JPS6214193B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to an improved method for bonding copper or copper alloy materials to other plates or structures made of various metals, resins, rubber, wood, etc. Conventionally, when adhering copper or copper alloy materials to other materials, it has been extremely difficult to obtain a predetermined adhesive strength due to poor compatibility (wetting) between the adhesive and the copper. Countermeasures for this have included the development of various primers and the creation of a CuS (copper sulfide) film on the bonded area of copper or copper alloy materials through vulcanization to increase bond strength. had the following drawbacks. The development of primers is still insufficient and there is nothing satisfactory. It is difficult to apply the primer, and if it is applied too thick (more than 50 μm), the primer itself will cause cohesive failure, reducing adhesive strength. By vulcanization, it can be applied to the bonded parts of copper or copper alloy materials.
The method of forming a CuS film requires a lot of work, such as heating and applying pressure. Depending on the type of adhesive, some adhesives may not be able to form a CuS film on the bonded area of copper or copper alloy. The present invention enables the predetermined adhesive strength of the adhesive to be obtained by simple pretreatment when bonding copper or copper alloy (plate material) to other plate materials or structures.
The purpose is to provide a method for bonding copper or copper alloys with high adhesion strength that is effective with a wide range of adhesives, and is much more effective than copper or copper alloys (excluding brass) with various adhesives. A predetermined bonding strength of the adhesive is obtained by plating iron or brass, which has good conformability (wetting), to the bonded portion of the copper or copper alloy plate. The thickness of the plating in the method of the present invention is preferably 0.5 μm or more and 200 μm or less. If it is less than 0.5 μm, the influence of the copper or copper alloy material will be strong and the compatibility (wetting) with the adhesive will be poor, and if it is 200 μm or more,
There is a risk that the plating layer will crack due to processing of the plate material after bonding or deformation of the structure, resulting in a decrease in bond strength. In the present invention, other members to which copper or copper alloy plates are bonded include carbon steel, stainless steel,
Examples include resins such as FRP or ABS (acrylonitrile-butadiene-styrene), rubbers such as natural rubber, neoprene rubber, and urethane rubber, glass, wood, etc., and adhesives include epoxy, modified epoxy, and rubber adhesives. is used. In particular, when bonding copper or copper alloy materials to plates or structures that will be used underwater or in seawater, if it is expected that the bonding strength will deteriorate due to water or seawater seeping into the bonded area, By plating the surface of the copper or copper alloy material to be bonded with brass, which has better corrosion resistance than copper and whose potential in water or seawater is approximately the same as that of copper, it is possible to prevent a decrease in adhesive strength. Example 1 In the cross-sectional view of Fig. 1, when pasting a 9/1 Cu-Ni plate 1 to a carbon steel plate 2 using an epoxy adhesive (CEMEDINE 1500) 3, as a pretreatment. 9/1 Cypronickel board 1
An iron plating 4 with a thickness of 10 μm was applied in advance to the surface 1a to be adhered, and then a 9/1 Cypronickel plate 1 was adhered to the carbon steel plate through four layers of the same iron plating. The adhesion strength of B, which was plated with iron as described above, and A, which was bonded as 9/1 Cypronickel board 1 (material) without plating, were as shown in the table below.

[Table] Example 2 In Fig. 2, carbon steel seawater storage tank 11
The inner surface is rubber adhesive (Ultite Super) 1
2 is used to line the neoprene rubber 13. When pasting the copper plate 14 with a thickness of 0.5 mm on this surface for the purpose of preventing the adhesion of marine organisms, the copper plate 14
Brass plating 15 with a thickness of 100 μm was applied to the surface 14 a to be adhered in advance, and the adhesive was bonded using another rubber adhesive 16 . In another tank in which a copper plate was bonded without plating the surface of the copper plate, the copper plate partially peeled off after about one month of use. In addition, in tanks where the surface of the copper plate was treated with iron plating, the copper plate peeled off approximately six months after use. The iron-plated surface of the copper plate that was peeled off at this time was
It was corroded to a reddish-brown to blackish-brown color due to seawater seepage. On the other hand, the copper plate with brass plating applied to the surface to be adhered has not peeled off even after about 2 years of use, and if the bonded part is immersed in seawater, the brass plate It turns out that Metsuki is effective.

[Brief explanation of the drawing]

FIGS. 1 and 2 are cross-sectional views schematically showing bonding of a copper plate and other members using the method of the present invention.

Claims (1)

[Claims] 1. When bonding copper or copper alloy materials to other members or structures using adhesives, as a pretreatment,
0.5μm or more, 200μ on the adhered part of copper or copper alloy
A method for adhering copper or copper alloy, characterized by forming a plating layer of iron plating or brass plating with a thickness of less than m, and bonding the copper or copper alloy material to another member or structure via the plating layer.