JPS6151550B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for correcting fine patterns such as conductor patterns and resistor patterns formed by a thick film method or a thin film method, and more particularly to an apparatus for correcting chips in image areas.

In recent years, electronic components in the electronics field,
2. Description of the Related Art The production of wiring patterns such as conductor patterns or resistance patterns for display devices and the like is becoming very popular. In most cases, such wiring patterns are required to be defect-free. In other words, there must be no chipping in the printed areas, stains in the non-printed areas, etc. However, the current situation is that it is easy to cause chipping or disconnection of the drawing area, which necessitates correction. The details will be explained below.

There are two types of methods for producing conductor patterns or resistor patterns for electronic components, display devices, etc. in the electronics field: a thick film method and a thin film method. First, we will discuss the thick film method.

The thick film method is generally performed using silk screen printing, etc., but the printing pattern is usually much finer than that of regular printing, with a line width of 100 to 200 μm.
It is difficult to obtain defect-free printed matter due to the influence of dust in the air, impurities in the ink, etc., and wire breaks are particularly likely to occur. Furthermore, recently, patterns are required to have even finer lines, and the line width has increased.
As 50 micron and 100 micron pitches are now being printed, defects are becoming more likely to occur.

On the other hand, the thin film method is a method in which a conductive layer formed on the entire surface of the substrate by vapor deposition or plating is partially removed using a photo etching method or lift-off process to form a fine pattern. However, wire breakage is more likely to occur due to dust in the air, impurities in the resist, etc., and because the patterning is finer than in the thick film method.

Conventionally, such defects were discovered during the inspection process after patterning was made, and were corrected by hand using a fine brush and looking through a magnifying glass. In this manual correction method, the tip of the brush is made as thin as the line width, and an appropriate amount of ink is applied to the tip of the brush (too little ink will cause it to smear and you will not be able to draw it, and if there is too much ink, the line will be too thick and may not reach the next line). Furthermore, since the amount of ink at the tip of the brush was very small, the tip of the brush would dry out if it was not corrected quickly, making it extremely difficult and requiring effort, time, and skill. For example, when a broken wire 20 as shown in FIG. 1a is repaired using the conventional method, the repair portion 21 becomes a shape as shown in FIG. It was hardly suitable for Section 22.

Furthermore, in order to make the ink used for retouching suitable for brush writing, it is often necessary to use a retouching ink that is different from the ink used for pattern printing using the thick film method, and the adhesion of the retouched area to the substrate may be affected. was also likely to be inadequate. Furthermore, as shown in FIG. 2, since the layer tends to be thick, it may cause defects such as poor insulation when overcoating an insulating layer in a later process. In many cases, it was necessary to retouch the areas that had been corrected, which caused problems in terms of efficiency and reliability.

The present invention was devised to eliminate the above-mentioned drawbacks, and is intended to detect and repair missing parts of patterns such as broken lines in fine patterns, and uses a device that combines a microscope and a printing machine. Corrections are made using the printing method. According to the present invention, it is possible to efficiently, accurately and reliably perform corrections without requiring skill and without using much labor and time. In addition, especially for fine patterns made using the thick film method, the same ink used for making wiring patterns can be used, so there is no problem with adhesion, and the finish of the repaired areas is ideal as shown in Figure 1c. You can make corrections close to the shape. Of course, there will be some overlap at the overlapped portion, resulting in a thicker film, but this level of thickness unevenness will hardly cause any problems in subsequent processes.

Further, while the conventional method could only modify a line width of 40 to 50 microns at most, the present invention allows modification of a line width of about 10 microns.

A detailed explanation of the apparatus according to the present invention will be given below.
3 and 4 show a fine pattern correction apparatus according to the present invention. First, an object on which a fine pattern such as wiring is formed (hereinafter referred to as "object to be repaired 1") is placed on an inspection table 2, and inspected while being observed with a microscope 5.

At this time, the left end of the movable table 6 is pressed against the inspection abutment pin 7, and the movable table 6 is accurately positioned.
The inspection table 2 includes an X-direction movement stage 3 and a Y-direction movement stage 4, each of which has an examination table X-direction movement handle 16 and an examination table Y-direction movement handle 17. The object to be repaired 1 is fixed so as not to move on the X-direction moving stage 3 by means such as vacuum suction.

Microscope 5 is conveniently a binocular microscope with a zoom.
In the example shown in the figure, a zoom binocular stereomicroscope modelsz manufactured by Olympus Co., Ltd. is used. In order to efficiently detect defects, it is preferable to observe a wide area at a relatively low magnification, and when a defect is found, to enlarge the area to confirm the size and shape.
The field of view of the microscope 5 is equipped with a scale line 11 having a shape as shown in FIG. For example, as shown in FIG.
After that, the X-direction moving stage 3 and the Y-direction moving stage 4 are fixed by a lock mechanism so that they do not move.

In the retouching device of the present invention, the position of the intersection line of the scale line 11 of the microscope 5 is set in advance so that it coincides with the ink deposits on the retouching printing plate in the next step. Aligning the defective part of the pattern with the intersection of the scale lines 11 is as follows:
This simply means that the defective area has been registered with the correction pattern for the next process of correction printing.

