JPS6154588B2 - - Google Patents
Info
- Publication number
- JPS6154588B2 JPS6154588B2 JP22523782A JP22523782A JPS6154588B2 JP S6154588 B2 JPS6154588 B2 JP S6154588B2 JP 22523782 A JP22523782 A JP 22523782A JP 22523782 A JP22523782 A JP 22523782A JP S6154588 B2 JPS6154588 B2 JP S6154588B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- decorative
- inorganic
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 8
- 230000002265 prevention Effects 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 5
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 description 9
- 239000000123 paper Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 5
- 238000004049 embossing Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000012634 fragment Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000012779 reinforcing material Substances 0.000 description 4
- 239000004575 stone Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910021532 Calcite Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 241000287219 Serinus canaria Species 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- -1 acrylic ester Chemical class 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002557 mineral fiber Substances 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
発明の技術分野
本発明は、タイル板、壁板等の建築の内装、外
装に好適に使用される不燃性無機質化粧板に関す
る。
先行技術
建築の内、外装用の化粧板としては、従来より
安価で、軽量で、加工の容易な有機質のプラスチ
ツク基材を用いたものが広く用いられて来たが、
このようなものは燃え易く、しかも燃焼時に有毒
ガスを発生するなどの問題点があつた。
このため、近年に至つては、燃えにくい無機質
基材を用いた化粧板が不燃性無機質化粧板として
開発され使用されるようになつて来ている。
この種の不燃性化粧板としては、一般に、水酸
化アルミニウムを主たる骨材とした基材に化粧面
を施した化粧層を熱圧一体成型したものが知られ
ているが、このような水酸化アルミニウムを主た
る骨材としたものは、水酸化アルミニウムが周囲
の温度が300〜550℃になるとその結晶水を放出し
て燃焼の抑制作用を行うことから不燃性に優れた
ものとなつている。
しかし、その反面、水酸化アルミニウムは有機
質プラスチツクに比べると高価であり、耐衝撃性
でも劣り、強い衝撃を受けて基板が破損した時に
はその破片が飛散するため安全性にも劣る等の欠
点があり、これらの方面からも改善が強く望まれ
ているのが現状である。
発明の要約
本発明はかかる要望に応えるべく本発明者らが
鋭意検討を重ねた結果開発されたものであり、そ
の要旨とすべき構成上の特徴は、20〜35%(重量
比、以下同様)の水酸化アルミニウムAl2O3・
3H2Oに3〜9%の難燃性の熱硬化性樹脂結合剤
を含んで、60〜70%の無機質充填剤及び0.5〜5
%の補助材を加えて板状に成型硬化された無機質
基板と、この基材の表面に積層された樹脂遮蔽
層、その上のパターン層及び表面樹脂層とより成
る化粧層と、紙質素材に熱硬化性樹脂を含浸させ
て成るバツカー層を上記基材の表面に配して熱圧
により成型一体とすると共に、上記基板の内部か
若しくは上記基板の上、下の少なくともいずれか
の面に2〜15メツシユの繊維質ネツト素材により
形成された飛散防止層を介層させて多層構造の板
状に形成した点にある。
発明の効果
しかして、本発明の不燃性無機質化粧板の特徴
と利点は次のようなものである。
(1) すなわち、本発明に於いては、無機質基板中
の比較的高価な水酸化アルミニウムの分量を20
〜35%(重量比、以下%は重量比を示す)に抑
える一方、珪素、ゼオライト等の安価な無機質
充填剤を60〜70%、ガラス繊維などの補強材を
0.5〜5%加えることにより材料コストの大幅
な低減が可能になつた。
(2) また、水酸化アルミニウムの分量を極力抑え
ることによつて生じた機械的強度の低下は、上
記した無機質充填剤、補強材の他に基板の裏面
