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JPS6213143B2 - - Google Patents
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JPS6213143B2 - - Google Patents

Info

Publication number
JPS6213143B2
JPS6213143B2 JP57121192A JP12119282A JPS6213143B2 JP S6213143 B2 JPS6213143 B2 JP S6213143B2 JP 57121192 A JP57121192 A JP 57121192A JP 12119282 A JP12119282 A JP 12119282A JP S6213143 B2 JPS6213143 B2 JP S6213143B2
Authority
JP
Japan
Prior art keywords
sphere
lap plate
lap
processed
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57121192A
Other languages
Japanese (ja)
Other versions
JPS5914461A (en
Inventor
Masahiro Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57121192A priority Critical patent/JPS5914461A/en
Publication of JPS5914461A publication Critical patent/JPS5914461A/en
Publication of JPS6213143B2 publication Critical patent/JPS6213143B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B11/00Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor
    • B24B11/02Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor for grinding balls
    • B24B11/04Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor for grinding balls involving grinding wheels
    • B24B11/06Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor for grinding balls involving grinding wheels acting by the front faces, e.g. of plane, grooved or bevelled shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は球体のラツプ加工装置に関し、特
に、硬脆部材からなる球体のラツプ加工に好適な
球体加工装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a spherical lapping device, and more particularly to a spherical lapping device suitable for lapping a spherical body made of a hard and brittle member.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

球体は装置の一構成として各技術分野に広く使
用されており、特に、セラミツクスなどの硬脆部
材からなる球体は、その耐食、耐熱、耐摩耗特性
からその特性を生かした特殊用途への適用が注目
されている。一般に、これら球体は真球度のよい
所定直径のものが要求されるため、それに適応さ
せるための各種ラツプ加工装置が開発されてい
る。第1図はその一例であつて、相対向する上下
一対のラツプ板1a,1bと、上ラツプ板1aに
取付けられた油圧式の荷重装置2と、下ラツプ板
1bを回転させる回転駆動装置(図示せず)を主
構成とし、下ラツプ板1bに形成された環状凹部
3に被加工球体Sを保持した状態で上下ラツプ板
1a,1b間に介挿し、この被加工球体Sに上ラ
ツプ板1aを介して荷重装置2により所定の荷重
を加えるとともに、下ラツプ板1bを回転させて
加工する。すなわち、上記荷重と回転により、被
加工球体Sは環状凹部3の内外両側面と上ラツプ
板1aのラツプ面4に圧接しながら上記環状凹部
3中を転動する間に加工される。
Spheres are widely used as a component of equipment in various technical fields, and in particular, spheres made of hard and brittle materials such as ceramics can be used for special purposes that take advantage of their corrosion, heat, and wear resistance properties. Attention has been paid. Generally, these spheres are required to have good sphericity and a predetermined diameter, and various lapping devices have been developed to accommodate this requirement. FIG. 1 shows an example of this, which includes a pair of upper and lower lap plates 1a and 1b facing each other, a hydraulic loading device 2 attached to the upper lap plate 1a, and a rotational drive device (for rotating the lower lap plate 1b). (not shown) is inserted between the upper and lower lap plates 1a and 1b with the workpiece sphere S held in an annular recess 3 formed in the lower lap plate 1b, and the upper lap plate is inserted into the workpiece sphere S. A predetermined load is applied by the loading device 2 via the lower lap plate 1a, and the lower lap plate 1b is rotated for processing. That is, due to the above-mentioned load and rotation, the spherical body S to be processed is machined while rolling in the annular recess 3 while being pressed against both the inner and outer surfaces of the annular recess 3 and the lap surface 4 of the upper lap plate 1a.

しかし、このような加工装置では、荷重装置2
が大がかりとなり、低荷重から高荷重まで広範囲
に精度よく荷重を制御することがむつかしく、そ
のため、微妙な荷重条件で真球度、直径、加工能
率などが変化する硬脆部材への適用が容易でな
い。また、、油圧式など従来の荷重装置2は、そ
の構造上、熱変形などにより精度維がむつかしい
欠点がある。
However, in such processing equipment, the loading device 2
It is difficult to accurately control the load over a wide range from low loads to high loads, and therefore it is not easy to apply to hard and brittle parts whose sphericity, diameter, machining efficiency, etc. change under delicate load conditions. . Furthermore, the conventional loading device 2, such as a hydraulic type, has the disadvantage that it is difficult to maintain accuracy due to its structure due to thermal deformation and the like.

