Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS6153937B2 - - Google Patents
[go: Go Back, main page]

JPS6153937B2 - - Google Patents

Info

Publication number
JPS6153937B2
JPS6153937B2 JP3128982A JP3128982A JPS6153937B2 JP S6153937 B2 JPS6153937 B2 JP S6153937B2 JP 3128982 A JP3128982 A JP 3128982A JP 3128982 A JP3128982 A JP 3128982A JP S6153937 B2 JPS6153937 B2 JP S6153937B2
Authority
JP
Japan
Prior art keywords
thin plate
synthetic resin
resin material
gate pin
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3128982A
Other languages
Japanese (ja)
Other versions
JPS58147331A (en
Inventor
Tadashi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP3128982A priority Critical patent/JPS58147331A/en
Publication of JPS58147331A publication Critical patent/JPS58147331A/en
Publication of JPS6153937B2 publication Critical patent/JPS6153937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1635Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1671Making multilayered or multicoloured articles with an insert

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 本発明はインサート成形法に関するものであ
り、その目的とするところは、放熱性や耐熱性等
の向上のためにインサートする薄板を変形させる
ことなく所定の位置に埋設することのできるイン
サート成形法を提供することにある。
[Detailed description of the invention] The present invention relates to an insert molding method, and its purpose is to embed a thin plate to be inserted in a predetermined position without deforming it in order to improve heat dissipation, heat resistance, etc. The purpose of the present invention is to provide an insert molding method that can be used for insert molding.

電気かみそりのような小物家電商品は、小型、
薄型化のために制御回路や充電回路等の電子回路
やモータ等を高密度で実装しているが、電子回路
やモータ等の内部発熱により合成樹脂材でできた
ハウジング内の温度が高くなり、放熱性が低いと
個々の電子部品の信頼性が低下するとともに、手
でふれるハウジングの表面温度が部分的に高くな
り使用者に不安感を与えたり、ハウジングが変形
したり、変色するという問題が生じた。
Small household appliances such as electric razors are small,
Electronic circuits such as control circuits and charging circuits, motors, etc. are mounted with high density in order to make the product thinner, but internal heat generation from the electronic circuits, motors, etc. increases the temperature inside the housing made of synthetic resin. Poor heat dissipation reduces the reliability of individual electronic components, and also causes problems such as the surface temperature of the housing that is touched by hands becoming high in some areas, giving the user a sense of anxiety, and causing the housing to deform or discolor. occured.

このような問題を解決する方法として、第9図
に示すように2分割のハウジングアの内面にアル
ミニウムのような熱伝導材よりなる薄板イを載置
して放熱効果を高めるとともに、薄板イと導電部
(図示せず)との間にプレスボードのような絶縁
板ウを挾み込む方法があるが、ハウジングアの内
面にモータ(図示せず)、電池(図示せず)、充電
部を固定するためのリブエが突出しており、薄板
イや絶縁板ウにこれらのリブエを避けるための切
欠オを設ける必要があり、放熱面積が小さくなつ
て熱の放散が悪くなるという問題があり、更に
は、ハウジングアの内面に薄板イや絶縁板ウを取
着するには接着剤を用いて貼着するが、形状の複
雑な薄板イや絶縁板ウを全面に亘つて完全に貼着
することは困難であり、放熱にばらつきが生じる
という問題があつた。
As a way to solve this problem, as shown in Figure 9, a thin plate made of a thermally conductive material such as aluminum is placed on the inner surface of the two-part housing to increase the heat dissipation effect. There is a method of inserting an insulating board such as a press board between the conductive part (not shown), but it is also possible to insert the motor (not shown), battery (not shown), and live parts on the inside of the housing. The ribs for fixing protrude, and it is necessary to provide notches in the thin plate A and the insulating plate C to avoid these ribs, which causes the problem that the heat radiation area becomes smaller and the heat dissipation becomes worse. In order to attach the thin plate A and the insulating plate C to the inner surface of the housing, adhesive is used to attach the thin plate A and the insulating plate C to the inner surface of the housing. It was difficult to do so, and there was a problem of uneven heat dissipation.