に紙質素材に熱硬化性樹脂を含浸させたバツカ
ー層を層着すると共に、上記した基板の内部若
しくは該基板の上、下の少なくともいずれかの
面に2〜15メツシユの繊維質ネツト素材よりな
る飛散防止層を介層させたことによつてこれを
補うことが出来た。
(3) 更に上記したバツカー層は、機械的強度を補
強する他に化粧板の温度上昇時に於ける反り返
りを防止し、その結果熱変形に強い化粧板を実
現した。
(4) さらにまた、上記した飛散防止層は、機械的
強度の補完の他に破損時に破片が飛び散ること
のない安全な化粧板を得ることを可能にした。
このように、本発明の無機質化粧板によれば、
材料費の大幅な軽減の他、不燃性の保持、熱変形
の防止、破損時の安全性という多方面から改善さ
れた建築用の化粧板を得ることが可能となつた。
また、本発明は、上記した他にも化粧板全体の
耐久性、耐水性、機械的強度、耐薬品性、軽量
性、加工性、施工性にも優れており、エンボス加
工による立体的な意匠が表現でき広く建築用内
装、外装材或いは家具類の化粧板にも適用される
ものである。
発明の詳細な構成
以下に、本発明化粧板の構成材料を詳述する。
〔1〕 無機質基板材料の調整
無機質基板を構成する各々の材料は、次のよう
な特徴を有しており、以下に示すもののなかから
適宜採択される。
水酸化アルミニウム
固形紛末のものが採用され、成型温度200℃以
下では熱変化しないが周囲温度が300〜550℃とな
ると結晶水を放出して燃焼の抑制作用を行ない同
時に耐熱材としてのAIOとなるため基板に不燃性
を与える。また、基板の主たる構成材料となり機
械的強度材ともなる。基材が不燃性を有するため
には25%以上が好ましい。
無機質充填剤
成型物(化粧板)の機械的強度の向上とコスト
の低減の為に、また補助結合剤として更には成型
時の流動性付与、増量の為に用いられる。
前者の目的では、珪砂、方解石紛、珪酸カルシ
ウム等の無機質の紛末が、後者の目的ではゼオラ
イト、カオリン、ベントナイト、酸化白土等の粘
土類が採用される。
これら無機質充填剤の使用量は70%以下であ
り、70%を超えると不燃性が損なわれるため、好
ましくは60〜70%である。
補強材
成型物(化粧板)の機械的強度を更に改善する
ために鉱物質繊維(石綿等)、無機繊維(ガラス
繊維、セラミツクス繊維)、金属繊維(鉄繊維、
アルミ繊維、ウイスカース繊維)、天然繊維(木
綿、麻綿)、合成化学繊維(ビニロン、ナイロ
ン、テトロン等)の中から選ばれた繊維チヨツプ
を0.5〜5%程度、好ましくは約1.0%程度加え
る。
熱硬化性樹脂結合剤
上記した基板の材料相互に成型流動性を与えて
互いに結合させるもので、熱圧によつて硬化する
ことが必要であり、一般にはフエノールホルマリ
ン縮合物及びその誘導体、ユリヤ、メラミン−ホ
ルマリン縮合物及びその誘導体、フラン−ホルマ
リン縮合物及びその誘導体、ポリジフエニルオキ
シド樹脂等の樹脂とその誘導体が採用され、好ま
しい使用量は5〜6.0%とする。
しかし、3%以下となると結合力は不足し逆に
8%を超えると仮にAl2O3・3H2Oの量を大として
も不燃材とはなりにくい。
〔2〕 化粧層
この化粧層は、上記した基板の上面に更に次の
ような層を積層させることによつて形成される。
表面樹脂層及びパターン層用部材
この部材としては更に次の2種のものがある。
(1) 表面樹脂層を透明乃至半透明とし樹脂層とは
別個にパターン層を設ける場合。
この場合は、通常の熱硬化性樹脂化粧板のオ
ーバレヤーとして用いられるもの、即ちセルロ
ーズ、パルブ製の紙、布(不織布を含む)にユ
リヤ、メラミン、チアリルフタレート、アクリ
ル酸やメタアクリル酸エステル及びその誘導体
樹脂等の透明乃至半透明の熱硬化性樹脂液を含
浸乾燥させたものを表面樹脂層用部材とし、同
上の熱硬化性樹脂液を含浸乾燥させたパターン
紙布をパターン層部材として、この表面樹脂層
用部材の下側に配置するか、或いは後述する遮
蔽層の表面にプリントによつてパターンを形成
したものをパターン層部材とするか或いは又ア
ルミ箔、銅箔等の薄い金属箔(0.3mm程度のも
のが望まれる)そのもの或いはこの金属箔に例
えば陽極酸化処理によつて着色被膜(0.1mm以
下)を施した金属箔を上記遮蔽層の表面に合成
樹脂接着剤を用いて全体的若しくは部分的に貼
合する。
(2) 表面樹脂層とパターン層部材とを共用するこ
とも考えられる。この場合(1)のオーバレイヤー
として用いられるセルローズパルプ製の紙、布
それ自体の表面に直接プリントによりパターン
層を形成すればよい。
遮蔽層部材
遮蔽層は熱圧成型の際、前掲の結合剤が化粧層
(前記表面樹脂層とパターン層とで構成される
層)側に滲出してシミ、汚れ、パターンの欠損等
を与えることのないように、基板と化粧層との間
に設けられるもので、例えば前記表面樹脂層部材
に用いられるのと同様の熱硬化性樹脂液又は例え
ば酢酸ビニル、塩化ビニル、アクリル酸エステル
エマルジヨンのような熱硬化性樹脂液を通常の遮
蔽紙又は布に含浸乾燥せしめた樹脂処理遮蔽紙等
が用いられる。
〔3〕 バツカー層
熱硬化性樹脂を予め含浸させたクラフト紙、和
紙、板紙等が用いられる。
化粧板の機械的強度の補強と加熱時の反り返り
を防止するために使用される。
このバツカー層を形成する素材は予め凹凸面を
形成したものでもよく、また熱圧により化粧板を
一体成型する時にエンボス加工により凹凸部を形
成してもよい。
〔4〕 飛散防止層
化粧板の破損時に破片が飛び散るのを防止する
ため補強材の代わりに或いは補強材と共に基板の
