JPS621359B2 - - Google Patents
Info
- Publication number
- JPS621359B2 JPS621359B2 JP19028581A JP19028581A JPS621359B2 JP S621359 B2 JPS621359 B2 JP S621359B2 JP 19028581 A JP19028581 A JP 19028581A JP 19028581 A JP19028581 A JP 19028581A JP S621359 B2 JPS621359 B2 JP S621359B2
- Authority
- JP
- Japan
- Prior art keywords
- shutter
- reactor
- liquid phase
- epitaxial growth
- phase epitaxial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000007791 liquid phase Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 4
- 239000000725 suspension Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/06—Reaction chambers; Boats for supporting the melt; Substrate holders
- C30B19/062—Vertical dipping system
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Thin Magnetic Films (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
【発明の詳細な説明】
本発明は過飽和状態の溶液から、下地となる半
導体基板上に結晶をエピタキシヤル成長させる液
相エピタキシヤル装置に関するものである。さら
に詳しくは縦型液相エピタキシヤル装置の反応炉
の上端開口部の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a liquid phase epitaxial apparatus for epitaxially growing crystals on an underlying semiconductor substrate from a supersaturated solution. More specifically, the present invention relates to an improvement in the upper end opening of a reactor in a vertical liquid phase epitaxial apparatus.
従来この種のエピタキシヤル装置の反応炉の上
端開口部には有毒蒸気の拡散を防止するための排
気口を設けるほかは閉塞機構を設けないか、若し
くは一重のシヤツタまたは蓋を設ける程度であつ
た。このために外気と炉内雰囲気との間で対流や
放射による熱交換が盛んに行われるので、炉内に
大きな温度勾配が生じ、溶液内にもそれに応じた
温度勾配が生じる。この結果
(1) 過飽和状態の溶液からの成長のため、溶液内
の温度差により溶質の析出速度が異なり、均一
な成長薄膜の歩留りを低下させる。 Conventionally, the upper opening of the reactor in this type of epitaxial apparatus was provided with no closing mechanism, or only with a single shutter or lid, other than an exhaust port to prevent the diffusion of toxic vapors. . For this reason, heat exchange through convection and radiation is actively performed between the outside air and the atmosphere inside the furnace, so a large temperature gradient occurs within the furnace, and a corresponding temperature gradient also occurs within the solution. As a result, (1) the growth from a supersaturated solution causes the solute precipitation rate to vary depending on the temperature difference within the solution, reducing the yield of uniformly grown thin films.
(2) 炉口より搬入された冷たい半導体基板に炉内
の蒸気が接触すると直ちに固化、付着して品質
の低下をまねく。(2) When the steam in the furnace comes into contact with the cold semiconductor substrates brought in through the furnace mouth, they immediately solidify and adhere, leading to a decline in quality.
などの欠点があつた。さらに近年の進歩により半
導体基板は大形化しているので、この傾向はさら
に激しくなつている。特に例えばPbO−B2O3系
の溶媒から磁性ガーネツト薄膜を成長させる磁気
バブルメモリ用の液相エピタキシヤル装置におい
ては大きな問題である。There were drawbacks such as: Furthermore, as semiconductor substrates have become larger due to recent advances, this trend has become even more severe. This is a particularly serious problem in liquid-phase epitaxial equipment for magnetic bubble memories, in which magnetic garnet thin films are grown from, for example, PbO--B 2 O 3 -based solvents.
本発明はこのような欠点を解決するためになさ
れたもので、炉内雰囲気と外気との熱交換を低減
させ、炉内温度の均一化を図ると共に新たに挿入
した冷たい半導体基板を炉内上部において予熱し
てから反応させ、品質の低下を防止する装置を提
供するものである。 The present invention was made to solve these drawbacks, and it reduces the heat exchange between the atmosphere inside the furnace and the outside air, equalizes the temperature inside the furnace, and transfers the newly inserted cold semiconductor substrate to the upper part of the furnace. The present invention provides an apparatus that prevents deterioration of quality by preheating and then reacting.
