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JPS6210256B2 - - Google Patents
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JPS6210256B2 - - Google Patents

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Publication number
JPS6210256B2
JPS6210256B2 JP53058566A JP5856678A JPS6210256B2 JP S6210256 B2 JPS6210256 B2 JP S6210256B2 JP 53058566 A JP53058566 A JP 53058566A JP 5856678 A JP5856678 A JP 5856678A JP S6210256 B2 JPS6210256 B2 JP S6210256B2
Authority
JP
Japan
Prior art keywords
molecular weight
low molecular
vinyl acetate
parts
copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53058566A
Other languages
Japanese (ja)
Other versions
JPS54149753A (en
Inventor
Nobuo Mizuno
Teruo Iwanami
Masao Tomita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Nippon Synthetic Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Synthetic Chemical Industry Co Ltd filed Critical Nippon Synthetic Chemical Industry Co Ltd
Priority to JP5856678A priority Critical patent/JPS54149753A/en
Publication of JPS54149753A publication Critical patent/JPS54149753A/en
Publication of JPS6210256B2 publication Critical patent/JPS6210256B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は、エチレン―酢酸ビニル共重合体ケン
化物と該共重合体ケン化物以外の熱可塑性樹脂と
を共押出成形する方法に関するものである。 エチレン―酢酸ビニル共重合体ケン化物は溶融
状態では金属との密着性が大きいため、溶融成形
中機壁と接触する個所の樹脂の流れが悪く、ロン
グラン成形する次第にスクリユートルクが増大
し、安定連転ができなくなるという問題点があ
る。 そこで、この問題点を解決するために、エチレ
ン―酢酸ビニル共重合体ケン化物に滑剤として少
量のステアリン酸金属塩やプロピレンビスアマイ
ドなどを配合して溶融成形に供することが従来よ
りなされている。 しかしながら、エチレン―酢酸ビニル共重合体
ケン化物を該共重合体ケン化物以外の熱可塑性樹
脂と共押出成形するにあたり、ステアリン酸金属
塩やプロピレンビスアマイドなど従来使用されて
いる滑剤を配合すると、両層間の接着力が著しく
低下し、層間剥離を起こすという問題点が発生す
る。また成形中これらの滑剤が熱分解して、着色
の原因となつたり、異臭の原因となつたりするこ
とがある。 また特開昭52―77160号公報には、エチレン―
ビニルアルコール共重合体80〜99重量部に可塑性
として融点60〜140℃のオレフイン系重合体を1
〜20重量部添加することにより、耐気体透過性を
維持しながら成形加工性を向上させることが開示
されており、具体的にはブラベンダープラストグ
ラフまたは高化式ブローテスターにてゲル化負
荷、平衡負荷、溶融粘度を測定したときの実験結
果が示されている。 この特開昭52―77160号公報の記載に従い、エ
チレン―酢酸ビニル共重合体ケン化物に融点60〜
140℃のオレフイン系重合体を1〜20重量%添加
して前記共重合体ケン化物の溶融成形を行うと、
熱分解による着色や異臭のおそれはなくなるが、
この技術を前記共重合体ケン化物と他の熱可塑性
樹脂との共押出成形に適用した場合は、両層間の
接着力が低下し、層間剥離を起こすという問題点
がある。 本発明は、上述のように従来使用されている滑
剤または可塑剤を共押出成形に応用したときに生
ずる問題点を解決することを目的になされたもの
である。 本発明の共押出成形物の製造法は、エチレン含
量15〜55モル%、酢酸ビニル成分のケン化度90モ
ル%以上のエチレン―酢酸ビニル共重合体ケン化
物(A)と該共重合体ケン化物(A)以外の熱可塑性樹脂
(B)とを共押出成形するにあたり、前記エチレン―
酢酸ビニ−ル共重合体ケン化物(A)100重量部に対
し分子量500〜10000の低分子量ポリオレフイン
0.01〜0.5重量部を配合して成形を行うことを特
徴とするものである。 本発明の方法により共押出成形を行えば、成形
上のトラブルを生じないばかりでなく、層間密着
性のすぐれた共押出成形物が得られるので、この
共押出成形物を二次加工に供したり、これに食品
等を充填して流通に供しても層間剥離、破袋など
が起こらず、信頼性が高い。 以下本発明を詳細に説明する。 本発明に用いられるエチレン―酢酸ビニル共重
合体ケン化物(A)としてはエチレン含量15〜55モル
%、酢酸ビニル成分のケン化度90モル%以上の組
成を有するものがあげられる。エチレン含量15モ
ル%未満では溶融成形性が低下し、エチレン含量
が55モル%を越える場合はポリエチレンに近くな
るため酸素遮断性が劣り、熱変形性、耐油性も低
下するので、ともに本発明の目的には適当でな
い。また酢酸ビニル成分のケン化度が90モル%未
満の場合は、熱安定性が不良となる上、酸素遮断
性が劣り、力学的性質、熱変形性、耐水性、耐油
性を充分でないので、実用性に乏しい。 なお上記エチレン―酢酸ビニル共重合体ケン化
物(A)は、エチレンと酢酸ビニル(或いはそれをケ
ン化したビニルアルコール)のほかに、不飽和カ
ルボン酸またはそのエステルまたは塩、不飽和ス
ルホン酸またはその塩、(メタ)アクリルアミ
ド、(メタ)アクリロニトリル、プロピレン、ブ
テン、α―オクテン、α―オクタデセンなどのα
―オレフイン、酢酸ビニル以外のビニルエステル
などの第三成分を10モル%程度以下含んでいても
よい。 次に、分子量500〜10000の低分子量ポリオレフ
インとしては、低分子量ポリエチレンまたは低分
子量ポリプロピレンが用いられる。これらの誘導
体(共重合変性物やグラフト変性物など)も同様
に用いられる。かかる分子量を有するものはプラ
スチツクの範ちゆうには入らず、かと言つて極端
に分子量が小さいものでもなく、その中間領域に
あり、広義のワツクスとも言える。形状は白色の
