JPS6212811B2 - - Google Patents
Info
- Publication number
- JPS6212811B2 JPS6212811B2 JP1598579A JP1598579A JPS6212811B2 JP S6212811 B2 JPS6212811 B2 JP S6212811B2 JP 1598579 A JP1598579 A JP 1598579A JP 1598579 A JP1598579 A JP 1598579A JP S6212811 B2 JPS6212811 B2 JP S6212811B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- parts
- water
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 50
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 46
- 239000011342 resin composition Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 239000000839 emulsion Substances 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 17
- 229920006026 co-polymeric resin Polymers 0.000 claims description 13
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 11
- 239000004711 α-olefin Substances 0.000 claims description 11
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 10
- 238000009833 condensation Methods 0.000 claims description 7
- 230000005494 condensation Effects 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- -1 methylol group Chemical group 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 235000013312 flour Nutrition 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 229920001807 Urea-formaldehyde Polymers 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 229920002261 Corn starch Polymers 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 241000209140 Triticum Species 0.000 description 3
- 235000021307 Triticum Nutrition 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000008120 corn starch Substances 0.000 description 3
- 229940099112 cornstarch Drugs 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010440 gypsum Substances 0.000 description 3
- 229910052602 gypsum Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000001648 tannin Substances 0.000 description 2
- 229920001864 tannin Polymers 0.000 description 2
- 235000018553 tannin Nutrition 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000005996 Blood meal Substances 0.000 description 1
- 244000060011 Cocos nucifera Species 0.000 description 1
- 235000013162 Cocos nucifera Nutrition 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 108010073771 Soybean Proteins Proteins 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- KVBYPTUGEKVEIJ-UHFFFAOYSA-N benzene-1,3-diol;formaldehyde Chemical compound O=C.OC1=CC=CC(O)=C1 KVBYPTUGEKVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000001058 brown pigment Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- YIBPLYRWHCQZEB-UHFFFAOYSA-N formaldehyde;propan-2-one Chemical compound O=C.CC(C)=O YIBPLYRWHCQZEB-UHFFFAOYSA-N 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920001592 potato starch Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 229940001941 soy protein Drugs 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】
本発明は水性成型材料樹脂組成物、更に詳細に
は、水性樹脂を基材とする成型用樹脂組成物に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an aqueous molding material resin composition, and more particularly to a molding resin composition based on an aqueous resin.
公知の成型用樹脂組成物は、揮発性成分が殆ん
ど皆無で、樹脂組成分が100%近いものである。
すなわち、古くから知られている熱硬化性樹脂及
び近来需要量が増大した熱可塑性樹脂が成型用樹
脂の双壁であるが、何れも樹脂組成中に水分は含
有されていない。 Known molding resin compositions have almost no volatile components and have a resin composition of nearly 100%.
That is, thermosetting resins, which have been known for a long time, and thermoplastic resins, whose demand has increased in recent years, are the dual walls of molding resins, but neither of them contains water in their resin compositions.
例えば、熱硬化性樹脂について述べると、ユリ
ア樹脂、フエノール樹脂及びメラミン樹脂がその
主な種類であるが、これらはホルムアルデヒド系
樹脂ともいわれるように、ホルマリンが主原料の
一つであり、合成反応完了時点でホルマリン中の
水分が混和されて樹脂分と揮発性成分(主として
水)が大略半分ずつとなるので、これを成型用樹
脂にするために水分を自然分離し、さらに加熱減
圧法などで除去した後、冷却、粉砕及び篩分けが
なされる。この場合、合成反応完了後、大量の水
分を除去するのにエネルギーを大量に消費する。
また、除去された水分及び蒸気中にはホルムアル
デヒドが含有されているので、廃水処理を行なう
場合、排水の水質基準に適合させなければならな
い。また、蒸気中に含有されたホルムアルデヒド
は焼却法により再度大量のエネルギーを消費しな
ければならない。このように、工程が反応−水分
除去−粉砕−篩分けと長く、しかも除去した水分
の処理に難点があり、生産性が悪い。 For example, when talking about thermosetting resins, the main types are urea resin, phenolic resin, and melamine resin, but these are also called formaldehyde resins, and formalin is one of the main raw materials, and the synthesis reaction is completed. At this point, the moisture in the formalin is mixed and the resin content and volatile components (mainly water) are roughly equal to half, so in order to use this as a molding resin, the moisture is naturally separated and further removed by heating and decompression. After that, it is cooled, crushed and sieved. In this case, a large amount of energy is consumed to remove a large amount of water after the synthesis reaction is completed.