以下図面により詳細に説明する。第1図は本発
明の実施例の反応炉の概略を示す縦断面図であ
る。図において、反応炉はセラミツクなどの耐火
物で作られた炉壁8を有し、炉内の下部の反応室
A内に、例えばPbO−B2O3系の過飽和状態の溶
液5を収容したるつぼ4がるつぼホルダ10上に
載置されて設けられ、またこの反応室Aには炉壁
8を貫通して排気口11が設けられている。反応
室Aの上方には反応炉の上端の炉口を開閉する第
1シヤツタ1と、反応室Aの入口を開閉する第2
シヤツタ2とが設けられている。さらに第1シヤ
ツタ1と第2シヤツタ2との中間にエアカーテン
3が設けられている。このエアカーテン3は、基
板ホルダ7とともに炉口から挿入される半導体基
板6を予熱するための予熱空間12をこのエアカ
ーテン3と第1シヤツタ1との間に形成すべく、
第1シヤツタ1の下方に、この第1シヤツタから
所定の間隔をおいて設けられている。この間隔
は、例えば反応炉の内径寸法が125〜150mmのと
き、100〜200mm程度に選定される。またその場
合、エアカーテン3とその下方の第2シヤツタ2
との間隔は50〜100mm程度に選定される。そして
炉壁8の外周全般に亘つて加熱ヒータ9が設けら
れている。 This will be explained in detail below with reference to the drawings. FIG. 1 is a vertical sectional view schematically showing a reactor according to an embodiment of the present invention. In the figure, the reactor has a furnace wall 8 made of a refractory material such as ceramic, and a supersaturated solution 5 of PbO-B 2 O 3 system, for example, is housed in a reaction chamber A at the lower part of the furnace. A crucible 4 is placed on a crucible holder 10, and an exhaust port 11 is provided in the reaction chamber A through the furnace wall 8. Above the reaction chamber A, there is a first shutter 1 that opens and closes the furnace opening at the upper end of the reactor, and a second shutter that opens and closes the entrance of the reaction chamber A.
A shutter 2 is provided. Further, an air curtain 3 is provided between the first shutter 1 and the second shutter 2. This air curtain 3 is designed to form a preheating space 12 between the air curtain 3 and the first shutter 1 for preheating the semiconductor substrate 6 inserted from the furnace mouth together with the substrate holder 7.
It is provided below the first shutter 1 at a predetermined distance from the first shutter. This interval is selected to be about 100 to 200 mm, for example, when the inner diameter of the reactor is 125 to 150 mm. In that case, the air curtain 3 and the second shutter 2 below it
The distance between the two is selected to be approximately 50 to 100 mm. A heater 9 is provided over the entire outer periphery of the furnace wall 8.
本実施例で第1シヤツタは左右に2分された2
枚のシヤツタ板をそれぞれ左右に摺動して開閉す
るもので、閉鎖時に基板ホルダ7の吊下軸7−1
が貫通する小孔13が残るように、閉鎖時に反応
炉の中心軸線と重なる位置に切込みが設けられて
いるものである。なお2〜4分割したシヤツタ板
を炉壁8の外側に設けた垂直軸を中心にして回動
して開閉する構造でも良い。第2シヤツタは反応
室Aの入口に設けられるもので、シヤツタ板は左
右に2分され、それぞれ互に平行して水平に設け
られた2本の回動軸2−1により回動して開閉を
行なうもので、第1シヤツタのシヤツタ板と同様
に吊下軸貫通用の切欠を有するものである。な
お、反応炉の水平断面が角形の場合は上記のまま
で良いが、円形の場合は第2図に示すように、反
応炉の内側において、同一水平面上にかつ互いに
対向して2枚の部分的な仕切板2−2を炉壁8に
取付け、この仕切板2−2にそれぞれ設けられた
水平軸2−1を中心にして第2シヤツタ2の回動
開閉を行なうことができる。この第2シヤツタ2
にも、第1シヤツタ1と同様に閉鎖時に反応炉の
中心軸線と重なる位置に切欠が形成され、閉鎖時
に基板ホルダ7の吊下軸7−1が貫通する小孔が
形成されるようになされている。3はエアカーテ
ンでガス導入口3−1より空気または不活性ガス
を吹込み、反応炉の横断面にそつて流され、排出
口3−2より炉外に排出されるもので、これによ
り炉内雰囲気は完全に外気と遮断されるものであ
る。加熱ヒータ9は反応炉全体を所定温度に維持
すると共にエアカーテンの上側の反応炉内の予熱
空間も加熱して新たに挿入された冷たい半導体基
板を必要温度まで予熱するものである。排気口1
1は反応に伴い発生する有害ガスを大気中に拡散
させずに吸引して排出させるものである。 In this embodiment, the first shutter is divided into left and right halves.
