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JPS6155454B2 - - Google Patents
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JPS6155454B2 - - Google Patents

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Publication number
JPS6155454B2
JPS6155454B2 JP56026536A JP2653681A JPS6155454B2 JP S6155454 B2 JPS6155454 B2 JP S6155454B2 JP 56026536 A JP56026536 A JP 56026536A JP 2653681 A JP2653681 A JP 2653681A JP S6155454 B2 JPS6155454 B2 JP S6155454B2
Authority
JP
Japan
Prior art keywords
frame
plastic
lead
insert
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56026536A
Other languages
Japanese (ja)
Other versions
JPS57140123A (en
Inventor
Hirotsugu Hanada
Juji Kinoshita
Sho Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56026536A priority Critical patent/JPS57140123A/en
Priority to PCT/JP1981/000210 priority patent/WO1982000918A1/en
Priority to DE8181902451T priority patent/DE3176825D1/en
Priority to US06/375,030 priority patent/US4578660A/en
Priority to EP81902451A priority patent/EP0058727B1/en
Publication of JPS57140123A publication Critical patent/JPS57140123A/en
Publication of JPS6155454B2 publication Critical patent/JPS6155454B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 本発明は金属薄板をインサートしたプラスチツ
ク・モールド体、特にプラスチツク流れにより前
記金属薄板が湾曲されることを防止する構造的改
良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plastic molded body with a sheet metal insert, and more particularly to a structural improvement that prevents the sheet metal from being bent by plastic flow.

例えばコイルと磁気回路と接点ばね組み等を有
底箱形の絶縁基体に装着してなる電磁継電器にお
いて、第1図に示す如くコイルや磁気回路等の内
部構造体1を収容する基体2は、固定接点及び可
動接点をそれぞれ固着又は板ばねなどを介して接
続した複数の各リード端子3をインサートしてモ
ールド形成し、カバー4を装着して構成される。
かかる電磁継電器5の基体2は第2図に示す如く
平面視長方形枠体6と底板7とを一体モールド形
成、又は別途モールド形成したのち接合して構成
される。そして、枠体6に中間部をインサートモ
ールドされた各1対のブレーク用固定接点リード
端子8と、メーク用固定接点リード端子9と、可
動接点ばね取着用リード端子10とは枠体6の上
面及び下面所定位置から両端部を導出するように
されている。
For example, in an electromagnetic relay in which a coil, a magnetic circuit, a contact spring assembly, etc. are attached to a bottomed box-shaped insulating base, the base 2 that houses the internal structure 1 such as the coil and magnetic circuit as shown in FIG. A mold is formed by inserting a plurality of lead terminals 3 in which fixed contacts and movable contacts are fixed or connected via leaf springs, etc., and a cover 4 is attached.
As shown in FIG. 2, the base body 2 of the electromagnetic relay 5 is constructed by integrally molding a rectangular frame body 6 in plan view and a bottom plate 7, or by molding them separately and then joining them together. Each pair of break fixed contact lead terminals 8, make fixed contact lead terminals 9, and movable contact spring attachment lead terminals 10, whose middle portions are insert-molded in the frame body 6, are attached to the upper surface of the frame body 6. and both ends are led out from a predetermined position on the lower surface.

第3図は底板7を別途モールド形成する枠体6
の作成主要工程を示したものであり、まず第3図
aに示す如く隣青銅等のフープ材をプレス加工し
て各リード端子8〜10が接続されたリードフレ
ーム11を2個所定に対向配置する。次いで第3
図bに示す如く、対向する各リード端子8〜10
の中間部をインサートするように枠体6をモール
ド形成する。然るのち、各リード端子8〜10の
接続部を切断し、接点溶接及び曲げ加工並びに底
板7(第2図)を接着して第2図に示す基板2が
完成する。なお、底板7の前記接着は、枠体6の
中に別途組立てられた内部構造体1(第1図)を
挿入したのち実施されるようになる。
Figure 3 shows a frame 6 in which the bottom plate 7 is separately molded.
First, as shown in Fig. 3a, two hoop materials such as bronze are pressed and two lead frames 11 to which respective lead terminals 8 to 10 are connected are arranged facing each other in a predetermined manner. do. Then the third
As shown in Figure b, each of the opposing lead terminals 8 to 10
The frame body 6 is formed by molding so that the middle part of the frame body 6 is inserted. Thereafter, the connecting portions of the lead terminals 8 to 10 are cut, contact welding and bending are performed, and the bottom plate 7 (FIG. 2) is bonded to complete the substrate 2 shown in FIG. 2. Note that the bonding of the bottom plate 7 is carried out after the separately assembled internal structure 1 (FIG. 1) is inserted into the frame 6.