内部に又は基板の上、下の少なくともいずれか一
方の面の上に介層される。
2〜15メツシユの無機、有機繊維ネツト等のネ
ツト状物が好ましい。
製造方法
次に本発明化粧板の製造方法について概説する
と、基板材料を秤量してコニーダ、ヘンシエルミ
キサ等で混合し、かくして得られた混合物を金型
内に入れ、この際金型底部に遮蔽層用及び表面樹
脂層用の各部材及びパターン層部材を所定の位置
関係に配置しその上から基板材料を充填し、更に
バツカー層を被せてから金型を閉じてホツトプレ
スにより熱圧一体成型してその後仕上げ、検査を
して製品となす。
本発明で適用する成型条件は温度200℃以下、
圧力100〜150Kg/cm2数分間の熱圧を行う。プレス
手段はエンボスプレス板若しくは金型を備えた従
来公知の直圧式プレスを用いれば良い。
また、化粧層の上にマスキングをするために天
然石(寒水砕石、蛇絞砕石、カナリヤ、美濃黒
等)の紛砕石をアクリル酸エステル類、メタクリ
ル酸エステル類及びこれらと共重合した樹脂、エ
チレン−酢酸ビニルエマルジヨン樹脂等と共に混
合したものを、吹き付き若しくは塗布によつて化
粧層上に定着して表面に砕石による凹凸を施し模
様を強調してもよい。
発明の実施例
最後に、本発明の代表的な実施例を挙げる。
〈実施例 1〉
本例は、第1図に示すように内部に飛散防止層
4を介層させた基板1の上面には三層構造の化粧
層2を載せ、下面にはバツカー層3を配してこれ
ら三者を熱圧一体成型して成るもので、化粧層2
は更に上方より順に表面樹脂層21、パターン面
を形成するパターン層22、樹脂遮蔽層23より
構成されている。
本例によるものは、不燃性で、且つ加工性にも
優れており、破損時にも破片が飛び散るようなこ
ともなく、しかも温度上昇時においても反り返り
を生じるようなことはなかつた。
このような本例の化粧板Aの各層を形成する
各々の材料構成は以下の通りである。
TECHNICAL FIELD OF THE INVENTION The present invention relates to a noncombustible inorganic decorative board suitably used for the interior and exterior of buildings such as tile boards and wall boards. PRIOR ART Conventionally, organic plastic base materials have been widely used as decorative laminates for the interior and exterior of buildings, as they are inexpensive, lightweight, and easy to process.
Such materials had problems such as being easily flammable and emitting toxic gas when burned. Therefore, in recent years, decorative laminates using inflammable inorganic base materials have been developed and used as nonflammable inorganic decorative laminates. This type of noncombustible decorative board is generally known to be one in which a decorative layer with a decorative surface is integrally molded by heat and pressure on a base material whose main aggregate is aluminum hydroxide. Products that use aluminum as the main aggregate have excellent nonflammability because aluminum hydroxide releases its crystal water when the surrounding temperature reaches 300 to 550°C, suppressing combustion. However, on the other hand, aluminum hydroxide is more expensive than organic plastics, has inferior impact resistance, and is less safe because if the board is damaged by a strong impact, fragments will scatter. The current situation is that improvements are strongly desired in these areas as well. Summary of the Invention The present invention was developed as a result of intensive studies by the present inventors in order to meet such demands. ) of aluminum hydroxide Al 2 O 3 .