本発明は上述の問題点に鑑みてなされたもので
あり、以下本発明の実施例を示す図面を参照して
説明する。第1図及び第2図において、ハウジン
グ1は2分割に形成されており、該ハウジング1
の内部にはモータ2、電池3、及び充電部4が収
容されており、該モータ2により駆動される内刃
5に摺接する外刃6が着脱自在に設けられてい
る。ハウジング1には複数の小孔7を有するアル
ミニウムのような熱伝導材よりなる薄板8がモー
タ2や電池3や充電部4の収納位置の略全体に埋
設されている。ハウジング1は内面層を形成する
電気絶縁性を有した第1の合成樹脂材1aと、薄
板8と、外面積を形成する第2の合成樹脂材1b
とで3層構造に形成されている。充電部4はプリ
ント配線板9と該プリント配線板9に実装される
電子部品10とで構成されており、ハウジング1
の内壁で支持されている。スイツチハンドル11
は一方のハウジング1に摺動自在に配設されてお
り、該スイツチハンドル11を操作することによ
り、モータ2に電池3からの電気を供給してモー
タ2を回転駆動させるのである。
The present invention has been made in view of the above-mentioned problems, and will be described below with reference to the drawings showing embodiments of the present invention. In FIGS. 1 and 2, the housing 1 is formed into two parts.
A motor 2, a battery 3, and a charging section 4 are housed inside, and an outer cutter 6 that slides in contact with an inner cutter 5 driven by the motor 2 is detachably provided. In the housing 1, a thin plate 8 made of a thermally conductive material such as aluminum and having a plurality of small holes 7 is embedded in substantially the entire housing position of the motor 2, battery 3, and charging section 4. The housing 1 includes a first synthetic resin material 1a having electrical insulation properties forming an inner layer, a thin plate 8, and a second synthetic resin material 1b forming an outer surface.
It is formed into a three-layer structure. The charging section 4 is composed of a printed wiring board 9 and an electronic component 10 mounted on the printed wiring board 9.
is supported by the inner wall of switch handle 11
is slidably disposed in one housing 1, and by operating the switch handle 11, electricity from the battery 3 is supplied to the motor 2 to rotate the motor 2.