しかし、該電磁継電器を小型化し所要搭載スペ
ースを極力狭くする等のため、枠体6の肉厚はな
るべく薄くすることが望まれる。とともに、枠体
6から導出される各リード端子8〜10の配列
は、内部構造体1の構成及び既に規格化されてい
る継電器搭載用穴間隔に拘束され、枠体6の肉厚
さ方向中心部に位置しないことがしばしば生じ
る。そのため枠体6をモールド形成した際、第4
図aに示す如く直状でなければならないリード端
子8〜10は枠体6の厚肉側6′に流入するプラ
スチツク流れ圧力に押され、第4図bに示す如く
枠体6の薄肉側6″に押し曲げられるようにな
る。その結果、リード端子8〜10の中央部が枠
体6の内側面に露出し、該枠体6に挿入されたコ
イルに接触する等の不都合があつた。そのため、
インサート部品(リード端子8〜10)の中央部
をピンで抑えるようにしてモールド体(枠体6)
を形成する等の手段が講じられていたが、かかる
従来手段はピンで抑えたモールド体部分に穴があ
いてインサート部品が露出し製品品位が低められ
たり、前記穴を埋める作業を要する等の欠点を有
するのみならず、小形モールド体にあつては、モ
ールド金型にインサート部品抑え用のピンを付属
させることができないことがある。
However, in order to downsize the electromagnetic relay and minimize the required installation space, it is desirable that the wall thickness of the frame 6 be as thin as possible. At the same time, the arrangement of each lead terminal 8 to 10 led out from the frame 6 is restricted by the configuration of the internal structure 1 and the already standardized relay mounting hole spacing, and the arrangement is centered in the thickness direction of the frame 6. It often happens that it is not located in the Therefore, when molding the frame 6, the fourth
The lead terminals 8 to 10, which must be straight as shown in FIG. As a result, the center portions of the lead terminals 8 to 10 are exposed to the inner surface of the frame 6 and come into contact with the coil inserted into the frame 6, resulting in inconveniences. Therefore,
Place the mold body (frame body 6) by holding the center part of the insert parts (lead terminals 8 to 10) with a pin.
However, such conventional methods have problems such as making holes in the mold body held down by pins, exposing the insert parts and lowering the quality of the product, and requiring work to fill the holes. In addition to having drawbacks, in the case of small molded bodies, it may not be possible to attach a pin for holding the insert part to the molding die.

本発明の目的は上記不都合を除去することであ
り、この目的は金属薄板よりなるインサート部品
に、プラスチツク厚肉側へ突出する突起を形成し
該突起が前記プラスチツク厚肉側へ流入するプラ
スチツク流れの一部をプラスチツク薄肉側へ導く
開口を具えてなることを特徴とした金属薄板イン
サートモールド体を提供して達成される。
An object of the present invention is to eliminate the above-mentioned disadvantages, and the object is to form a protrusion projecting toward the thick plastic side on an insert part made of a thin metal plate, so that the protrusion prevents the flow of plastic flowing into the thick plastic side. This is achieved by providing a thin metal plate insert mold body characterized by having an opening that leads a portion to the thin plastic side.

以下、本発明の実施例に係わる図面を用いて本
発明を説明する。
Hereinafter, the present invention will be explained using drawings related to embodiments of the present invention.

第5図は本発明の一実施例に係わる電磁継電器
用リードフレームの平面図aとその下視図b、第
6図は第5図に示したリードフレームを継電器基
体構成用枠体にインサートモールドしたものの側
断面図、第7図は本発明の他の一実施例に係わる
電磁継電器用リードフレームの平面図aとその下
視図b、第8図は第7図に示したリードフレーム
を継電器基体構成用枠体にインサートモールドし
たものの側断面図である。
FIG. 5 is a plan view a and a bottom view b of a lead frame for an electromagnetic relay according to an embodiment of the present invention, and FIG. 6 is an insert molding of the lead frame shown in FIG. FIG. 7 is a plan view a and a bottom view b of a lead frame for an electromagnetic relay according to another embodiment of the present invention, and FIG. 8 is a side sectional view of the lead frame shown in FIG. FIG. 2 is a side sectional view of a frame body that is insert-molded into a frame for forming a base body.