〔発明の目的〕[Purpose of the invention]

この発明は硬脆部材からなる球体を精度よくラ
ツプ加工する球体加工装置を提供することにあ
る。
SUMMARY OF THE INVENTION An object of the present invention is to provide a sphere machining device for accurately lapping a sphere made of a hard and brittle member.

〔発明の概要〕[Summary of the invention]

相対向する上下一対のラツプ板からなるラツプ
部に被加工球体を保持する保持部を設けるととも
に、上記一対のラツプ板を介して、磁束調整自在
の磁力発生装置により上記被加工球体に所要のラ
ツプ荷重をかけることができるようにしたもので
ある。
A holding part for holding the workpiece sphere is provided in the lap part consisting of a pair of upper and lower lap plates facing each other, and a magnetic force generating device with adjustable magnetic flux is used to apply the required lap to the workpiece sphere via the pair of lap plates. It is designed to be able to carry loads.

〔発明の実施例〕[Embodiments of the invention]

第2図に示すように球体加工装置は、磁性部材
からなる相対向する上下一対のラツプ板10a,
10bからなるラツプ部を有し、これらラツプ板
10a,10bはそれぞれ回転軸11a,11b
を介して、回転駆動装置12a,12bにより互
に反対方向に回転するようになつている。被加工
球体Sは上記下ラツプ板11bに形成された環状
の凹部13に保持されて、これら一対のラツプ板
10a,10b間に介挿される。上記環状の凹部
13は下ラツプ板10bの回転軸11bと同心に
形成した二つの傾斜側面をもつ断面V形の溝であ
つて、第3図に示すように下ラツプ板10bの回
転中心より遠い外側の傾斜側面14aは内側の傾
斜側面14bより凹部を形成したラツプ板面15
に対して急傾斜している(α>β)。しかして、
上記一対のラツプ板10a,10bの各回転軸1
1a,11bのまわりには、ラツプ板10a,1
0b間に吸引磁界を形成する電磁石からなる磁力
発生装置16a,16bが設けられ、各電磁石の
コイル17a,17bは電流調整器18を介して
電源装置に接続され、一対のラツプ板10a,1
0b間に形成される磁界の強さ、方向を自由に調
整、変更できるようになつている。しかして、一
対のラツプ板10a,10b間に介挿された被加
工球体Sは、上記磁力発生装置16a,16bに
より、これらラツプ板10a,10b間に形成さ
れる吸引磁界により加圧される。なお、19は上
記被加工球体Sに加わる吸引磁界による荷重を調
整するコイルばね20を有するダンパ装置であ
る。
As shown in FIG. 2, the sphere processing device includes a pair of upper and lower lap plates 10a, which are made of magnetic members and are opposed to each other.
10b, and these wrap plates 10a, 10b are connected to rotating shafts 11a, 11b, respectively.
The rotary drive devices 12a and 12b rotate in opposite directions through the rotary drive devices 12a and 12b. The sphere S to be processed is held in an annular recess 13 formed in the lower lap plate 11b and inserted between the pair of lap plates 10a and 10b. The annular recess 13 is a V-shaped groove in cross section with two inclined side surfaces formed concentrically with the rotation axis 11b of the lower lap plate 10b, and is far from the rotation center of the lower lap plate 10b as shown in FIG. The outer inclined side surface 14a is a lap plate surface 15 having a recess formed from the inner inclined side surface 14b.
It has a steep slope with respect to (α>β). However,
Each rotating shaft 1 of the pair of lap plates 10a, 10b
Around 1a and 11b, wrap plates 10a and 1
Magnetic force generators 16a and 16b made of electromagnets that form an attractive magnetic field between 0b and 0b are provided, and coils 17a and 17b of each electromagnet are connected to a power supply device via a current regulator 18, and a pair of lap plates 10a and 1
The strength and direction of the magnetic field formed between 0b and 0b can be freely adjusted and changed. Thus, the workpiece sphere S inserted between the pair of lap plates 10a, 10b is pressurized by the attractive magnetic field formed between the lap plates 10a, 10b by the magnetic force generators 16a, 16b. Note that 19 is a damper device having a coil spring 20 for adjusting the load due to the attractive magnetic field applied to the spherical body S to be processed.

