JPS6153938B2 - - Google Patents
Info
- Publication number
- JPS6153938B2 JPS6153938B2 JP6021380A JP6021380A JPS6153938B2 JP S6153938 B2 JPS6153938 B2 JP S6153938B2 JP 6021380 A JP6021380 A JP 6021380A JP 6021380 A JP6021380 A JP 6021380A JP S6153938 B2 JPS6153938 B2 JP S6153938B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- control valve
- pressure control
- injection
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 28
- 238000002347 injection Methods 0.000 claims description 19
- 239000007924 injection Substances 0.000 claims description 19
- 238000001746 injection moulding Methods 0.000 claims description 7
- 238000012856 packing Methods 0.000 description 24
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 238000005429 filling process Methods 0.000 description 10
- 230000004044 response Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は射出成形機の射出工程における射出圧
力制御に係り、特にパツキング工程の制御回路お
よびその制御方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to injection pressure control in an injection process of an injection molding machine, and more particularly to a control circuit for a packing process and a control method thereof.
パツキングとは射出成形機の射出工程において
溶融樹脂を金型内に充填する充填工程から金型内
に充填された溶融樹脂が冷却固化に伴いヒケ等が
生じないように所定の圧力に保つ、保持圧力工程
(以下単に保圧工程という)へ切換える極く短い
間に前記金型内へ充填された樹脂を所定の圧力値
まで上昇させ、成形品の転写性を向上させるため
の工程である。 Packing is the filling process in which molten resin is filled into the mold during the injection process of an injection molding machine.The molten resin filled into the mold is maintained at a predetermined pressure to prevent sink marks as it cools and solidifies. This is a process for increasing the resin filled into the mold to a predetermined pressure value in a very short period of time before switching to the pressure process (hereinafter simply referred to as the pressure holding process) to improve the transferability of the molded product.
従来、一般の射出成形機においてはパツキング
工程は直接に制御することはせず充填工程から保
圧工程への切換制御の精度を高めることにより替
えていた。即ち、パツキング状態は成形機の運転
条件を充填から保圧工程へ切換える時点までの金
型内に溶融樹脂が何パーセント満されているかを
示す樹脂充填率と、同時点における射出プランジ
ヤの持つ慣性エネルギーと保圧工程の運転条件と
で決定される前記時点における流動樹脂の慣性エ
ネルギーによつて決定されるものであるから前記
切換時点の射出プランジヤの位置、前記切換時直
前の射出プランジヤの前進速度、保圧の設定値と
この時の射出速度の設定条件等を制御すれば間接
的にパツキングの制御が行われるからである。 Conventionally, in general injection molding machines, the packing process has not been directly controlled, but has been changed by increasing the accuracy of switching control from the filling process to the pressure holding process. In other words, the packing state is determined by the resin filling rate, which indicates the percentage of molten resin in the mold up to the time when the operating conditions of the molding machine are switched from filling to pressure holding process, and the inertial energy possessed by the injection plunger at the same time. Since it is determined by the inertial energy of the fluid resin at the time determined by the operating conditions of the pressure holding process, the position of the injection plunger at the time of switching, the forward speed of the injection plunger immediately before the time of switching, This is because packing can be indirectly controlled by controlling the setting value of the holding pressure and the setting conditions of the injection speed at this time.
しかし、保圧は成形品の重量的な安定等には効
果はあるが、成形品を金型と同じ形状とするいわ
ゆる転写性は劣るため転写性を高め、成形品の外
観の向上をさせるためには従来のように保圧工程
による間接的なパツキング制御では十分でなく、
パツキング工程の直接制御が必要となつてくる。 However, although holding pressure is effective in stabilizing the weight of the molded product, it has poor transferability, which allows the molded product to have the same shape as the mold, so it is necessary to increase the transferability and improve the appearance of the molded product. Indirect packing control using the conventional packing process is not sufficient,
Direct control of the packing process becomes necessary.
