JPS6152989B2 - - Google Patents
Info
- Publication number
- JPS6152989B2 JPS6152989B2 JP56080177A JP8017781A JPS6152989B2 JP S6152989 B2 JPS6152989 B2 JP S6152989B2 JP 56080177 A JP56080177 A JP 56080177A JP 8017781 A JP8017781 A JP 8017781A JP S6152989 B2 JPS6152989 B2 JP S6152989B2
- Authority
- JP
- Japan
- Prior art keywords
- input
- output pins
- lsi
- board
- lsi package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】
本発明は、大規模集積回路（LSI）パツケージ
の冷却構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling structure for large scale integrated circuit (LSI) packages.
従来のLSIパツケージの冷却構造は、LSIパツ
ケージの裏面（LSIを搭載していない方の面）に
ヒートシンクを圧接又は接着し、これを送風機等
によつて強制空冷する構造である。LSIが発生す
る熱は、LSIパツケージ基板を通つて前記ヒート
シンクに伝導し、ヒートシンクから空中に放散す
るから、熱発生源から空気までの熱抵抗が大であ
り熱放散が十分でないという欠点がある。近年の
半導体技術の進展に伴ない、LSIの集積度が飛躍
的に増大し、発熱量も増加の一途をたどつてい
る。このため、従来の冷却構造では、LSIの温度
を所定値以下に押えることが困難になつて来てい
る。大形のヒートシンクを取付け、放熱面に工夫
を施す等の対策によつてもなお不充分である。
LSIは一定温度以上になると特性が劣化し、甚だ
しいときは破壊されるおそれがあるから効率のよ
い冷却構造が必要である。 The conventional cooling structure for an LSI package is such that a heat sink is pressure-bonded or glued to the back side of the LSI package (the side on which no LSI is mounted), and this is forcedly air-cooled using a blower or the like. The heat generated by the LSI is conducted to the heat sink through the LSI package board and dissipated from the heat sink into the air, so there is a drawback that the thermal resistance from the heat generation source to the air is large and heat dissipation is insufficient. With recent advances in semiconductor technology, the degree of integration of LSIs has increased dramatically, and the amount of heat generated has also continued to increase. For this reason, with conventional cooling structures, it has become difficult to keep the temperature of the LSI below a predetermined value. Even with measures such as installing a large heat sink and making improvements to the heat dissipation surface, it is still insufficient.
LSI characteristics deteriorate when the temperature exceeds a certain level, and in extreme cases, there is a risk of destruction, so an efficient cooling structure is required.
本発明の目的は、高集積、高発熱量のLSIの熱
放散を充分ならしめる高密度LSIパツケージの冷
却構造を提供することにある。 An object of the present invention is to provide a cooling structure for a high-density LSI package that can sufficiently dissipate heat from a highly integrated, high-heat-generating LSI.
本発明の冷却構造は、複数のLSIを搭載し複数
の入出力ピンが植設されたLSIパツケージ基板
と、前記LSIパツケージ基板の入出力ピンと対向
する位置に入出力ピンを植設した高密度プリント
基板と、前記LSIパツケージ基板と上記高密度プ
リント基板の対向する入出力ピンとをそれぞれ圧
接挿入する金属円筒を複数個植設し内部に液体冷
媒を流通可能なコネクタとを備え、該コネクタを
介して前記LSIパツケージ基板と前記高密度プリ
ント基板の対応する入出力ピンを接続し、かつ、
該コネクタ内部に液体冷媒を流通させて放熱する
ことを特徴とする。 The cooling structure of the present invention includes an LSI package board on which multiple LSIs are mounted and a plurality of input/output pins implanted, and a high-density printed circuit board with input/output pins implanted in positions facing the input/output pins of the LSI package board. A circuit board, and a connector in which a plurality of metal cylinders are implanted into which the opposing input/output pins of the LSI package board and the high-density printed circuit board are inserted under pressure, and a liquid refrigerant can flow therein; Connecting the corresponding input/output pins of the LSI package board and the high-density printed circuit board, and
The connector is characterized in that heat is radiated by circulating a liquid refrigerant inside the connector.
次に、本発明について、図面を参照して詳細に
説明する。 Next, the present invention will be explained in detail with reference to the drawings.