Furthermore, since the removed moisture and steam contain formaldehyde, when wastewater is treated, it must meet wastewater quality standards. Further, the formaldehyde contained in the steam must be incinerated again, which requires a large amount of energy to be consumed again. As described above, the process is long, including reaction, moisture removal, pulverization, and sieving, and there are also difficulties in processing the removed moisture, resulting in poor productivity.
一方、熱可塑性樹脂は、ポリエチレン、ポリプ
ロピレン、塩化ビニール、エチレン酢酸ビニール
等が主要な種類であるが、これらの樹脂は粉末、
粒状又はペレツト状で、当然水分は含有されてい
ない。従つて、生産性については問題はないが、
成型加工時に樹脂の軟化点より少なくとも50℃高
い温度に加熱熔融して液体とされるので、エネル
ギーを大量に消費すること、冷却を必要とするこ
と、燃焼し易いこと、射出成型機といわれる専用
の大型機械(成型される品物の大きさに対比し
て)を必要とすることなどが難点である。 On the other hand, the main types of thermoplastic resins include polyethylene, polypropylene, vinyl chloride, and ethylene vinyl acetate.
It is in the form of granules or pellets, and naturally contains no water. Therefore, there is no problem with productivity, but
During the molding process, the resin is heated to a temperature at least 50°C higher than the softening point and melted into a liquid, which consumes a large amount of energy, requires cooling, is easily flammable, and requires a special injection molding machine. Disadvantages include the need for large machinery (compared to the size of the item being molded).
このように、従来からの成型用樹脂組成物は、
基本的には加熱溶融して流動性をもたせた状態で
成型し硬化させるものであるから、揮発性成分が
皆無であることを必須条件としていた。これらの
樹脂組成物は、成型性能自体は良いけれども、化
粧板製造の場合のようにオーバーレイシートを同
時に成型する場合には、オーバーレイシートに可
塑性が与えられないため、紙割れを発生する。 In this way, conventional molding resin compositions are
Basically, it is molded and hardened in a state where it is heated and melted to give it fluidity, so it was an essential condition that it was free of volatile components. Although these resin compositions have good molding performance, when an overlay sheet is molded at the same time as in the production of decorative laminates, paper cracking occurs because the overlay sheet does not have plasticity.
本発明によれば、従来の常識を破つて、水性の
成型用樹脂組成物が提供される。水分を10%前後
の量で混入した樹脂が安価で取扱いが容易である
ことは周知であつたけれども、未だそれが成型物
の製造に実用されたことはなく、本発明のように
α−オレフイン無水マレイン酸共重合樹脂の使用
によつてこれが可能になるとは、全く予期できな
いことであつた。 According to the present invention, an aqueous molding resin composition is provided, breaking the conventional wisdom. Although it was well known that resin mixed with around 10% water is cheap and easy to handle, it has not yet been put to practical use in the production of molded products, and as in the present invention, α-olefin It was completely unexpected that this would become possible through the use of maleic anhydride copolymer resins.