It opens and closes by sliding the shutter plates left and right, respectively, and when closed, the suspension shaft 7-1 of the board holder 7
A notch is provided at a position that overlaps with the central axis of the reactor when the reactor is closed, so that a small hole 13 passing through the reactor remains. Note that a structure in which a shutter plate divided into 2 to 4 parts is rotated about a vertical shaft provided outside the furnace wall 8 to open and close may also be used. The second shutter is installed at the entrance of the reaction chamber A, and the shutter plate is divided into left and right halves, and each side is opened and closed by rotating with two rotation shafts 2-1 installed horizontally in parallel with each other. Like the shutter plate of the first shutter, it has a notch for penetrating the hanging shaft. If the horizontal cross section of the reactor is square, the above may be used, but if it is circular, as shown in Figure 2, two sections should be placed on the same horizontal plane and facing each other inside the reactor. A partition plate 2-2 is attached to the furnace wall 8, and the second shutter 2 can be rotated to open and close about the horizontal shaft 2-1 provided on each partition plate 2-2. This second shutter 2
Similarly to the first shutter 1, a notch is formed at a position that overlaps with the central axis of the reactor when closed, and a small hole is formed through which the suspension shaft 7-1 of the substrate holder 7 passes when closed. ing. 3 is an air curtain that blows air or inert gas through the gas inlet 3-1, flows along the cross section of the reactor, and is discharged outside the furnace through the outlet 3-2. The internal atmosphere is completely isolated from the outside air. The heater 9 maintains the entire reactor at a predetermined temperature and also heats the preheating space in the reactor above the air curtain to preheat the newly inserted cold semiconductor substrate to the required temperature. Exhaust port 1
No. 1 is one in which harmful gases generated during the reaction are sucked and discharged without being diffused into the atmosphere.
次に本発明の装置の操作について説明する。ま
ずるつぼに所定の溶液を入れ、第1および第2シ
ヤツタを閉鎖してから加熱ヒータに通電して反応
炉全体を所定温度に維持する。一方基板ホルダに
は半導体基板を装着しておく。この状態から基板
ホルダを反応炉内に挿入するのであるが、まずエ
アカーテン部に送気してエアカーテンを動作させ
る。このエアカーテンは総ての操作が完了し、反
応炉の温度を下げるまで動作を継続させておくも
のである。次に第1シヤツタを開き、半導体基板
を装着した基板ホルダをその吊下軸7−1が反応
炉の軸心と一致するように降下させ、基板ホルダ
の下端がエアカーテンの上側で停止させ、前記第
1シヤツタを閉鎖する。この状態で半導体基板お
よび基板ホルダを予熱し、予熱完了したところで
第2シヤツタを開き基板ホルダなどを降下させ
る。基板ホルダが第2シヤツタ通過し切つたらこ
のシヤツタを閉鎖し、基板ホルダなどはさらに降
下を続け、基板ホルダに装着された半導体基板が
完全にるつぼ内の溶液に浸漬したところで停止さ
せる。 Next, the operation of the apparatus of the present invention will be explained. First, a predetermined solution is put into a crucible, the first and second shutters are closed, and then the heater is energized to maintain the entire reactor at a predetermined temperature. On the other hand, a semiconductor substrate is mounted on the substrate holder. From this state, the substrate holder is inserted into the reactor. First, air is supplied to the air curtain section to operate the air curtain. This air curtain is kept in operation until all operations are completed and the temperature of the reactor is lowered. Next, the first shutter is opened, the substrate holder with the semiconductor substrate mounted thereon is lowered so that its hanging shaft 7-1 is aligned with the axis of the reactor, and the lower end of the substrate holder is stopped above the air curtain. The first shutter is closed. In this state, the semiconductor substrate and the substrate holder are preheated, and when the preheating is completed, the second shutter is opened and the substrate holder and the like are lowered. When the substrate holder has completely passed through the second shutter, this shutter is closed, and the substrate holder and the like continue to descend, stopping when the semiconductor substrate mounted on the substrate holder is completely immersed in the solution in the crucible.
この後所定時間液相でエピタキシヤル成長を行
わせるのであるが、この期間中発生する有害ガス
は排気口11より吸引し、図示してない処理装置
により無害化して放出する。エピタキシヤル成長
終了後は挿入時と逆の順序で操作すれば良いが、
基板ホルダが予熱空間へ来た時にこの部分のヒー
タによる加熱を止め、基板ホルダおよび半導体基
板を徐冷してから第1シヤツタを開き外気中に取
り出すことが好ましい。 Thereafter, epitaxial growth is performed in a liquid phase for a predetermined period of time, and harmful gases generated during this period are sucked through the exhaust port 11, rendered harmless by a treatment device (not shown), and then released. After epitaxial growth is complete, the operations can be performed in the reverse order of insertion.
