JPS6156872B2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a lead cutting machine and a cutting method using the same, and provides versatility in cutting DIL-G IC leads with 16, 18, and 22 pins, and reduces impact using a transfer feed mechanism. The object of the present invention is to provide a lead cutting machine that can easily automate chip processing of IC leads in one step.

The current lead cutting method uses an IC on the cutting die.
Cutting is performed by feeding the material by hand and driving the cylinder. As a similar machine, the DIL-P (mold type) IC has fewer problems such as impact, so it feeds and cuts using a 45° slope. in this case
It is classified into two types, 16- and 18-pin types and 22-pin types, and is considered a dedicated machine. However, this type of construction was difficult to implement in a continuous line system due to the use of gradients. In addition, DIL-G is vulnerable to shocks, so the machine must be kept horizontal and has a feed mechanism for cutting, but chip disposal becomes a problem. DIL− before cutting
The GIC (hereinafter referred to as the work) has a shape as shown in Fig. 1 and is supplied to the cutting section in the form of a lead frame. After cutting, the shape will be as shown in Figure 2. As shown in Fig. 3, the leads 1 and 2 remain on the cutting die.
Leads 3 and 4 will fall naturally, so there is no problem, but the rest of leads 1 and 2 will be "tangled" when the next supply is made.
This may cause bending or feed jam problems.
Cutting die shape, work guide rail, transportation method,
There were problems with how to adjust the lead length and how to discharge chips.

The purpose of the present invention is to devise a chip disposal method that could not be achieved with the conventional technology described above, to provide versatility by making it compatible with 16, 18, and 22 pin types, and to provide a lead length adjustment method and switching method. Our objective is to provide a lead cutting machine such as DIL-GIC that solves problems such as timing and no shock during transportation, and takes automation of the production process into consideration.

In order to meet these objectives, the present invention has the following configurations for IC lead chip treatment, lead cutting length adjustment method, cutting timing method, transportation method, etc.

IC chip processing method...The IC transporting piece is made floating, and a spring and pin are placed inside the piece, and pressure is applied to the frame on the side of the IC by pin pressure, so that it will fall when it is cut. The cutting die is made to be independent of the rail, and there is a space between the rail and the cutting die to allow the cutting chips to pass through.

Transfer method: Press the transfer piece against the rail surface using the floating spring force. The supply rail is 0.5mm higher than the cutting die height, and the discharge rail is
It is placed 0.5 mm lower than the cutting die and the pressure is set to 0, and is conveyed using pins to reduce impact.

IC feed standard...The reference is set at the rear end, the size of the cutting die is set for 22 pins, the 16 and 18 pins are aligned with the rear end of the cutting die, and the chips at the front are placed on the cutting die. Press with the corner to remove chips.

By devising such a combination, the present invention automates a general-purpose machine for cutting leads of ICs, etc.

This invention applies to 16, 18 pins and 22 pins when cutting IC leads in the production process of DIL-G (ceramic type).
This relates to an IC lead cutting machine that is versatile enough to be used with both pin types, reduces the number of setup steps required to change types, and ensures reliable chip disposal.

An embodiment illustrating the present invention will be described below.
First, an IC is supplied to the escape rail 2, and the escape piece 12 supplies the IC individually. The supplied IC is adjusted by a stopper 13 according to the type of IC, and the rear part of the IC is used as a reference, and the IC is clamped by a presser piece 7 on the supply rail 3 and conveyed to the cutting die 4. After conveyance, as shown in FIG. 5, the slide piece 18 is moved to the right and left by the cutting cylinder 16, and the lead of the IC is pressed against the cutting die 4 by the lead presser piece 15 and cut by the lead cutting blade 14. When the front and rear leads are cut as shown in Figure 7C, the frames on both sides are connected to the IC built in the presser piece 7.
Since the guide pin 8 is pushed by the force of the spring 9, it is forcibly ejected. To adjust the lead cutting length depending on the product type, a groove is formed in the piece of the cutting die 4 into which the liner 5 can be inserted, and a square hole is formed so that it cannot be removed during transportation. In addition, in order to reduce the impact on the IC during transportation, the height of the supply rail 3 is 0.3 mm based on the height of the cutting die 4.
~0.1mm higher, and the ejection rail 6 is higher than the cutting die 4.
We have designed it to be 0.3mm to 0.1mm lower to avoid any trouble during delivery. As described above, chips are disposed of by providing a discharge gap of 5 mm between the cutting die 4, the supply rail 3, and the discharge rail 6, and are forcibly discharged by the force of the IC guide pin 8 of the presser piece 7. In this way, IC lead cutting can be automated using various ideas.

According to the present invention, chips from the lead frame can be completely discharged in a straight line, so IC lead cutting can be automated with a simple mechanism.

[Brief explanation of the drawing]

1 to 3 are perspective views showing the IC shape during the IC manufacturing process, FIG. 4 is a front view showing a lead cutting machine according to the present invention, FIG. 5 is a side view thereof, and FIGS. 6a to 6
7c is a plan view, a front view, and a side view showing the cutting die, and FIGS. 7a to 7c are explanatory diagrams showing the IC clamping state of the cutting die and the presser piece and the ejecting state where the frame is cut. 1...Base plate, 2...Escape rail, 3
... Supply rail, 4 ... Cutting die, 5 ... Liner, 6 ... Discharge rail, 7 ... Presser piece, 8 ...
IC guide pin, 9... Spring, 10... Clamp cylinder, 11... Guide shaft, 12
...Escape piece, 13...Stoppa, 14...
Lead cutting blade, 15...Lead presser piece, 16...
Cutting cylinder, 17... Feed cylinder, 18...
Slide piece, 19...IC.

Claims (1)

[Claims] 1. A feeding mechanism that guides both sides of the cap using pins with built-in springs in the sample holding piece, a mechanism that presses down the side leads, and a supply rail, a cutting die, and a discharge rail arranged in this order. A lead cutting machine that has a mechanism for forcibly ejecting cutting debris by creating an escape gap between the rail and the cutting die, and the cutting die has an angle at both ends. 2. The lead cutting machine according to claim 1, wherein the cutting die has a square hole into which a liner for adjusting lead cutting length according to product type can be inserted. 3. The process of supplying the IC to the supply rail, and the process of supplying the IC to the supply rail.
A step of clamping the IC lead with a presser piece and transporting it to the cutting die, a step of pressing the IC lead against the cutting die with the lead presser piece and cutting the lead with a lead cutting blade, and a step of transferring the frame part of the IC lead to the cutting die. A method for cutting a lead, comprising the step of forcibly discharging the lead from the lead.