本発明による水性成型用樹脂組成物の主成分
は、水系ホルムアルデヒド初期縮合樹脂(A)及び熱
可塑性エマルジヨン(B)である。何れも、揮発成分
として水を含有する樹脂(粉末、粒状等の固型樹
脂で水に可溶性のもの或いは水に混合する容易に
分散して粘性液となるものも含まれる)である。
本発明の第一の特徴は、水溶性樹脂なので安価で
あること、熱硬化性樹脂の熱により急速に硬化し
て硬い固型物になる性質と熱可塑性樹脂エマルジ
ヨンの熱による適当な流動性及び熱可塑性樹脂が
持つ耐クラツク性の良い性質とが組合わせられる
と共に、α−オレフイン無水マレイン酸共重合樹
脂を配合することによる熱硬化性樹脂と熱可塑性
樹脂とのバランス的効果及び架橋効果が更に相剰
されて、耐熱、耐クラツク、強靭性等の如き耐久
性及び成型性が付与されること、水性成型用樹脂
組成物の粘性調整剤、流動性調整剤、耐燃焼剤等
として種々の充填剤を可成り広範囲に配合し得る
ことなどが挙げられる。 The main components of the aqueous molding resin composition according to the present invention are an aqueous formaldehyde precondensation resin (A) and a thermoplastic emulsion (B). All of them are resins that contain water as a volatile component (including solid resins such as powders and granules that are soluble in water, and those that mix easily with water and become viscous liquids).
The first characteristics of the present invention are that it is inexpensive because it is a water-soluble resin, that the thermosetting resin has the property of rapidly curing with heat to become a hard solid, and that the thermoplastic resin emulsion has suitable fluidity and In addition to combining the good crack resistance properties of thermoplastic resins, the blending of α-olefin maleic anhydride copolymer resin further enhances the balanced effect and crosslinking effect between thermosetting resins and thermoplastic resins. It is used as a viscosity modifier, fluidity modifier, flame resistant agent, etc. for aqueous molding resin compositions, and is used as a filler to provide durability and moldability such as heat resistance, crack resistance, and toughness. For example, it is possible to mix a fairly wide range of agents.
水性樹脂が成型材料として従来検討されなかつ
たのは、前記したように揮発性成分(水)が多い
からである。これに反して、本発明の形成用樹脂
組成物は、第二の特徴として、5〜40重量%好ま
しくは10〜25重量%の水を含んでいる。このた
め、常温で液状又は粘稠液状であつて流動性が良
く、従来の成型材料とは基本的に異なつて逆に水
分を有効に利用することができる。 The reason why water-based resins have not been considered as molding materials is because, as mentioned above, they contain a large amount of volatile component (water). In contrast, the forming resin compositions of the present invention contain, as a second feature, 5 to 40% by weight of water, preferably 10 to 25% by weight. Therefore, it is liquid or viscous liquid at room temperature and has good fluidity, which is fundamentally different from conventional molding materials and allows for effective use of moisture.
本発明の水性成型用樹脂組成物は、(A)水系ホル
ムアルデヒド初期縮合樹脂5〜50重量部に(B)α−
オレフイン無水マレイン酸共重合樹脂を含む酢酸
ビニール樹脂エマルジヨン100重量部及び(C)充填
剤10〜150重量部を混合し水分が5〜40重量%に
成るように調整した組成物である。 The aqueous molding resin composition of the present invention includes (A) 5 to 50 parts by weight of an aqueous formaldehyde initial condensation resin and (B) α-
This is a composition prepared by mixing 100 parts by weight of a vinyl acetate resin emulsion containing an olefin maleic anhydride copolymer resin and 10 to 150 parts by weight of filler (C) so that the water content is 5 to 40% by weight.
ここでいう水系ホルムアルデヒド初期縮合樹脂
(A)とは、フエノールホルムアルデヒド樹脂、ユリ
アホルムアルデヒド樹脂、メラミンホルムアルデ
ヒド樹脂、レゾルシノールホルムアルデヒド樹
脂、タンニンホルムアルデヒド樹脂、リグニンホ
ルムアルデヒド樹脂、アセトンホルムアルデヒド
樹脂等の初期縮合物で、不揮発分が40〜70重量%
の水溶液状又は水分散液状の水系樹脂を指す。当
然、上記樹脂の共重合樹脂や反応後ブレンドした
樹脂、又は粉末化されたホルムアルデヒド樹脂で
も水に溶解されたものであれば、本発明における
水系ホルムアルデヒド初期縮合樹脂(A)として使用
可能である。 Aqueous formaldehyde initial condensation resin referred to here
(A) is an initial condensate of phenol formaldehyde resin, urea formaldehyde resin, melamine formaldehyde resin, resorcinol formaldehyde resin, tannin formaldehyde resin, lignin formaldehyde resin, acetone formaldehyde resin, etc., and has a nonvolatile content of 40 to 70% by weight.
