JPS6214229B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a metal slit plate used in precision measuring machines and the like.

Traditionally, photo etching processing was often used for metal slits in this type of precision machinery.
The manufacturing method is to coat a stainless steel, copper or copper alloy base material with a resist, form a desired pattern by exposure and development, then apply gold plating or nickel plating to the entire surface outside the pattern from which the resist has been removed, and use this plating film as a resist. A method of finishing by etching with an alkaline etchant is known. However, metal resists using gold plating have the drawback that if the plating film is thin, less than 1 micron, the underlying metal will be corroded by the etching solution and pinholes will occur due to incomplete coverage. Therefore, in order to maintain corrosion resistance, a minimum film thickness of about 2 to 3 microns is required, which is unsuitable for practical use because it leads to high costs. Similar to the gold plating method, metal resists using nickel plating also have the drawback of being susceptible to pinholes if the plating film is thin. Therefore, a certain degree of thick plating is required, but since the bath temperature of thick plating baths is generally high, there have been various problems such as softening and chipping of the resist in the patterned areas during plating.

The present invention was made with the aim of eliminating the drawbacks in conventional photoetching, and is a palladium alloy plating that does not cause stress on copper or copper alloy base materials as a metal resist and has excellent performance in ductility and corrosion resistance. The purpose of this invention is to provide an effective manufacturing method for forming fine slits with high precision by applying the method.

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

First, as shown in FIG. 1, after coating the surface of a copper or copper alloy base material 1 with a resist 2,
A desired pattern 3 is formed by exposure and development. Next, a palladium alloy plating film 5 applied in the present invention is applied as a metal resist to the entire area outside the pattern 4 from which the resist has been removed, and then the resist of the desired pattern 3 is removed 6 and through holes 7 are formed by etching. In this case, it is made into a metal slit plate.

Since the palladium alloy plating film applied in the present invention has excellent corrosion resistance in terms of acid resistance and alkali resistance, it can be applied not only to alkali etching but also to acid etching.

Example 1 A commercially available negative type resist was coated on a copper substrate 1 with a material width of 350 mm□ and a thickness of 50 microns, and a slit with a length of 2 mm and a width of 50 microns was patterned to form an effective width.
After patterning a slit pattern with 800 slits arranged in a 260 mm area, it was plated in a plating bath using a palladium-nickel alloy composition (palladium 10 g/, nickel 10 g/) at a current density of 1 A/dm ² , pH 7.5, and bath temperature of 30°C.
Plating was carried out for 8 minutes under the following conditions. A plating film of about 2 microns was obtained, and analysis of the content of palladium precipitates revealed that 53% palladium was precipitated. Next, etching was performed using an alkali etchant, and as a result, no pinholes were observed on the metal resist surface, and a metal slit plate with a precision that satisfies the purpose was completed.

Example 2 Brass base material 1 with a material width of 200 mm□ and a thickness of 200 microns
coated with a commercially available positive type resist,
After patterning a slit pattern in which 300 slits with a length of 1 mm and a width of 180 microns were arranged in a 20 mm square, plating was performed for 18 minutes using the same plating bath and plating conditions as in Example 1.

A plating film of approximately 5 microns was obtained, and analysis of the content of palladium precipitates revealed that 55% palladium was precipitated. Next, as a result of etching with a ferric chloride solution, an ideal slit plate could be completed with no pinholes observed on the metal resist surface, similar to the above.

As shown in the examples above, the palladium alloy coating applied to copper and copper alloy substrates shows no pinholes due to etching even at a coating thickness of 2 microns, showing good corrosion resistance equivalent to gold plating. It is something. When the base material is thick and etching takes a long time, the thickness of the palladium alloy plating is appropriately selected to be up to 5 microns in order to withstand acidic etching solutions. Furthermore, as a problem during plating, conventionally, when the bath temperature is high, the resist tends to soften in the pattern portion, often resulting in resist defects. On the other hand, since the temperature conditions for palladium alloy plating were as low as 25°C to 35°C, no resist defects were observed. As described above, the metal resist plated with palladium alloy has various effects such as easy finishing with stable quality and the ability to manufacture slit plates with high precision.

[Brief explanation of the drawing]

FIGS. 1A to 1E are cross-sectional views illustrating a manufacturing method according to the present invention. 1... Copper or copper alloy base material, 2... Resist, 3... Desired pattern, 4... Part outside the pattern, 5... Palladium alloy plating film, 6... Pattern portion resist removed, 7... Through hole.

Claims (1)

[Scope of Claims] 1. A metal slit characterized by coating a copper or copper alloy base material with a resist, forming a desired pattern by exposure and development, and then applying palladium alloy plating outside the pattern as a metal resist and etching it. Method of manufacturing the board. 2. The method for manufacturing a metal slit plate according to claim 1, wherein the palladium alloy plating composition is 55% or less in terms of palladium electrodeposited alloy ratio, and the plating thickness is 5 microns or less.