第3図に示したリードフレーム11と同様なリ
ードフレームを示す第5図において、隣青銅等の
フープ材をプレス加工してなるリードフレーム2
1は、ブレーク用固定接点リード端子22と、メ
ーク用固定接点リード端子23と、可動接点ばね
取着用リード端子24とが接続されて構成され
る。ただし、各リード端子22〜24の中央広幅
部には所定方向に突出する角形突起25〜27が
それぞれ設けてあり、突起25〜27の3方が各
リード端子材とそれぞれ連している反面、インサ
ートモールド時にプラスチツクが流れ込む矢印A
方向に向う一方が開口28〜30を形成するよう
にしてある。
In FIG. 5 showing a lead frame similar to the lead frame 11 shown in FIG. 3, a lead frame 2 formed by pressing a hoop material such as bronze is shown.
1 is constructed by connecting a fixed contact lead terminal 22 for break, a fixed contact lead terminal 23 for make, and a lead terminal 24 for attaching a movable contact spring. However, square protrusions 25 to 27 that protrude in a predetermined direction are respectively provided in the central wide portion of each lead terminal 22 to 24, and while three sides of the protrusions 25 to 27 are connected to each lead terminal material, Arrow A where plastic flows during insert molding
One side facing the direction forms openings 28-30.

従つて第6図に示す如く、1対のリードフレー
ム21を図示しないモールド金型内に対向配置さ
せて固定し、各リード端子22〜24の中央広幅
部を埋入するプラスチツク枠体31をモールド形
成すると、プラスチツク流れは突起開口28〜3
0により図示左右に分けられたのち、その後方
(図の裏面側)で合流して金型キヤビテイを満す
ようになる。その際、枠体31の厚肉側31′へ
突出するようにした突起25〜27及びその開口
28〜30により、枠体厚肉側31′と枠体薄肉
側31″にそれぞれ流入するプラスチツク量が従
来構成リードフレーム(第3図の11)に比べて
著しく近似するとともに、開口28〜30を通過
したプラスチツクは薄肉部31″でその圧力を高
められる反面、厚肉側31′へ流入したプラスチ
ツクは突起25〜27を通過してその圧力が低め
られるようになる。従つて、各リード端子22〜
24はその直状が維持されることになる。
Therefore, as shown in FIG. 6, a pair of lead frames 21 are arranged and fixed facing each other in a mold (not shown), and a plastic frame 31 is molded into which the wide central part of each lead terminal 22 to 24 is embedded. Once formed, the plastic flows through the projection openings 28-3.
After being divided into left and right sides as shown in the figure by 0, they merge at the rear (on the back side of the figure) to fill the mold cavity. At this time, the amount of plastic flowing into the thick side 31' of the frame 31' and the thin side 31'' of the frame 31, respectively, due to the protrusions 25 to 27 and their openings 28 to 30, which project toward the thick side 31' of the frame 31. is significantly similar to that of the conventional lead frame (11 in FIG. 3), and while the pressure of the plastic that has passed through the openings 28 to 30 is increased in the thin walled portion 31'', the pressure of the plastic that has flowed into the thick walled side 31' is passes through the protrusions 25 to 27 and its pressure is reduced. Therefore, each lead terminal 22~
24 will maintain its straight shape.

