JPS6211503B2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a wafer positioning device used when manufacturing ICs and the like.

The wafer has a circular outer shape as shown in FIG. 1, and an orientation flat 2 that serves as a reference for positioning is provided in a part of the outer shape.

Such a wafer 1 positioning device has problems such as a complicated structure.

(b) Object of the Invention The present invention provides a device that enables accurate positioning with a simple structure that mainly involves setting the position of the guide end surface with respect to the driving roller.

(c) Embodiment of the invention First, FIG. 2 shows an external view of an embodiment of the invention.

In Figure 2, 3 is a driving roller, 4 is a guide, and 5
is an end face of the guide 4, 6 and 7 are freely rotating rollers, 8 is a table on which the wafer 1 is placed, 9 is a guide, 10
is the end face of the guide 9.

In FIG. 2, the wafer 1 is placed on the stand 8, and the roller 6
This shows a state in which the wafer 1 is being rotated by the rotation of the roller 3 while the wafer 1 is pressed against the roller 3 side by the roller 7.

Next, FIG. 3 shows a top view of FIG. 2.

A force is constantly applied to the rollers 6 and 7 to press the wafer 1 toward the roller 3, and as the wafer 1 rotates, the rollers 6 and 7 rotate freely.

When placing the wafer 1 on the stand 8, keep the rollers 6 and 7 away from the stand 8, and place the wafer 1 on the stand 8.
After the wafer 1 is placed on the roller 3, the rollers 6 and 7 are pressed against the roller 3 using a spring (not shown), and the wafer 1 is brought into contact with the roller 3.

In addition, in FIGS. 2 and 3, the wafer 1 is placed on the roller 3.
Although rollers 6 and 7 are used for contacting the rollers, two or more rollers may be used.

In FIG. 3, the end surface 5 and the end surface 10 are arranged so as to be on the same line, and the roller 3 is arranged at a position opposite to the wafer 1 with respect to the extension line of the end surface 5 and the end surface 10.

Since the wafer 1 has a circular outer shape, it contacts the roller 3 but rotates without contacting the guides 4 and 9.

Next, FIGS. 4 and 5 show partially enlarged views of the main parts when the wafer 1 is further rotated from the state shown in FIG. 3.

FIG. 4 shows a state in which the wafer 1 is rotated and the orientation flat 2 is in contact with the roller 3.

In the state shown in FIG. 4, the wafer 1 is being pushed by the rollers 6 and 7, so that the portion of the wafer 1 other than the orientation flat 2 comes into contact with the end of the guide 9.

When the wafer 1 and the guide 9 come into contact, the rotation of the wafer 1 is braked by frictional force, but if the rotational force of the roller 3 is stronger, the wafer 1 continues to rotate.

FIG. 5 shows a state in which the orientation flat 2 is in contact with the end surface 5 of the guide 4 and the end surface 10 of the guide 9.

In the state shown in FIG. 5, the end surface 5 and the end surface 1 are
0 and the position of roller 3.

Therefore, in the state shown in FIG.
and fixed at the end face 10.

In FIGS. 2 to 5, the end surface 5 and the end surface 10 are arranged, so if the end surface 5 and the end surface 10 respectively contact the orientation flat 2, the wafer 1
rotation can be reliably stopped.

On the other hand, the end face 5 of the guide 4 or the guide 9
It is possible to operate only one of the end faces 10 of.

When using only one guide, either guide 4 or guide 9 may be used, but when rotating roller 3 clockwise as shown in Figures 2 to 5, guide 4 may be used. It is better to use the guide 9 when rotating the roller 3 counterclockwise.

This is because there is no phenomenon in which the portion of the wafer 1 other than the orientation flat 2 comes into contact with the guide as shown in FIG. 4, and the operation becomes more reliable.

(e) Effect of the invention According to the invention, when the orientation flat 2 contacts the end face 5 and the end face 10, the wafer 1
Since the rotation of the wafer 1 is stopped, the position of the wafer 1 can be set accurately.

[Brief explanation of the drawing]

FIG. 1 is an external view of a wafer, FIG. 2 is an external view of an embodiment according to the present invention, and FIG. 3 is a top view of FIG.
4 and 5 are partially enlarged views of the main parts when the wafer 1 is further rotated from FIG. 3. 1... Wafer, 2... Orientation flat, 3... Roller, 4... Guide, 5... End face, 6... Roller, 7... Roller, 8... Stand, 9
...Guide, 10...End face.

Claims (1)

[Claims] 1. A first roller for driving, a guide having an end surface, a second roller that rotates freely, and a third roller that rotates freely, the second roller and the third roller. pressing the wafer against a first roller with a roller, rotating the wafer with the first roller, and arranging the first roller at a position offset on the opposite side of the wafer with respect to an extension of the end surface; A wafer positioning device characterized in that the rotation of the wafer is stopped when an orientation flat of the wafer comes into contact with the end surface. 2. A first roller for driving, a first guide with a first end surface, a second guide with a second end surface, a freely rotating second roller, and a freely rotating third roller. A second roller and a third roller press the wafer against the first roller, and the first roller rotates the wafer to form an extension line connecting the first end surface and the second end surface. On the other hand, a first roller is disposed at a shifted position on the opposite side of the wafer, and the rotation of the wafer is stopped when the orientation flat of the wafer contacts the first end surface and the second end surface. A wafer positioning device characterized by: