JPS6158990B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and more particularly to an improvement in a structure for attaching a semiconductor element to an envelope in a semiconductor device.

In a semiconductor device, one of the means for stereotically fixing a semiconductor element to an envelope is to configure the envelope into a plurality of parts,
Some devices press and fix the semiconductor element to a predetermined position of the envelope by fastening these. The above structure will be explained using a photo interrupter as an example. The photo interrupter is shown in a perspective view in Fig. 1, a top view in Fig. 2, a side view in Figs. 3 and 6, and a view taken along line AA' in Figs. 2 and 3 in Fig. 4. Molded with translucent resin, as shown in the cross-sectional view, Figure 5 is a cross-sectional view taken along line BB' in Figures 2 and 3, and Figure 7 is a cross-sectional view taken along line CC' in Figure 6. The light-emitting element 1 and the light-receiving element 2 molded in the same manner are
For example, the envelopes are disposed facing each other in the recesses 4a and 4b of the envelope 3 , which is molded from a thermoplastic non-transparent resin such as polycarbonate or Noryl, and are arranged so as to form a light guide path between the two elements. Windows 5a and 5b are provided in the windows 5a and 5b. Furthermore, the positional arrangement of both elements in the envelope is such that the convex portions 6a, 6
This is achieved by inserting the adaptable member 6 formed with b and fixing it to the bottom surface of the envelope with an adhesive 7. In the figure, 1a and 1b are both lead wires of the light emitting element 1, 2a and 2b are both lead wires of the light receiving element 2, and 8a and 8b are mounting holes for the photointerrupter.

The photointerrupter having the above-mentioned conventional structure generally has an envelope made of synthetic resin, for example, molded, and therefore has variations in dimensions. In particular, due to variations in the dimensions of the recess in which the element is placed, the dimensions of the element, the dimensions of the applicable member, the position of the window, etc., the mounting position of the element within the recess may not be constant, creating gaps and causing the element to move. A serious drawback is that the performance of the photointerrupter is severely impaired.

A semiconductor device according to the present invention includes first and second housing-shaped envelopes arranged in parallel at a predetermined interval, and a light-passing tube formed on the opposing wall surface of each envelope. a light emitting element and a light receiving element respectively inserted into the housings of the first and second envelopes from below; and inside the housings of the first and second envelopes. first and second supporting adaptive members inserted so as to push each element upward from below and supported and fixed to a part of the wall of each of the envelopes, each of the adaptive members being attached to each upper part of the housing; Each end has a flexible protrusion, and these protrusions are formed to support the respective elements upwardly and in pressure contact with the upper wall surfaces of the first and second envelopes. It is characterized by the fact that

Next, the present invention will be explained in detail with reference to the drawings regarding the differences from the conventional photo interrupter according to one embodiment. It should be noted that the perspective view shown in FIG. 1 and FIGS. 2, 3, and 6 showing cross-sections in one embodiment differ only in the partial numbers of the envelopes, especially the numbers of the envelopes. will be explained using what is shown in parentheses. Figure 8 is similar to Figures 2 and 3.
A cross-sectional view along the line AA', Figure 9 is the same as Figures 2 and 3.
A cross-sectional view taken along line BB' in the figure, Figure 10 is the same as Figure 6.
11 is a sectional view taken along the line CC', and FIG. 11 is a sectional view showing a state in the middle of the process leading to the state shown in FIG.
In the figure, reference numeral 16 denotes an adaptive member to be inserted into the envelope, and the empty portion of the recess that remains after each element is stored in the recesses 4a and 4b for storing the light emitting element and the light receiving element in the envelope. Convex portion 16 filling a part of
a, 16b. This convex portion does not come into direct contact with each element, but is in contact with a protrusion 16p on the surface facing the element that extends toward the element and has a tip pressed against the element. This protrusion is bent due to pressure contact,
The occurrence of deflection is clear with reference to FIG. 11, which shows the process of press-fitting the adaptive member into the envelope. That is, when the adaptive member is located at the entrance of the recesses 4a and 4b of the envelope, the adaptive member pushes and expands the protrusion 13a formed at the inner end of the recess entrance so as to protrude toward the center (11th At the same time as shown in FIG. 2, the protrusion 16p pointing toward the back of the recess does not contact the outer element. Then, as the force in the direction of the arrow is applied and press-fitting continues, the tip of the protrusion comes into contact with the element, and as the press-fitting continues, the protrusion bends and presses the element against the bottom of the recess, after which the protrusion 13a comes out to the outside of the adaptive member and holds it. It takes shape.
That is, the adaptive member has a bend in the protrusion and is fixed while pressing the element deep into the recess. Note that the above-mentioned means for fixing the adaptive members to the envelope is one example of achieving the present invention, and it is possible to fix them together by thermocompression bonding or by using a quick-drying adhesive. Alternatively, these two methods may be used in combination. Next, the variation in dimensions of the element varies greatly depending on the design of the resin molding die, but since the error is generally about 0.1 to 0.5 mm, the deflection of the protrusion need only exceed this dimensional error.

According to this invention, the element can be fixed to the envelope with high positional accuracy, so for example, the element in the photo interrupter of the embodiment can be placed with high precision to the window for transmitting light, and its characteristics can be improved. There are advantages that can be improved. It goes without saying that the present invention is not limited to photointerrupters and can be applied to other semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the photo interrupter, FIG. 2 is a top view of the photo interrupter, FIG. 3 is a side view of the photo interrupter, and FIG. 4 is a sectional view taken along line AA' in FIGS. 2 and 3. Figure 5 is a cross-sectional view taken along line BB' in Figures 2 and 3, Figure 6 is a side view of the photo interrupter, Figure 7 is a cross-sectional view taken along line CC' in Figure 6, Figures 8 onwards. 8 is a sectional view based on FIG. 4, FIG. 9 is a sectional view based on FIG. 5, and FIG. 10 is a sectional view based on FIG. 7. , FIG. 11 is a sectional view showing a state in the middle of the process leading to the state of FIG. 10. 1... Light emitting element, 2... Light receiving element, 3 , 13 ...
... Envelope, 4a, 4b... Recessed portion of the envelope, 5a,
5b...Envelope window, 6 , 16 ...Adaptable member, 6
a, 6b, 16a, 16b... Convex portion of adaptive member,
16p', 16p...Protrusions of adaptive members.

Claims (1)

[Claims] 1. First and second housing-like enclosures arranged in parallel at a predetermined interval, and first and second windows for light passage formed on opposing wall surfaces of each enclosure, respectively. , a light-emitting element and a light-receiving element inserted into the casings of the first and second envelopes from below, respectively, and each element inserted into the casings of the first and second envelopes from below upward. first and second support adaptable members inserted in a pushing-up manner and supported and fixed to a portion of the wall of each of the envelopes, each of the adaptable members having a flexible support member at each upper end thereof; The device is characterized in that it has a protrusion, and is formed such that each of the elements is elastically supported in pressure contact with the upper wall surfaces of the first and second envelopes in an upward direction by the protrusions. Semiconductor equipment.