutting blade in which grooves are arranged at appropriate intervals on both the front and back surfaces of the base metal, and superhard abrasive grains are fixed to each groove with an abrasive binder, both sides of the grooves are The tangent line drawn parallel to the front and back surfaces of the base metal at the part where it reaches the end face of the base metal is inclined in the direction approaching the deep part of the groove, and the interval between the two side walls becomes gradually narrower in the depth direction from the end face of the base metal. A cutting blade characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6364881A JPS57178669A (en) | 1981-04-23 | 1981-04-23 | Cutting edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6364881A JPS57178669A (en) | 1981-04-23 | 1981-04-23 | Cutting edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57178669A JPS57178669A (en) | 1982-11-02 |
| JPS6150754B2 true JPS6150754B2 (en) | 1986-11-05 |
Family
ID=13235373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6364881A Granted JPS57178669A (en) | 1981-04-23 | 1981-04-23 | Cutting edge |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57178669A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002113666A (en) * | 2000-10-10 | 2002-04-16 | Funasoo Kk | Hand saw capable of cutting glass bottle and method of manufacturing the same |
-
1981
- 1981-04-23 JP JP6364881A patent/JPS57178669A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57178669A (en) | 1982-11-02 |
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