JPS6154224B2 - - Google Patents
Info
- Publication number
- JPS6154224B2 JPS6154224B2 JP2360680A JP2360680A JPS6154224B2 JP S6154224 B2 JPS6154224 B2 JP S6154224B2 JP 2360680 A JP2360680 A JP 2360680A JP 2360680 A JP2360680 A JP 2360680A JP S6154224 B2 JPS6154224 B2 JP S6154224B2
- Authority
- JP
- Japan
- Prior art keywords
- silicone
- image
- substrate
- layer
- silicone layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001296 polysiloxane Polymers 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 35
- 238000007639 printing Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 25
- 239000002904 solvent Substances 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920002050 silicone resin Polymers 0.000 claims description 5
- 230000008961 swelling Effects 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 40
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- -1 polypropylene Polymers 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 229920002379 silicone rubber Polymers 0.000 description 15
- 239000004945 silicone rubber Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 14
- 238000001723 curing Methods 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000004743 Polypropylene Substances 0.000 description 8
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 206010040844 Skin exfoliation Diseases 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000005453 ketone based solvent Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000004447 silicone coating Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- QYAMPIKBANGIEM-UHFFFAOYSA-N chloroethene;hydrochloride Chemical compound Cl.ClC=C QYAMPIKBANGIEM-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013005 condensation curing Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- QGEOKXWFGANCJL-UHFFFAOYSA-N ethenyl acetate;hydrochloride Chemical compound Cl.CC(=O)OC=C QGEOKXWFGANCJL-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- NMJKIRUDPFBRHW-UHFFFAOYSA-N titanium Chemical compound [Ti].[Ti] NMJKIRUDPFBRHW-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000010887 waste solvent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
【発明の詳細な説明】
本発明は、湿し水を必要としない平版印刷用刷
版の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a lithographic printing plate that does not require dampening water.
平版印刷においては、凸版または凹版のように
版面に明瞭な高低がなく、外見上同じ平面上に画
線と非画線とを設けた版が使用されるが、この印
刷法はつぎの工程で行われる。すなわち、これに
はまず水と脂肪とが互に反発することから、前記
非画線部を化学的あるいは機械的処理によつて親
水性にすると共に、前記画線部を脂肪性樹脂の転
写または写真焼付けなどによつて親油性とし、つ
いでこの版面に水を転移させて水を親水性である
非画線部のみに付着させてから、さらにこの版面
にインキを転移する。このようにすると、このイ
ンキは水が存在している非画線部には付着せずに
親油性である画線部にのみ付着するので、つぎに
これを被印刷物に転移させて、目的の印刷物を得
るという工程によつて行われている。 In lithographic printing, a plate is used that does not have clear heights on the plate surface like letterpress or intaglio printing, and has printed lines and non-printed lines on the same plane in appearance, but this printing method is carried out in the following process. be exposed. That is, first of all, water and fat repel each other, so the non-image areas are made hydrophilic by chemical or mechanical treatment, and the image areas are made hydrophilic by transfer of fatty resin or The printing plate is made lipophilic by photographic printing or the like, and then water is transferred to this printing plate so that the water adheres only to the hydrophilic non-image areas, and then ink is further transferred to this printing plate. In this way, this ink does not adhere to the non-print areas where water is present, but only to the lipophilic print areas, and is then transferred to the printing substrate to achieve the desired effect. This is done through the process of obtaining printed matter.
しかし、この平版印刷法には、たとえば上記し
た湿し水のインキローラーへの転移がインキロー
ラー上でのインキの乳化を引き起すため、地よご
れなどの原因となるほか、この湿し水の被印刷物
への転移は、被印刷物の寸法変化の原因ともなる
ので、特に多色刷り印刷においては印刷画像が不
鮮明になるという大きな欠点がある。また、この
平版印刷法においては、色調の一定な印刷物を得
るために、湿し水の量とインキの量とを一定のつ
り合いに保つことが必要とされているが、この両
者の量を一定のつり合いに保つことは非常に困難
であり、したがつて印刷物の色調にばらつきが生
じるという欠点があつた。 However, with this lithographic printing method, for example, the transfer of the dampening water to the ink roller causes the ink to emulsify on the ink roller, which may cause soiling, and also cause the dampening water to be covered. Transfer to printed matter also causes a change in the dimensions of the printed material, which has a major drawback, especially in multicolor printing, in that the printed image becomes unclear. In addition, in this lithographic printing method, in order to obtain printed matter with a constant color tone, it is necessary to maintain a constant balance between the amount of dampening water and the amount of ink. It is very difficult to maintain this balance, which has the disadvantage of causing variations in the color tone of printed matter.