以下、ハウジング1の製造方法について第3図
乃至第8図に基づいて述べる。第3図において、
キヤビデイ12は可動金型13と、ゲート14a
を収容した固定金型14とで構成されている。可
動金型13にはキヤビテイ12内に突出自在なゲ
ートピン15が複数本設けられている。ゲートピ
ン15は突出状態で拘束することが可能で可動金
型13内に収納されており、薄板8に当接した位
置で係止される。第5図に示すように、ゲートピ
ン15の先端には薄板8の小孔7の周縁を支持す
る複数個の凸部16が同心円上に配置され且つゲ
ートピン15の軸方向に突出形成されている。凸
部16の高さHは薄板8と可動金型13との距離
Lと等しく形成されている。固定金型14のキヤ
ビテイ12面にはゲートピン15と対向する位置
に小孔7を配列し、かつ表面に接着剤が塗布され
た薄板8が載置され、キヤビテイ12内に突出さ
れたゲートピン15の端面が全ての小孔7を覆う
とともにゲートピン15を拘束してゲートピン1
5の凸部16と固定金型14のキヤビテイ12面
との間に薄板8が保持されている。この状態でキ
ヤビテイ12内に絶縁材でできた第1の合成樹脂
材1aを溶融させてゲート14aから注入するの
であるが、薄板8は小孔7の周縁がゲートピン1
5の凸部16の先端で支持されているので第1の
合成樹脂材1aの射出流により移動することな
く、第4図に示すように、第1の合成樹脂材1a
で薄板8を片面がモールドされ、一体的に同時成
形されるのである。このとき、第6図に示すよう
に、ゲートピン15の凸部16が位置している部
分は薄板8が凹所18内に露出されており、ゲー
トピン15の凹部17が位置している部分は第1
の合成樹脂材1aによりモールドされ、この部分
の第1の合成樹脂材1aで薄板8の小孔7の周縁
が保持されている。次に型開きした後、ゲートピ
ン15の凸部16に硬化した第1の合成樹脂材1
aを取着したままで別の固定金型19に取り替え
て第7図に示す大きな容積のキヤビテイ20を形
成し、該キヤビテイ20内に第2の合成樹脂材1
bを溶融させて注入する。このとき、ゲートピン
15の拘束状態を開放すれば、樹脂圧によりゲー
トピン15は可動金型13内に収納されてキヤビ
テイ20面とゲートピン15の凸部16とが面一
になつた状態で係止され、第2の合成樹脂材1b
は、第8図に示すように、小孔7内に充填される
とともに薄板8の他面をモールドし、薄板8は第
1の合成樹脂材1a、及び第2の合成樹脂材1b
により完全に包み込まれる。
Hereinafter, a method for manufacturing the housing 1 will be described based on FIGS. 3 to 8. In Figure 3,
The cavity 12 has a movable mold 13 and a gate 14a.
It is composed of a fixed mold 14 containing a. The movable mold 13 is provided with a plurality of gate pins 15 that can freely protrude into the cavity 12. The gate pin 15 can be restrained in a protruding state and is housed in the movable mold 13, and is locked at a position where it abuts against the thin plate 8. As shown in FIG. 5, at the tip of the gate pin 15, a plurality of protrusions 16 that support the periphery of the small hole 7 of the thin plate 8 are arranged concentrically and protrude in the axial direction of the gate pin 15. The height H of the convex portion 16 is formed to be equal to the distance L between the thin plate 8 and the movable mold 13. On the surface of the cavity 12 of the fixed mold 14, a thin plate 8 with small holes 7 arranged in a position facing the gate pin 15 and whose surface is coated with adhesive is placed. The end surface covers all of the small holes 7 and restrains the gate pin 15.
A thin plate 8 is held between the convex portion 16 of the mold 5 and the cavity 12 surface of the fixed mold 14. In this state, the first synthetic resin material 1a made of an insulating material is melted into the cavity 12 and injected from the gate 14a.
As shown in FIG. 4, the first synthetic resin material 1a does not move due to the injection flow of the first synthetic resin material 1a.
One side of the thin plate 8 is molded, and the two are integrally molded at the same time. At this time, as shown in FIG. 6, the thin plate 8 is exposed in the recess 18 at the part where the convex part 16 of the gate pin 15 is located, and the part where the recess 17 of the gate pin 15 is located is the part where the convex part 16 of the gate pin 15 is located. 1
The peripheral edge of the small hole 7 of the thin plate 8 is held by the first synthetic resin material 1a of this portion. Next, after opening the mold, the hardened first synthetic resin material 1 is applied to the convex portion 16 of the gate pin 15.
A is replaced with another fixed mold 19 with mold a still attached to form a cavity 20 with a large volume as shown in FIG.
Melt and inject b. At this time, if the restraint state of the gate pin 15 is released, the gate pin 15 is housed in the movable mold 13 by the resin pressure and is locked in a state where the cavity 20 surface and the convex part 16 of the gate pin 15 are flush with each other. , second synthetic resin material 1b
is filled into the small hole 7 and molded on the other side of the thin plate 8, as shown in FIG.
completely enveloped.

このようにしたものは、薄板8が第1の合成樹
脂材1aと第2の合成樹脂材1bによつて完全に
包み込むことができるので第1の合成樹脂材1a
と第2の合成樹脂材1bと薄板8との機械的結合
力を大きくすることができる上に薄板8に塗布し
た接着剤による結合力によつても強固に結合され
ハウジングの強度向上をはかることができ薄肉の
ものにすることができるのであり、更に、内面層
となる第1の合成樹脂材1aに弾力性を有する合
成樹脂材料を用いることによりハウジング1内に
収納するモータ2、電池3、及び充電部4等の緩
衝効果を持たせたり、吸音材や防振材を使用する
ことによりモータ2及び内刃5の駆動時の雑音や
振動を吸収させることもできるのである。
In this case, since the thin plate 8 can be completely wrapped by the first synthetic resin material 1a and the second synthetic resin material 1b, the first synthetic resin material 1a
The mechanical bonding force between the second synthetic resin material 1b and the thin plate 8 can be increased, and the bonding force of the adhesive applied to the thin plate 8 can also firmly bond the housing, thereby improving the strength of the housing. Furthermore, by using a synthetic resin material having elasticity for the first synthetic resin material 1a serving as the inner surface layer, the motor 2, battery 3, and It is also possible to absorb noise and vibration when the motor 2 and the inner cutter 5 are driven by providing a buffering effect to the charging part 4 or by using a sound absorbing material or a vibration isolating material.