第3図及び第5図に示したリードフレーム11
及び21と同様なリードフレームを示す第7図に
おいて、隣青銅等のフープ材をプレス加工してな
るリードフレーム41は、ブレーク用固定接点リ
ード端子42と、メーク用固定接点リード端子4
3と、可動接点ばね取着用リード端子44とが接
続構成されている。そして、リード端子43の中
央広幅部にはコ字形切起しになる突起46を形成
しリード端子42及び44の中央広幅部には二字
形切起しになる突起45及び47が形成され、第
7図bに示す各突起45〜47の下方にはコ字形
又はロ字形開口48〜50が形成される。なお、
各突起45〜47の立ち上りは同一方向であり、
かつ、プラスチツクが流れ込む矢印B方向に向つ
て約45゜の傾斜を有する。
Lead frame 11 shown in FIGS. 3 and 5
In FIG. 7 showing a lead frame similar to 21 and 21, a lead frame 41 formed by pressing a hoop material such as bronze has a break fixed contact lead terminal 42 and a make fixed contact lead terminal 4.
3 and a lead terminal 44 for attaching a movable contact spring are connected. A U-shaped protrusion 46 is formed at the wide center portion of the lead terminal 43, and two-shaped protrusions 45 and 47 are formed at the wide center portions of the lead terminals 42 and 44. U-shaped or square-shaped openings 48 to 50 are formed below each of the protrusions 45 to 47 shown in FIG. 7b. In addition,
Each of the protrusions 45 to 47 rises in the same direction,
Moreover, it has an inclination of about 45° toward the direction of arrow B in which the plastic flows.

従つて第8図に示す如く、1対のリードフレー
ム41を図示しないモールド金型内に対向配置さ
せて固定し、各リード端子42〜44の中央広幅
部を埋入するプラスチツク枠体51をモールド形
成すると、枠体厚肉側51′に流入したプラスチ
ツクの一部は各突起45〜47に突当つてガイド
され、開口48〜50を通つて枠体薄肉側51″
へ流れみ、金型キヤビテイ内がプラスチツクで満
されるようになる。その際、枠体厚肉側51′へ
突出するようにした突起45〜47に突当つたプ
ラスチツク流れの押圧力が、枠体厚肉部51′と
薄肉部51″との隙間差によるプラスチツク流れ
圧力のアンバランスを解消し、各リード端子45
〜47の直状が維持されることになる。
Therefore, as shown in FIG. 8, a pair of lead frames 41 are arranged and fixed opposite each other in a mold (not shown), and a plastic frame 51 is molded into which the wide central portion of each lead terminal 42 to 44 is embedded. When formed, a portion of the plastic that has flowed into the thick side 51' of the frame is guided against each protrusion 45-47, passes through the openings 48-50, and flows into the thin side 51'' of the frame.
The inside of the mold cavity is filled with plastic. At this time, the pressing force of the plastic flow that hits the protrusions 45 to 47 that protrude toward the thick wall side 51' of the frame body is caused by the plastic flow due to the gap difference between the thick wall part 51' and the thin wall part 51'' of the frame body. Eliminates pressure imbalance and connects each lead terminal 45
~47 straightness will be maintained.