3H2O containing 3-9% flame retardant thermosetting resin binder, 60-70% mineral filler and 0.5-5
% of an auxiliary material and hardened into a plate shape, a resin shielding layer laminated on the surface of this base material, a decorative layer consisting of a pattern layer and a surface resin layer thereon, and a paper material A backer layer impregnated with a thermosetting resin is disposed on the surface of the base material and integrally molded by heat pressure, and a backer layer is formed inside the base material or on at least one of the upper and lower surfaces of the base material. The point is that it is formed into a multilayered plate shape by interposing an anti-scattering layer made of a fibrous net material with ~15 meshes. Effects of the Invention The features and advantages of the nonflammable inorganic decorative board of the present invention are as follows. (1) That is, in the present invention, the amount of relatively expensive aluminum hydroxide in the inorganic substrate is reduced to 20%.
While suppressing the amount to ~35% (weight ratio, below % indicates weight ratio), use 60-70% of cheap inorganic fillers such as silicon and zeolite, and reinforcing materials such as glass fiber.
Adding 0.5 to 5% made it possible to significantly reduce material costs. (2) In addition to the above-mentioned inorganic fillers and reinforcing materials, the reduction in mechanical strength caused by minimizing the amount of aluminum hydroxide can be reduced by impregnating paper material with thermosetting resin on the back side of the substrate. In addition to layering the backer layer, a scattering prevention layer made of a fibrous net material of 2 to 15 meshes is interposed on the inside of the substrate or on at least one of the upper and lower surfaces of the substrate. I was able to compensate for this. (3) Furthermore, the above-mentioned backer layer not only reinforces the mechanical strength but also prevents the decorative board from warping when the temperature rises, thereby realizing a decorative board that is resistant to thermal deformation. (4) Furthermore, the above-mentioned anti-scattering layer not only complements the mechanical strength but also makes it possible to obtain a safe decorative board that will not scatter fragments when broken. Thus, according to the inorganic decorative board of the present invention,
In addition to a significant reduction in material costs, it has become possible to obtain architectural decorative laminates that are improved in many aspects: non-combustibility, prevention of thermal deformation, and safety in the event of damage. In addition to the above, the present invention also has excellent durability, water resistance, mechanical strength, chemical resistance, lightness, workability, and workability of the decorative board as a whole, and has a three-dimensional design by embossing. It can be widely applied to architectural interiors, exterior materials, and decorative laminates for furniture. Detailed Structure of the Invention The constituent materials of the decorative board of the present invention will be described in detail below. [1] Adjustment of inorganic substrate material Each material constituting the inorganic substrate has the following characteristics, and is appropriately selected from among those shown below. Aluminum hydroxide solid powder is used, and it does not change thermally when the molding temperature is below 200℃, but when the ambient temperature reaches 300 to 550℃, it releases crystal water and suppresses combustion. At the same time, it is used as AIO as a heat-resistant material. This makes the board nonflammable. It also serves as the main constituent material of the substrate and serves as a mechanical strength material. In order for the base material to have nonflammability, the content is preferably 25% or more. Inorganic fillers are used to improve the mechanical strength and reduce costs of molded products (decorative laminates), and are used as auxiliary binders to provide fluidity and increase volume during molding. For the former purpose, inorganic powders such as silica sand, calcite powder, and calcium silicate are used, and for the latter purpose, clays such as zeolite, kaolin, bentonite, and clay oxide are used. The amount of these inorganic fillers used is 70% or less, and if it exceeds 70%, nonflammability will be impaired, so it is preferably 60 to 70%. Reinforcing materials To further improve the mechanical strength of the molded product (veneer board), mineral fibers (asbestos, etc.), inorganic fibers (glass fibers, ceramic fibers), metal fibers (iron fibers,