以上説明したように、本発明によれば、熱伝導
材からなる薄板の片面から予じめ注入する第1の
合成樹脂材と該薄板の他面から注入する第2の合
成樹脂材で該薄板を埋設して成るインサート成形
法において、前記薄板に小孔を形成するととも
に、ゲートピンの先端に軸方向に突出する凸部を
複数個形成し、前記ゲートピンの凸部で前記薄板
の小孔の周縁を支持して第1の合成樹脂材を注入
し薄板の片面をモールドした後、第2の合成樹脂
材を注入して前記小孔内に充填するとともに前記
薄板の他面をモールドしたので、ハウジング1の
組立てと同時に放熱板や耐熱板を装着することが
でき組込みが簡単となり、従来のように放熱面積
がリブのために小さくなることがなくて放熱効果
が大きくなるので、電子回路やモータ等の内部発
熱によつて個々の電子部品の信頼性が低下したり
ユーザーに不安感を与えることがないという効果
があり、また、複雑な形状の金属板や絶縁板を接
着する必要がなくて放熱効果が均一となり、製品
による放熱のばらつきがなくなるという効果があ
り、更に、第1の合成樹脂材の注入時にはゲート
ピンの凸部で薄板の小孔周縁を支持しているの
で、第1の合成樹脂材の注入圧力により薄板が所
定の位置からずれないようになるとともに、ゲー
トピンの凹部に注入された第1の合成樹脂材で薄
板の小孔周縁を部分的に支持した状態で第2の合
成樹脂材を注入するので、第2の合成樹脂材の注
入圧力により薄板の小孔の周縁がゲートピン側に
変形した薄板が第1の合成樹脂材から剥離した
り、合成樹脂材の表面と薄板との間隔が不均一に
なるようなことはなく放熱効果を均一にすること
ができるという効果がある。
As explained above, according to the present invention, the first synthetic resin material is injected in advance from one side of a thin plate made of a thermally conductive material, and the second synthetic resin material is injected from the other side of the thin plate. In the insert molding method, a small hole is formed in the thin plate, and a plurality of convex portions protruding in the axial direction are formed at the tip of the gate pin, and the convex portion of the gate pin closes the periphery of the small hole in the thin plate. After supporting the first synthetic resin material and molding one side of the thin plate, the second synthetic resin material was injected and filled into the small holes and the other side of the thin plate was molded. The heat sink and heat resisting plate can be attached at the same time as the assembly of step 1, which simplifies assembly.The heat dissipation area is not reduced due to ribs as in the past, and the heat dissipation effect is increased, so it is suitable for electronic circuits, motors, etc. This has the effect of not reducing the reliability of individual electronic components or causing a sense of anxiety to the user due to internal heat generation, and also eliminates the need to bond complicatedly shaped metal plates or insulating plates, allowing heat dissipation. This has the effect of making the effect uniform and eliminating variations in heat dissipation depending on the product.Furthermore, since the convex part of the gate pin supports the periphery of the small hole in the thin plate when injecting the first synthetic resin material, the first synthetic resin material The injection pressure of the material prevents the thin plate from shifting from the predetermined position, and the first synthetic resin material injected into the recess of the gate pin partially supports the periphery of the small hole in the thin plate, while the second synthetic resin is applied. Since the injection pressure of the second synthetic resin material deforms the periphery of the small hole in the thin plate toward the gate pin side, the thin plate may peel off from the first synthetic resin material, or the surface of the synthetic resin material and the thin plate may There is an advantage that the spacing is not uneven and the heat dissipation effect can be made uniform.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のインサート成形法で形成した
ハウジングを備えた電気かみそりの正面図、第2
図は同上の断面図、第3図及び第4図、第7図及
び第8図はハウジングの製造方法を示す断面図、
第5図はゲートピンの外観斜視図、第6図は第1
の合成樹脂材を注入した状態のハウジングの平面
図、第9図は従来例の分解斜視図である。 1a……第1の合成樹脂材、1b……第2の合
成樹脂材、7……小孔、8……薄板、15……ゲ
ートピン、16……凸部。
FIG. 1 is a front view of an electric shaver equipped with a housing formed by the insert molding method of the present invention, and FIG.
The figure is a cross-sectional view of the same as above, FIGS. 3 and 4, and FIGS. 7 and 8 are cross-sectional views showing a method of manufacturing the housing.
Figure 5 is an external perspective view of the gate pin, Figure 6 is the first
FIG. 9 is an exploded perspective view of the conventional example. 1a...First synthetic resin material, 1b...Second synthetic resin material, 7...Small hole, 8...Thin plate, 15...Gate pin, 16...Convex portion.