パツキング制御は金型キヤビテイ内が溶融樹脂
で充満された後、金型内の溶融樹脂が所定の圧力
まで上昇する間の0.1〜0.5秒程度の極く短い時間
に行う制御のため、パツキング時における圧力は
圧力変化の速い応答と、その作用させる時間の厳
密な制御が必要となる。なぜならパツキングの圧
力を負荷する時間が早すぎると樹脂表面のスキン
層の冷却が不十分となり、バリが発生し、逆に遅
い場合には樹脂粘度が高くなりキヤビテイ未満ま
で十分に圧力が伝達されなくなるからである。 Packing control is a control that is performed in a very short time of about 0.1 to 0.5 seconds, after the mold cavity is filled with molten resin and the molten resin in the mold rises to a predetermined pressure. Pressure requires a fast response to pressure changes and strict control of the time during which it is applied. This is because if the packing pressure is applied too quickly, the skin layer on the resin surface will not be cooled enough and burrs will occur, whereas if it is too slow, the resin viscosity will increase and the pressure will not be sufficiently transmitted below the cavity. It is from.
本発明は前述のような状況に鑑み成されたもの
で従来の充填工程から保圧工程へ切換える極く短
い間のパツキング工程を制御する回路を提供する
ものであり、さらに詳しく説明すると保圧工程を
多段に制御する改良された射出成形機において圧
力変化の応答が十分得られるが高価で油の汚染管
理等に手間のかゝるサーボバルブを使用すること
なく電圧等の電気信号で作動する電磁比例圧力制
御弁を用い圧力を多段に制御する機能を利用し、
充填から保圧へ切換る0.1〜0.5秒程度の時間に高
速、高圧力を印加し、パツキングの制御を行うよ
うにした制御回路装置である。 The present invention was created in view of the above-mentioned situation, and provides a circuit for controlling the packing process during a very short period of time when switching from the conventional filling process to the pressure holding process. In an improved injection molding machine that controls the temperature in multiple stages, it is possible to obtain sufficient response to pressure changes, but without using servo valves that are expensive and require time and effort to control oil contamination. Utilizing the function of controlling pressure in multiple stages using a pressure control valve,
This is a control circuit device that controls packing by applying high speed and high pressure during the 0.1 to 0.5 second period when switching from filling to holding pressure.
次に本発明の1実施例を第1図および第2図に
より充填ストロークS間をa,b,c,dに分割
して充填速度および保圧工程を電磁比例圧力制御
弁を用いて2段階に圧力制御する装置に例を採り
説明すると、1は射出成形機で加熱筒2内にスク
リユ3が嵌挿されており油圧シリンダ4に作用さ
れる圧油により進退し、図示してない油圧モータ
歯車列等の駆動機構を介して回転自在となつてい
る。前記油圧シリンダ4に作用する圧油は配管中
に設けられた電磁比例流量制御弁5によりその流
量が調節される。同弁5は作用される電圧等の電
気信号の大小によりその弁路の開閉を調整するよ
うになつている。 Next, in an embodiment of the present invention, the filling stroke S is divided into a, b, c, and d as shown in FIGS. To explain this using an example of a device that controls pressure, 1 is an injection molding machine in which a screw 3 is inserted into a heating cylinder 2, and is moved forward and backward by pressure oil applied to a hydraulic cylinder 4, and a hydraulic motor (not shown) It is rotatable via a drive mechanism such as a gear train. The flow rate of the pressure oil acting on the hydraulic cylinder 4 is adjusted by an electromagnetic proportional flow control valve 5 provided in the piping. The valve 5 is adapted to adjust the opening and closing of its valve passage depending on the magnitude of an electric signal such as a voltage applied thereto.