第１図は、本発明の一実施例を示し、同図ａは
平面図であり、そのAA断面図を同図を同図ｂに
示す。また、第１図ｂのＢ部の拡大断面図を第２
図に示す。すなわち、複数のLSIIがLSIパツケー
ジ基板２に搭載され、多数の入出力ピン３がパツ
ケージ基板２に植設されている。一方、高密度プ
リント基板４には、多数の入出力ピン５が植設さ
れ、前記入出力ピン３と該入出力ピン５とは対向
する位置に配置されている。コネクタ６は、前記
ピン３，５等に対応する位置に金属円筒からなる
ソケツト１０が植設れていて内部には液体冷媒９
を流通させることができる。液体冷媒９は、流入
口７から流入し、コネクタ６のハウジング１１内
を流通して排出口８から流出する。コネクタ６に
は前記ソケツト１０（金属円筒）が多数植設され
ているが、その間をを通つて冷媒９が流通する。
なお、ソケツト１０はその外周端部をハウジング
１１に密着し、冷媒９を外部へ漏洩させることは
ない。なお、ハウジング１１および冷媒９には、
電気絶縁性を有する物質が使用される。そして、
コネクタ６のソケツト１０に、前記ピン３および
５を挿入して、LSIパツケージ基板２を高密度プ
リント基板４に装着すれば必要な電気接続がなさ
れ、コネクタ６に液体冷媒９を流通させればLSI
を冷却することができる。すなわち、LSIから発
生した熱は、LSIパツケージ基板２を通つて、入
出力ピン３に伝導し、ソケツト１０を介して液体
冷媒９に伝えられる。一般に、LSIパツケージ基
板２および入出力ピン３は熱良導体であり、ま
た、入出力ピン３とソケツト１０は圧接されてい
るため、接触部における熱抵抗も少ない。従つ
て、LSIから発生した熱は、低熱抵抗で液体冷媒
９まで伝導し、液体冷媒中に放散することができ
る。液体冷媒を流通させて所定温度以下に保つこ
とによりLSIの温度を一定値以下にすることがで
きる。 FIG. 1 shows an embodiment of the present invention, and FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view along line AA. In addition, the enlarged sectional view of part B in Figure 1b is shown in Figure 2.
As shown in the figure. That is, a plurality of LSIIs are mounted on the LSI package board 2, and a large number of input/output pins 3 are implanted in the package board 2. On the other hand, a large number of input/output pins 5 are implanted in the high-density printed circuit board 4, and the input/output pins 3 and the input/output pins 5 are arranged at opposing positions. The connector 6 has a socket 10 made of a metal cylinder installed at a position corresponding to the pins 3, 5, etc., and a liquid refrigerant 9 inside.
can be distributed. The liquid refrigerant 9 flows in from the inlet 7 , flows through the housing 11 of the connector 6 , and flows out from the outlet 8 . A large number of sockets 10 (metal cylinders) are installed in the connector 6, and the refrigerant 9 flows through them.
Note that the outer peripheral end of the socket 10 is brought into close contact with the housing 11, so that the refrigerant 9 will not leak to the outside. Note that the housing 11 and the refrigerant 9 include
A material with electrical insulation properties is used. and,
By inserting the pins 3 and 5 into the socket 10 of the connector 6 and attaching the LSI package board 2 to the high-density printed circuit board 4, the necessary electrical connections are made.If the liquid coolant 9 is passed through the connector 6, the LSI
can be cooled. That is, heat generated from the LSI is conducted to the input/output pins 3 through the LSI package board 2, and then to the liquid coolant 9 via the socket 10. Generally, the LSI package board 2 and the input/output pins 3 are good thermal conductors, and since the input/output pins 3 and the socket 10 are pressed together, the thermal resistance at the contact portion is also small. Therefore, the heat generated from the LSI can be conducted to the liquid coolant 9 with low thermal resistance and dissipated into the liquid coolant. By circulating the liquid refrigerant and keeping the temperature below a predetermined temperature, the temperature of the LSI can be kept below a certain value.
近年のLSIの集積度の増大に伴つて、LSIパケ
ージ基板の入出力ピン３の数は増大する傾向にあ
り、また、性能上の要請からLSIパツケージ基板
２と高密度プリント基板４とが近づけられる傾向
に伴つて、熱伝導距離も短くなる。従つて、LSI
の高集積化、高性能化に対応して放熱効果はます
ます良好となり、本発明の特徴が発揮される。 With the increase in the degree of integration of LSIs in recent years, the number of input/output pins 3 on LSI package boards tends to increase, and due to performance requirements, the LSI package boards 2 and high-density printed circuit boards 4 are being brought closer together. Along with this trend, the heat conduction distance will also become shorter. Therefore, LSI
In response to higher integration and higher performance, the heat dissipation effect becomes better and better, and the features of the present invention are exhibited.
以上のように、本発明においては、入出力ピン
の熱を液体冷媒によつて強制冷却するように構成
されているから、LSIの発熱を効率よく放散させ
ることができLSIを所定温度以下に保つことがで
きる。 As described above, since the present invention is configured to forcibly cool the heat of the input/output pins with the liquid refrigerant, the heat generated by the LSI can be efficiently dissipated and the LSI can be kept at a predetermined temperature or below. be able to.