しかして、上記構成の球体加工装置において、
ラツプ加工は磁力発生装置16a,16bを消磁
した状態にし、一対のラツプ板10a,10b間
の間隔を広げて、下ラツプ板10bの環状凹部1
3中に被加工球体Sを入れる。しかるのち、一対
のラツプ板10a,10bを接近させて、これら
一対のラツプ板10a,10b間に介挿する。つ
ぎに、磁力発生装置16a,16bに所定の電流
を流して一対のラツプ板10a,10b間に所要
の強さの吸引磁界を発生させ、上記被加工球体S
を加圧するとともに、回転駆動装置12a,12
bにより一対のラツプ板10a,10bを互に逆
回転させて、被加工球体Sを環状凹部13に沿つ
て転動させる。しかして、この回転駆動中に適宜
ラツプ剤を供給すれば、上記被加工球体Sをラツ
プ加工することができる。
However, in the sphere processing device having the above configuration,
In the lapping process, the magnetic force generators 16a and 16b are demagnetized, the gap between the pair of lapping plates 10a and 10b is widened, and the annular recess 1 of the lower lapping plate 10b is
3. Place the sphere S to be processed into the container. Thereafter, the pair of lap plates 10a, 10b are brought close to each other and inserted between the pair of lap plates 10a, 10b. Next, a predetermined current is passed through the magnetic force generators 16a and 16b to generate an attractive magnetic field of a required strength between the pair of lap plates 10a and 10b, and the above-mentioned sphere to be processed S
While pressurizing the rotary drive devices 12a, 12
b, the pair of lap plates 10a and 10b are rotated in opposite directions, and the spherical body S to be processed is rolled along the annular recess 13. If a lapping agent is appropriately supplied during this rotational drive, the spherical object S to be processed can be lapping processed.

この加工装置によれば、被加工球体Sへの加圧
を磁力発生装置でおこなうので、電磁石のコイル
17a,17bに流す電流を正確に制御すること
により、被加工球体Sに対するラツプ荷重を正確
に、しかも容易・迅速に制御することができ、被
加工球体を精度よく加工することができる。また
被加工球体Sが転動する環状の凹部13が内外側
異なる角度の傾斜面で形成されているため被加工
球体Sの回転方向を常時変化させることができ、
それにより真球度のより球体を得ることができ
る。また、環状の凹部13の外側の傾斜側面14
aを内側の傾斜側面14bより急傾斜に形成した
ので、ラツプ板10a,10bを高速回転して
も、被加工球体Sが加工装置から脱落することが
なく、しかもラツプ剤の飛散が少なくなり、高能
率の加工をおこなうことができる。
According to this machining device, the pressure on the spherical body S to be machined is performed by the magnetic force generator, so the lap load on the spherical body S to be machined can be accurately controlled by accurately controlling the current flowing through the coils 17a and 17b of the electromagnet. Moreover, it can be controlled easily and quickly, and the spherical object to be processed can be processed with high precision. In addition, since the annular recess 13 in which the processed sphere S rolls is formed of inclined surfaces with different angles on the inside and outside, the rotation direction of the processed sphere S can be constantly changed.
As a result, a spherical body with higher sphericity can be obtained. Further, the outer inclined side surface 14 of the annular recess 13
Since a is formed to be more steeply inclined than the inner inclined side surface 14b, even if the wrapping plates 10a and 10b are rotated at high speed, the processed sphere S will not fall off from the processing device, and the scattering of the wrapping agent will be reduced. Highly efficient processing can be performed.

つぎに、他の実施例について述べる。 Next, other embodiments will be described.

第4図は、被加工球体Sの保持部として、下ラ
ツプ板10bに形成された環状の凹部13のほか
に上下一対のラツプ板10a,10b間に板状の
スペーサ30を配置したものである。このスペー
サ30は、第5図に示すように上記環状の凹部1
3と同じ直径の円周上に被加工球体Sの直径より
小さい直径の孔31を等間隔に複数個あけたもの
であつて、上記孔31に被加工球体Sを嵌合させ
て加工するようにしたものである。
In FIG. 4, in addition to an annular recess 13 formed in the lower lap plate 10b, a plate-shaped spacer 30 is arranged between a pair of upper and lower lap plates 10a and 10b as a holding part for the spherical body S to be processed. . This spacer 30 is connected to the annular recess 1 as shown in FIG.
A plurality of holes 31 having a diameter smaller than the diameter of the sphere S to be processed are bored at equal intervals on the circumference having the same diameter as 3, and the sphere S to be processed is fitted into the holes 31 to be machined. This is what I did.