6は電磁切換弁で充填圧力および保持圧力を電
圧等の電気信号により設定する電磁比例圧力制御
弁7とパツキング圧力設定用の圧力制御弁8の切
換を行い、前記電磁比例圧力制御弁7を用いた保
圧工程の多段制御装置では圧力変化の応答が十分
でなく、パツキング制御が有効に適用出来る範囲
が限定されるという欠点を補つて、充填工程と保
圧工程の間の極く短い時間だけ、前記電磁弁6に
より応答の悪い電磁比例圧力制御弁7からあらか
じめ後述する圧力設定器に設定してあるパツキン
グ圧力により圧力制御弁8で制御するように電磁
比例圧力制御弁7から圧力制御弁8へ切換えるた
めである。 Reference numeral 6 denotes an electromagnetic switching valve that switches between an electromagnetic proportional pressure control valve 7 that sets the filling pressure and holding pressure using electrical signals such as voltage, and a pressure control valve 8 for setting the packing pressure. The conventional multi-stage control device for the pressure holding process does not have sufficient response to pressure changes, which limits the range to which packing control can be effectively applied. , the electromagnetic proportional pressure control valve 7 to the pressure control valve 8 is controlled by the electromagnetic proportional pressure control valve 8, which has a poor response, by the solenoid valve 6, using the packing pressure set in advance in a pressure setting device, which will be described later. This is to switch to
そして前記電磁切換弁6の作動は後述する充填
圧力および保持圧力等の圧力を設定する圧力設定
器用の信号切換器の発する信号により行われる。
9ないし14は第2図に示すように充填ストロー
クS間の区間a,b,c,dおよびパツキング区
間e、保圧区間fを前記スクリユ3が移動する時
の移動速度V1ないしV6を電気信号として設定す
る速度設定器である。15は比較器で前記各区間
a,b,c,dの境位置S1,S2,S3,S4に設けた
位置信号設定器16ないし19の発する信号と前
記スクリユ3の移動位置を連続的に検出するポテ
ンシヨンメータ20が検出する信号とを比較し、
夫々一致したとき信号切換器21および後述する
タイマに作用する信号を発するものである。前記
信号切換器21は前記比較器15からの信号を受
けて前記電磁比例流量制御弁5を制御する電気信
号を発し、次に比較器15からの信号を受けるま
ではそのまま前記流量制御弁5を制御するように
なつている。例へば位置S1で発せられた信号は、
位置S2の信号が発せられない限りそのまゝ前記制
御弁5を制御し続ける。従つて、スクリユ3の移
動に伴い位置S1ないしS4を通過する毎に信号切換
器21から信号が発せられ、スクリユ3は前記電
磁比例流量制御弁5に設定された流量、即ち移動
速度V1,V2,V3,V4で各区間a,b,c,dを
通過することになる。22ないし26は圧力設定
器で22および23は充填工程中の充填圧力P1,
P2の圧力設定用、24はパツキン工程のパツキン
圧力P3、25および26は保持圧力P4およびP5を
設定する圧力設定器である。27ないし30は最
小設定値が0.1秒未満が設定可能なタイマ等を使
用した時間設定器で夫々前記圧力設定器23ない
し26に設定した圧力P2,P3,P4,P5が作用する
時間T1,T2,T3,T4を規制するもので前記ポテ
ンシヨンメータ20が位置S4を検出したとき比較
器15が発する信号により作動するタイマ31の
発する信号と前記時間設定器27ないし30の発
する信号とを比較器32が比較し、前記時間設定
器27ないし30からの夫々の信号とタイマ31
からの信号が一致したとき、前記比較器32から
信号が発せられ信号切換器33および前記信号切
換器21に作用するようになつている。前記比較
器32からの信号を受けた信号切換器33は前記
電磁比例圧力制御弁7を前記圧力設定器22およ
び23に設定した充填用圧力P1およびP2と、前記
設定器25および26に設定した保持圧力の設定
値P4およびP5により制御するとともに、前記電磁
切換弁6をパツキン工程の間、即ち前記時間設定
器28に設定した時間T2だけ前記圧力制御弁8
がパツキング圧力設定器24に設定した圧力P3で
作動するようになつている。 The operation of the electromagnetic switching valve 6 is performed by a signal generated by a signal switching device for a pressure setting device that sets pressures such as filling pressure and holding pressure, which will be described later.