粉末である。軟化点は低分子量ポリエチレンの場
合で約95〜115℃、低分子量ポリプロピレンの場
合で約130〜160℃、比重は低分子量ポリエチレン
の場合で約0.90〜0.95、低分子量ポリプロピレン
の場合で約0.88〜0.93である。 低分子量ポリオレフインの分子量が500未満で
は、低分子量ポリオレフインが界面にブリードし
て層間の密着性を阻害するおそれがあり、一方分
子量が10000を越える場合はエチレン―酢酸ビニ
ル共重合体ケン化物(A)との相溶性が不足して肌荒
れの原因となる。特に好ましい分子量範囲は1000
〜8000である。 エチレン―酢酸ビニル共重合体ケン化物(A)100
重量部に対する低分子量ポリオレフインの配合量
は0.01〜0.5重量部、好ましくは0.05〜0.5重量部
の範囲内から選ぶべきであり、0.01重量%未満で
は改質効果が乏しく、一方、0.5重量%を越える
ときはエチレン―酢酸ビニル共重合体ケン化物(A)
の有する特質(酸素遮断性、耐油性、耐溶剤性、
剛性、寸法安定性等)を損なうようになる上、層
間の密着性を損なうようになり、またその量がさ
らに多くなると混練時または押出成形時に低分子
量ポリオレフインの有する外部滑性のためにスリ
ツプし、加工が困難となる。 エチレン―酢酸ビニル共重合体ケン化物(A)の粉
末またはペレツトに低分子量ポリオレフインを加
えてヘンシエルミキサー、タンブラー等で混合し
た後は、そのまま共押出成形に供してもよく、あ
るいは一旦この混合物をペレツト化してから共押
出成形に供してもよい。 共押出成形に際しての温度条件は、約160〜260
℃に設定するのが望ましい。成形に際しては、エ
チレン―酢酸ビニル共重合体ケン化物(A)または該
共重合体ケン化物(A)以外の熱可塑性樹脂(B)の少な
くとも一方に、必要に応じガラス繊維、炭素繊維
などの補強材、フイラー、着色剤、安定剤、発泡
剤などの公知の添加剤を適当量配合することもで
きる。 共押出成形法としては、たとえばT―ダイ法、
中空成形法、パイプ押出法、異型ダイ押出法、線
条押出法、インフレーシヨン法などが採用でき
る。 エチレン―酢酸ビニル共重合体ケン化物(A)以外
の熱可塑性樹脂(B)としては、低密度ポリエチレ
ン、中密度ポリエチレン、高密度ポリエチレン、
エチレン―酢酸ビニル共重合体、アイオノマー、
エチレン―α―オレフイン(炭素数3〜20のα―
オレフイン)共重合体、エチレン―アクリル酸エ
ステル共重合体、ポリプロピレン、プロピレン―
α―オレフイン(炭素数4〜20のα―オレフイ
ン)共重合体、ポリブテン、ポリペンテンなどの
オレフインの単独または共重合体、あるいはこれ
らのオレフインの単独または共重合体を不飽和カ
ルボン酸またはそのエステルでグラフト変性した
ものなど広義のポリオレフイン系樹脂が好適に用
いられ、そのほか、ポリエステル、ポリアミド、
共重合ポリアミド、ポリ塩化ビニル、ポリ塩化ビ
ニリデン、アクリル系樹脂、スチレン系樹脂、ビ
ニルエステル系樹脂、ポリエステルエラストマ
ー、ポリウレタンエラストマー、塩素化ポリエチ
レン、塩素化ポリプロピレンなども用いられる。
上記エチレン―酢酸ビニル共重合体ケン化物(A)と
は組成の違うエチレン―酢酸ビニル共重合体ケン
化物(A)も用いることができる。 共押出に際しての層構成は、エチレン―酢酸ビ
ニル共重合体ケン化物層をA(A1,A2、…)、
他の熱可塑性樹脂層をB(B1,B2、…)とする
とき、フイルム、シート、ボトルなどであれば、
A/Bの2層構造のみならず、B/A/B、A/
B/A、A1/A2/B、A/B1/B2、B/A/
B/A/B、B2/B1/A/B1/B2など任意の組
合せが可能であり、フイラメント状であれば、
A/Bのバイメタル型、芯(A)―鞘(B)型、芯(B)―鞘
(A)型、あるいは偏心芯鞘型などの任意の組合せが
可能である。 またエチレン―酢酸ビニル共重合体ケン化物(A)
に他の熱可塑性樹脂(B)、他の熱可塑性樹脂(B)にエ
チレン―酢酸ビニル共重合体ケン化物(A)をブレン
ドしたり、(A)や(B)の少なくとも一方に両層間の密
着性を向上させる密着性付与樹脂を配合すること
もできる。 上記のようにして得られた共押出成形法は、必
要に応じ熱処理、冷却処理、圧延処理、一軸また
は二軸延伸処理、印刷、ドライラミネート処理、
溶液または溶融コート処理、製袋加工、深しぼり
加工、箱加工、チユーブ加工等を行なうことがで
きる。 本発明の方法により得られる共押出成形物は、
包装用材をはじめ広い分野に使用できる。 次に実施例をあげて本発明をさらに説明する。
以下「部」、「%」とあるのは特にことわりのない
限り重量基準で表わしたものである。 実施例 1 次の条件で三層ブロー成形を行なつた。 使用樹脂 (A):エチレン含量33モル%、酢酸ビニル成分のケ
ン化度、99.5モル%のエチレン―酢酸ビニル共
重合体ケン化物100部に、分子量2000、温度140
℃における溶融粘度2.9ポイズ、軟化点107℃、
比重0.93の白色粉末状の低分子量ポリエチレン
を、0.2部配合し、一旦押出機にてペレツト化
した組成物。 (B1):ポリプロピレンをカルボン酸で0.3%変性
した変性ポリプロピレン。 (B2):メルトインデツクス0.8のポリプロピレ
ン。 成形条件 押出機(A)用 30mm径押出機(内層用) (B1)用 30mm径押出機(中間層用) (B2)用 65mm径押出機(外層用) スクリユー 共にL/D=28、圧縮比3.2 ダイス三層ダイ、マンドレル径26mmφ、コア径
22mmφ 押出温度 シリンダー先端部 (A):240℃、 (B1):220℃ (B2):220℃ ダイ 200℃ スクリユー回転数 (A)用 40rpm (B1)用 40rpm (B2)用 100rpm 成形品形状 容量 300c.c.の中空ボトル 肉厚内層: (A) 30μ 中間層:(B1) 30μ 外層: (B2) 330μ 実施例 2 実施例1の低分子量ポリエチレンに代えて、分
子量5000、温度140℃における溶融粘度43ポイ
ズ、軟化点111℃、比重0.93の白色粉末状の低分
子量ポリエチレンを用いたほかは実施例1と同様
にして中空ボトルを製造した。 対照例 1 低分子量ポリエチレンを加えなかつたほかは実
施例1と同様にして中空ボトルを製造しようとし
たが、成形開始後4時間もするとスクリユートル
クが顕著に増大し、ロングラン成形は到底不可能
であつた。 対照例 2〜5 低分子量ポリエチレン0.2部に代えて、プロピ
レンビスアマイド0.2部(対照例2)、ステアリン
酸カルシウム0.2部(対照例3)を用いたほかは
実施例1と同様にして中空ボトルを製造した。 また、低分子量ポリエチレンの配合を2.2部
(対照例4)、同じく低分子量ポリエチレンの配合
を5個(対照例5)としたほかは実施例1と同様
にして中空ボトルを製造した。 以上実施例1〜2、対照例1〜5の結果を第1
表に示す。