Claims (1)

【特許請求の範囲】[Claims] 1 熱伝導材からなる薄板の片面から予じめ注入
する第1の合成樹脂材と該薄板の他面から注入す
る第2の合成樹脂材で該薄板を埋設して成るイン
サート成形法において、前記薄板に小孔を形成す
るとともに、ゲートピンの先端に軸方向に突出す
る凸部を複数個形成し、前記ゲートピンの凸部で
前記薄板の小孔の周縁を支持して第1の合成樹脂
材を注入し薄板の片面をモールドした後、第2の
合成樹脂材を注入して前記小孔内に充填するとと
もに前記薄板の他面をモールドしたことを特徴と
するインサート成形法。
1. In an insert molding method in which a thin plate made of a thermally conductive material is embedded with a first synthetic resin material injected in advance from one side of the thin plate and a second synthetic resin material injected from the other side of the thin plate, A small hole is formed in the thin plate, and a plurality of convex portions protruding in the axial direction are formed at the tip of the gate pin, and the convex portion of the gate pin supports the periphery of the small hole in the thin plate and the first synthetic resin material is formed. An insert molding method characterized in that after injecting and molding one side of the thin plate, a second synthetic resin material is injected to fill the small holes and the other side of the thin plate is molded.
JP3128982A 1982-02-26 1982-02-26 Insert molding method Granted JPS58147331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3128982A JPS58147331A (en) 1982-02-26 1982-02-26 Insert molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3128982A JPS58147331A (en) 1982-02-26 1982-02-26 Insert molding method

Publications (2)

Publication Number Publication Date
JPS58147331A JPS58147331A (en) 1983-09-02
JPS6153937B2 true JPS6153937B2 (en) 1986-11-20

Family

ID=12327145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3128982A Granted JPS58147331A (en) 1982-02-26 1982-02-26 Insert molding method

Country Status (1)

Country Link
JP (1) JPS58147331A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6290213A (en) * 1985-10-17 1987-04-24 Mitsubishi Metal Corp Molding method of integrated circuit element casing based on injection molding
CA2197136A1 (en) * 1997-02-10 1998-08-10 Dave Cockle Plastic molding process and products produced thereby

Also Published As

Publication number Publication date
JPS58147331A (en) 1983-09-02

Similar Documents

Publication Publication Date Title
US4507675A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
EP0817261B1 (en) Method for manufacturing plastic package for electronic device having a fully insulated dissipator
US4750030A (en) Resin-molded semiconductor device having heat radiating plate embedded in the resin
EP0066188B1 (en) Plastic encapsulated semiconductor device and method for manufacturing the same
US5370517A (en) Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device
JPS6153937B2 (en)
JP3906510B2 (en) Heat dissipation board for mounting electronic components
US5995374A (en) Resin-coated mount substrate and method of producing the same
CA2347663A1 (en) Electronic gas-lighting device
JPS6153936B2 (en)
GB2151845A (en) A semiconductor memory
JPH0786704A (en) Wiring board for power circuit and manufacturing method thereof
JPS6138717B2 (en)
JPH118007A (en) Electric connector assembly and its manufacture
JP3456738B2 (en) Mold motor
JPH02184040A (en) Manufacture of semiconductor device
JP3802467B2 (en) Pack battery and manufacturing method thereof
JP2004213931A (en) Battery pack
JPS6018156B2 (en) Electrical equipment case and its manufacturing method
JP2864995B2 (en) Circuit device
JPS5926604Y2 (en) semiconductor equipment
JPS6138194Y2 (en)
JPH0729607Y2 (en) Composite electronic components
JPH0512857B2 (en)
JPS62141942A (en) Assembling method for stator of motor