Approximately 0.5 to 5%, preferably approximately 1.0%, of a fiber tip selected from among natural fibers (cotton, linen), and synthetic chemical fibers (vinylon, nylon, Tetron, etc.) (aluminum fiber, whisker fiber) is added. Thermosetting resin binder It binds the above-mentioned substrate materials to each other by imparting molding fluidity to each other, and must be cured by heat and pressure. Generally, phenol-formalin condensates and their derivatives, urea, Resins such as melamine-formalin condensates and their derivatives, furan-formalin condensates and their derivatives, and polydiphenyl oxide resins and their derivatives are used, and the preferred amount used is 5 to 6.0%. However, if it is less than 3%, the bonding strength is insufficient, and if it exceeds 8%, it is difficult to make it a noncombustible material even if the amount of Al 2 O 3 .3H 2 O is increased. [2] Decorative layer This decorative layer is formed by further laminating the following layers on the upper surface of the above-described substrate. Surface resin layer and pattern layer member There are two types of these members as follows. (1) When the surface resin layer is transparent or semitransparent and a pattern layer is provided separately from the resin layer. In this case, materials used as overlayers of ordinary thermosetting resin decorative laminates, such as cellulose, pulp paper, cloth (including non-woven fabrics), urea, melamine, thialyl phthalate, acrylic acid and methacrylic ester, etc. A surface resin layer member is made by impregnating and drying a transparent to translucent thermosetting resin liquid such as the derivative resin, and a patterned paper cloth impregnated and drying with the same thermosetting resin liquid is used as a pattern layer member. The pattern layer member may be placed under the surface resin layer member, or a pattern formed by printing on the surface of the shielding layer described later, or a thin metal foil such as aluminum foil or copper foil. (preferably about 0.3 mm) or this metal foil with a colored coating (0.1 mm or less), for example, by anodizing, and then glue the entire surface of the shielding layer with a synthetic resin adhesive to the surface of the shielding layer. Attach the target or partially. (2) It is also possible to share the surface resin layer and the pattern layer member. In this case, the pattern layer may be formed by direct printing on the surface of the cellulose pulp paper or cloth itself used as the overlayer in (1). Shielding layer member When the shielding layer is hot-press molded, the above-mentioned binder oozes out to the decorative layer (layer composed of the surface resin layer and pattern layer) side, causing stains, dirt, pattern defects, etc. It is provided between the substrate and the decorative layer so as to prevent the above-mentioned surface resin layer from occurring, and is made of, for example, a thermosetting resin liquid similar to that used for the surface resin layer member or vinyl acetate, vinyl chloride, or acrylic ester emulsion. A resin-treated shielding paper, etc., which is obtained by impregnating ordinary shielding paper or cloth with a thermosetting resin liquid and drying it, is used. [3] Backer layer Kraft paper, Japanese paper, paperboard, etc. impregnated with a thermosetting resin in advance is used. It is used to reinforce the mechanical strength of decorative boards and prevent them from warping when heated. The material forming the backer layer may have an uneven surface formed thereon in advance, or the uneven portion may be formed by embossing when the decorative board is integrally molded by heat pressure. [4] Scattering prevention layer In order to prevent fragments from scattering when the decorative board is damaged, an intermediary layer is provided inside the substrate or on at least one of the top and bottom surfaces of the substrate, instead of or together with the reinforcing material. be done. A net-like material such as an inorganic or organic fiber net having 2 to 15 meshes is preferred. Manufacturing method Next, to outline the manufacturing method of the decorative board of the present invention, the substrate materials are weighed and mixed using a Konida, Henschel mixer, etc., and the mixture thus obtained is placed in a mold. Each member for the layer and the surface resin layer and the pattern layer member are arranged in a predetermined positional relationship, the substrate material is filled from above, a backer layer is further covered, the mold is closed, and the mold is integrally molded by hot pressing. After that, it is finished and inspected to become a product. The molding conditions applied in the present invention are a temperature of 200℃ or less,
Heat pressure is applied for several minutes at a pressure of 100 to 150 kg/cm. As the pressing means, a conventionally known direct pressure press equipped with an embossing press plate or a mold may be used. In addition, in order to mask the top of the decorative layer, crushed natural stones (kansui crushed stone, snake crushed stone, canary, minoguro, etc.) are used to coat acrylic esters, methacrylic esters, resins copolymerized with these, and ethylene- A mixture of vinyl acetate emulsion resin and the like may be fixed on the decorative layer by spraying or coating, and the surface may be textured with crushed stone to emphasize the pattern. Embodiments of the Invention Finally, typical embodiments of the present invention will be described. <Example 1> In this example, as shown in FIG. 1, a three-layer decorative layer 2 is placed on the top surface of a substrate 1 which has a scattering prevention layer 4 interposed therein, and a backer layer 3 is placed on the bottom surface. These three parts are integrally molded by heat and pressure, and the decorative layer 2
Further, from the top, it is composed of a surface resin layer 21, a pattern layer 22 forming a pattern surface, and a resin shielding layer 23. The material according to this example was nonflammable and had excellent workability, and did not cause any fragments to scatter even when broken, and did not warp even when the temperature rose. The composition of each material forming each layer of the decorative board A of this example is as follows.