このため、上記した不利を改良する目的におい
て、湿し水を必要としない平版印刷版の開発が試
みられているが、現在までに知られているものは
いずれもいまだ実用に耐える充分満足すべき性質
を示すには至つていない。 For this reason, attempts have been made to develop lithographic printing plates that do not require dampening water in order to improve the above-mentioned disadvantages, but none of the plates known to date are still sufficiently satisfactory for practical use. It has not yet been possible to demonstrate its properties.
たとえば、アルミニウム板などの基板上に、ジ
アゾ型感光性組成物よりなるジアゾ感光層とジメ
チルポリシロキサンゴム層とを形成させ、ついで
この上にさらにポジフイルムを重ね合せてから露
光することによつて露光部分のジアゾ感光層を不
溶化させ、非露光部分のジアゾ感光層を現像処理
により除去し、ついで非露光部分のジメチルポリ
シロキサンゴム層を剥ぎ取るという方法(特公昭
44−23042号公報参照)あるいはアルミニウム板
などの基板上に、ジアゾ感光層と接着剤層とシリ
コーンゴム層を順次形成させ、ついでこの上にネ
ガフイルムを重ね合せてから露光し、露光部分に
おける感光層の光分解を利用して現像し、ついで
露光部分のシリコーンゴム層を剥ぎ取るという方
法で平版印刷用刷版を得る方法(特公昭46−
16044号公報参照)が公知とされている。しか
し、これらの方法はいずれもジアゾ感光層とポジ
またはネガフイルムとの間に非感光性のシリコー
ンゴムが存在するため、これにはポジまたはネガ
フイルムに現わされているパターンが正確に再現
されず、また、シリコーンと感光層の接着が充分
でなく、現像および印刷中にシリコーンが欠落し
易いという重大な欠点があり、これにはまたその
製造が基板上に2〜3層を順次重ね、露光後、現
像するという工程で行われるため、操作が複雑で
あるという不利がある。 For example, a diazo photosensitive layer made of a diazo type photosensitive composition and a dimethylpolysiloxane rubber layer are formed on a substrate such as an aluminum plate, and then a positive film is further laminated thereon and then exposed. A method of insolubilizing the diazo photosensitive layer in the exposed areas, removing the diazo photosensitive layer in the non-exposed areas by development treatment, and then peeling off the dimethylpolysiloxane rubber layer in the non-exposed areas (Tokuko Sho)
44-23042) or on a substrate such as an aluminum plate, a diazo photosensitive layer, an adhesive layer, and a silicone rubber layer are sequentially formed, and then a negative film is superimposed thereon and exposed, and the exposed areas are exposed to light. A method of obtaining a lithographic printing plate by developing the layer using photolysis and then peeling off the silicone rubber layer in the exposed area (Special Publication No. 1973-
16044) is known. However, in all of these methods, a non-photosensitive silicone rubber exists between the diazo photosensitive layer and the positive or negative film, so it is difficult to accurately reproduce the pattern appearing on the positive or negative film. Moreover, there is a serious drawback that the adhesion between the silicone and the photosensitive layer is not sufficient, and the silicone is easily lost during development and printing. Since the process is performed after exposure and development, there is a disadvantage that the operation is complicated.
さらにこの方式では製版にあたつてこの方式特
有の設備が必要とされるほか、高度な製版技術が
要求されるという問題がある。 Furthermore, this method requires equipment unique to this method for plate making, and also requires advanced plate making technology.
以上の点を改良したものとして従来のPS版か
ら作製した平版を用いて乾式平版化する方法(特
公昭44−23042号および特公昭47−32906号参照)
が知られているが、これはシリコーン塗膜を形成
する方式として溶液またはエマルジヨンを用いて
コーテイングするという手段を採用しているの
で、実際上コーターが新たに必要であること、ま
たシリコーン溶液に触媒を添加しておくと経時的
にゲル化が進むため、コーテイング直前に触媒を
添加するという繁雑な方式を取る必要が生じるこ
と、さらに触媒を使用しない一液型シリコーンを
用いた場合には、経済的には2液タイプのものよ
り安定であるが、シリコーンの硬化に長時間を要
するため製版サイクルが長くなるなど製造上の欠
点がある。 As an improvement on the above points, there is a method of dry lithography using a lithographic plate made from a conventional PS plate (see Japanese Patent Publication No. 44-23042 and Japanese Patent Publication No. 47-32906).
However, since this method uses a solution or emulsion coating method to form a silicone coating, it actually requires a new coater, and also requires a catalyst in the silicone solution. If a one-component silicone without a catalyst is used, gelation will progress over time, making it necessary to add a catalyst just before coating. Although it is more stable than the two-component type, it has manufacturing disadvantages such as a longer plate-making cycle because it takes a long time for the silicone to harden.
