JPS6213668B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light emitting diode display device, and particularly provides a base that has good processing accuracy and is easy to handle. Conventionally, in a light emitting diode display device that displays numbers, for example, using a base, a light emitting diode placed on the base, and a reflective frame surrounding the light emitting diode, the base is made of glass epoxy or the like. The feet have been attached to a printed circuit board with solder or the like, or a lead frame has been used.
However, when a printed circuit board is used, it is easy to attach the light emitting diodes, but the display device becomes expensive. Further, when a lead frame is used, the cost is low, but since the lead frame is a thin plate, the workability of attaching the light emitting diode is poor, and it is also difficult to handle. Furthermore, in the case of printed circuit boards, a sheet material called prepreg and copper foil are pressed together to form a single board, so it is not possible to make the board light reflective, and in the case of lead frames, between the lead tongues. In both cases, light was inefficiently used because light leaked through the holes. The present invention has been made in view of the above drawbacks,
The present invention will be explained in detail below based on the drawings. Figures 1 to 3 are diagrams showing the manufacturing procedure of a base according to an embodiment of the present invention, in which 1 is a lead frame bent into a substantially U-shape, and this lead frame is formed by continuous parts 2, 2. Consisting of a plurality of lead tongues 3, 3...3, 3' supported at equal intervals, a particular lead tongue 3' has a light emitting diode mounting part 4, 4...4 having a light reflecting part around its periphery. is provided. 5,
8 is a mold, and the lead frame 1 is fitted into the recess 6 of the mold 5, and the protrusion 9 of the mold 8 is fitted into the recess 6. The mold 8 is provided with two types of through holes 10 and 11, and the through holes 10 and 10 are connected to the leg portions 30 and 30 supported by the continuous portions 2 and 2 of the lead frame 1 .
This is for guiding the material to the outside of the mold 8, and the through hole 1
1 is a notch 7 provided in a part of the recess 6 of the mold 5
The tip of the resin introduction tube 12 is placed in the through hole 11, and the through hole 11 and the notch 7 are connected to each other.
This is provided for inserting the resin 13 into the mold interior 14 through the hole. Reference numeral 15 denotes a base manufactured by the method shown in FIG.
The protruding resin produced by this process was removed. In the above description, the material of the resin 13 is either thermoplastic such as polyethylene, polystyrene, ABS, etc., and molded by injection using a piston, or thermosetting resin such as epoxy, polyester, etc. is used for transfer molding. It is preferable to form a base by Further, the dimensional accuracy and shape of this base 15 are completely controlled by the dimensions and shapes of the molds 5 and 8, so that, for example, the external dimensions can be kept within ±0.005 cm of the desired dimensions. Regarding the shape, in the example shown in FIG .
Although it protrudes from the end 16 of the base, it is not limited to this end 16, and may protrude from approximately the center of the base. On the other hand, the light reflecting portions around the light emitting diode mounting portions 4, 4, . ,
As shown in FIG. 4, the area around the light emitting diode mounting portion 4 may be depressed, and a reflecting mirror may be formed around the light emitting diode 20. Conventionally, in integrated circuit packages, in order to homogenize the outer envelope and seal the inside, the injection molding or transfer molding method described above has been used after the integrated circuit element is attached to the frame. However, it was unthinkable to manufacture a resin base using this method, and the inside of this integrated circuit package cannot be seen at all after the product is completed, and if a display window was to be provided, this sealing method would not have the advantage. Since the above-mentioned sealing would not be possible, it could not be considered to use this sealing method for a display. However, as mentioned above, in the base of the present invention, since the main material of the base is resin, a base that is strong and has good dimensional accuracy like the printed circuit board described above can be obtained, and it can be used to place light emitting diodes. Starting with work,
It is easy to handle and costs less than the printed circuit board mentioned above, and as will be explained later, it
A light emitting diode display device can be manufactured with a smaller number of component parts than an LED display device, and has the advantage that it is possible to obtain a bright and high-quality display section due to the light reflecting section. FIG. 5 is a cross-sectional view of a conventional light emitting diode display device using a printed circuit board.
