JPS6161702B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a component mounting structure on an insulating plate of a semiconductor device having a modular structure in which a plurality of semiconductor elements are mounted on an insulating plate and predetermined circuit connections are made.

A modular semiconductor device is made by placing multiple semiconductor elements (hereinafter referred to as pellets) such as thyristors and diodes on an insulating plate, making predetermined circuit connections, and storing them in a single case. Compared to thyristors and diodes of a so-called discreed structure, each housed in a case, and connected to a predetermined circuit, it has advantages such as being easier to implement and being smaller and lighter. It's in the spotlight.

Figure 1 shows a conventional modular structure semiconductor device 1.
00 is shown. The circuit is a three-phase full-wave rectifier circuit using six diode pellets.

In FIG. 1, reference numeral 101 is an insulating plate made of alumina or the like, and a plate-shaped cooling body 103 made of copper or the like is provided on the lower surface of the plate using a solder material 102 such as solder.
Further, on the upper surface, plate-shaped conductors 105a to 105e made of copper or the like are provided via a brazing material 104 such as solder. Among them, conductors 105a to 105
C is for an AC terminal, 105d and 105e are for a DC terminal, and external connection terminals 106a to 106e are also provided with a solder material 107 such as solder. A pellet 1 having a diode effect is formed on the conductors 105d and 105e by a soldering material 108 such as solder.
09a to 109f are provided. pellet 1
09a to 109c are in the same rectification direction,
Although the pellets 109d to 109f are in the same rectifying direction, the rectifying direction of the pellets 109a to 109c is opposite to the rectifying direction of the pellets 109d to 109f. Pellet 109a and 10
9d, 109b and 109e, 109c and 109f
, connecting bodies 110a to 110c are provided using a brazing material 111 such as solder, and the ends of each connecting body 110a to 110c are connected to conductors 106a to 106a.
06c by a solder material 112 such as solder.

Each pellet 109a to 109f and conductor 105
d, 105e and the connecting bodies 110a-110c are in low-resistance contact through the respective brazing materials 108, 111 on the upper and lower main surfaces of each pellet 109a-109f. Each pellet 109a-109
F is coated with a surface stabilizing material such as silicone rubber, and is sealed and housed in a case that is airtightly fixed onto the cooling body 103 .

The inside of the case may be filled with an insulating resin such as epoxy resin. Note that the surface stabilizing material, case, and insulating resin are not shown in FIG.

External connection terminals 106a to 106e protrude from the top of the case, and lead wires are connected thereto.
External connection terminals 106a to 106c are on the AC input side, and 106d and 106e are on the DC output side.

In the module, many parts are brazed onto the insulating plate 101, so it is desirable that the number of parts be as small as possible and that they can be shared.

However, in the conventional device shown in FIG.
5d and 105e, the number of parts was large, many of which could not be shared, and the workability was also poor.

Therefore, an object of the present invention is to provide a semiconductor device having a modular structure, which has a simple structure and good workability.

A feature of the present invention is that the pellets are provided on the conductor on the AC side.

FIG. 2 shows a semiconductor device 200 constituting a three-phase full-wave rectifier circuit according to the present invention.

The semiconductor device 200 in FIG. 2 is a three-phase full-wave rectifier circuit like the semiconductor device 100 in FIG. 1, and is made of similar materials.

In FIG. 2, the bottom surface of the insulating plate 201 has a solder material
A cooling body 203 is provided with a cooling body 203, and conductors 205a to 205e are provided on the upper surface via a solder material 204.
is provided. The conductors 205a to 205c are for AC terminals, and 205d and 205e are for DC terminals. External connection terminals 206a to 206e are provided to each of the conductors 205a to 205e using a solder material 207. Pellets 209a to 209 are formed on the conductors 205a to 205c by a solder material 208.
f is provided. Pellet group 209a-20
9c and the pellet groups 209d to 209f are rectified in the same direction within the pellet group, and in opposite rectifying directions among the pellet groups. Connection body 1
10a, 110b are solder materials 211,
212. Of course, each pellet and connector are low resistance contacts. surface stabilizing material,
The case is omitted as in FIG.