また、この方式では二液または一液タイプのシ
リコーンを塗布後、十分硬化するまでの間、未硬
化のシリコーンは表面が軟かく粘着性を有するた
め、ゴミ等が付着しやすくその様なゴミまたはゴ
ミの付着した跡にできる凹凸はシリコーンが硬化
した後、インキ受容性となり、地汚れ、ピンホー
ルの原因となるという重大な欠点を有する。 In addition, with this method, after applying the two-component or one-component type silicone, until it is sufficiently cured, the surface of the uncured silicone is soft and sticky, so it is easy for dust to adhere to it. After the silicone hardens, the unevenness formed by the dirt residue becomes ink receptive, which has the serious disadvantage of causing background smudges and pinholes.
本発明者らは、かかる欠点を解決すべく、平版
印刷用刷版に関して鋭意研究した結果、経時的に
も安定でシリコーン層を簡易に形成することがで
き、かつ使用するシリコーンの設計および選択を
容易に行える平版印刷用刷版の製造方法に関する
発明を完成した。 In order to solve these drawbacks, the present inventors have conducted intensive research on printing plates for lithographic printing, and have found that they are stable over time, can easily form a silicone layer, and that they can design and select the silicone to be used. We have completed an invention related to an easy method for manufacturing printing plates for lithographic printing.
すなわち、本発明は少なくともその表面がイン
キ受容性の基板上に溶剤に可溶性ないしは膨潤性
の画線を形成し、ついで該画線を含む面に、あら
かじめ支持体上に塗布形成した未硬化状態の光硬
化型以外の硬化型シリコーン樹脂層の面を圧着し
た後、該シリコーンを硬化させ、ついで支持体を
剥離することにより硬化シリコーン層を基板上に
転写形成し、さらに溶剤で画線を溶解ないしは膨
潤させた後、その画線および画線上のシリコーン
層を除去することにより基板上にその基板の露出
面からなる画線部と硬化シリコーン層からなる非
画線部とを形成することおよび上記方法において
圧着直前に硬化剤を未硬化シリコーン層に付着浸
透させることを特徴とするものである。 That is, in the present invention, a solvent-soluble or swellable image is formed on a substrate whose surface is at least ink receptive, and then an uncured image that has been previously coated on a support is applied to the surface containing the image. After pressing the surface of a curable silicone resin layer other than a photocurable type, the silicone is cured, and then the support is peeled off to form a cured silicone layer on the substrate, and the image line is dissolved or removed with a solvent. After swelling, the image line and the silicone layer on the image line are removed to form an image area consisting of the exposed surface of the substrate and a non-image area consisting of the cured silicone layer on the substrate, and the above method. The method is characterized in that a curing agent is allowed to adhere to and penetrate into the uncured silicone layer immediately before compression bonding.
以下、本発明を詳細に説明する。 The present invention will be explained in detail below.
まず、本発明の構成を図面に基づいて説明する
と、第1図に示すように基板1の一方の面に溶剤
に可溶性ないしは膨潤性の画線2を形成する。こ
の画線を形成する方法としては溶剤に可溶性もし
くは膨潤性の物質をパターン化する方法であれば
よく、たとえばPS版、ワイプオン版、フオトレ
ジストを所定の方法で刷版し画線を形成する方
法、さらにはマーキングペン等を用いて文字その
他の像を画く方法などいずれでもよい。 First, the structure of the present invention will be explained based on the drawings. As shown in FIG. 1, a solvent-soluble or swellable object line 2 is formed on one surface of a substrate 1. The method for forming these lines may be any method of patterning a substance that is soluble or swellable in a solvent; for example, printing a PS plate, wipe-on plate, or photoresist using a predetermined method to form the lines. Alternatively, any method such as drawing characters or other images using a marking pen or the like may be used.
基板1の材質は耐溶剤性でかつ少なくともその
表面がインキが容易に付着する親油性のものであ
ればよく、たとえばアルミニウム、鉄、銅、亜
鉛、ステンレスなどの金属、またはそれらの積層
板、およびポリエステル、ポリプロピレンなどの
プラスチツクフイルムが好適とされる。これらは
溶剤に耐えるほか印刷用基板に要求される伸びの
少ない寸法安定性および表面平滑性にすぐれたも
のがよい。 The material of the substrate 1 may be any material as long as it is solvent-resistant and has at least a lipophilic surface to which ink can easily adhere, such as metals such as aluminum, iron, copper, zinc, and stainless steel, or laminates thereof; Plastic films such as polyester and polypropylene are preferred. These should not only be resistant to solvents but also have excellent dimensional stability with little elongation and surface smoothness required for printing substrates.
