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JPS6154113B2 - - Google Patents
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JPS6154113B2 - - Google Patents

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Publication number
JPS6154113B2
JPS6154113B2 JP12893081A JP12893081A JPS6154113B2 JP S6154113 B2 JPS6154113 B2 JP S6154113B2 JP 12893081 A JP12893081 A JP 12893081A JP 12893081 A JP12893081 A JP 12893081A JP S6154113 B2 JPS6154113 B2 JP S6154113B2
Authority
JP
Japan
Prior art keywords
boron
substrate
temperature
depositing
amorphous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12893081A
Other languages
Japanese (ja)
Other versions
JPS5832013A (en
Inventor
Masaki Aoki
Shigeru Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56128930A priority Critical patent/JPS5832013A/en
Publication of JPS5832013A publication Critical patent/JPS5832013A/en
Publication of JPS6154113B2 publication Critical patent/JPS6154113B2/ja
Granted legal-status Critical Current

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  • Chemical Vapour Deposition (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は、硼素構造材の製造方法に関するもの
で、硼素構造材を構成する硼素の膜質や機械的性
質の向上および硼素構造材のコストダウンを目的
とするものである。 硼素(B)はダイヤモンドに次ぐ硬度を持ち、かつ
その耐摩耗性も非常に大きいものであるため、切
削工具や摺動機械部品、軸受けなどに有用な材料
である。また、比弾性率(弾性率/密度)が現在
知られている物質中では最大という優れた特徴を
もつている。この性質は、音波の伝播速度が既存
の物質中で最大であることを意味し、音響材料と
して特に有用である。 硼素応用製品を鋳造や圧延といつた方法を用い
て緻密な塊の状態で得ることは困難であり、この
ため、硼素応用製品の製作にあたつては、ほとん
どの場合、硼素以外の材料からなる基体上に蒸着
法やスパツタリング法、化学蒸着法(CVD法)
などによつて、ホウ素被膜を形成した複合体とし
て用いられている。 このような従来の方法は、ホウ素の硬さやその
優れた耐摩耗性を利用しようとする製品の場合に
は、大きな支障を生じることがない。ところが、
比弾性率の大きさを利用するスピーカーの振動板
や、カートリツジのカンチレバー等の音響材料あ
るいは、ビデオデイスクのカンチレバー等ではき
わめて重大な支障となる。すなわち、複合体の密
度や弾性率は基体の性質に大きく左右され、硼素
本来の性質がそれによつて大きく減殺されるから
である。 また、上記した方法以外に、タンタル(Ta)、
ニオブ(Nb)、モリブデン(Mo)、タングステン
(W)等の線(0.2〜0.4mmφ)に硼素をCVD法に
より蒸着させ、その後これらの芯線を溶解除去し
て硼素単体を得ることが可能となつているが、振
動板やビデオデイスクのカンチレバー等の大きな
形状のものをこれらの芯線や基体で歩留り良く作
成するのは、基体との熱膨張の違いや、蒸着され
た硼素の内部応力のため困難であつた。特にMo
やW等の安価な芯材で硼素単体の大きな構造材を
歩留り良く作成するのは困難であつた。 本発明はかかる従来の欠点を除去するためにな
されたものであり、クロムで被覆されたW基体上
に減圧化学蒸着法(LP−CVD法)により硼素を
析出させ、その後熱処理によりW基体表面に
CrB2、WB2、W2B5の少くとも1つからなる結晶
層を形成し、この上に硼素層を析出させることに
より、機械的強度があり、しかも歩留りの良い硼
素構造材を提供できるようにしたものである。 以下、本発明の製造方法について具体的に説明
する。 硼素をLP−CVD法により、基体上に形成する
方法は、たとえば減圧にされた反応器内におかれ
た基体を、赤外線加熱、高周波加熱、通電等によ
り加熱し、次式に示すごとき還元分解反応により
硼素を析出させる。 2BX3+3H2→2B+6HX (ただし、XはCl、Br、I等のハロゲン元素) CVD法に使用する原料ガスとしては、BX3の他
に硼素の水素化物等がある。また、この硼素析出
反応においては、加熱温度、減圧状態、ガス圧、
反応器への原料ガスの流入量等により種々の結晶
形態が得られる。特に減圧状態では、上記の反応
は700℃〜1000℃でアモルフアス状態の硼素が、
1000℃〜1300℃でβ−ロンボヘドラル硼素が得ら
れる。特に、常圧のCVD法にくらべて、LP−
CVD法は低温でアモルフアス硼素やβ−ロンボ
ヘドラル硼素が析出されるため、基体と蒸着硼素
との間の熱的ひずみが少なく有利である。 LP−CVD法を用いてW基体上にアモルフアス
硼素を析出させる際の温度は700〜800℃が適当で
あり、700℃より低い温度では析出速度が非常に
遅く、パウダー状で析出するため、この後熱処理
によつてCrB2、WB2、W2B5を作成するのが困難
であり、800℃を越える温度では基体(W)とア
モルフアス硼素との間にひずみが入りやすい。ま
た、これらのアモルフアス硼素を熱処理によつて
拡散させて、CrB2、WB2、W2B5の少くとも1つ
からなる結晶層を形成する際の温度としては、
850〜1250℃が適当であり、850℃より低い温度で
は、CrB2、WB2、W2B5が生成しにくく、1250℃
を越える温度では熱的なひずみを生じやすい。ま
たWの硼化物として、WB2、W2B5あるいは、こ
れらの混合物の結晶に限定したのは、これらの結
晶系がW2B、WBにくらべて硼素に近い熱膨張係
数を持つており、したがつて、硼素膜にひずみが
生じにくいためである。またWB4では、硼素と
WB4間の結合力が強くなりすぎて、エツチングし
にくくなる欠点を有している。CrB2、WB2
W2B5の少くとも1つからなる結晶層の厚さは20
〜200μmが良く、20μmより薄くなると、硼素
層とW基体の熱ひずみを緩和することができず、
また200μmより厚くなると基体自身がもろくな
り保形性が保ちにくい。またW基体にCrを被覆
するのは、硼素とWB2あるいはW2B5との密着性
を弱め、化学的あるいは機械的に基体を除去しや
すくするためである。この場合、Crは硼素と反
応してCrB2となり、硼素とWB2あるいはW2B5
の間の密着性を弱める働きをし、そのためエツチ
ング歩留りが向上するという効果がある。なお
Crの膜厚は数μm程度であることが望ましい。
次いでこの硼化物上に硼素を蒸着法、CVD法等
を用いて析出させ、しかるのち化学的あるいは機
械的に基体を除去し、硼素単体から成る構造材を
得る。 以下、本発明の一実施例について説明する。直
径2.0mm、長さ100cmのW線を準備し、脱脂、洗浄
ののち、スパツタリング法で約1ミクロン厚の
Crを被覆した。次にCVD炉の中にこの線をお
き、ロータリーポンプで炉内の空気を排除し、通
電により700℃に加熱した。次に三塩化硼素
(BCl3)1容量部と、水素(H2)3容量部を毎分
2の割合で4分間流した。この時、減圧状態は
100Torrになるようにロータリーポンプとバルブ
でコントロールした。その後BCl3ガスのみを止
め、850℃にて熱処理を3分間行ない、アモルフ
アス硼素を拡散させ20μm厚のWB2とした(X線
解析の結果)。次いで、再びBCl3ガスを流し、基
体芯線を1000℃に保ち、6分間ガスを流した。こ
れによりWB3上にアモルフアス硼素が50μm析出
した。このようにして作つた試料を4cmの長さに
切断して、Brとメタノールの混合液に浸漬さ
せ、WおよびWB2を溶解させた。 次に梁の長さを3.5cmとし、両端支持梁の形で
荷重を加えて、パイプが破壊した時の荷重より平
均強度を求めた。その結果、切断したサンプル20
本中17本が良品で、その平均強度は1.85Kgであつ
た。この結果を次表の試料No.1に示す。 以下、各条件を変え、実施例と同様にして硼素
構造材を得た。その結果を次表に示す。ただし試
料番号No.10〜No.15は比較例である。また、す
べての試料は、内径および外径がそれぞれ2.0