The present invention relates to a method for coextruding a saponified ethylene-vinyl acetate copolymer and a thermoplastic resin other than the saponified copolymer. Saponified ethylene-vinyl acetate copolymer has strong adhesion to metal in the molten state, so the flow of the resin at the point where it comes into contact with the machine wall during melt molding is poor, and the screw torque increases and becomes stable during long-run molding. There is a problem that continuous rotation is no longer possible. Therefore, in order to solve this problem, it has conventionally been done to blend a small amount of a metal stearate, propylene bisamide, etc. as a lubricant into a saponified ethylene-vinyl acetate copolymer and then subject it to melt molding. However, when coextruding a saponified ethylene-vinyl acetate copolymer with a thermoplastic resin other than the saponified copolymer, if conventionally used lubricants such as metal stearate and propylene bisamide are added, both A problem arises in that the adhesion between the layers is significantly reduced, causing delamination. Furthermore, during molding, these lubricants may thermally decompose, causing coloring or an unpleasant odor. Moreover, in Japanese Patent Application Laid-Open No. 52-77160, ethylene-
Add 1 part of an olefin polymer with a melting point of 60 to 140℃ to 80 to 99 parts by weight of vinyl alcohol copolymer for plasticity.
It is disclosed that adding ~20 parts by weight improves molding processability while maintaining gas permeability resistance. Specifically, gelation load, Experimental results are shown when measuring equilibrium load and melt viscosity. According to the description in JP-A-52-77160, a saponified ethylene-vinyl acetate copolymer with a melting point of 60 to
When 1 to 20% by weight of an olefinic polymer at 140°C is added and the saponified copolymer is melt-molded,
There is no risk of coloring or odor caused by thermal decomposition, but
When this technique is applied to coextrusion molding of the saponified copolymer and other thermoplastic resin, there is a problem that the adhesive force between both layers decreases, causing delamination. The present invention was made to solve the problems that occur when conventionally used lubricants or plasticizers are applied to coextrusion molding as described above. The method for producing a coextrusion product of the present invention involves combining a saponified ethylene-vinyl acetate copolymer (A) with an ethylene content of 15 to 55 mol% and a degree of saponification of the vinyl acetate component of 90 mol% or more; Thermoplastic resins other than compounds (A)
In coextrusion molding with (B), the ethylene-
Low molecular weight polyolefin with a molecular weight of 500 to 10,000 per 100 parts by weight of saponified vinyl acetate copolymer (A)
It is characterized in that 0.01 to 0.5 parts by weight is blended and molded. If coextrusion molding is carried out by the method of the present invention, not only will there be no molding troubles, but also a coextrusion molded product with excellent interlayer adhesion can be obtained, so this coextrusion molded product can be used for secondary processing. Even when this is filled with food and distributed, it does not cause delamination or bag breakage, and is highly