つぎに、上記のようにして画線を形成した面
に、第2図に示すようにして、あらかじめ支持体
3上に塗布形成した未硬化のシリコーン層4の面
を圧着(ラミネート)する。この圧着は未硬化の
シリコーン層が基板1の非画線部分のすべてに気
泡等が含まれることなく完全に密着するように充
分な圧力でラミネートする必要があり、このラミ
ネートの方法としては基板の画線部が形成されて
いる面に、未硬化のシリコーン層の面を貼合せ上
からロールで圧着するという方法によつてもよい
が、より能率的に行なうには貼合せロール、ある
いはカレンダーロールを使用するのが有利であ
る。 Next, as shown in FIG. 2, the surface of the uncured silicone layer 4 previously coated on the support 3 is pressure-bonded (laminated) onto the surface on which the image line has been formed as described above. This pressure bonding requires laminating with sufficient pressure so that the uncured silicone layer completely adheres to all the non-image areas of the substrate 1 without containing any air bubbles. You can also use a method of laminating the surface of the uncured silicone layer to the surface on which the image area is formed and pressing it with a roll from above, but a more efficient method is to use a laminating roll or a calendar roll. It is advantageous to use
シリコーン樹脂は、支持体3に塗布する前に、
硬化剤が必要な場合、あらかじめこれを添加して
おくか、または硬化剤を添加せずに支持体3の上
に塗布し、乾燥させ、圧着前に硬化剤を該シリコ
ーン層に付着浸透させる方法のいずれかを採れば
よい。硬化剤をシリコーン層に付着浸透させるに
は、シリコーン中に硬化剤が浸透するならいずれ
の方法でも良いが効果的に行なうには、硬化剤を
そのままで、あるいは適当な溶剤で希釈してシリ
コーン面に噴霧すればよく、この方法の利点はシ
リコーン層の基板側から触媒を浸透させるため、
硬化後のシリコーン層と基板の接着が向上するこ
とである。 Before applying the silicone resin to the support 3,
If a curing agent is required, it can be added in advance, or it can be coated on the support 3 without adding a curing agent, dried, and the curing agent can adhere to and penetrate into the silicone layer before pressing. You can choose either one. To adhere and penetrate the hardening agent into the silicone layer, any method may be used as long as the hardening agent penetrates into the silicone, but to do this effectively, apply the hardening agent as it is or dilute it with an appropriate solvent and apply it to the silicone surface. The advantage of this method is that the catalyst penetrates from the substrate side of the silicone layer.
This improves the adhesion between the cured silicone layer and the substrate.
本発明で使用するシリコーン樹脂は硬化後に撥
油性もしくはインキ付着力の低いものであること
が好ましく、光硬化型以外の熱硬化型、室温硬化
型などが用いられる。たとえば、ジメチルシリコ
ーン生ゴム、メチルフエニルシリコーン生ゴム、
メチルフエニルビニルシリコーン生ゴムなどの加
熱加硫型のシリコーンゴム;SiOH,SiOR,
SiH,SiCH=CH2のような反応基をもつシロキサ
ンどうしを触媒で架橋させることによりゴム弾性
体となる2液型常温加硫型のシリコーンゴム;縮
合硬化型で空気中の水分と反応して硬化するシリ
コーンゴムで一液型常温加硫型シリコーンゴムと
して一般に知られるもの;シリコーンワニスなど
が使用できる。 The silicone resin used in the present invention is preferably one having low oil repellency or ink adhesion after curing, and a thermosetting type other than a photocuring type, a room temperature curing type, etc. are used. For example, dimethyl silicone raw rubber, methylphenyl silicone raw rubber,
Heat-vulcanized silicone rubber such as methylphenyl vinyl silicone raw rubber; SiOH, SiOR,
A two-component cold-curable silicone rubber that becomes a rubber elastic material by crosslinking siloxanes with reactive groups such as SiH, SiCH=CH 2 with a catalyst; a condensation-curing type silicone rubber that reacts with moisture in the air. Silicone rubber that cures and is generally known as one-component room-temperature vulcanizable silicone rubber; silicone varnish, etc. can be used.
加熱硬化型のシリコーンゴムは放射線によつて
も加硫できるが、硬化剤として有機過酸化物、脂
肪酸アゾ化合物、いおうなどが用いられ、もつと
も一般的なのは有機過酸化物を用いる方法である
二液型常温加硫型の硬化剤としては、縮合反応に
より常温で加熱硬化するタイプでは有機金属酸
塩、有機アミン、第4級アンモニウムあるいはホ
スホニウム化合物などの酸性、塩基性物質の縮合
触媒を使用する。不飽和基とSiHとの間の付加重
合によつて加硫硬化するタイプではパラジウムや
白金などの触媒を硬化剤として使用する。また、
一液型常温加硫型シリコーンゴムおよびシリコー
ンワニスは硬化剤なしで硬化できる。 Heat-curable silicone rubber can also be vulcanized by radiation, but organic peroxides, fatty acid azo compounds, sulfur, etc. are used as curing agents, and the most common method is a two-component method using organic peroxides. As a curing agent of the room temperature vulcanization type, a condensation catalyst of an acidic or basic substance such as an organometallic acid salt, an organic amine, a quaternary ammonium, or a phosphonium compound is used for a type that heats and cures at room temperature by a condensation reaction. Types that cure by vulcanization through addition polymerization between unsaturated groups and SiH use a catalyst such as palladium or platinum as a curing agent. Also,
One-component cold-curable silicone rubber and silicone varnish can be cured without a curing agent.