mm、2.1mmと一定の値になるように(肉厚が50μ
mで一定)硼素の析出量をコントロールした。
The present invention relates to a method for manufacturing a boron structural material, and aims to improve the film quality and mechanical properties of boron constituting the boron structural material and to reduce the cost of the boron structural material. Boron (B) has a hardness second only to diamond and has extremely high wear resistance, so it is a useful material for cutting tools, sliding machine parts, bearings, etc. It also has the excellent characteristic of having the highest specific elastic modulus (elastic modulus/density) among currently known materials. This property means that the propagation velocity of sound waves is the highest among existing materials, making it particularly useful as an acoustic material. It is difficult to obtain boron-applied products in the form of dense blocks using methods such as casting or rolling, and for this reason, in most cases, boron-applied products are manufactured from materials other than boron. Vapor deposition method, sputtering method, chemical vapor deposition method (CVD method) on the substrate
It is used as a composite with a boron coating formed by et al. Such conventional methods do not pose any major problems in the case of products that take advantage of the hardness of boron and its excellent wear resistance. However,
This is a very serious problem in acoustic materials such as speaker diaphragms, cartridge cantilevers, and video disk cantilevers that utilize a high specific elastic modulus. In other words, the density and elastic modulus of the composite are greatly influenced by the properties of the substrate, and the inherent properties of boron are thereby greatly reduced. In addition to the above methods, tantalum (Ta),
It has become possible to deposit boron on wires (0.2 to 0.4 mmφ) of niobium (Nb), molybdenum (Mo), tungsten (W), etc. using the CVD method, and then dissolve and remove these core wires to obtain simple boron. However, it is difficult to produce large shapes such as diaphragms and video disc cantilevers with a good yield using these core wires and substrates due to the difference in thermal expansion with the substrate and the internal stress of the deposited boron. It was hot. Especially Mo
It has been difficult to produce a large structural material made of simple boron with a good yield using an inexpensive core material such as or W. The present invention has been made to eliminate such conventional drawbacks, and involves depositing boron on a W substrate coated with chromium by low pressure chemical vapor deposition (LP-CVD method), and then depositing boron on the surface of the W substrate by heat treatment.
By forming a crystal layer consisting of at least one of CrB 2 , WB 2 , and W 2 B 5 and depositing a boron layer on top of this, a boron structural material with mechanical strength and high yield can be provided. This is how it was done. The manufacturing method of the present invention will be specifically explained below. To form boron on a substrate by the LP-CVD method, for example, the substrate is placed in a reduced pressure reactor and heated by infrared heating, high frequency heating, energization, etc., and reductive decomposition as shown in the following formula is performed. Boron is precipitated by the reaction. 2 B _ In addition, in this boron precipitation reaction, heating temperature, reduced pressure state, gas pressure,
Various crystal forms can be obtained depending on the amount of raw material gas flowing into the reactor. In particular, under reduced pressure, the above reaction occurs when boron in an amorphous state at 700°C to 1000°C
β-rombohedral boron is obtained at 1000°C to 1300°C. In particular, compared to the normal pressure CVD method, LP−