このようにスペーサ30を配置すると、環状の
凹部13に複数個の被加工球体Sを配置しても、
その相互位置を正しく規制し、加工中、球体相互
の接触を防止し、欠けなどのない所要の球体Sを
容易に製作することができる。
If the spacer 30 is arranged in this way, even if a plurality of workpiece spheres S are arranged in the annular recess 13,
By correctly regulating their mutual positions, the spheres can be prevented from coming into contact with each other during processing, and the desired spheres S without chipping can be easily produced.

第6図は上ラツプ板10aのラツプ板面側に一
方の磁極が存在する永久磁石で形成するととも
に、下ラツプ板10bを磁性部材で形成し、これ
に電磁石からなる磁力発生装置16bを付設した
ものである。
In Fig. 6, the upper lap plate 10a is made of a permanent magnet with one magnetic pole on the lap plate surface side, and the lower lap plate 10b is made of a magnetic material, and a magnetic force generator 16b made of an electromagnet is attached to this. It is something.

このような加工装置は磁力発生装置16bに流
す電流の方向、大きさを制御し、一対のラツプ板
10a,10b間に反発磁界を形成して、その間
隔を広げて、被加工球体Sを介挿することがで
き、また、吸引磁界を形成して任意の荷重で加工
することができ、荷重装置を簡易化することがで
きる。
Such a processing device controls the direction and magnitude of the current flowing through the magnetic force generator 16b, forms a repulsive magnetic field between the pair of lap plates 10a and 10b, widens the gap between them, and causes the spherical object S to pass through the processing device. In addition, it is possible to form an attractive magnetic field and process with an arbitrary load, and the loading device can be simplified.

なお、上記実施例は上ラツプ板10aを永久磁
石、下ラツプ板10bを磁性部材で構成したが、
逆に、下ラツプ板を永久磁石、上ラツプ板を磁性
部材で構成してもよい。
In the above embodiment, the upper lap plate 10a was made of a permanent magnet and the lower lap plate 10b was made of a magnetic member.
Conversely, the lower lap plate may be made of a permanent magnet and the upper lap plate may be made of a magnetic member.

なおまた、前記各実施例では、下ラツプ板10
bに被加工球体Sを保持する環状の凹部13を形
成したが、この環状の凹部は上ラツプ板または、
上下ラツプ板の両方に形成してもよい、また、こ
の環状の凹部は、1個でなく、複数個形成しても
よい。さらにまた環状の凹部は、ラツプ板の回転
軸に対して偏心していてもよい。また、ラツプ板
は上下いづれか一方のラツプ板を回転するだけで
よい。
Furthermore, in each of the above embodiments, the lower lap plate 10
An annular recess 13 for holding the workpiece sphere S is formed in b, but this annular recess is attached to the upper lap plate or
The annular recess may be formed in both the upper and lower lap plates, or a plurality of annular recesses may be formed instead of one. Furthermore, the annular recess may be eccentric with respect to the rotation axis of the lap plate. Also, it is only necessary to rotate either the upper or lower lap plate.

〔発明の効果〕〔Effect of the invention〕

磁力発生装置を設け、上下一対のラツプ板間に
形成される磁界によつて被加工球体に荷重をかけ
るので、被加工球体に正確にしかも容易/迅速に
所要のラツプ荷重を加えることができるととも
に、環状の凹部が内外傾斜角の異なる傾斜面でで
きているので、被加工球体の回転方向を常時変化
させることができ、しかも、ラツプ板を高速回転
しても被加工球体が脱落したりラツプ剤の飛散が
少なくなるようにしているので、高精度かつ高能
率に球体を加工することができる。
A magnetic force generator is provided, and the magnetic field formed between the pair of upper and lower lap plates applies a load to the sphere to be machined, making it possible to accurately and easily/quickly apply the required lap load to the sphere to be machined. Since the annular recess is made of sloped surfaces with different inclination angles, the direction of rotation of the workpiece sphere can be constantly changed, and even if the lap plate is rotated at high speed, the workpiece sphere will not fall off or flop. Since the scattering of the agent is reduced, the sphere can be processed with high precision and high efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の球体加工装置を一部切欠して示
した断面図、第2図はこの発明の一実施例を一部
切欠して示した断面図、第3図は第2図示装置に
おける環状の凹部を拡大して示した図、第4図は
この発明の他の実施例の要部を示した断面図、第
5図は第4図示装置のスペーサの図、第6図は第
4図示装置とは別の他の実施例の要部を示した断
面図である。 S:被加工球体、10a:上ラツプ板、10
b:下ラツプ板、12a,12b:回転駆動装
置、13:凹部、16a,16b:磁力発生装
置。
Fig. 1 is a partially cutaway sectional view of a conventional sphere processing device, Fig. 2 is a partially cutaway sectional view of an embodiment of the present invention, and Fig. 3 is a partially cutaway sectional view of a conventional sphere processing device. FIG. 4 is a cross-sectional view showing the main parts of another embodiment of the present invention, FIG. 5 is a diagram of the spacer of the device shown in FIG. 4, and FIG. FIG. 3 is a cross-sectional view showing the main parts of another embodiment other than the illustrated device. S: Sphere to be processed, 10a: Upper lap plate, 10
b: Lower lap plate, 12a, 12b: Rotary drive device, 13: Recessed portion, 16a, 16b: Magnetic force generator.