支持体3の上にシリコーン層4を形成するに
は、シリコーンを必要に応じ適当な溶剤と混合し
て塗布しやすい粘度に調整し、これをはけ塗り、
回転塗布、ロツドコーテイング、ロールコーテイ
ングなどの方法により該支持体4上に塗布し溶剤
を揮散させればよく、この際のシリコーン層の厚
さはおおむね2〜30μmとすればよい。 To form the silicone layer 4 on the support 3, silicone is mixed with an appropriate solvent as necessary to adjust the viscosity to be easy to coat, and this is applied by brushing.
The silicone layer may be coated on the support 4 by a method such as spin coating, rod coating, or roll coating and the solvent may be evaporated, and the thickness of the silicone layer at this time may be approximately 2 to 30 μm.
なお、上記目的で使用される溶剤としては、メ
チルエチルケトン、メチルイソブチルケトンなど
のケトン系溶剤、ベンゼン、トルエン、キシレン
などの芳香族炭化水素系溶剤、トリクロロエチレ
ン、テトラクロロエチレンなどのハロゲン系炭化
水素系溶剤、イソプロパノール、オクタノールな
どのアルコール系溶剤などが例示される。 Solvents used for the above purpose include ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, aromatic hydrocarbon solvents such as benzene, toluene, and xylene, halogen hydrocarbon solvents such as trichlorethylene and tetrachloroethylene, and isopropanol. , alcoholic solvents such as octanol, and the like.
支持体3の材質は、使用するシリコーン樹脂の
硬化温度、反応機構を考慮して選択すれば良く、
硬化後のシリコーン表面が平滑になる様に、支持
体表面も平滑でなければならない。さらにシリコ
ーンを硬化させた後においてはこれが支持体3か
ら容易に剥離されることが要求され、たとえばポ
リエチレン、ポリプロピレンなどのポリオレフイ
ンからなるフイルム、酢酸セルロース、三酢酸セ
ルロース、ポリビニルアルコール、ポリメタクリ
レート、ポリアミド、ポリスチレン、ポリ塩化ビ
ニル、ポリ塩化ビニル酢酸ビニル、ポリ塩化ビニ
リデン塩化ビニル、ポリエチレンテレフタレー
ト、ポリ塩化ビニリデン、ポリフツ化エチレン、
アクリル樹脂、ポリカーボネートなどのフイルム
ないしシートなどが用いられ、さらに金属箔、お
よびそれらの積層物、金属板などを界面活性剤等
により剥離処理して使用してもよい。 The material of the support 3 may be selected in consideration of the curing temperature and reaction mechanism of the silicone resin used.
The support surface must also be smooth so that the silicone surface is smooth after curing. Furthermore, after the silicone is cured, it is required that it be easily peeled off from the support 3, such as films made of polyolefins such as polyethylene and polypropylene, cellulose acetate, cellulose triacetate, polyvinyl alcohol, polymethacrylate, polyamide, etc. Polystyrene, polyvinyl chloride, polyvinyl chloride vinyl acetate, polyvinylidene chloride vinyl chloride, polyethylene terephthalate, polyvinylidene chloride, polyethylene fluoride,
Films or sheets made of acrylic resin, polycarbonate, etc. are used, and metal foils, laminates thereof, metal plates, etc. may also be used after being subjected to a peeling treatment with a surfactant or the like.