reliable. The present invention will be explained in detail below. The saponified ethylene-vinyl acetate copolymer (A) used in the present invention includes those having an ethylene content of 15 to 55 mol% and a degree of saponification of the vinyl acetate component of 90 mol% or more. If the ethylene content is less than 15 mol%, melt moldability will decrease, and if the ethylene content exceeds 55 mol%, it will become close to polyethylene, resulting in poor oxygen barrier properties, as well as poor heat deformability and oil resistance. Not suitable for purpose. In addition, if the degree of saponification of the vinyl acetate component is less than 90 mol%, the thermal stability will be poor, the oxygen barrier property will be poor, and the mechanical properties, heat deformability, water resistance, and oil resistance will not be sufficient. Poor practicality. The saponified ethylene-vinyl acetate copolymer (A) contains, in addition to ethylene and vinyl acetate (or vinyl alcohol obtained by saponifying it), an unsaturated carboxylic acid or its ester or salt, an unsaturated sulfonic acid or its α-salts, (meth)acrylamide, (meth)acrylonitrile, propylene, butene, α-octene, α-octadecene, etc.
- It may contain about 10 mol% or less of a third component such as olefin and vinyl ester other than vinyl acetate. Next, as the low molecular weight polyolefin having a molecular weight of 500 to 10,000, low molecular weight polyethylene or low molecular weight polypropylene is used. Derivatives of these (copolymer modified products, graft modified products, etc.) can also be used in the same manner. Materials having such molecular weights do not fall into the category of plastics, nor do they have extremely low molecular weights, but are in the intermediate range, and can be said to be waxes in a broad sense. The form is a white powder. The softening point is approximately 95 to 115°C for low molecular weight polyethylene, approximately 130 to 160°C for low molecular weight polypropylene, and the specific gravity is approximately 0.90 to 0.95 for low molecular weight polyethylene and approximately 0.88 to 0.93 for low molecular weight polypropylene. It is. If the molecular weight of the low molecular weight polyolefin is less than 500, the low molecular weight polyolefin may bleed to the interface and impede the adhesion between the layers, while if the molecular weight exceeds 10,000, saponified ethylene-vinyl acetate copolymer (A) Insufficient compatibility with the skin can cause rough skin. A particularly preferred molecular weight range is 1000
~8000. Saponified ethylene-vinyl acetate copolymer (A) 100
The amount of low molecular weight polyolefin to be added to parts by weight should be selected within the range of 0.01 to 0.5 parts by weight, preferably 0.05 to 0.5 parts by weight; less than 0.01 parts by weight will result in poor modification effect, while more than 0.5 parts by weight. Tokiha saponified ethylene-vinyl acetate copolymer (A)
Characteristics (oxygen barrier, oil resistance, solvent resistance,