Refers to a water-based resin in the form of an aqueous solution or dispersion. Naturally, copolymer resins of the above resins, resins blended after reaction, or powdered formaldehyde resins can be used as the aqueous formaldehyde initial condensation resin (A) in the present invention, as long as they are dissolved in water.
α−オレフイン無水マレイン酸共重合樹脂を含
むエマルジヨン(B)とは、α−オレフイン無水マレ
イン酸共重合樹脂が、酢酸ビニール樹脂エマルジ
ヨンの製造反応中にエマルジヨンに対して0.5〜
20重量%あらかじめ加えられたもの、或いは反応
後のエマルジヨンに0.5〜20重量%ブレンドされ
たものであつて、不揮発分を40〜70重量%含んで
いる。酢酸ビニール樹脂エマルジヨンを製造する
際に、アクリル樹脂、エチレン樹脂、等が多少共
重合されていても、主体が酢酸ビニール樹脂エマ
ルジヨンであれば、当然、本発明においてエマル
ジヨン(B)として使用可能である。 The emulsion (B) containing an α-olefin maleic anhydride copolymer resin means that the α-olefin maleic anhydride copolymer resin is added in a proportion of 0.5 to
It is either 20% by weight added in advance or 0.5 to 20% by weight blended into the emulsion after reaction, and contains 40 to 70% by weight of non-volatile matter. When producing vinyl acetate resin emulsion, even if acrylic resin, ethylene resin, etc. are copolymerized to some extent, as long as the main component is vinyl acetate resin emulsion, it can of course be used as emulsion (B) in the present invention. .
充填剤(C)としては、無機質系では炭酸カルシウ
ム、タルク、カオリン、石膏、石綿、セメント等
が、有機質系では小麦粉、カゼイン、コーンスタ
ーチ、血粉、大豆タンパク、殿粉、木粉、くるみ
粉、ヤシ粉、ニカワ、ゼラチン等が、それぞれ使
用できる。 Inorganic fillers (C) include calcium carbonate, talc, kaolin, gypsum, asbestos, cement, etc.; organic fillers include wheat flour, casein, cornstarch, blood meal, soy protein, starch, wood flour, walnut flour, and coconut. Powder, glue, gelatin, etc. can be used.
本発明組成物における組成と効果との関係につ
いては技術的解明及び技術理論の確立は未だ為さ
れていない。しかし、水系ホルムアルデヒド初期
縮合樹脂が持つ硬化性樹脂の性質、酢酸ビニール
樹脂エマルジヨンが持つ熱可塑性樹脂の性質及び
これに含有されているα−オレフイン無水マレイ
ン酸共重合樹脂が持つ熱硬化性と熱可塑性との中
間的な性質が程よくバランスされて、而かも架橋
剤的な働きを示すこと、並びに、水分が含有され
ているために流れが良いことが、水系樹脂組成物
の成型材料としての使用を可能ならしめたものと
思われる。 Regarding the relationship between the composition and the effect of the composition of the present invention, technical elucidation and technical theory have not yet been established. However, the properties of the curable resin of the aqueous formaldehyde initial condensation resin, the properties of the thermoplastic resin of the vinyl acetate resin emulsion, and the thermosetting and thermoplastic properties of the α-olefin maleic anhydride copolymer resin contained therein It is suitable for use as a molding material for water-based resin compositions because it has a well-balanced intermediate property between water-based resin compositions, acts like a cross-linking agent, and has good flow due to the water content. It seems possible.
次に、本発明を実施例によつて具体的に説明す
る。部及び%は重量基準である。 Next, the present invention will be specifically explained using examples. Parts and percentages are by weight.