The main difference between the device 200 of the present invention shown in FIG. 2 and the conventional device 100 shown in FIG. 1 is that pellets 209a to 209f are mounted on conductors 205a to 205c on the AC side. be.

Therefore, in the device 200 of the present invention, each pellet 2
The number of brazed objects and the number of connected objects between the conductors 09a to 209c, the conductors 205a to 205e, and the connecting bodies 210a and 210b are reduced by one.

Further, the conductors 205a to 205c have a simple structure in which two pellets 209a to 209f are mounted each, and positioning during work is easy. The heating element is each pellet, but the conductor 205
Since two pellets are placed on each of a to 205c, the first one, which had three pellets each,
Compared to the conventional device 100 shown in the figure, the burden of heat radiation to the cooling body 203 via the conductive insulating plate 201 is lighter, and the heat radiation performance is also better accordingly.

As shown in FIG. 2, a conductor 205 on the DC side
d, 205e on both sides, and conductor 20 on the AC side.
When 5a to 205c are placed in the center, the conductor 205a
205c, 205d and 205e can be of the same shape. That is, if conductors of the same shape are punched out using a press or the like and used with their front and back sides reversed, the conductor 205a becomes 205c, and the conductor 205d becomes 20
It is also used as 5e. Therefore, there is an advantage that the number of parts can be extremely small.

The conductor arrangement shown in FIG. 2 is also advantageous when applying a surface stabilizer to each pellet.

FIG. 3 shows the state in which the surface stabilizing material 213 is applied.

The surface stabilizing material 213 is applied in the form of a viscous fluid and then cured, but when the surface stabilizing material 213 is applied in the form of a fluid, the conductors 205d and 205e on the DC side prevent the surface stabilizing material 213 from flowing. Therefore, as shown in FIG. 3, each pellet 209a to 209
This ensures that the exposed surface of pellets 209a to 209f is covered, thereby preventing deterioration of the characteristics of each pellet 209a to 209f.

Incidentally, although FIG. 3a is a top view, dots are added to areas where the surface stabilizing material 213 is applied.

In the conventional device shown in FIG.
Since there is no member to prevent the surface stabilizing material from flowing out to ~109f, deterioration in properties has often existed, but this problem does not exist in the device of the present invention shown in FIG.

In the above embodiments, the pellets have a diode effect, but they may also have a thyristor effect, or one group of pellets may have a diode effect, and the remaining pellets have a thyristor effect. It may be something that constitutes.

Further, although the explanation has been made using a device that constitutes a three-phase full-wave rectifier circuit, other devices may also be used.

[Brief explanation of the drawing]

FIG. 1 shows a conventional semiconductor device, in which a is a top view, b is a vertical cross-sectional view taken along the line A-A of a, and c is a cross-sectional view taken along the line B-B of a. FIG. 2 shows a semiconductor device according to an embodiment of the present invention, in which a is a top view, b is a vertical sectional view taken along the line C--C of a, and FIG. 3 is a book shown in FIG. 2. In the device of the invention, a state in which a surface stabilizing material is applied is shown, in which a is a top view and b is a longitudinal sectional view taken along the cutting line DD of a. 201... Insulating plate, 203... Cooling body, 205
a to 205e... conductor, 206a to 206e...
...External connection terminal, 209a-209f...Pellet, 210a, 210b...Connection body, 202,2
04,207,208,211,212...Brazing material.

Claims (1)

[Claims] 1. A plurality of conductors, the number of which corresponds to the number of alternating current phases, are provided on an insulating plate, and at least two semiconductor elements with different rectification directions are arranged on one main surface of each semiconductor element. are provided in low resistance contact with each of the conductors, and each of at least two connecting bodies is provided on the other main surface of each of the semiconductor elements which are on each of the conductors and are in the same rectifying direction. 1. A semiconductor device, wherein the connecting bodies are provided in a low-resistance contact manner, and each of the connecting bodies is connected to a DC-side conductor provided on the insulating plate. 2. A semiconductor device according to claim 1, characterized in that the conductor on the DC side is located on both sides of the conductor on the AC side.