JPS6211767B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing electronic components.

In electronic components packaged with resin, a conductor is required to take out terminals from the electrodes of the electronic component body to the outside, and a method for efficiently and inexpensively connecting the electronic component body and the conductor is required. There is. Methods for connecting an electronic component body and a conductor include soldering, welding, thermocompression bonding, and the like, but soldering is a common method.

2. Description of the Related Art Conventionally, methods for connecting an electronic component body and a conductor by soldering include a method of directly soldering, a method of using paste solder, and a method of using ball solder. Direct soldering involves aligning the electronic component body, conductor, and solder, then applying a soldering iron to melt the solder and soldering. There are disadvantages in that the electronic component element body may be damaged by exposure to heat or a soldering iron, and furthermore, it is unsuitable for mass production. In addition, the method using paste solder has disadvantages in that it is difficult to control the amount of paste solder applied to the soldering location, flux tends to remain in the soldering location, and the price of paste solder is high.

As a conventional example, a method using ball solder will be explained with reference to FIGS. 1 to 3, taking a solid tantalum electrolytic capacitor as an example of an electronic component. The solid tantalum electrolytic capacitor body 1 shown in FIG. 1 is placed on the conductor 2 on which the ball solder 3 shown in FIG. 2 is placed, as shown in FIG. 3, and the solder is heated and melted in this state. A connection between the solid tantalum electrolytic capacitor body 1 and the conductor 2 is obtained. In this method, it is difficult to perform continuous work because it is necessary to place solder balls one by one for each solid tantalum electrolytic capacitor element that is an electronic component element.
Furthermore, since the ball solder needs to be fixed, it has the disadvantage that its uses are limited.

The above is an explanation of how to connect an electronic component element and a conductor using conventional soldering. However, as recent electronic components are generally trending toward miniaturization, the connections are also miniaturized, which means that the amount of solder reduce as much as possible,
It is also necessary to solder uniformly and reliably.

The present invention has been made to eliminate the above-mentioned drawbacks and to be able to be manufactured at low cost.Hereinafter, the present invention will be described in detail using a solid tantalum electrolytic capacitor body as an example based on the drawings.

First, a first embodiment of the manufacturing method of the present invention will be described with reference to a series of process diagrams shown in FIGS. 4 to 7. As shown in Figure 4, the length is 2 mm, the width is 1 mm, and the height is 0.8 mm.
One end of the solid tantalum electrolytic capacitor body 5 and the anode lead wire 6 are connected, and the other end of the anode lead wire 6 is arranged and fixed in 25 pairs in parallel on a stainless steel plate 7 at a pitch of 2 mm to form a series of capacitor sections 4. obtain. The cathode portion of the solid tantalum electrolytic capacitor body 5 is made of Ag.
It may be painted, and may be coated with Ag paint, or may be coated with solder on top of the Ag paint. On the other hand, as shown in FIG. 5, a strip-shaped solder ribbon 11 with a thickness of 40 μm and a width of 1.5 mm is placed on the wide part of the conductor 10, which has one wide end and is connected to the metal plate 9 at the other end. I'll keep it. Twenty-five of the conductors 10 are successively arranged at a pitch of 2 mm in correspondence with the solid tantalum electrolytic capacitor body 5 to form a series of conductor portions 8. The ribbon-shaped solder 11 has a length that corresponds to the entire distance of the 25 solid tantalum electrolytic capacitor elements 5. A ribbon-shaped solder 11 is interposed between the solid tantalum electrolytic capacitor body 5 of the series of capacitor parts 4 and the conductor 10 of the series of conductor parts 8, and after stacking them as shown in FIG. When the ribbon-shaped solder 11 is melted by heating, the melted solder flows into the connection portion, and as shown in FIG. 7, a preferable connection is obtained without connecting adjacent solid tantalum electrolytic capacitor bodies 5 to each other. and the seventh
A solid solid tantalum electrolytic capacitor is obtained by cutting along the dashed line a in the figure and covering it with resin.