9 to 14 indicate the moving speeds V 1 to V 6 when the screw 3 moves in the sections a, b, c, d between the filling strokes S, the packing section e, and the pressure holding section f, as shown in FIG . This is a speed setting device that is set as an electrical signal. Reference numeral 15 is a comparator which compares the signals generated by the position signal setters 16 to 19 provided at the boundary positions S 1 , S 2 , S 3 , and S 4 of the sections a, b, c, and d with the moving position of the screw 3. Compare the signal detected by the continuously detected potentiometer 20,
When they match, a signal is generated that acts on the signal switch 21 and a timer, which will be described later. The signal switching device 21 receives the signal from the comparator 15 and issues an electric signal to control the electromagnetic proportional flow control valve 5, and continues to operate the flow control valve 5 until receiving the next signal from the comparator 15. It's starting to be controlled. For example, the signal emitted at position S 1 is
The control valve 5 continues to be controlled as long as the signal at position S2 is not issued. Therefore, each time the screw 3 passes through a position S 1 to S 4 as it moves, a signal is issued from the signal switch 21, and the screw 3 adjusts to the flow rate set in the electromagnetic proportional flow control valve 5, that is, the moving speed V. 1 , V 2 , V 3 , and V 4 to pass through each section a, b, c, and d. 22 to 26 are pressure setting devices, and 22 and 23 are filling pressure P 1 during the filling process,
24 is a pressure setting device for setting the pressure P 2 , 24 is the packing pressure P 3 of the packing process, 25 and 26 are pressure setting devices for setting the holding pressures P 4 and P 5 . 27 to 30 are time setting devices using a timer or the like whose minimum setting value can be set to less than 0.1 seconds, and the pressures P 2 , P 3 , P 4 , and P 5 set in the pressure setting devices 23 to 26 respectively act on them. The timer 31 regulates the times T 1 , T 2 , T 3 , and T 4 and is activated by the signal emitted by the comparator 15 when the potentiometer 20 detects the position S 4 and the time setter 27 A comparator 32 compares the signals emitted by the time setters 27 to 30 with the signals emitted by the timer 31.
When the signals from the comparator 32 match, a signal is generated from the comparator 32 and acts on the signal switch 33 and the signal switch 21. The signal switching device 33 receiving the signal from the comparator 32 switches the electromagnetic proportional pressure control valve 7 to the filling pressures P 1 and P 2 set in the pressure setting devices 22 and 23 and the filling pressures P 1 and P 2 set in the setting devices 25 and 26. The pressure control valve 8 is controlled by the set values P 4 and P 5 of the holding pressure, and the electromagnetic switching valve 6 is operated during the packing process, that is, for the time T 2 set in the time setting device 28.
is operated at a pressure P3 set in the packing pressure setting device 24.
以上説明したような構成となつており、次に作
用動作について第1図および第2図により説明す
ると、スクリユ3は図示してない後退限から第1
図に示す前進限まで充填ストロークSを移動する
にあたり、先づ位置設定器16の設定値に従い区
間aを速度設定器9に設定した移動速度V1で進
む。スクリユ3の移動に伴いポテンシヨンメータ
20が絶えずその位置を検出しているので、スク
リユ3が区間aとbの境位置S2を通過すると、前
記ポテンシヨンメータ20からの信号と速度設定
器17からの信号が一致し比較器15から信号が
発せられた信号切換器21に作用する。前記信号
切換器21は前記信号切換器21からの信号を受
けスクリユ3が区間aの移動速度V1から区間b
用の移動速度V2に切換るよう前記電磁比例流量
制御弁5に信号を送る。このようにしてスクリユ
3は区間a,b,cの順に移動速度V1,V2,V3
で移動して行く。この間充填圧力は圧力設定器2
2に設定した圧力P1となるよう、前記電磁比例圧
力制御弁7が作動する。前記スクリユ3が位置S4
を通過すると比較器15からの信号でタイマ31
が作動し、今までポテンシヨメータ20の検出す
るスクリユ位置によつて制御していた充填工程は
前記タイマ31による時間制御となる。スクリユ
3が位置S1からS4まで移動する間に溶融樹脂は金
型キヤビテイ内に90ないし95%程度満され、区間
dをスクリユ3が移動する間、即ち時間設定器2
8に設定された時間T1の間に圧力設定器23に
設定された圧力P2で100%まで詰め込まれ、前述
の樹脂表面のスキン層が形成され充填工程が完了
する。充填工程の完了と同時に、即ち設定された
時間T1が過ぎると時間設定器28に設定された
パツキング時間、T2の間圧力設定器24に設定
された所定のパツキング圧力P3を負荷されるよう
に前記信号切換器33から発した信号が電磁切換
弁6に作用し、同弁6をA位置とし制力制御弁8
が作動するようにするとともに電磁流量調整弁5
も速度設定器13に設定した値で制御される、こ
の際、応答性を良くするため開度は40%以上にす
るのが好ましい。パツキング工程の時間T2が過
ぎると再び電磁切換弁6はB位置に戻り、その圧
力制御は前記電磁比例圧力制御弁7により、圧力
設定器25および26に設定された保持圧力P4お
よびP5でそれぞれ時間T3およびT4の間制御され
るようになり、パツキングされた溶融樹脂の逆流
を防止しゲートシールされるまで冷却による収縮
を補充する。 The structure is as explained above, and the operation will now be explained with reference to FIGS. 1 and 2. The screw 3 moves from the retraction limit (not shown) to the first
In moving the filling stroke S to the forward limit shown in the figure, first, according to the setting value of the position setting device 16, the section a is moved at the moving speed V 1 set in the speed setting device 9. Since the potentiometer 20 constantly detects the position of the screw 3 as it moves, when the screw 3 passes the boundary position S2 between sections a and b, a signal from the potentiometer 20 and a speed setting device 17 are sent. When the signals from the comparator 15 match, the signal from the comparator 15 acts on the signal switch 21. The signal switching device 21 receives a signal from the signal switching device 21, and the screw 3 changes from the moving speed V 1 of the section a to the section b.
