JPS6214756B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a heating floor panel in which a heat medium passes through the inside for heating. A recess 8 is provided at the side end to open the top surface and the end surface,
The connection ports 2d at both ends of the pipe 1a are respectively disposed in the recess 8, an on-off valve 2b is provided at the connection port 2d in the recess 8, and a cover 2a capable of closing the upper opening of the recess 8 is provided in the recess 8. The present invention relates to a heating floor panel that is characterized in that it is attached to the floor panel, and the object of the present invention is that the heating medium is sealed, so that the pipes of the floor panel, the compressor, the evaporator,
A heat pump circuit is formed by connecting the heat pump main circuit, which consists of an expansion valve, and opening an on/off valve.It is a heating system that can be easily assembled without the need for the complicated work of later sealing in a heat medium. Located in providing floor panels.

The present invention will be explained in detail below with reference to Examples. Reference numeral 1 denotes a floor panel in which a metal plate 1b and heat insulating materials 1c and 1d are laminated, and a zigzag-shaped pipe 1a is embedded inside. A recess 8 is provided at the end of the surface side of the floor panel 1 at a position corresponding to both ends of the pipe 1a to open the top surface and the end surface.
Connect the connection port 2d, which has male threads on the outer periphery of both ends, to the recess 8.
It is located inside. An on-off valve 2b is installed in front of this connection port 2d, and a heat medium such as ammonia or Freon is sealed in the pipe 1a. Here, 2a is a cover that covers the recess 8, and 2c is a connection sleeve having female threads cut on the inner periphery of both ends.
The heat pump main circuit A is formed by arranging an expansion valve 3, an evaporator 5, and a compressor 6 in a pipe 7, and seals a heat medium in the pipe 7 and closes both ends of the pipe 7 with an on-off valve. be. Here, 4 is a fan for promoting heat exchange. Therefore, a plurality of floor panels 1 are arranged, and the connection ports 2 of adjacent floor panels 1 are connected.
d are connected with the connecting sleeves 2c, and both ends of the piping 7 of the heat pump main body circuit A are connected to the connection ports 2d at both ends of the pipes of the plurality of floor panels 1 with the connecting sleeves 2c. Opening/closing valve 2b
When the opening/closing valve of the piping is opened, a heat pump circuit is formed. In this state, compressor 6 and fan 4
When driven, the heating medium flows through the pipes 1a of the floor panel 1,
The heat circulates through the expansion valve 3, evaporator 5, compressor 6, and pipe 1a, and is radiated from the floor panel 1 for heating. That is, in the expansion valve 3, the liquefied heat medium is suddenly expanded from a high-pressure state to become a low-pressure, low-temperature damp gas. In the evaporator 5, external high-temperature heat is applied to the low-pressure, low-temperature damp gas heat medium, and the heat medium is evaporated into dry gas.
The compressor 6 brings the heat medium to high temperature and high pressure. floor panel 1
In the pipe 1a, a condenser acts to release the heat of the high-temperature, high-pressure heating medium to the outside. As a result, the heat medium changes from gas to liquid and is sent to the expansion valve 3. When the heat radiating part of the heat pump circuit is used as the floor panel 1 in this way, the structure is not only simplified, but also heat loss due to heat exchange, which is the case with those that exchange heat with hot water or hot air, is eliminated, and heating efficiency is improved. Further, when removing the heating floor panel or changing its location, close the on-off valve 2b of the floor panel 1 and stop the on-off valve of the piping of the heat pump main body circuit A and disassemble it.

As described above, the present invention encloses a heating medium in a pipe embedded in a floor panel, and also provides on-off valves at the connection ports at both ends of the pipe. The heat pump circuit is formed by connecting the heat pump body circuit consisting of a compressor and opening the on-off valve, and it is easy to assemble without the complicated work of enclosing a heat medium afterwards. Moreover, when removing or relocating the location, the heating medium will not leak by closing the on-off valve and disassembling, and the work can be done easily. A recess is provided to open the pipe, the connection port of the pipe is placed in the recess, an on-off valve is provided at the connection port in the recess, and a cover that can close the top opening of the recess is attached to the recess. The opening/closing valve is located in the recess so that even if there is a connection port or opening/closing valve, it does not protrude from the edge of the floor panel, and the floor panel can be spread without any gaps. Even if the valve is installed, the floor panel is laid down, the connection port is connected, and the on-off valve is opened to communicate the heat medium sealed in the floor panel, after opening the on-off valve, the cover is attached and the top surface of the floor It can be made flush, and the opening/closing valve can be operated by removing the cover, so when removing or relocating the floor panel, the opening/closing valve is closed before removing the floor panel, and the heating medium is sealed inside the floor panel. Even if the floor panel is sealed with a heating medium, it can be easily removed and removed.Furthermore, the recesses in which the connection ports and on-off valves are located are open at the top and end faces, and closed at the bottom. Because of this, it has good thermal insulation properties downward, making it difficult for heat to escape downward even at the connecting parts, resulting in good thermal efficiency.

[Brief explanation of the drawing]

FIG. 1 is a partially exploded perspective view of an embodiment of the present invention;
FIG. 2 is a schematic circuit diagram of the same heat pump circuit as described above, in which 1 is a floor panel, 1a is a pipe, 2b is an on-off valve, and 2d is a connection port.

Claims (1)

[Claims] 1. A heating medium is sealed in a pipe buried in a floor panel, a recess is provided at the end of the surface side of the floor panel to open the top surface and the end surface, and the connection ports at both ends of the pipe are placed in the recess respectively. A heating floor panel characterized in that an opening/closing valve is provided at a connection port in the recess, and a cover capable of closing the upper opening of the recess is attached to the recess.