(rigidity, dimensional stability, etc.) and the adhesion between the layers.If the amount increases even further, the external lubricity of the low molecular weight polyolefin may cause slippage during kneading or extrusion molding. , machining becomes difficult. After adding a low molecular weight polyolefin to the saponified ethylene-vinyl acetate copolymer (A) powder or pellets and mixing with a Henschel mixer, tumbler, etc., the mixture may be subjected to coextrusion molding as it is, or the mixture may be subjected to coextrusion molding. It may be pelletized and then subjected to coextrusion molding. The temperature conditions for coextrusion molding are approximately 160 to 260℃.
It is preferable to set it at ℃. During molding, at least one of the saponified ethylene-vinyl acetate copolymer (A) or a thermoplastic resin other than the saponified copolymer (A) (B) may be reinforced with glass fiber, carbon fiber, etc. as necessary. Appropriate amounts of known additives such as materials, fillers, colorants, stabilizers, and blowing agents can also be blended. Examples of coextrusion molding methods include T-die method,
Blow molding method, pipe extrusion method, profile die extrusion method, line extrusion method, inflation method, etc. can be adopted. Thermoplastic resins (B) other than saponified ethylene-vinyl acetate copolymer (A) include low-density polyethylene, medium-density polyethylene, high-density polyethylene,
Ethylene-vinyl acetate copolymer, ionomer,
Ethylene-α-olefin (α- with 3 to 20 carbon atoms)
Olefin) copolymer, ethylene-acrylic acid ester copolymer, polypropylene, propylene
α-olefin (α-olefin having 4 to 20 carbon atoms) copolymer, a single or copolymer of olefin such as polybutene, polypentene, or a single or copolymer of these olefins with an unsaturated carboxylic acid or an ester thereof. Polyolefin resins in a broad sense, such as graft-modified ones, are preferably used, and in addition, polyesters, polyamides,
Copolymerized polyamide, polyvinyl chloride, polyvinylidene chloride, acrylic resin, styrene resin, vinyl ester resin, polyester elastomer, polyurethane elastomer, chlorinated polyethylene, chlorinated polypropylene, etc. are also used.
A saponified ethylene-vinyl acetate copolymer (A) having a different composition from the above-mentioned saponified ethylene-vinyl acetate copolymer (A) can also be used. The layer structure during coextrusion is the saponified ethylene-vinyl acetate copolymer layer A (A1, A2,...),
When other thermoplastic resin layers are B (B1, B2,...), if it is a film, sheet, bottle, etc.
Not only A/B two-layer structure, but also B/A/B, A/
B/A, A1/A2/B, A/B1/B2, B/A/
Any combination such as B/A/B, B2/B1/A/B1/B2 is possible, and if it is filament-like,
A/B bimetal type, core (A) - sheath (B) type, core (B) - sheath
Any combination such as type (A) or eccentric core-sheath type is possible. Also saponified ethylene-vinyl acetate copolymer (A)
Blend the saponified ethylene-vinyl acetate copolymer (A) with the other thermoplastic resin (B), or blend the saponified ethylene-vinyl acetate copolymer (A) with the other thermoplastic resin (B), or An adhesion-imparting resin that improves adhesion may also be blended. The coextrusion molding method obtained as described above includes heat treatment, cooling treatment, rolling treatment, uniaxial or biaxial stretching treatment, printing, dry lamination treatment,