A light emitting diode 20 is placed on top, and the light emitting diode 20 is surrounded by an opening 12.
After arranging the reflective frame 122 for performing a predetermined display on the base 115 and covering the opening 123 with the light diffusing film 125 in step 3, these parts are placed in the outer case 1.
26 and sealed with resin 127 to fix the parts, seal the interior of the display device, and reinforce the foot portions 130 attached to the substrate 115 by soldering or the like. FIG. 6 shows a base 15 which is an embodiment of the present invention described above.
This is a perspective view of assembled parts when manufacturing a display device using the lead frame embedded in the base 15 .
The light emitting diodes 20...20 are electrically mounted and connected to the light emitting diode mounting parts 4...4 of 1 , and each light emitting diode 20...20 is wired to the corresponding lead tongue piece 3...3 with a thin metal wire 21...21. The continuous portions 2, 2 of the lead frame are cut off, and the leg portions 30...30 are each independent.
Reference numeral 22 denotes a reflective frame such as a resin molded product having reflective windows 23 .
The opening is opened at a position corresponding to the light emitting diode 20 on the top of the window 5, and the upper part is opened in the shape of, for example, a Japanese character, and the inside of the reflection window is coated with a mirror finish to improve reflection efficiency. processing has been carried out. The protrusion 24 provided on the bottom surface of the reflective frame 22 is connected to the through hole 24 provided in the base 15 .
The tip of the protrusion 24 is crushed below the base 15 , and the base 15 and the reflective frame 22 are fixed to each other.
26 is a colored diffusion film whose back surface is uniformly coated with adhesive, and is directly attached to the surface of the reflective frame 22. The display device using the base according to the present invention has the above-described configuration, and the mutual fixation of the components is done by the adhesive applied to the projections 24 of the reflection frame 22 and the colored light diffusion film 26. , there is no need for another parts fixing process, and the material of the base 15 is also the same as that of the reflective frame 22.
Since both are made of resin, they have good adhesion, and since the foot portions 30 are integrated with the base 15 , there is no need for reinforcement. Stop cover case 1
26 is also unnecessary. In the embodiment shown in FIG. 6, a skirt portion may be provided around the lower part of the reflective frame 22 to protect the end portion 16 of the base 15 . As described above, the present invention includes at least a base, a light emitting diode electrically mounted and connected to the base, and a reflective frame surrounding the light emitting diode and disposed on the base. In the light emitting diode display device, the base is a resin molded product having a light reflecting part which is embedded and integrated so that at least the mounting part and the wiring part are exposed and the lead frame does not protrude from the surface of the substrate. A base with good dimensional accuracy, good workability, and economy, which can optionally be equipped with a light-emitting diode reflector, is provided, and by using this base, the number of component parts is small. It is possible to manufacture a light emitting diode display device that is as good as the quality.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a lead frame, FIG. 2 is a sectional view for explaining the method of manufacturing a base according to the present invention, FIG. 3 is a perspective view of a base according to an embodiment of the present invention, and FIG.
The figure is a perspective view showing another embodiment of the present invention in a light emitting diode mounting section, FIG. 5 is a sectional view of a conventional display device, and FIG. 6 is a display manufactured using the base of one embodiment of the present invention. FIG. 3 is a perspective view of parts of the device. DESCRIPTION OF SYMBOLS 1 ...Lead frame, 13...Resin, 15 ...Base, 20...Light emitting diode, 22...Reflection frame.

Claims (1)

[Scope of Claims] 1. A lead frame made of a metal thin plate molded product is embedded and integrated so that at least the mounting part of the light emitting diode and the wiring part are exposed and the lead frame does not protrude from the base surface, and light is reflected around the mounting part. 1. A light-emitting diode display device comprising: a base made of a resin molded product having a section; and a light-emitting diode mounted on a lead frame in the base and wired thereto. 2. The light emitting diode display device according to claim 1, wherein a reflective frame made of a resin molded product is disposed on the base.