Since amorphous boron and β-rombohedral boron are precipitated at a low temperature, the CVD method is advantageous because there is little thermal strain between the substrate and the deposited boron. The appropriate temperature for depositing amorphous boron on a W substrate using the LP-CVD method is 700 to 800°C. At temperatures lower than 700°C, the precipitation rate is very slow and the precipitation is in the form of a powder. It is difficult to produce CrB 2 , WB 2 , and W 2 B 5 by post-heat treatment, and strain tends to occur between the substrate (W) and amorphous boron at temperatures exceeding 800°C. In addition, the temperature at which amorphous boron is diffused by heat treatment to form a crystal layer consisting of at least one of CrB 2 , WB 2 , and W 2 B 5 is as follows:
A temperature of 850 to 1250℃ is suitable; at temperatures lower than 850℃, CrB 2 , WB 2 , and W 2 B 5 are difficult to generate;
Temperatures exceeding this temperature tend to cause thermal distortion. In addition, we limited the W boride to crystals of WB 2 , W 2 B 5 or a mixture thereof because these crystal systems have a coefficient of thermal expansion closer to that of boron than W 2 B or WB. , Therefore, strain is less likely to occur in the boron film. Also in WB 4 , boron and
This has the disadvantage that the bonding force between WB 4 becomes too strong, making etching difficult. CrB2 , WB2 ,
The thickness of the crystal layer consisting of at least one of W 2 B 5 is 20
~200 μm is good; if it is thinner than 20 μm, it will not be possible to alleviate the thermal strain of the boron layer and W substrate,
Furthermore, if the thickness exceeds 200 μm, the substrate itself becomes brittle and has difficulty maintaining its shape. Further, the reason why the W substrate is coated with Cr is to weaken the adhesion between boron and WB 2 or W 2 B 5 and to make it easier to remove the substrate chemically or mechanically. In this case, Cr reacts with boron to form CrB 2 , which serves to weaken the adhesion between boron and WB 2 or W 2 B 5 , which has the effect of improving the etching yield. In addition
The thickness of the Cr film is preferably about several μm.
Next, boron is deposited on this boride using a vapor deposition method, a CVD method, etc., and then the substrate is removed chemically or mechanically to obtain a structural material made of simple boron. An embodiment of the present invention will be described below. Prepare a W wire with a diameter of 2.0 mm and a length of 100 cm, and after degreasing and cleaning, use the sputtering method to create a wire with a thickness of about 1 micron.
Coated with Cr. Next, this wire was placed in a CVD furnace, the air inside the furnace was removed using a rotary pump, and the wire was heated to 700°C by electricity. Next, 1 volume part of boron trichloride (BCl 3 ) and 3 volume parts of hydrogen (H 2 ) were flowed at a rate of 2 per minute for 4 minutes. At this time, the decompression state is
It was controlled with a rotary pump and valve to achieve 100Torr. Thereafter, only the BCl 3 gas was stopped, and heat treatment was performed at 850° C. for 3 minutes to diffuse amorphous boron and form WB 2 with a thickness of 20 μm (results of X-ray analysis). Next, BCl 3 gas was flowed again, the base core wire was kept at 1000° C., and the gas was flowed for 6 minutes. As a result, 50 μm of amorphous boron was deposited on WB 3 . The thus prepared sample was cut into a length of 4 cm and immersed in a mixed solution of Br and methanol to dissolve W and WB 2 . Next, the length of the beam was set to 3.5cm, and a load was applied to the beam with both ends supported, and the average strength was determined from the load when the pipe broke. As a result, the cut sample 20
Seventeen of the books were of good quality, and their average strength was 1.85 kg. The results are shown in sample No. 1 in the following table. Hereinafter, boron structural materials were obtained in the same manner as in the examples, with different conditions. The results are shown in the table below. However, sample numbers No. 10 to No. 15 are comparative examples. In addition, all samples have an inner diameter and an outer diameter of 2.0
mm, so that it is a constant value of 2.1 mm (thickness is 50μ
(constant at m) The amount of boron precipitation was controlled.