Solution or melt coating processing, bag making processing, deep drawing processing, box processing, tube processing, etc. can be performed. The coextrusion molded product obtained by the method of the present invention is
It can be used in a wide range of fields including packaging materials. Next, the present invention will be further explained with reference to Examples.
Hereinafter, "parts" and "%" are expressed on a weight basis unless otherwise specified. Example 1 Three-layer blow molding was performed under the following conditions. Resin used (A): ethylene content 33 mol%, saponification degree of vinyl acetate component, 100 parts of saponified ethylene-vinyl acetate copolymer with 99.5 mol%, molecular weight 2000, temperature 140.
Melt viscosity at ℃ 2.9 poise, softening point 107℃,
A composition containing 0.2 parts of low molecular weight polyethylene in the form of white powder with a specific gravity of 0.93 and pelletizing it using an extruder. (B1): Modified polypropylene made by modifying polypropylene with 0.3% carboxylic acid. (B2): Polypropylene with melt index 0.8. Molding conditions For extruder (A) 30 mm diameter extruder (for inner layer) For (B1) 30 mm diameter extruder (for middle layer) For (B2) 65 mm diameter extruder (for outer layer) Screw Both L/D = 28, compression Ratio 3.2 die three-layer die, mandrel diameter 26mmφ, core diameter
22mmφ Extrusion temperature Cylinder tip (A): 240℃, (B1): 220℃ (B2): 220℃ Die 200℃ Screw rotation speed (A) 40rpm (B1) 40rpm (B2) 100rpm Molded product shape Capacity Hollow bottle of 300c.c. Wall thickness inner layer: (A) 30μ Intermediate layer: (B1) 30μ Outer layer: (B2) 330μ Example 2 Instead of the low molecular weight polyethylene of Example 1, polyethylene with a molecular weight of 5000 and melted at a temperature of 140℃ was used. A hollow bottle was produced in the same manner as in Example 1, except that white powdery low molecular weight polyethylene having a viscosity of 43 poise, a softening point of 111° C., and a specific gravity of 0.93 was used. Control Example 1 An attempt was made to manufacture a hollow bottle in the same manner as in Example 1 except that low molecular weight polyethylene was not added, but the screw torque increased significantly after 4 hours after the start of molding, making long-run molding impossible. It was hot. Control Examples 2 to 5 Hollow bottles were produced in the same manner as in Example 1, except that 0.2 parts of propylene bisamide (Control Example 2) and 0.2 parts of calcium stearate (Control Example 3) were used in place of 0.2 parts of low molecular weight polyethylene. did. Further, hollow bottles were produced in the same manner as in Example 1, except that the proportion of low molecular weight polyethylene was 2.2 parts (Comparative Example 4) and the proportion of low molecular weight polyethylene was 5 parts (Comparative Example 5). The results of Examples 1 to 2 and Control Examples 1 to 5 above are summarized as
Shown in the table.