実施例 1
ユリア樹脂(大鹿レヂン20105、不揮発分60
%)10部、85部の酢酸ビニール樹脂エマルジヨン
を通常の方法で乳化重合せしめたのち、あらかじ
めα−オレフイン無水マレイン酸共重合樹脂をア
ルカリ水溶液に10%含有されるように加熱溶解し
ておいたα−オレフイン無水マレイン酸共重合樹
脂溶液をこれに15部添加して熟成させたエマルジ
ヨン(不揮発分50%)100部並びに充填剤として
の炭酸カルシウム50部、小麦粉(薄力2等粉)20
部及びコーンスターチ30部、を良く混合すること
によつて、粘稠性ある水系成型用樹脂組成物をつ
くつた。Example 1 Urea resin (Oshika Resin 20105, non-volatile content 60
%) 10 parts and 85 parts of vinyl acetate resin emulsion were emulsion polymerized in a conventional manner, and then α-olefin maleic anhydride copolymer resin was heated and dissolved in an alkaline aqueous solution so that it contained 10%. 100 parts of an emulsion (non-volatile content 50%) obtained by adding 15 parts of α-olefin maleic anhydride copolymer resin solution (50% nonvolatile content), 50 parts of calcium carbonate as a filler, and 20 parts of wheat flour (weak grade 2 flour)
A viscous water-based molding resin composition was prepared by thoroughly mixing 30 parts of corn starch and 30 parts of cornstarch.
この樹脂組成物を長さ1800mm、幅900mm、厚さ
10mmの容器に流し込むと自然に隅々まで流動し
た。これを0.5Kg/cm2程度の低い圧力で、60℃の
温度において10分間平板プレスして硬化させた。
得られた成型板は壁材として利用することができ
る。 This resin composition has a length of 1800 mm, a width of 900 mm, and a thickness of
When poured into a 10mm container, it naturally flowed to every corner. This was plate pressed at a low pressure of about 0.5 kg/cm 2 at a temperature of 60° C. for 10 minutes to harden it.
The obtained molded plate can be used as wall material.
実施例 2
メラミン、ユリアホルムアルデヒド樹脂(大鹿
レヂン213号、不揮発分50%)50部、α−オレフ
イン無水マレイン酸共重合樹脂(イソバン)をア
ルカリで溶解した15%水溶液を酢酸ビニル樹脂エ
マルジヨンを重合させる際に保護コロイドとして
使用されるポリビニルアルコール溶液に添加した
のちAPS法により反応せしめて得られる不揮発分
40%の酢酸ビニル樹脂エマルジヨン(α−オレフ
イン無水マレイン酸共重合樹脂を不揮発分として
1%含有している)100部並びに充填剤としての
陽イオン繊維20部、タルク50部及び小麦粉20部、
を良く混合することによつて粘稠性ある水系成型
用組成物をつくつた。Example 2 A vinyl acetate resin emulsion was polymerized with a 15% aqueous solution in which 50 parts of melamine, urea formaldehyde resin (Oshika Resin No. 213, nonvolatile content 50%), and α-olefin maleic anhydride copolymer resin (isoban) were dissolved in an alkali. A non-volatile component obtained by adding it to a polyvinyl alcohol solution used as a protective colloid and reacting it using the APS method.
100 parts of a 40% vinyl acetate resin emulsion (containing 1% of α-olefin maleic anhydride copolymer resin as a non-volatile content), 20 parts of cationic fiber as a filler, 50 parts of talc and 20 parts of wheat flour,
A viscous aqueous molding composition was prepared by thoroughly mixing the two.
この組成物を複雑な凹凸模様を有する金型に入
れると自然に凹凸模様のすみずみまで流れこむ。
このため、80℃、10分、2Kg/cm2の簡単な加熱加
圧操作で、凹凸模様が鮮明に再現された成型樹脂
が製造された。 When this composition is put into a mold having a complicated uneven pattern, it naturally flows into every corner of the uneven pattern.
Therefore, a molded resin with a clearly reproduced uneven pattern was produced by a simple heating and pressing operation at 80°C for 10 minutes at 2 kg/cm 2 .