Claims (1)

【特許請求の範囲】[Claims] 1 被加工球体を保持する環状の凹部が形成され
た下ラツプ板と、この下ラツプ板の上記凹部形成
側に配設され上記下ラツプ板とともに上記凹部に
保持された被加工球体をラツプ加工する上ラツプ
板と、上記上ラツプ板及び上記下ラツプ板のうち
少なくとも一方を回転させ上記被加工球体を上記
凹部内にて転動させる回転駆動装置と、上記上ラ
ツプ板と上記下ラツプ板との間に相互に吸引する
磁界を形成して上記上ラツプ板と上記下ラツプ板
とにより上記被加工球体を挾圧して上記被加工球
体にラツプ荷重を負荷し且つこのラツプ荷重の調
整を上記磁界の調整により行う磁力発生装置とを
具備し、上記凹部は、外側傾斜側面と内側傾斜側
面とからなり、かつ上記外側傾斜側面は上記内側
傾斜側面よりも上記凹部が形成されている主面に
対して急傾斜に形成されていることを特徴とする
球体加工装置。
1. A lower lap plate in which an annular recess is formed to hold the sphere to be processed, and the lower lap plate is arranged on the side where the recess is formed, and the lower lap plate and the sphere to be processed held in the recess are lapped. an upper lap plate, a rotation drive device for rotating at least one of the upper lap plate and the lower lap plate to roll the processed sphere in the recess, and the upper lap plate and the lower lap plate. A magnetic field that attracts each other is formed between the upper lap plate and the lower lap plate to clamp the sphere to be processed, apply a lap load to the sphere to be machined, and adjust the lap load by adjusting the magnetic field. and a magnetic force generating device that generates magnetic force by adjustment, and the recess is composed of an outer inclined side surface and an inner inclined side surface, and the outer inclined side surface is smaller than the inner inclined side surface with respect to the main surface on which the recess is formed. A sphere processing device characterized by being formed with a steep slope.
JP57121192A 1982-07-14 1982-07-14 Spherical member working machine Granted JPS5914461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57121192A JPS5914461A (en) 1982-07-14 1982-07-14 Spherical member working machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57121192A JPS5914461A (en) 1982-07-14 1982-07-14 Spherical member working machine

Publications (2)

Publication Number Publication Date
JPS5914461A JPS5914461A (en) 1984-01-25
JPS6213143B2 true JPS6213143B2 (en) 1987-03-24

Family

ID=14805134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57121192A Granted JPS5914461A (en) 1982-07-14 1982-07-14 Spherical member working machine

Country Status (1)

Country Link
JP (1) JPS5914461A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173166A (en) * 1985-08-08 1987-07-30 Jgc Corp Sphere polishing method using magnetic fluid and polishing device
US5214884A (en) * 1991-04-23 1993-06-01 Kabushiki Kaisha Toshiba Ball polishing apparatus and method for the same
AU3090699A (en) * 1998-03-17 1999-10-11 Board Of Regents For Oklahoma State University, The Large batch magnetic float polishing equipment
EP2484488B1 (en) * 2009-09-29 2017-12-20 NTN Corporation Method for grinding green ball, method for manufacturing ceramic ball, and grinding device
JP2011104696A (en) * 2009-11-16 2011-06-02 Jtekt Corp Sphere polishing device
JP6536175B2 (en) * 2015-05-27 2019-07-03 株式会社ジェイテクト Sphere polishing apparatus and sphere polishing method

Also Published As

Publication number Publication date
JPS5914461A (en) 1984-01-25

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