JPS6158506B2 - - Google Patents

Description

[Detailed description of the invention]

This invention is a novel method for attaching articles such as nameplates and small articles to the surfaces of articles such as electrical devices, mechanical devices, and housing equipment, or of structures such as concrete surfaces and walls (hereinafter referred to as foundation surfaces). Regarding the attachment method. This invention has a base surface that normally has weak adhesiveness to the extent that an article can be temporarily attached to the base surface, and is heat sensitive by being heated for a short time at a relatively low temperature of about 90°C or less. The bonded articles are laminated through a specific heat-sensitive adhesive material that is activated to a viscosity with a modulus of elasticity equivalent to that of commonly known pressure-sensitive adhesives at room temperature and exhibits sufficient adhesive strength. The object of the present invention is to provide a pasting method that maintains a strong adhesive state even when used at room temperature or under heated conditions by heating or heating and pressurizing the adhesive. Conventionally, when attaching articles such as surface plates such as nameplates, punching plates, and decorative plates, or small articles such as attachment suspension devices and panels to a base surface, a pressure-sensitive adhesive is formed on the support surface. A so-called double-sided pressure-sensitive adhesive tape is used. However, when a tape made of this adhesive is used to adhesively fix an article to be attached to a base surface, the tape may not be able to withstand distortion or warping of the base surface and/or the article to be attached, and may deteriorate over time. There is a drawback that the ends of the applied article may peel off from the base surface. This is because when various stresses are continuously applied to the adhesive layer, flow occurs inside the adhesive layer.
Moreover, such flow phenomenon is further promoted under conditions such as exposure to heating and/or humid conditions. On the other hand, thermosetting adhesive tapes that chemically induce a crosslinking reaction are known, but these tapes require heating to 100°C or higher to obtain sufficient adhesive strength and require expensive heating equipment as a heating means. need,
The work is complicated, and there is a restriction that it cannot be applied unless the base surface is heat resistant. This invention enables the application of an adhesive article to a base surface without using a heating means that requires a large amount of heat capacity, such as a thermosetting adhesive tape.
By heating at a relatively low temperature of ~90°C, it can be thermally activated to a viscosity that exhibits sufficient wettability even on the rough base surface and/or the surface of the attached article. The object of the present invention is to provide a pasting method using a heat-sensitive adhesive material that can maintain sufficient adhesive strength. To explain the details of this invention more specifically,
A reactive hot-melt resin having good compatibility with 100 parts by weight of a pressure-sensitive adhesive composition having good pressure-sensitive adhesive properties under normal conditions and having a melting point of 70°C or higher on the base surface. The pasted articles are laminated via a hot pressure-sensitive adhesive material which has a low degree of tackiness at room temperature and which is given a pressure-sensitive adhesive function by heating, which is made by adding 50 to 200 parts by weight of The present invention provides a pasting method characterized by heating or heating and pressurizing the adhesive after applying the adhesive. The pressure-sensitive adhesive composition used here is a component that has good pressure-sensitive adhesive properties under normal conditions and imparts desired tackiness, adhesion, etc. to the pressure-sensitive adhesive material when hot, such as butyl acrylate, acrylic acid, etc. Methyl, ethyl acrylate, 2-ethylhexyl acrylate, and octadecyl acrylate are most suitable, but other acrylic acid alkyl esters with an alkyl group of 1 to 10 carbon atoms may be used or used in combination. It is also possible. The acrylic acid alkyl esters include methacrylic acid alkyl esters such as methyl methacrylate, ethyl methacrylate, and butyl methacrylate, and vinyl monomers copolymerizable with the (meth)acrylic acid alkyl esters, such as styrene, vinyl acetate, etc.
An appropriate amount of acrylonitrile or methacrylonitrile may be added. In addition, the polymerizable monomer having a functional group used together with the above-mentioned acrylic acid alkyl ester is a component that imparts desired adhesiveness, cohesiveness, etc. to the heat-sensitive adhesive material. For example, the following polymerizable monomer is used. (a) Polymerizable monomers with carboxyl groups, such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, and itaconic acid. (b) Polymerizable monomers having hydroxyl groups, such as 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, and 2-hydroxypropyl methacrylate. . (c) Polymerizable monomers having an amide group, such as acrylamide and methacrylic acid amide. Then, by copolymerizing the acrylic acid alkyl ester and a polymerizable monomer having a functional group, an acrylic pressure-sensitive adhesive composition as a base material for the hot pressure-sensitive adhesive material used in the present invention is obtained. It will be done. However, in addition to the above-mentioned acrylic adhesive compositions, for example, polyvinyl ether adhesive compositions,
Vinyl acetate-based or rubber-based pressure-sensitive adhesive compositions that have good pressure-sensitive adhesive properties under normal conditions are also effective. The hot-melt resin is a component that imparts desired adhesion retention to the hot pressure-sensitive adhesive material used in the present invention, and has good compatibility with the composition and has a melting point of 70°C or higher, more preferably. 80~150℃ resin is used. Such a resin is not particularly limited as long as it satisfies the above characteristics, but for example, it contains at least one functional group that can react with the functional group of the polymerizable monomer directly or through components such as a crosslinking agent and a catalyst.
reaction type such as epoxy resin, or reaction type such as xylene resin, phenol resin, phenol modified resin, which has at least one functional group that can react with the functional group of the polymerizable monomer via a crosslinking agent or catalyst. When the mold resin is used as a heat-melting resin constituting the hot pressure-sensitive adhesive material used in this invention, it is suitable for adhesives in which the article to be pasted is used in an intermittent or continuous heated state in this invention. It is something. It goes without saying that a non-reactive thermofusible resin and a reactive thermofusible resin may be used in combination. In addition, the above-mentioned crosslinking agent or catalyst used to promote the reaction between the functional group of the polymerizable monomer and the reactive hot-melt resin at a relatively low temperature of 40 to 90°C is used for pressure-sensitive adhesives. 0.1 per 100 parts by weight of the composition
It is preferable to add up to 20 parts by weight. The crosslinking agent used to promote the reaction at low temperature is preferably polyisocyanate, polyamine, melamine, etc., and the catalyst is preferably a reaction catalyst such as metal salt, inorganic salt, organic salt, tertiary amine, cresol, etc. used. These crosslinking agents or catalysts react with functional groups when the hot pressure-sensitive adhesive material is heated, and act to improve the adhesive properties, particularly the heat resistance, of the adhesive material. These hot-melt resins are contained in an amount of 50 to 200 parts by weight, more preferably 70 to 200 parts by weight, based on 100 parts by weight of the composition.
It is preferably added in an amount of 150 parts by weight. If the resin is less than 50 parts by weight, the elastic modulus of the pressure-sensitive adhesive material when heated is small, the rate at which the melted adhesive material solidifies is slow, and the shear adhesive strength is weak, and if the resin is more than 200 parts by weight, the adhesive material This is undesirable because the elastic modulus of the adhesive material is large, the wettability of the melted adhesive material to the base surface and/or the surface of the article to be adhered to is poor, and the peel strength is weakened. The heat-sensitive adhesive material configured in this way is
Either the adhesive material is applied to at least one of the base surface and/or the surface of the article to be pasted, or the adhesive material is applied in advance to the surface of a removable base material such as resin-treated paper or plastic film that has a low adhesive function. A film-like adhesive material is interposed between the base surface and the article to be pasted, and heated or heated and pressurized at a relatively low temperature of about 40 to 90 degrees Celsius (pressure conditions: 50 to 1000 degrees Celsius).
g/cm ² ), and the pasting method of the present invention is completed. polyester in that material layer of said adhesive material;
0.5~10 made of materials such as nylon and rayon
mm short fibers, or non-woven fabrics such as nylon non-woven fabrics and rayon non-woven fabrics, fabrics such as cheesecloth and cotton fabrics,
It is preferable to include a reinforcing core material such as a plastic film, since this increases the tensile strength of the adhesive material and provides a cushioning effect. The pasting method of the present invention includes the above-mentioned device,
It exhibits a remarkable effect when attaching items such as name plates and display boards to the basic surface of equipment, etc., but it is also useful for attaching plastic side molds to automobile bodies, for example. Examples of this invention will be shown below. Example: Prepare a solution of a pressure-sensitive adhesive composition (average molecular weight approximately 150,000) solution polymerized (toluene 25%) at a ratio of ethyl acrylate: butyl acrylate: glycidyl methacrylate = 3:6.9:0.1 (copolymerization weight ratio). do. For 100 parts by weight of solid content of the solution, 100 parts by weight of bisphenol type epoxy resin (melting point 100°C),
Add and mix 3 weights of tolylene diisocyanate, apply the mixture to a 0.2 mm thick aluminum plate (#280 sandblast) so that the thickness after drying is 50μ, and dry at 70℃ for 5 minutes. , a sample piece was prepared. Next, a 0.2 mm thick aluminum plate (#280 sandblast) heated to each temperature shown in Table 1 was placed on the surface of the hot pressure sensitive adhesive material layer of this sample piece, and a pressure of 100 g/cm ² was applied. Return to room temperature and test using a shotpar type tensile tester (peel speed 50mm/min, 20℃ x 65cm)
%RH). Its properties are shown in Table 1.