When the substrate holder comes to the preheating space, it is preferable to stop heating this part by the heater, allow the substrate holder and the semiconductor substrate to slowly cool down, and then open the first shutter and take them out into the outside air.
以上のように反応炉の上部に予熱空間を含んだ
多重シヤツタ機構を設けることにより、最下部の
シヤツタ以下の炉内雰囲気と外気との接触がなく
なつて炉内雰囲気が安定し、かつシヤツタによつ
て炉内からの熱放出が遮断されるので炉内温度分
布が均一となり、従つて溶液中の温度分布も均一
となるので、エピタキシヤル成長温度の管理も容
易となり均一な膜成長が容易となる。またこのた
めに溶液量を増すことも可能となるので、一回の
半導体基板の装着枚数を増すことも可能となり、
作業効率が向上する。さらにエアカーテンを設け
ることにより外気の侵入を遮断するばかりでな
く、内部で発生した有害ガスを大気中に放出する
ことなく無害化できるので、安全に作業を進める
ことも可能である。 As described above, by providing a multiple shutter mechanism including a preheating space in the upper part of the reactor, there is no contact between the atmosphere in the furnace below the bottom shutter and the outside air, and the atmosphere in the furnace is stabilized. Therefore, heat release from inside the furnace is blocked, so the temperature distribution inside the furnace becomes uniform, and therefore the temperature distribution in the solution also becomes uniform, making it easier to control the epitaxial growth temperature and making it easier to grow a uniform film. Become. Also, since it is possible to increase the amount of solution, it is also possible to increase the number of semiconductor substrates that can be mounted at one time.
Improves work efficiency. Furthermore, by providing an air curtain, not only can the intrusion of outside air be blocked, but also the harmful gases generated inside can be made harmless without being released into the atmosphere, so it is possible to proceed with the work safely.
以上のように本発明は、従来技術の欠点を解消
するばかりでなく、さらに多くの利点を実現しう
るもので、実用上極めて有効である。 As described above, the present invention not only eliminates the drawbacks of the prior art, but also realizes many advantages, and is extremely effective in practice.
第1図は本発明の反応炉の概略を示す縦断面
図、第2図は丸形反応炉の第2シヤツタ部分の縦
断面図である。
図において、1は第1シヤツタ、2は第2シヤ
ツタ、3はエアカーテン、8は反応炉壁、9は加
熱ヒータ、12は予熱空間である。
FIG. 1 is a vertical cross-sectional view schematically showing the reactor of the present invention, and FIG. 2 is a vertical cross-sectional view of a second shutter portion of the round reactor. In the figure, 1 is a first shutter, 2 is a second shutter, 3 is an air curtain, 8 is a reactor wall, 9 is a heater, and 12 is a preheating space.
Claims (1)
れた過飽和状態の溶液から半導体基板上に結晶を
エピタキシヤル成長させるように構成された縦型
液相エピタキシヤル成長装置において、 前記反応炉は、前記溶液の容器が設置されかつ
排気口が設けられている反応室の上方に、前記反
応炉の上端の炉口を開閉する第1のシヤツタと、
この第1のシヤツタの下方にほぼ水平に設けら
れ、かつ前記炉口から挿入される前記半導体基板
を予熱するための予熱空間を前記第1のシヤツタ
との間に形成すべく、この第1のシヤツタから所
定の間隔をおいて設けられたエアカーテン機構
と、このエアカーテン機構の下方に設けられて前
記反応室の入口を開閉する第2のシヤツタとを備
えており、 前記反応炉の外周全般に亘つて加熱ヒータが設
けられていることを特徴とする縦型液相エピタキ
シヤル成長装置。 2 前記第1のシヤツタは、閉鎖時に前記反応炉
の中心軸線と重なる位置にそれぞれ切欠が形成さ
れた左右に分割された2枚のシヤツタ板を備え、
これらシヤツタ板が左右に摺動して前記炉口を開
閉するように構成されていることを特徴とする特
許請求の範囲第1項記載の縦型液相エピタキシヤ
ル成長装置。 3 前記第1のシヤツタは、閉鎖時に前記反応炉
の中心軸線と重なる位置にそれぞれ切欠が形成さ
れた2ないし4枚のシヤツタ板を備え、これらシ
ヤツタ板が、炉壁の外側に設けられた2ないし4
本の垂直軸を中心にしてそれぞれ回動して前記炉
口を開閉するように構成されていることを特徴と
する特許請求の範囲第1項記載の縦型液相エピタ
キシヤル成長装置。 4 前記第2のシヤツタは、閉鎖時に前記反応炉
の中心軸線と重なる位置にそれぞれ切欠が形成さ
れた左右に分割された2枚のシヤツタ板を備え、
これらシヤツタ板が、前記反応炉の内側において
同一水平面上にかつ互いに対向して設けられた2
本の水平軸を中心にしてそれぞれ回動して前記反
応室の入口を開閉するように構成されていること
を特徴とする特許請求の範囲第1項記載の縦型液
相エピタキシヤル成長装置。 5 反応炉の内側において同一水平面上にかつ互
いに対向して設けられた2枚の部分的な仕切板が
設けられ、前記第2のシヤツタは、閉鎖時に前記
反応炉の中心軸線と重なる位置にそれぞれ切欠が
形成された左右に分割された2枚のシヤツタ板を
備え、これらシヤツタ板が、前記仕切板にそれぞ
れ設けられた水平軸を中心にしてそれぞれ回動し
て前記反応室の入口を開閉するように構成されて
いることを特徴とする特許請求の範囲第1項記載
の縦型液相エピタキシヤル成長装置。[Claims] 1. A vertical liquid phase epitaxial growth apparatus configured to epitaxially grow crystals on a semiconductor substrate from a supersaturated solution contained in a container installed at the bottom of a reactor. The reactor includes a first shutter for opening and closing the reactor port at the upper end of the reactor above the reaction chamber in which the solution container is installed and an exhaust port is provided;