【表】 実施例 3 次の条件でT―ダイ押出法により二層フイルム
を製造した。 使用樹脂 (A):エチレン含量48モル%、酢酸ビニル成分のケ
ン化度92.5モル%のエチレン―酢酸ビニル共重
合体ケン化物100部に、分子量3500、温度140℃
における溶融粘度10ポイズ、軟化点108℃、比
重0.93の白色粉末状の低分子量ポリエチレンを
0.4部配合して得られた粉末組成物。 (B):酢酸ビニル含量5%、メルトインデツクス2
のエチレン―酢酸ビニル共重合体 成形条件 押出機(A用) 40mm径押出機 (B用) 90mm径押出機 スクリユー 共にL/D=28、圧縮比4.8 ダイスマニホールドタイプ二層ダイ、ダイ巾
1000mm、リツプ巾0.7mm 押出温度 シリンダー先端部 (A):210℃、 (B):220℃ ダイ 200℃ スクリユー回転数 (A)用 80rpm (B)用 100rpm 引取速度 80m/min 冷却条件 35℃の冷却ロール上に押出し 膜厚80μ (A)層:20μ (B)層:60μ 実施例 4 低分子量ポリエチレンに代えて、分子量1500、
温度190℃における溶融粘度1.8ポイズ、軟化点
105℃、比重0.90の白色粉末状の低分子量ポリプ
ロピレンを用いたほかは実施例3と同様にして二
層フイルムを得た。 対照例 76〜9 低分子量ポリエチレン0.4部に代えて、ステア
リン酸カルシウム0.4部(対照例6)、ステアリン
酸バリウム0.4部(対照例7)を用いたほかは実
施例3と同様にして二層フイルムを得た。 また、低分子量ポリエチレンの配合を2.2部
(対照例8)、同じく低分子量ポリエチレンの配合
を5部(対照例9)としたほかは実施例3と同様
にして二層フイルムを得た。 以上実施例3〜4、対照例6〜9の結果を第2
表に示す。
[Table] Example 3 A two-layer film was produced by T-die extrusion under the following conditions. Resin used (A): 100 parts of a saponified ethylene-vinyl acetate copolymer with an ethylene content of 48 mol% and a degree of saponification of the vinyl acetate component of 92.5 mol%, a molecular weight of 3500, and a temperature of 140°C.
Low molecular weight polyethylene in the form of white powder with a melt viscosity of 10 poise, a softening point of 108°C, and a specific gravity of 0.93.
A powder composition obtained by blending 0.4 parts. (B): Vinyl acetate content 5%, melt index 2
Molding conditions for ethylene-vinyl acetate copolymer Extruder (for A) 40 mm diameter extruder (for B) 90 mm diameter extruder Screw Both L/D = 28, compression ratio 4.8 Die manifold type double layer die, die width
1000mm, lip width 0.7mm Extrusion temperature Cylinder tip (A): 210℃, (B): 220℃ Die 200℃ Screw rotation speed (A) 80rpm (B) 100rpm Take-up speed 80m/min Cooling condition 35℃ Extruded onto a cooling roll Film thickness: 80μ (A) layer: 20μ (B) layer: 60μ Example 4 Instead of low molecular weight polyethylene, molecular weight 1500,
Melt viscosity 1.8 poise at temperature 190℃, softening point
A two-layer film was obtained in the same manner as in Example 3 except that white powdery low molecular weight polypropylene with a specific gravity of 0.90 was used at 105°C. Control Examples 76-9 A two-layer film was prepared in the same manner as in Example 3, except that 0.4 parts of calcium stearate (Control Example 6) and 0.4 parts of barium stearate (Control Example 7) were used in place of 0.4 parts of low molecular weight polyethylene. Obtained. Further, a two-layer film was obtained in the same manner as in Example 3, except that the low molecular weight polyethylene was mixed at 2.2 parts (Control Example 8) and the low molecular weight polyethylene was mixed at 5 parts (Control Example 9). The results of Examples 3 and 4 and Control Examples 6 and 9 above are summarized in the second section.
Shown in the table.