A second embodiment of the manufacturing method of the present invention will be described with reference to FIGS. 8 to 10. Figure 8 shows a storage case 12 made of an insulating material that serves as an exterior case for a solid tantalum electrolytic capacitor.The side surface 13, which serves as the cathode of the external electrode, is covered with 35μ thick copper foil, and is further coated with 5μ thick solder plating. is applied. On the other hand, a copper foil with a thickness of 35μ is pasted on the side surface 14 of the storage case 12, which serves as an anode.
Furthermore, 50 μ Ni plating is applied, and 5
μ solder plating is applied. One end of the conductor 16 is connected to the side surface 13 by solder,
The other end is bent along the inside of the storage case 12 as shown in FIG. This conductor 16 has a width of 0.8
mm, 30μ thick copper foil with solder plating, 2
25 pieces are consecutively attached to the storage case 12 with a pitch of 1.5 mm. In addition, the side surface 14 of the storage case 12
As shown in FIG. 8, a slit 15 is cut in correspondence with the conductor 16. Dotted line 1 in Figure 8
7, a ribbon-shaped solder 18 having an L-shaped cross section is placed over the length of the series of conductors 16;
Thereafter, the series of solid tantalum electrolytic capacitor bodies 5 shown in FIG.
and placed on the conductor 16 via the ribbon-shaped solder 18 as shown in FIG. When the ribbon-shaped solder 18 is melted by hot air heating, the melted solder 18 flows into the connecting portion 19 in FIG.
A favorable connection with the conductor 16 can be obtained without connecting adjacent solid tantalum electrolytic capacitor bodies 5 to each other.

In the process shown in FIG. 10 and below, an exterior resin is poured into the storage case 12 and cured, and the anode lead wire 6 is cut at a distance of about 1 mm from the side surface 14. The anode lead 6 is then bent along the side surface 14 and welded. By cutting the storage case 12 at the intermediate portion between each solid tantalum electrolytic capacitor body, individual solid tantalum electrolytic capacitors are obtained.

In the method using ball soldering described above, the second
Since the ball solder 3 shown in the figure is heated under the solid tantalum electrolytic capacitor body 1 shown in FIG. needs to be made quite high.

On the other hand, in the manufacturing method of the present invention, as shown in FIG. 6, in the portions that are not under the solid tantalum electrolytic capacitor body 5, the ribbon-shaped solder 11 is easily melted without the hot wire being obstructed, and the heat conduction is further improved. , even the portion below the solid tantalum electrolytic capacitor body 5 is melted, so a reliable connection can be obtained even at relatively low temperatures, and there are no restrictions on the heating method; A preferable connection can be obtained by either light beam heating or electric furnace heating. Note that flux may be used if necessary.

As described above, according to the manufacturing method of the present invention, when a longer ribbon-shaped solder is used, it can be easily loaded and automated, and can be applied to each solid tantalum electrolytic capacitor body. There is no need to worry about placing solder.

The amount of solder at the connection portion can be adjusted by selecting the thickness of the ribbon-shaped solder, and ribbon-shaped solder is easier to manufacture than ball solder or the like. Furthermore, since thin ribbon-shaped solder can be manufactured, there is an advantage that it can be applied to minute objects.

The above explanation has been made using a solid tantalum electrolytic capacitor as an example of an electronic component, but it goes without saying that the manufacturing method of the present invention is also effective for various small electronic components such as resistors, ceramic capacitors, diodes, and transistors. .

[Brief explanation of the drawing]

1 to 3 are explanatory diagrams of a conventional example, and FIGS. 4 to 7, and FIGS. 8 to 10 are process explanatory diagrams showing embodiments of the present invention. 5...Solid tantalum electrolytic capacitor, 6...Anode lead wire, 7...Stainless steel plate, 9...Metal plate, 10...
Conductor, 11... Band-shaped ribbon-shaped solder, 12... Storage case, 15... Slit, 16... Conductor, 17...
Part where ribbon-shaped solder with an L-shaped cross section is placed, 1
8... Ribbon-shaped solder with an L-shaped cross section, 19... Connection portion.

Claims (1)

[Claims] 1. Ribbon-shaped solder is sandwiched between a plurality of continuously arranged conductors and an electronic component element continuously arranged corresponding to the conductors, and the solder is heated. A method for manufacturing an electronic component, which comprises melting and connecting the electronic component element and the conductor. 2. The method of manufacturing an electronic component according to claim 1, wherein the ribbon-shaped solder has a band-like shape. 3 Solder heating methods include infrared heating, light beam heating,
The method for manufacturing an electronic component according to claim 1, characterized in that the method is one of hot air heating or heating using an electric furnace. 4. The method of manufacturing an electronic component according to claim 1, wherein the conductor is soldered.