第１図ａは本発明の一実施例を示す平面図、同
図ｂはその断面図、第２図は上記実施例のソケツ
ト部の一部拡大断面図である。
図において、１……LSI、２……LSIパツケー
ジ基板、３……LSIパツケジ基板の入出力ピン、
４……高密度プリント基板、５……高密度プリン
ト基板の入出力ピン、６……コネクタ、９……液
体冷媒、１０……金属円筒。
FIG. 1a is a plan view showing one embodiment of the present invention, FIG. 1b is a sectional view thereof, and FIG. 2 is a partially enlarged sectional view of the socket portion of the above embodiment. In the figure, 1...LSI, 2...LSI package board, 3...LSI package board input/output pins,
4... High density printed circuit board, 5... Input/output pin of high density printed circuit board, 6... Connector, 9... Liquid refrigerant, 10... Metal cylinder.
Claims (1)
されたLSIパツケージ基板と、前記LSIパツケー
ジ基板の入出力ピンと対向する位置に入出力ピン
を植設した高密度プリント基板と、前記SLIパツ
ケージ基板と上記高密度プリント基板の対向する
入出力ピンとをそれぞれ圧接挿入する金属円筒を
複数個植設し内部に液体冷媒を流通可能なコネク
タとを備え、該コネクタを介して前記LSIパツケ
ージ基板と前記高密度プリント基板の対応する入
出力ピンとが接続され、かつ、該コネクタ内部に
液体冷媒を流通させる手段を備えたことを特徴と
する高密度LSIパツケージ。1. An LSI package board on which multiple LSIs are mounted and multiple input/output pins implanted, a high-density printed circuit board with input/output pins implanted in positions facing the input/output pins of the LSI package board, and the SLI package board. A connector is provided, in which a plurality of metal cylinders are implanted into which the board and the opposing input/output pins of the high-density printed circuit board are inserted in pressure contact, respectively, and a liquid refrigerant can flow therein, and the LSI package board and the 1. A high-density LSI package connected to corresponding input/output pins of a high-density printed circuit board, and comprising means for circulating a liquid refrigerant inside the connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56080177A JPS57196551A (en) | 1981-05-28 | 1981-05-28 | Cooling structure of high density lsi package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56080177A JPS57196551A (en) | 1981-05-28 | 1981-05-28 | Cooling structure of high density lsi package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57196551A JPS57196551A (en) | 1982-12-02 |
| JPS6152989B2 true JPS6152989B2 (en) | 1986-11-15 |
Family
ID=13711064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56080177A Granted JPS57196551A (en) | 1981-05-28 | 1981-05-28 | Cooling structure of high density lsi package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57196551A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19514548C1 (en) * | 1995-04-20 | 1996-10-02 | Daimler Benz Ag | Method of manufacturing a micro cooler |
-
1981
- 1981-05-28 JP JP56080177A patent/JPS57196551A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57196551A (en) | 1982-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5513070A (en) | Dissipation of heat through keyboard using a heat pipe | |
| US6712621B2 (en) | Thermally enhanced interposer and method | |
| US6816378B1 (en) | Stack up assembly | |
| US5933324A (en) | Apparatus for dissipating heat from a conductive layer in a circuit board | |
| US6795315B1 (en) | Cooling system | |
| US6530419B1 (en) | Cooling system for electronic packages | |
| US6105662A (en) | Cooling system for electronic packages | |
| US5828549A (en) | Combination heat sink and air duct for cooling processors with a series air flow | |
| US4468717A (en) | Apparatus for cooling integrated circuit chips | |
| US7345885B2 (en) | Heat spreader with multiple stacked printed circuit boards | |
| WO1981003734A1 (en) | Heat pin integrated circuit packaging | |
| KR20010070141A (en) | Electronic module | |
| JPH1051169A (en) | Heating element mounting semiconductor device | |
| JPS6152989B2 (en) | ||
| CN218158692U (en) | DMD packaging and heat dissipation structure for optical machine, heat dissipation pressing plate and projection optical machine | |
| US6399877B1 (en) | Heat sink | |
| JPH0778917A (en) | J-lead package, socket system and board system | |
| CN113099680B (en) | Electronic devices and heat dissipation components | |
| KR19990041018U (en) | Heat Sink of Central Processing Unit (CPU) Cooling Unit | |
| JPH0817221B2 (en) | Semiconductor device and semiconductor wafer mounting method | |
| CN223584567U (en) | A heat dissipation system | |
| JP3057021U (en) | Heat dissipation device | |
| JPH08130385A (en) | Electronic circuit board and cooling method thereof | |
| JPS59155158A (en) | Cooling structure of semiconductor device | |
| JP2919313B2 (en) | Printed wiring board and its mounting method |