【表】
〈実施例 2〉
本例は第2図に示すように基板1の上面に二層
構造の化粧層2を載せ、下面にはバツカー層3を
配し、更に基板1と化粧層2との間には飛散防止
層4を介層させて、これらすべての層は熱圧によ
り一体成型されて一枚の平板化粧板A′を構成し
ている。
化粧層2は、表面樹脂層21とパターン層22
とを共用したもので、表面樹脂層21の裏面には
プリントによるパターン層を形成しており、バツ
カー層3はメラミン含浸クラフト紙を用いたもの
である。
なお、基板1の材料構成は第1の実施例のもの
と同様である。
また、得られた化粧板も第1の実施例のものと
同様の効果が得られた。
〈実施例 3〉
本例は第3図に示すように、内部に飛散防止層
4を介層させた基板1の上面に第1の実施例と同
様な三層構造の化粧層2を載せ、下面にはバツカ
ー層3を配して、これら三者の熱圧一体成型時に
表裏両面にエンボス加工を施しエンボス深溝5…
を形成したものであり、形成されたエンボス深溝
5…は表面化粧層並びにバツカー層3の厚み以上
の凹凸を形成している。
バツカー層3はフエノール含浸接着紙31とメ
ラミン含浸クラフト紙32より構成されており、
基板1の裏面に配されている。
なお、本例の化粧板A″のその他の各層を形成
するそれぞれの材料構成については第1の実施例
と同様であり、得られた化粧板は前掲の第1、第
2の実施例のものに比べバツカー層3の裏面への
ノリ付きが良く、又加熱時における反り返り防止
に対しても極めて効果的なものであつた。[Table] <Example 2> In this example, as shown in FIG. 2, a two-layer decorative layer 2 is placed on the upper surface of the substrate 1, a backer layer 3 is placed on the lower surface, and the substrate 1 and the decorative layer 2 are placed on the lower surface. A scattering prevention layer 4 is interposed between them, and all these layers are integrally molded by heat and pressure to form one flat decorative board A'. The decorative layer 2 includes a surface resin layer 21 and a pattern layer 22.
A printed pattern layer is formed on the back side of the surface resin layer 21, and the backer layer 3 is made of melamine-impregnated kraft paper. Note that the material composition of the substrate 1 is the same as that of the first embodiment. Furthermore, the obtained decorative board had the same effect as that of the first example. <Example 3> In this example, as shown in FIG. 3, a decorative layer 2 having a three-layer structure similar to that of the first example is placed on the upper surface of a substrate 1 with a scattering prevention layer 4 interposed therein. A backer layer 3 is arranged on the lower surface, and when these three are integrally molded by heat and pressure, embossing is performed on both the front and back surfaces to form embossed deep grooves 5...
The formed embossed deep grooves 5 form irregularities larger than the thickness of the surface decorative layer and the backer layer 3. The backer layer 3 is composed of phenol-impregnated adhesive paper 31 and melamine-impregnated kraft paper 32.
It is arranged on the back surface of the substrate 1. The composition of the materials forming the other layers of the decorative board A'' of this example is the same as that of the first example, and the obtained decorative board is the same as that of the first and second examples described above. Compared to the above, the backer layer 3 adhered well to the back surface, and was also extremely effective in preventing warping during heating.
第1図は、本発明の第一の実施例に於ける要部
横断面、第2図は、本発明の第二の実施例に於け
る要部横断面、第3図は、本発明の第三の実施例
に於ける要部横断面である。
符号の説明、A,A′,A″はいずれも本発明の
化粧板であり、1……基板、2……化粧板、3…
…バツカー層、4……飛散防止層、5……エンボ
ス深溝。
1 is a cross-sectional view of a main part in a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a main part in a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a main part in a second embodiment of the present invention. It is a cross section of the main part in the third embodiment. Explanation of the symbols: A, A', A'' are all decorative boards of the present invention, 1... substrate, 2... decorative board, 3...