A signal is sent to the electromagnetic proportional flow control valve 5 to switch to the desired moving speed V2 . In this way, the screw 3 changes the moving speed V 1 , V 2 , V 3 in the order of sections a, b, c.
Let's move on. During this time, the filling pressure is set to pressure setting device 2.
The electromagnetic proportional pressure control valve 7 operates so as to achieve the pressure P1 set at P2. The screw 3 is in position S 4
When passing through, the timer 31 is activated by the signal from the comparator 15.
is activated, and the filling process, which was previously controlled by the screw position detected by the potentiometer 20, is now time-controlled by the timer 31. While the screw 3 moves from position S 1 to S 4 , the mold cavity is filled with about 90 to 95% of the molten resin.
During the time T1 set at 8, the resin is packed to 100% at the pressure P2 set in the pressure setting device 23, and the skin layer on the resin surface described above is formed, completing the filling process. Simultaneously with the completion of the filling process, that is, when the set time T1 has passed, a predetermined packing pressure P3 set in the pressure setting device 24 is applied during the packing time T2 set in the time setting device 28. As shown in FIG.
so that the electromagnetic flow control valve 5 is activated.
It is also controlled by the value set in the speed setting device 13. In this case, in order to improve responsiveness, it is preferable to set the opening degree to 40% or more. When the time T 2 of the packing process has passed, the electromagnetic switching valve 6 returns to the B position again, and its pressure is controlled by the electromagnetic proportional pressure control valve 7 at the holding pressures P 4 and P 5 set in the pressure setting devices 25 and 26. for times T 3 and T 4 , respectively, to prevent backflow of the packed molten resin and replenish shrinkage due to cooling until the gate is sealed.
以上説明したような構成および作用効果があり
時間を厳密に制御することによりパツキング工程
の制御が出来るようになつた。また、前記実施例
では充填工程および保圧工程の圧力制御を1個の
電磁比例圧力制御弁で行つたが充填工程、保圧工
程の圧力制御を別々の圧力制御弁を用いて行つて
もよいし、充填工程制御用の圧力制御弁で兼用さ
せてもよい。 With the configuration and effects described above, it has become possible to control the packing process by strictly controlling the time. Further, in the above embodiment, pressure control in the filling process and pressure holding process was performed using one electromagnetic proportional pressure control valve, but pressure control in the filling process and pressure holding process may be performed using separate pressure control valves. However, it may also be used as a pressure control valve for controlling the filling process.
第1図は本発明の1実施例を示す図。第2図は
その説明図で射出工程におけるスクリユの動作、
圧力、時間の関係を示す図。
3……スクリユ、5……電磁比例流量制御弁、
6……電磁切換弁、7……電磁比例圧力制御弁、
8……圧力制御弁、9〜14……速度設定器、1
5,32……比較器、16〜19……位置設定
器、20……ポテンシヨンメータ、21,33…
…信号切換器、22〜26……圧力設定器、27
〜30……時間設定器。
FIG. 1 is a diagram showing one embodiment of the present invention. Figure 2 is an explanatory diagram of the operation of the screw in the injection process.
A diagram showing the relationship between pressure and time. 3... Screw, 5... Solenoid proportional flow control valve,
6... Solenoid switching valve, 7... Solenoid proportional pressure control valve,
8...Pressure control valve, 9-14...Speed setter, 1
5, 32... Comparator, 16-19... Position setter, 20... Potentiometer, 21, 33...