【表】【table】

Claims (1)

【特許請求の範囲】 1 エチレン含量15〜55モル%、酢酸ビニル成分
のケン化度90モル%以上のエチレン−酢酸ビニル
共重合体ケン化物(A)と該共重合体ケン化物(A)以外
の熱可塑性樹脂(B)とを共押出成形するにあたり、
前記エチレン―酢酸ビニル共重合体ケン化物(A)
100重量部に対し分子量500〜10000の低分子量ポ
リオレフイン0.01〜0.5重量部を配合して成形を
行うことを特徴とする共押出成形物の製造法。 2 低分子量ポリオレフインの分子量が1000〜
8000である特許請求の範囲第1項記載の製造法。 3 低分子量ポリオレフインが低分子量ポリエチ
レンまたはその誘導体である特許請求の範囲第1
項記載の製造法。 4 低分子量ポリオレフインが低分子量ポリプロ
ピレンまたはその誘導体である特許請求の範囲第
1項記載の製造法。
[Scope of Claims] 1. A saponified ethylene-vinyl acetate copolymer (A) having an ethylene content of 15 to 55 mol% and a saponification degree of vinyl acetate component of 90 mol% or more, and a saponified copolymer other than the saponified copolymer (A). When coextruding with the thermoplastic resin (B),
Said saponified ethylene-vinyl acetate copolymer (A)
1. A method for producing a coextruded product, which comprises blending 0.01 to 0.5 parts by weight of a low molecular weight polyolefin with a molecular weight of 500 to 10,000 to 100 parts by weight. 2 The molecular weight of low molecular weight polyolefin is 1000~
8000, the manufacturing method according to claim 1. 3 Claim 1 in which the low molecular weight polyolefin is low molecular weight polyethylene or a derivative thereof
Manufacturing method described in section. 4. The manufacturing method according to claim 1, wherein the low molecular weight polyolefin is low molecular weight polypropylene or a derivative thereof.
JP5856678A 1978-05-16 1978-05-16 Molding composition Granted JPS54149753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5856678A JPS54149753A (en) 1978-05-16 1978-05-16 Molding composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5856678A JPS54149753A (en) 1978-05-16 1978-05-16 Molding composition

Publications (2)

Publication Number Publication Date
JPS54149753A JPS54149753A (en) 1979-11-24
JPS6210256B2 true JPS6210256B2 (en) 1987-03-05

Family

ID=13087989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5856678A Granted JPS54149753A (en) 1978-05-16 1978-05-16 Molding composition

Country Status (1)

Country Link
JP (1) JPS54149753A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58128817A (en) * 1982-01-26 1983-08-01 Toppan Printing Co Ltd Manufacturing of modified film
JPS62106904A (en) * 1985-11-05 1987-05-18 Nippon Synthetic Chem Ind Co Ltd:The Method for producing saponified ethylene-vinyl acetate copolymer pellets with improved quality
JP3063864B2 (en) * 1991-06-24 2000-07-12 日本合成化学工業株式会社 Process for producing saponified ethylene-vinyl acetate copolymer molded article

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832574A (en) * 1971-08-30 1973-04-28
JPS5141746A (en) * 1974-10-07 1976-04-08 Toyo Boseki HORIPUROPIRENSOSEIBUTSUNO SEIZOHOHO
JPS5277160A (en) * 1975-12-24 1977-06-29 Kureha Chem Ind Co Ltd Ethylene-vinyl alcohol copolymer compositions
JPS52128932A (en) * 1976-04-23 1977-10-28 Toyo Soda Mfg Co Ltd Adhesive composition

Also Published As

Publication number Publication date
JPS54149753A (en) 1979-11-24

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