第2図のようにして圧着が完了すると、未硬化
のシリコーンは画線2および非画線部すなわち基
板1の面に密着する。つぎに、加熱等の処理ある
いは室温放置によりシリコーンを硬化させる。シ
リコーンは硬化と同時に、基板1に固着するよう
になる。この固着をより強固にするためには基板
1の面がプライマー処理されていることが好まし
く、この場合のプライマーとしては、ビニルトリ
ス(2−メトキシエトキシ)シラン、3−グリシ
ドオキシプロピルトリメトキシシラン、3−メタ
クリルオキシプロピルトリメトキシシラン、N−
(トリメトキシシリルプロピル)エチレンジアミ
ン、3−アミノプロピルトリエトキシシランなど
の単独またはこれらの混合物、さらにはこれらの
部分加水分解物または部分共加水分解物などが例
示され、これらはたとえば回転塗布、ロツドコー
テイング、はけ塗り、スプレー塗りなどの常用の
方法により塗布を行えばよい。 When the pressure bonding is completed as shown in FIG. 2, the uncured silicone adheres closely to the image line 2 and the non-image area, that is, the surface of the substrate 1. Next, the silicone is cured by treatment such as heating or by being left at room temperature. The silicone becomes fixed to the substrate 1 at the same time as it cures. In order to make this adhesion stronger, it is preferable that the surface of the substrate 1 is treated with a primer. In this case, the primers include vinyltris(2-methoxyethoxy)silane, 3-glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, N-
Examples include (trimethoxysilylpropyl)ethylenediamine, 3-aminopropyltriethoxysilane, etc. alone or mixtures thereof, as well as partial hydrolysates or cohydrolysates thereof, and these can be coated by spin coating, rod coating, etc. Application may be carried out by conventional methods such as coating, brushing, spraying, etc.
このようにしてシリコンを硬化させたのちに、
第3図に示すように、支持体3を基板1から引き
はがす。この際シリコーンの硬化層は基板1に強
固に接着しており、該引きはがしによつてシリコ
ーン層の硬化層は基板1側に転移する。つぎにシ
リコーン面上に溶剤を注ぎ、シリコーンを通して
溶剤により画線を溶解ないしは膨潤させた後、該
画線および該画線上のシリコーンを除去する。第
4図は画線2′の溶解ないしは膨潤により該画線
上のシリコーンが盛り上つている状態を示す。こ
の状態では軟かい布、紙、スポンジ、ゴムなどで
簡単にシリコーンを剥ぎとることができる。ここ
で使用する溶剤は、画線を溶解ないしは膨潤する
ものであればよく、メチルエチルケトン
(MEK)、アセトン等のケトン系、トルエン、キ
シレン等の芳香族系、またはそれらの混合溶剤が
使用される。 After curing the silicone in this way,
As shown in FIG. 3, the support 3 is peeled off from the substrate 1. At this time, the cured silicone layer is firmly adhered to the substrate 1, and the peeling transfers the cured silicone layer to the substrate 1 side. Next, a solvent is poured onto the silicone surface to dissolve or swell the image through the silicone, and then the image and the silicone on the image are removed. FIG. 4 shows a state in which the silicone on the image line 2' bulges due to dissolution or swelling of the image line 2'. In this state, the silicone can be easily removed with a soft cloth, paper, sponge, rubber, etc. The solvent used here may be any solvent as long as it dissolves or swells the image, and ketone solvents such as methyl ethyl ketone (MEK) and acetone, aromatic solvents such as toluene and xylene, or mixed solvents thereof are used.
第5図は上記の方法により得た平版印刷版を示
し、基板の露出した部分が画線部となる。 FIG. 5 shows a lithographic printing plate obtained by the above method, and the exposed portion of the substrate becomes the image area.
第6図は画線部にインキ5を付着させた様子を
示す。 FIG. 6 shows how the ink 5 is applied to the image area.
以上の説明で明らかなように、本発明はあらか
じめ支持体に塗布されたシリコーン層を基板とラ
ミネートし、硬化、転写するため、基板に硬化シ
リコーン層を形成する工程では、シリコーンのコ
ーテイングに伴なう溶液管理、廃溶剤等の管理が
不要となるばかりでなく、シリコーン塗膜の硬化
反応中、塗膜表面が支持体で保護されているため
ゴミ付き等が防止され良好な塗膜表面が得られる
というすぐれた利点を有する。 As is clear from the above description, in the present invention, a silicone layer coated on a support in advance is laminated with a substrate, cured, and transferred. Not only does it eliminate the need to manage cleaning solutions and waste solvents, but the coating surface is protected by a support during the curing reaction of the silicone coating, which prevents dust from sticking and provides a good coating surface. It has the excellent advantage of being able to
さらに硬化剤を圧着直前に付着、浸透させる方
法においては圧着前のシリコーン層には硬化剤が
含まれないため経時的に安定なシリコーン層を形
成できると同時に、支持体上に塗布された状態で
シリコーンを保管することも可能となるというす
ぐれた利点を有する。 Furthermore, in the method in which a hardening agent is applied and permeated immediately before pressure bonding, the silicone layer before pressure bonding does not contain a hardening agent, so it is possible to form a silicone layer that is stable over time, and at the same time, it is possible to form a silicone layer that is stable over time. It also has the great advantage of being able to store silicone.
つぎに本発明の実施例をあげる。 Next, examples of the present invention will be given.