...Signal switch, 22-26...Pressure setting device, 27
~30...Time setting device.
Claims (1)
御を行う制御回路に充填圧力および保持圧力設定
用圧力制御弁とは別に設けた第3の圧力制御弁
と、前記第3の圧力制御弁と前記充填および保持
圧力制御弁とを切換える電磁切換弁と、前記切換
弁の作動時間を決定するための最小設定値が0.1
秒未満を設定可能なタイマを設けたことを特徴と
する射出成形機の射出圧力制御回路。 2 前記第3の圧力制御弁を充填圧力設定用圧力
制御弁で兼用することを特徴とした前記特許請求
範囲第1項記載の射出圧力制御回路。 3 前記充填圧力および保持圧力設定用の圧力制
御弁を電磁比例圧力制御弁としたことを特徴とし
た前記特許請求範囲第1項記載の射出圧力制御回
路。 4 射出工程時に射出プランジヤの圧力制御を行
う制御回路に充填圧力および保持圧力設定用圧力
制御弁とは別に設けた第3の圧力制御弁と、前記
第3の圧力制御弁と前記充填および保持圧力制御
弁とを切換える電磁切換弁と、前記切換弁の作動
時間を決定するための最小設定値が0.1秒未満で
あるタイマを設け、前記電磁切換弁の作動してい
る間は前記射出プランジヤを制御する電磁比例流
量制御弁の開度を40%以上に保つことを特徴とし
た射出成形機の射出圧力制御方法。 5 前記第3の圧力制御弁を充填圧力設定用圧力
制御弁で兼用することを特徴とした前記特許請求
範囲第4項記載の射出圧力制御方法。 6 前記充填圧力および保持圧力設定用の圧力制
御弁を電磁比例圧力制御弁としたことを特徴とし
た前記特許請求範囲第4項記載の射出圧力制御方
法。[Scope of Claims] 1. A third pressure control valve provided separately from the pressure control valve for setting filling pressure and holding pressure in a control circuit that controls pressure in the injection plunger during the injection process, and the third pressure control valve. and the filling and holding pressure control valve, and a minimum set value for determining the operating time of the switching valve is 0.1.
An injection pressure control circuit for an injection molding machine, characterized in that it is provided with a timer that can be set to less than a second. 2. The injection pressure control circuit according to claim 1, wherein the third pressure control valve also serves as a pressure control valve for setting filling pressure. 3. The injection pressure control circuit according to claim 1, wherein the pressure control valve for setting the filling pressure and holding pressure is an electromagnetic proportional pressure control valve. 4. A third pressure control valve provided separately from the pressure control valve for setting the filling pressure and holding pressure in a control circuit that controls the pressure of the injection plunger during the injection process, and the third pressure control valve and the filling and holding pressure. an electromagnetic switching valve for switching between the control valve and a timer having a minimum setting value of less than 0.1 seconds for determining the operation time of the switching valve, and controlling the injection plunger while the electromagnetic switching valve is operating. An injection pressure control method for an injection molding machine characterized by maintaining the opening degree of an electromagnetic proportional flow control valve at 40% or more. 5. The injection pressure control method according to claim 4, wherein the third pressure control valve is also used as a pressure control valve for setting filling pressure. 6. The injection pressure control method according to claim 4, wherein the pressure control valve for setting the filling pressure and holding pressure is an electromagnetic proportional pressure control valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6021380A JPS56157335A (en) | 1980-05-07 | 1980-05-07 | Control circuit for injection pressure of injection molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6021380A JPS56157335A (en) | 1980-05-07 | 1980-05-07 | Control circuit for injection pressure of injection molding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56157335A JPS56157335A (en) | 1981-12-04 |
| JPS6153938B2 true JPS6153938B2 (en) | 1986-11-20 |
Family
ID=13135643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6021380A Granted JPS56157335A (en) | 1980-05-07 | 1980-05-07 | Control circuit for injection pressure of injection molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56157335A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01129440A (en) * | 1987-11-14 | 1989-05-22 | Fujitsu Ltd | Semiconductor device |
-
1980
- 1980-05-07 JP JP6021380A patent/JPS56157335A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01129440A (en) * | 1987-11-14 | 1989-05-22 | Fujitsu Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56157335A (en) | 1981-12-04 |
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