[Table] On the other hand, the mixture was applied onto a resin-treated paper with low adhesion so that the thickness after drying was 50μ,
Dry at 70°C for 5 minutes to produce a film-like heat-sensitive adhesive material. This film-like adhesive material was temporarily attached to a 0.7 mm thick aluminum plate (#280 sandblast), which was then shaped into an ABS resin sheet (0.13 mm thick) with a radius of curvature of 100 mm, 50 mm, and 30 mm, respectively.
A test base consisting of an aluminum plate (0.7 mm thick, #280 sandblasted) was heated at 100℃ for 60 seconds (100g/
A sample piece was created by heat-pressing (pressure at ^cm2 ). This sample piece was subjected to a temperature cycle test for 10 cycles, with the following cycle being one cycle, and the state of peeling at the edges was observed. Its properties are shown in Table 2.

[Table] Judgment method ◎: No peeling at edges.
○: The edges are slightly raised.
As is clear from the above examples, it is clear that the bonding method of the present invention provides good adhesion even in severe temperature cycle tests.

Claims (1)

[Scope of Claims] 1. Good compatibility with 100 parts by weight of a pressure-sensitive adhesive composition that has good pressure-sensitive adhesive properties under normal conditions on the base surface and has a melting point of 70°C or higher. Through a hot pressure-sensitive adhesive material which has a low degree of tackiness at room temperature and which is given pressure-sensitive adhesive function by heating, it is made by adding 50 to 200 parts by weight of a reactive heat-melt resin. A pasting method characterized by overlapping articles to be pasted and then heating or heating and pressurizing them. 2. Claim 1, in which the heat-sensitive adhesive material has short fibers or a reinforcing core material in its material layer.
Pasting method described in section.