実施例 1
信越化学工業製の剥離紙用縮合タイプシリコー
ンゴムKS705Fを触媒を加えずに厚さ12μmのポ
リプロピレンフイルム上に乾燥塗膜が15μmにな
るように塗布した。一方、アルミ板上にポジタイ
プのジアゾ感光層を有するプレセンシタイズド版
DP−100(東京応化工業製商品名)を刷版して、
画線を形成し、プライマーとしてKBP41(信越
化学工業製商品名)を乾燥塗膜が厚さ0.5μm程
度になるように塗布した。Example 1 A condensation type silicone rubber KS705F for release paper manufactured by Shin-Etsu Chemical Co., Ltd. was coated on a polypropylene film having a thickness of 12 μm without adding a catalyst so that the dry coating film was 15 μm. On the other hand, a presensitized plate has a positive type diazo photosensitive layer on an aluminum plate.
Print DP-100 (trade name manufactured by Tokyo Ohka Kogyo),
Stretch lines were formed, and KBP41 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied as a primer so that the dry coating film had a thickness of about 0.5 μm.
次に上記塗膜を設けたポリプロピレンフイルム
の塗膜面にMEKで5倍に希釈した触媒を噴霧し
シリコーン層に触媒を付着・浸透させ、前記アル
ミ板の画線を有する面にこの塗膜面が合うように
加圧ラミネートした。このように加圧ラミネート
したものを100℃に加熱しシリコーンを硬化させ
た後、アルミ板とポリプロピレンフイルムとを剥
離したところ、アルミ板上へ硬化したシリコーン
ゴムが転移し、アルミ板と接着していた。 Next, a catalyst diluted 5 times with MEK is sprayed onto the coated surface of the polypropylene film provided with the above coating film, so that the catalyst adheres and penetrates into the silicone layer, and the coated surface is applied to the surface of the aluminum plate having the image lines. I pressure laminated it so that it would fit. After heating the pressure laminated product to 100℃ to harden the silicone, the aluminum plate and polypropylene film were peeled off, and the cured silicone rubber transferred onto the aluminum plate, causing it to adhere to the aluminum plate. Ta.
つぎに、このアルミ板の表面をMEKに充分に
ひたし画線を溶解させた後、軟かな布で軽くシリ
コーン表面をこすつて画線上のシリコーン層を除
去した。 Next, the surface of this aluminum plate was sufficiently soaked in MEK to dissolve the image, and then the silicone layer on the image was removed by lightly rubbing the silicone surface with a soft cloth.
このアルミ板を平版印刷用刷版としてKOR印
刷機を使用し、湿し水を供給せずに印刷したとこ
ろ、10000枚の鮮明な印刷物を得た。 When this aluminum plate was used as a lithographic printing plate on a KOR printing machine and printed without supplying dampening water, 10,000 clear prints were obtained.
実施例 2
信越化学工業製剥離紙用付加タイプシリコーン
ゴムKS774を使用したほかは実施例1と同様の工
程で製造し、印刷を行なつたところ、結果は実施
例1とほぼ同様であつた。Example 2 Printing was carried out in the same manner as in Example 1 except that the additive type silicone rubber KS774 manufactured by Shin-Etsu Chemical Co., Ltd. was used, and the results were almost the same as in Example 1.
実施例 3
KE77
(信越化学工業製商品名,シリコーンゴム)
100重量部
KF99
( 〃 ,シリコーンオイル)
10重量部
PL−3
( 〃 触 媒) 0.5重量部
上記組成物をポリプロピレンフイルム上に乾燥
塗膜が15μmになるように塗布した。このものは
25℃で1日間放置しても硬化しなかつた。Example 3 KE77 (trade name manufactured by Shin-Etsu Chemical, silicone rubber)
100 parts by weight KF99 (〃, silicone oil)
10 parts by weight PL-3 (Catalyst) 0.5 parts by weight The above composition was applied onto a polypropylene film so that the dry film thickness was 15 μm. This thing is
It did not harden even after being left at 25°C for one day.
一方、アルミ板上にポジタイプのジアゾ感光層
を有するプレセンシタイズド版DP−100(東京応
化工業製商品名)を刷版して、画線を形成し、プ
ライマーとして
γ−クリシドキシプロピルトリメトキシシラン
50重量部
チタンチトラブトキシド 50重量部
を乾燥塗膜が厚さ0.5μm程度になるように塗布
し、この面に上記塗膜を設けたポリプロピレンフ
イルムをその塗膜面が合うように加圧ラミネート
した。このように加圧ラミネートしたものを150
℃に加熱すると30分後にはシリコーンが硬化して
いた。次にアルミ板とポリプロピレンフイルムを
剥離したところ、アルミ板上へ硬化したシリコー
ンゴムが転移しアルミ板と接着していた。 On the other hand, a presensitized plate DP-100 (trade name, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a positive type diazo photosensitive layer was printed on an aluminum plate to form an image, and γ-chrysidoxypropyl trifluoride was used as a primer. methoxysilane
50 parts by weight of titanium titanium trabutoxide was applied so that the dry coating film had a thickness of approximately 0.5 μm, and a polypropylene film with the above coating film on this surface was laminated under pressure so that the coating surfaces matched. . 150 pieces of pressure laminated material like this
When heated to ℃, the silicone was cured after 30 minutes. Next, when the aluminum plate and polypropylene film were peeled off, the cured silicone rubber had transferred onto the aluminum plate and adhered to the aluminum plate.