実施例 3
タンニンホルムアルデヒド樹脂(大鹿レヂンプ
ライタン、不揮発分60%)30部、実施例2に示し
た酢酸ビニル樹脂エマルジヨン100部、充填材と
してのバレイシヨ殿粉50部、木粉20部及び炭酸カ
ルシウム20部、並びに着色剤としての褐色顔料
0.5部、を混合することによつて水系成型用樹脂
組成物をつくつた。この樹脂組成物を、石膏ボー
ド上に300g/m2塗付し、鎌倉彫様の模様を有す
る金型に離型剤を塗付したものを重ね、100℃、
5分、5Kg/cm2で加熱加圧することにより、石膏
ボード上に鎌倉彫様の模様が施された樹脂層を有
する複合材料が製造された。Example 3 30 parts of tannin formaldehyde resin (Oshika Resin Plaitan, nonvolatile content 60%), 100 parts of the vinyl acetate resin emulsion shown in Example 2, 50 parts of potato starch as a filler, 20 parts of wood flour, and calcium carbonate. 20 parts, as well as brown pigment as a coloring agent
A water-based molding resin composition was prepared by mixing 0.5 parts. This resin composition was applied at 300 g/m 2 on a gypsum board, and a mold with a Kamakura-bori pattern coated with a mold release agent was layered, and heated at 100°C.
By heating and pressurizing at 5 kg/cm 2 for 5 minutes, a composite material having a resin layer with a Kamakura-bori pattern on a gypsum board was manufactured.
Claims (1)
デヒド初期縮合樹脂5〜50重量部、(B)不揮発分40
〜70重量%の、α−オレフイン無水マレイン酸共
重合樹脂を含む酢酸ビニール樹脂エマルジヨン
100重量部及び(C)充填剤50〜180重量部からなり、
水分を5〜40重量%含有することを特徴とする水
性成型用樹脂組成物。 2 水系ホルムアルデヒド初期縮合樹脂(A)が、メ
チロール基、メチレン結合又はエーテル結合を含
有する5量体以下の水溶性又は水に分散された液
体樹脂である特許請求の範囲第1項に記載の水性
成型用樹脂組成物。 3 α−オレフイン無水マレイン酸共重合樹脂が
酢酸ビニール樹脂エマルジヨン(B)中に0.5〜20重
量%含有されている特許請求の範囲第1項又は第
2項に記載の水性成型用組成物。[Scope of Claims] 1 (A) 5 to 50 parts by weight of an aqueous formaldehyde initial condensation resin with a nonvolatile content of 40 to 70%, (B) a nonvolatile content of 40% by weight.
Vinyl acetate resin emulsion containing ~70% by weight of α-olefin maleic anhydride copolymer resin
Consisting of 100 parts by weight and (C) filler 50 to 180 parts by weight,
An aqueous molding resin composition characterized by containing 5 to 40% by weight of water. 2. The aqueous formaldehyde initial condensation resin (A) according to claim 1, wherein the aqueous formaldehyde initial condensation resin (A) is a pentamer or less water-soluble or water-dispersed liquid resin containing a methylol group, a methylene bond, or an ether bond. Resin composition for molding. 3. The aqueous molding composition according to claim 1 or 2, wherein the vinyl acetate resin emulsion (B) contains 0.5 to 20% by weight of the α-olefin maleic anhydride copolymer resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1598579A JPS55110148A (en) | 1979-02-16 | 1979-02-16 | Water-based resin composition for forming material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1598579A JPS55110148A (en) | 1979-02-16 | 1979-02-16 | Water-based resin composition for forming material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55110148A JPS55110148A (en) | 1980-08-25 |
| JPS6212811B2 true JPS6212811B2 (en) | 1987-03-20 |
Family
ID=11903955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1598579A Granted JPS55110148A (en) | 1979-02-16 | 1979-02-16 | Water-based resin composition for forming material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55110148A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002265803A (en) * | 2001-03-14 | 2002-09-18 | Japan U-Pica Co Ltd | Porous cured product and method for producing the same |
| GB2392446A (en) * | 2002-09-02 | 2004-03-03 | Reckitt Benckiser Nv | Resin comprising water-soluble polymer and water-soluble filler |
-
1979
- 1979-02-16 JP JP1598579A patent/JPS55110148A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55110148A (en) | 1980-08-25 |
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