【表】 表から明らかなように、本発明の範囲内の試料
は抗折強度が大きく、歩留りも良く、音響材料と
して極めて優れた特性を有している。 以上説明した如く、本発明の製造方法は、W基
体上にLP−CVD法によりアモルフアス硼素を析
出させ、その後熱処理によりこれを拡散させて
CrB2、WB2、W2B5を生成させ、更に基体上に硼
素を析出させ、その後基体を除去して硼素単体を
得るようにしたものであり、このような本発明の
方法は、従来の方法と比較して高強度の硼素構造
材を歩留り良く、しかも安価に得ることができる
ため、その産業上の価置は大きいものである。
[Table] As is clear from the table, the samples within the scope of the present invention have high bending strength, good yield, and have extremely excellent characteristics as acoustic materials. As explained above, the manufacturing method of the present invention involves depositing amorphous boron on a W substrate by the LP-CVD method, and then diffusing it by heat treatment.
CrB 2 , WB 2 , W 2 B 5 are generated, boron is further precipitated on a substrate, and the substrate is then removed to obtain simple boron. This method of the present invention is different from conventional methods. Compared to the above method, high-strength boron structural materials can be obtained at a higher yield and at a lower cost, so its industrial value is high.

Claims (1)

【特許請求の範囲】[Claims] 1 クロムを被覆したタングステン基体を700〜
800℃の温度に保ち、この基体上に減圧化学蒸着
法を用いてアモルフアス硼素を析出させる第1の
工程と、前記アモルフアス硼素を析出させた基体
を850℃〜1250℃の温度で熱処理することによ
り、前記基体表面にCrB2、WB2、W2B5の少くと
も1つからなる結晶層を20〜200μmの厚さに形
成する第2の工程と、前記結晶層上に硼素を析出
させる第3の工程と、前記基体を化学的手段もし
くは機械的手段により除去する第4の工程を経て
製造することを特徴とする硼素構造材の製造方
法。
1 Tungsten substrate coated with chromium 700 ~
A first step of depositing amorphous boron on the substrate using a reduced pressure chemical vapor deposition method while maintaining the temperature at 800°C, and heat treating the substrate on which the amorphous boron has been deposited at a temperature of 850°C to 1250°C. , a second step of forming a crystal layer of at least one of CrB 2 , WB 2 , and W 2 B 5 to a thickness of 20 to 200 μm on the surface of the substrate; and a second step of depositing boron on the crystal layer. 3. A method for producing a boron structural material, characterized in that the material is produced through step 3 and a fourth step of removing the substrate by chemical means or mechanical means.
JP56128930A 1981-08-18 1981-08-18 Preparation of boron structural material Granted JPS5832013A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56128930A JPS5832013A (en) 1981-08-18 1981-08-18 Preparation of boron structural material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56128930A JPS5832013A (en) 1981-08-18 1981-08-18 Preparation of boron structural material

Publications (2)

Publication Number Publication Date
JPS5832013A JPS5832013A (en) 1983-02-24
JPS6154113B2 true JPS6154113B2 (en) 1986-11-20

Family

ID=14996907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56128930A Granted JPS5832013A (en) 1981-08-18 1981-08-18 Preparation of boron structural material

Country Status (1)

Country Link
JP (1) JPS5832013A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4683266B2 (en) * 2004-11-25 2011-05-18 三菱マテリアル株式会社 Cutting tool made of surface-coated cemented carbide that exhibits excellent wear resistance in high-speed cutting of heat-resistant alloys.

Also Published As

Publication number Publication date
JPS5832013A (en) 1983-02-24

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