... Backer layer, 4... Shatter prevention layer, 5... Embossed deep groove.
Claims (1)
ミニウムAl2O3・3H2Oに3〜9%の難燃性の熱硬
化性樹脂結合剤を含んで、60〜70%の無機質充填
剤及び0.5〜5%の補助材を加えて板状に成型硬
化された無機質基板と、 この基板の表面に積層されて熱圧により上記基
板と互いに成型一体化された樹脂遮蔽層、その上
のパターン層及び表面樹脂層とより成る化粧層
と、 紙質素材に熱硬化性樹脂を含浸させて成り、上
記基板の裏面に配されて上記基板に熱圧により成
型一体化されたバツカー層と、 2〜15メツシユの繊維質ネツト素材より形成さ
れ、上記基板の内部か若しくは上記基板の上、下
の少なくともいずれかの面に介層された飛散防止
層とより成る不燃性無機質化粧板。[Scope of Claims] 1 20-35% (weight ratio, the same applies hereinafter) of aluminum hydroxide Al 2 O 3 3H 2 O containing 3-9% of a flame-retardant thermosetting resin binder, An inorganic substrate that is molded and hardened into a plate shape with the addition of 60-70% inorganic filler and 0.5-5% auxiliary material, and an inorganic substrate that is laminated on the surface of this substrate and molded and integrated with the above substrate by heat pressure. A decorative layer consisting of a resin shielding layer, a pattern layer thereon, and a surface resin layer, and a paper material impregnated with a thermosetting resin, which is placed on the back side of the substrate and integrally molded onto the substrate by heat pressure. a non-flammable backer layer made of a fibrous net material with 2 to 15 meshes, and a scattering prevention layer interposed inside the substrate or on at least one of the upper and lower surfaces of the substrate. Inorganic decorative board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22523782A JPS59114050A (en) | 1982-12-22 | 1982-12-22 | Incombustible inorganic decorative board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22523782A JPS59114050A (en) | 1982-12-22 | 1982-12-22 | Incombustible inorganic decorative board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59114050A JPS59114050A (en) | 1984-06-30 |
| JPS6154588B2 true JPS6154588B2 (en) | 1986-11-22 |
Family
ID=16826138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22523782A Granted JPS59114050A (en) | 1982-12-22 | 1982-12-22 | Incombustible inorganic decorative board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59114050A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012210794A (en) * | 2011-03-31 | 2012-11-01 | Dic Corp | Non-combustible decorative plate |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557826A (en) * | 1991-08-30 | 1993-03-09 | Meisei Kogyo Kk | Heat insulation structural body and its manufacture |
| JP2013159920A (en) * | 2012-02-02 | 2013-08-19 | Ibiden Kenso Co Ltd | Method of manufacturing non-inflammable decorative sheet |
| JP2013158950A (en) * | 2012-02-02 | 2013-08-19 | Ibiden Kenso Co Ltd | Non-combustible decorative sheet |
| JP2013158945A (en) * | 2012-02-02 | 2013-08-19 | Ibiden Kenso Co Ltd | Method of producing unburnable decorative laminate |
| JP2013159917A (en) * | 2012-02-02 | 2013-08-19 | Ibiden Kenso Co Ltd | Method of manufacturing non-inflammable decorative sheet |
| JP2013158949A (en) * | 2012-02-02 | 2013-08-19 | Ibiden Kenso Co Ltd | Non-combustible decorative sheet |
| JP2013158947A (en) * | 2012-02-02 | 2013-08-19 | Ibiden Kenso Co Ltd | Non-combustible decorative sheet |
| JP5836146B2 (en) * | 2012-02-02 | 2015-12-24 | イビデン建装 株式会社 | Incombustible decorative board |
| JP5981153B2 (en) * | 2012-02-02 | 2016-08-31 | イビデン建装 株式会社 | Incombustible decorative board |
| JP2013158946A (en) * | 2012-02-02 | 2013-08-19 | Ibiden Kenso Co Ltd | Non-combustible decorative sheet |
-
1982
- 1982-12-22 JP JP22523782A patent/JPS59114050A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012210794A (en) * | 2011-03-31 | 2012-11-01 | Dic Corp | Non-combustible decorative plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59114050A (en) | 1984-06-30 |
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