以上説明した如く本発明によれば、機械的強度
の弱い薄板状インサート部品を変形させることな
く、インサートモールドすることができるため、
従来の当該モールド体作成不良率を低めたのみな
らず、さらにモールド体の薄肉化を実現させてそ
の小型化を図り得た実用上の効果が顕著である。
As explained above, according to the present invention, insert molding can be performed without deforming a thin plate-like insert component with weak mechanical strength.
The practical effect of not only reducing the defective rate of the conventional molded body but also making the molded body thinner and smaller in size is remarkable.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は電磁継電器の主要構成を示す側断面
図、第2図は板状をした各種リード端子をインサ
ートしてなる前記継電器用基体の斜視図、第3図
は前記基体の作成主要工程を示す斜視図、第4図
は前記基体の側断面図でありリード端子(リード
フレーム)が正常にインサートされたものaと曲
げられてインサートされたものbを示す。第5図
は本発明の一実施例に係わる電磁継電器用リード
フレームの平面図aとその下視図b、第6図は第
5図に示したリードフレームを継電器基体構成用
枠体にインサートモールドした側断面図、第7図
は本発明の他の一実施例に係わる電磁継電器用リ
ードフレームの平面図aとその下視図b、第8図
は第7図に示したリードフレームを継電器基体構
成用枠体にインサートモールドした側断面図であ
る。 なお、図中において2は電磁継電器用基体、
3,8〜10,22〜24,42〜44は各種リ
ード端子、6,31,51は所定の前記各種リー
ド端子をインサートしてモールド形成した継電器
基体構成用枠体、6′,31′,51′は前記各枠
体の厚肉部、6″,31″,51″は前記各枠体の
薄肉部、11,21,41は前記各種リード端子
を所定に接続形成されたリードフレーム、25〜
27,45〜47は前記リード端子にそれぞれ設
けられた突起、28〜30,48〜50は前記各
突起に具えられた開口を示す。
Fig. 1 is a side sectional view showing the main structure of an electromagnetic relay, Fig. 2 is a perspective view of the relay base into which various plate-shaped lead terminals are inserted, and Fig. 3 shows the main steps of making the base. The perspective view shown in FIG. 4 is a side sectional view of the base body, and shows a case a in which a lead terminal (lead frame) is inserted normally and a case b in which a lead terminal (lead frame) is bent and inserted. FIG. 5 is a plan view a and a bottom view b of a lead frame for an electromagnetic relay according to an embodiment of the present invention, and FIG. 6 is an insert molding of the lead frame shown in FIG. 7 is a plan view a and a bottom view b thereof of a lead frame for an electromagnetic relay according to another embodiment of the present invention, and FIG. 8 is a side sectional view of the lead frame shown in FIG. It is a sectional side view which carried out insert molding in the frame for a structure. In addition, in the figure, 2 is the base for electromagnetic relay,
3, 8 to 10, 22 to 24, 42 to 44 are various lead terminals; 6, 31, and 51 are frames for forming a relay base body into which predetermined various lead terminals are inserted and molded; 6', 31', Reference numeral 51' indicates a thick wall portion of each of the frame bodies, 6'', 31'', and 51'' a thin wall portion of each frame body, 11, 21, and 41 a lead frame to which the various lead terminals are connected in a predetermined manner; ~
Reference numerals 27, 45-47 indicate protrusions provided on the lead terminals, and 28-30, 48-50 indicate openings provided in each of the protrusions.

Claims (1)

【特許請求の範囲】[Claims] 1 金属薄板よりなるインサート部品をその板厚
方向に片寄らせて一体化貫通させたプラスチツ
ク・モールド体において、インサート部品はプラ
スチツク厚肉側へ突出する突起を有し、該突起は
前記プラスチツク厚肉側へ流入するプラスチツク
流れの一部をプラスチツク薄肉側へ導く開口を具
えてなることを特徴とした金属薄板インサートモ
ールド体。
1. In a plastic molded body in which an insert part made of a thin metal plate is integrated and penetrated in the direction of the plate thickness, the insert part has a protrusion that protrudes toward the thick side of the plastic, and the protrusion is attached to the thick side of the plastic. A thin metal plate insert mold body characterized by having an opening that guides a part of the plastic flow flowing into the plastic to the thin plastic side.
JP56026536A 1980-09-01 1981-02-25 Thin metal sheet-inserted mold body Granted JPS57140123A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP56026536A JPS57140123A (en) 1981-02-25 1981-02-25 Thin metal sheet-inserted mold body
PCT/JP1981/000210 WO1982000918A1 (en) 1980-09-01 1981-09-01 Electromagnetic relay and method of manufacturing the same
DE8181902451T DE3176825D1 (en) 1980-09-01 1981-09-01 Electromagnetic relay and method of manufacturing the same
US06/375,030 US4578660A (en) 1980-09-01 1981-09-01 Housing for an electromagnetic relay
EP81902451A EP0058727B1 (en) 1980-09-01 1981-09-01 Electromagnetic relay and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56026536A JPS57140123A (en) 1981-02-25 1981-02-25 Thin metal sheet-inserted mold body

Publications (2)

Publication Number Publication Date
JPS57140123A JPS57140123A (en) 1982-08-30
JPS6155454B2 true JPS6155454B2 (en) 1986-11-27

Family

ID=12196209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56026536A Granted JPS57140123A (en) 1980-09-01 1981-02-25 Thin metal sheet-inserted mold body

Country Status (1)

Country Link
JP (1) JPS57140123A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356143A (en) * 1986-08-22 1988-03-10 Matsushita Electric Ind Co Ltd Motor for cleaner

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6483015B2 (en) * 2015-12-28 2019-03-13 日立オートモティブシステムズ株式会社 Pressure detection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356143A (en) * 1986-08-22 1988-03-10 Matsushita Electric Ind Co Ltd Motor for cleaner

Also Published As

Publication number Publication date
JPS57140123A (en) 1982-08-30

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