つぎにこのアルミ板の表面をMEKに充分にひ
たし画線を溶解させた後、軟かな布で軽くシリコ
ーン表面をこすつて画線上のシリコーン層を除去
した。 Next, the surface of this aluminum plate was sufficiently soaked in MEK to dissolve the image lines, and then the silicone layer on the image lines was removed by lightly rubbing the silicone surface with a soft cloth.
このアルミ板を平版印刷用刷版としてKOR印
刷機を使用し、湿し水を供給せずに印刷したとこ
ろ、10000枚の鮮明な印刷物を得た。 When this aluminum plate was used as a lithographic printing plate on a KOR printing machine and printed without supplying dampening water, 10,000 clear prints were obtained.
第1図から第4図は、本発明の方法によつて平
版印刷用刷版を製造する工程を説明するための概
略断面図を、また、第5図はこれによつて得られ
た平版印刷用刷版の概略断面図を、第6図は本印
刷版の画線部にインキを付着させた場合の概略断
面図をそれぞれ例示したものである。
1……基板、2……溶剤に可溶性ないしは溶剤
膨潤性物質からなる画線、3……支持体、4……
未硬化の硬化型シリコーン層、4……硬化したシ
リコーン層、2′……溶剤により溶解ないしは膨
潤した画線、5……インキ。
1 to 4 are schematic cross-sectional views for explaining the process of manufacturing a lithographic printing plate by the method of the present invention, and FIG. 5 is a lithographic printing plate obtained by this method. FIG. 6 is a schematic cross-sectional view of the printing plate, and FIG. 6 is a schematic cross-sectional view of the main printing plate with ink attached to the image area. DESCRIPTION OF SYMBOLS 1...Substrate, 2...A streak made of a solvent-soluble or solvent-swellable substance, 3...Support, 4...
Uncured curable silicone layer, 4... Cured silicone layer, 2'... Image dissolved or swollen by solvent, 5... Ink.
Claims (1)
に溶剤に可溶性ないしは膨潤性の画線を形成し、
ついで該画線を含む面に、あらかじめ支持体上に
塗布形成した未硬化状態の光硬化型以外の硬化型
シリコーン樹脂層の面を圧着した後該シリコーン
層を硬化させ、ついで支持体を剥離し、さらに溶
剤で該画線を溶解ないしは膨潤させた後、その画
線および画線上のシリコーン層を除去することに
より、基板上にその基板の露出面からなる画線部
と硬化シリコーン層からなる非画線部とを形成す
ることを特徴とする平版印刷用刷版の製造方法。 2 圧着直前に硬化剤を未硬化シリコーン層に付
着浸透させる特許請求の範囲第1項記載の方法。[Claims] 1. Forming a solvent-soluble or swellable streak on a substrate whose surface is at least ink receptive;
Next, the surface of an uncured non-photocurable silicone resin layer coated on the support in advance is pressed onto the surface containing the image, and the silicone layer is cured, and then the support is peeled off. Further, by dissolving or swelling the image with a solvent and removing the image and the silicone layer on the image, an image area consisting of the exposed surface of the substrate and a non-containing silicone layer consisting of the cured silicone layer are formed on the substrate. 1. A method for producing a lithographic printing plate, the method comprising forming an image area. 2. The method according to claim 1, wherein a curing agent is allowed to adhere to and penetrate into the uncured silicone layer immediately before compression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2360680A JPS56121038A (en) | 1980-02-27 | 1980-02-27 | Manufacture of lithographic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2360680A JPS56121038A (en) | 1980-02-27 | 1980-02-27 | Manufacture of lithographic plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56121038A JPS56121038A (en) | 1981-09-22 |
| JPS6154224B2 true JPS6154224B2 (en) | 1986-11-21 |
Family
ID=12115262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2360680A Granted JPS56121038A (en) | 1980-02-27 | 1980-02-27 | Manufacture of lithographic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56121038A (en) |
-
1980
- 1980-02-27 JP JP2360680A patent/JPS56121038A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56121038A (en) | 1981-09-22 |
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