Next, the moving table 6 on the base 8 is moved along the guardrail 10, and the right end of the moving table 6 is accurately pressed against the printing press bottle 9. This completes the positioning for correction printing.

As the correction printing machine, a screen printing machine, a gravure offset printing machine, an octopus printing machine, etc. can be adopted. Here, the gravure offset printing machine refers to one that uses a cylindrical offset cylinder. Gravure offset printing machines and tacho printing machines are preferable to screen printing machines because of the beauty of the line shapes, the ability to print thinner lines, stability, and accuracy, and the tacho printing machines are more preferable from the viewpoint of the simplicity of the mechanism.

As plates for retouching patterns, we have a variety of patterns at each stage with a line width of 10 to 200 microns and a length of 50 to 300 microns, and if necessary,
If these repair patterns are prepared in directions of 30 degrees, 45 degrees, 60 degrees, and 90 degrees, they can be applied to almost all defects. Defects that cannot be completely covered by this correction pattern can be completely corrected by repeating the above correction pattern two or three times, but this rarely happens. It is up to the parties concerned whether to form a plurality of correction patterns having a common shape or only one pattern for one plate.

The third example shows the case where an octopus printing machine is used as a printing machine.
Referring back to the figures and FIG. 4, this will be explained in more detail.

In other words, in a printing press for retouching, the movable table 6
An X-direction moving stage 13 and a Y-direction moving stage 14 are installed on the printing table 12 placed above.
The plate table 12 can be moved in the XY direction by the plate table X direction movement handle 18 and plate table Y direction movement handle 19.

The plate 15 is set on the X-direction moving stage 13. Furthermore, above this printing table 12, there is a tachopad 23.
so that it moves up and down. In this device, the left end of the movable table 6 is placed against the inspection pin 7 for inspection, and if a defective part is found, inking and doctoring are performed on the plate 15, and the tacho pad 23 is pushed down to remove the image area on the plate 15. Transfer the ink onto the tacopad.

Next, after pushing up the tacho pad 23, the moving table 6 is moved and its right end is brought into contact with the printing pin 9, and then the tacho pad 23 is pushed down to transfer the ink on the pad to the object 1 to be retouched. It is something. Of course, before moving on to retouching,
At which position on the XY direction moving stage the plate 15 is set, which pattern on the plate will be printed at a predetermined position within the scale of the microscope is read.

The shape of the octopus pad is not particularly limited, but preferably a semicylindrical shape, an anti-weight shape, etc.
In addition, its hardness is preferably 40° or less (JIS spring type hardness test type A), and the material is gelatin,
Resins such as urethane and silicone rubber are preferable.

As explained above, according to the present invention, no special skill is required, and anyone can easily perform repairs by simply learning how to operate the machine. It is possible to make certain adjustments. Also, unlike brush ink, ink for retouching can be used with excellent adhesion to the substrate, strength, etc., so there are no problems, and the retouched shape can be said to be close to ideal. It can be retouched, and the line width that can be retouched can be up to about 10μ.

The present invention is useful for modifying wiring patterns as described above, but it is also useful for modifying etching resists and the like. In other words, when creating characters, etc. for a line printer by etching, for example, it is unacceptable for the characters to be missing, etc.
The present invention is also useful for correction in such cases.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing the state of the correction, where a shows the state before correction, b shows the part corrected by the conventional method, and c shows the ideally corrected part, and Fig. 2 shows the part corrected by the conventional method. FIG.
FIG. 3 is a front view showing an embodiment of the fine pattern retouching apparatus according to the present invention, FIG. 4 is a plan view thereof, and FIG. 5 is an explanatory view showing the state of alignment for retouching. 1...Object to be repaired, 2...Inspection table, 3...X direction moving stage, 4...Y direction moving stage, 5...
...Microscope, 6...Movement table, 7...Putting pin for inspection, 8...Base, 9...Putting pin for printing, 10...
...Guardrail, 11...Scale line, 12...
Plate stand, 13...X direction moving stage, 14...Y
Directional movement stage, 15... Plate, 16... Handle for moving the inspection table in the X direction, 17... Handle for moving the inspection table in the Y direction, 18... Handle for moving the plate table in the X direction, 19... Handle for moving the plate table in the Y direction. handle.

Claims (1)

[Scope of Claims] 1. An apparatus for reprinting defective parts such as disconnected parts of fine patterns, which includes: (A) a microscope for discovering defective parts of the fine patterns; (B) an object to be repaired having fine patterns. (C) An inspection table that can move in the X and Y directions to position the defective part in a normal view.
(D) A plate stand on which a plate having various repair patterns suitable for repairing the defective part can be placed and moved in the X and Y directions to accurately set the position of the plate; (D) the defective part of the object to be repaired; (E) A movable table that can carry the above-mentioned inspection table and printing plate and move back and forth between the microscope and the printing press; (A) to (E) above; A fine pattern correction device comprising: 2. The fine pattern retouching device according to claim 1, wherein the printing machine is a screen printing machine. 3. The fine pattern retouching device according to claim 1, wherein the printing machine is a gravure offset printing machine. 4. The fine pattern retouching device according to claim 1, wherein the printing machine is an octopus printing machine.