The first shutter is provided substantially horizontally below the first shutter, and is designed to form a preheating space between the first shutter and the first shutter for preheating the semiconductor substrate inserted through the furnace opening. An air curtain mechanism is provided at a predetermined distance from the shutter, and a second shutter is provided below the air curtain mechanism to open and close the entrance of the reaction chamber, and the entire outer periphery of the reactor is provided. 1. A vertical liquid phase epitaxial growth apparatus, characterized in that a heater is provided over the entire length of the apparatus. 2. The first shutter includes two left and right shutter plates each having a notch formed at a position overlapping the central axis of the reactor when closed,
2. The vertical liquid phase epitaxial growth apparatus according to claim 1, wherein these shutter plates are configured to slide left and right to open and close the furnace opening. 3. The first shutter includes two to four shutter plates each having a notch formed at a position overlapping with the central axis of the reactor when closed, and these shutter plates are provided on the outside of the reactor wall. or 4
2. The vertical liquid phase epitaxial growth apparatus according to claim 1, wherein the vertical liquid phase epitaxial growth apparatus is configured to open and close the furnace opening by rotating respectively about the vertical axis of the book. 4. The second shutter includes two left and right shutter plates each having a notch formed at a position overlapping the central axis of the reactor when closed,
Two shutter plates are provided inside the reactor on the same horizontal plane and facing each other.
2. The vertical liquid phase epitaxial growth apparatus according to claim 1, wherein the vertical liquid phase epitaxial growth apparatus is configured to open and close the entrance of the reaction chamber by rotating respectively about the horizontal axis of the book. 5. Two partial partition plates are provided inside the reactor on the same horizontal plane and facing each other, and the second shutter is arranged at a position that overlaps with the central axis of the reactor when closed. It is equipped with two shutter plates divided into left and right sides with notches formed therein, and these shutter plates open and close the entrance of the reaction chamber by rotating around horizontal shafts respectively provided in the partition plates. A vertical liquid phase epitaxial growth apparatus according to claim 1, characterized in that it is configured as follows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19028581A JPS5891099A (en) | 1981-11-27 | 1981-11-27 | Vertical liquid phase epitaxial growth device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19028581A JPS5891099A (en) | 1981-11-27 | 1981-11-27 | Vertical liquid phase epitaxial growth device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5891099A JPS5891099A (en) | 1983-05-30 |
| JPS621359B2 true JPS621359B2 (en) | 1987-01-13 |
Family
ID=16255621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19028581A Granted JPS5891099A (en) | 1981-11-27 | 1981-11-27 | Vertical liquid phase epitaxial growth device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5891099A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60115271A (en) * | 1983-11-28 | 1985-06-21 | Showa Denko Kk | Method for manufacturing gallium phosphide red light emitting device |
| JP5115413B2 (en) * | 2008-09-09 | 2013-01-09 | トヨタ自動車株式会社 | Silicon carbide single crystal manufacturing apparatus and manufacturing method |
-
1981
- 1981-11-27 JP JP19028581A patent/JPS5891099A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5891099A (en) | 1983-05-30 |
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