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JPS6217832B2 - - Google Patents
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JPS6217832B2 - - Google Patents

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Publication number
JPS6217832B2
JPS6217832B2 JP54064118A JP6411879A JPS6217832B2 JP S6217832 B2 JPS6217832 B2 JP S6217832B2 JP 54064118 A JP54064118 A JP 54064118A JP 6411879 A JP6411879 A JP 6411879A JP S6217832 B2 JPS6217832 B2 JP S6217832B2
Authority
JP
Japan
Prior art keywords
circuit board
circuit
printed circuit
flat plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54064118A
Other languages
Japanese (ja)
Other versions
JPS55155480A (en
Inventor
Yoshiaki Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP6411879A priority Critical patent/JPS55155480A/en
Publication of JPS55155480A publication Critical patent/JPS55155480A/en
Publication of JPS6217832B2 publication Critical patent/JPS6217832B2/ja
Granted legal-status Critical Current

Links

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【発明の詳細な説明】 本発明は、IC、LSIまたはプリント基板等をプ
リント基板上に実装する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for mounting an IC, an LSI, a printed circuit board, or the like on a printed circuit board.

従来よりIC、LSIまたはプリント基板等の回路
平板(以下平板という)を他のプリント基板上に
実装する場合、両者を直接はんだ付け等により接
続して固定する方法のほかコネクタまたはソケツ
トを使用する方法がある。例えばIC又はLSIにお
いてリード形又はピン形の接続用端子を有するも
のは、第1図の如く各端子1に適合するソケツト
コンタクト2を備えるソケツト3を予めプリント
基板4上に固定しておき、実装すべき平板5の端
子1を各ソケツトコンタクトに嵌合させつつ平板
を押し込んでソケツトに挿入することにより実装
がなされる。しかしこの方法では平板の端子数が
多くなるとソケツトコンタクト全体の挾持力が増
すため、平板のソケツトへの挿入又は抜去の際に
大きな力が必要となり誤つて端子或いは平板自体
を破損してしまうような事故を起すおそれがある
ほか端子とソケツトコンタクトが直列につながる
ため平板からプリント基板に至る導電路が長くな
るので高周波特性に悪影響を生ずる等の問題があ
つた。またパツドと称する平板に直接密着した形
式の接続用端子を有するものに対しては第2図及
び第3図の如き実装方法がある。例えば第2図a
において6は実装すべき平板であつて周辺部にパ
ツド7を有している。プリント基板8上には予め
ハウジング9が取付けられておりハウジング内の
凹所10にはパツド7と対応する弾性金属コンタ
クト11が配列され、該コンタクトの一端はハウ
ジング9の下面に突出してプリント基板上の導体
パターン12と接続されているから、先ず平板6
を凹所10に収納し次に上方からカバー13をか
ぶせ4隅をハウジング9と一体にプリント基板へ
ネジ止めして平板6を押圧することにより、第2
図b(第2図aのA−A′断面図)のようにコン
タクト11はパツド7と弾性接触し従つて平板と
プリント基板の導体パターンとが接続される。ま
た第3図の方法ではプリント基板8′上に取付け
られたハウジング9′の凹所10′内にはコンタク
トが設けず代りに導体パターン12′の端部14が
平板6のパツド7と対応する位置に配列されてい
る。そして平板と略同大の板状の弾性絶縁体であ
つてその周辺部に、パツド7及び導体パターン端
部14とそれぞれ対向しかつ両者を短絡させるよ
うなコの字形状の金属箔等の導電性端子15を配
列させた中継用エラストマ16を先ず凹所10′
に収納し、その上に平板6を載置してから第2図
の場合と同様にカバー13をかぶせプリント基板
にネジ止めすることにより、平板はカバーで押圧
され平板はエラストマ16を押圧するからエラス
トマの弾力により端子15はパツド7及び導体パ
ターン端部14に十分接触し平板と導体パターン
との接続が達成される。第2図または第3図の何
れの方法もカバー13で平板6を十分に押圧する
ことにより、コンタクト11またはエラストマ1
6はそれぞれの弾性をもつて平板のパツドに十分
な接触圧で接触し、更にカバーを着脱するのみで
平板のプリント基板への装着又は取外しが平板に
特に力を加える必要なく従つて破損等のおそれも
なく容易に行いうるほか第1図の場合に比し導電
路が短くできるから高周波特性を向上できる等の
利点を有する。しかし一方平板が大形となりパツ
ド数が多くなると、カバーを固定するネジの位置
から離れた部分では第4図に見られるようにコン
タクト又はエラストマの弾性のためにハウジング
9,9′の中間部分を最大としてカバー13及び
プリント基板8,8′にX及びX′のようなたわみ
を生ずることがありその結果として各パツドとコ
ンタクトまたは端子との接触部に十分な接触圧が
得られず電気的接触不安定の原因となるおそれが
あつた。更に上記の実装方法ではプリント基板上
に占めるハウジングの面積及びカバーを含めた体
積が平板本体に比べて大きくなり、特に前記のカ
バー及びプリント基板に生ずるたわみに起因する
たわみによる接触不安定を防ぐためカバーの厚み
を増したりまたカバーの固定ネジの数を多くした
りすると一層ハウジングの占める面積が大きくな
るほかプリント基板に設けられるネジ孔が多くな
る等プリント基板回路設計上不都合を生ずる欠点
があつた。
Traditionally, when mounting a flat circuit board (hereinafter referred to as a flat board) such as an IC, LSI, or printed circuit board on another printed circuit board, there are methods of directly connecting and fixing the two by soldering, etc., as well as methods of using connectors or sockets. There is. For example, in an IC or LSI having lead-type or pin-type connection terminals, a socket 3 equipped with a socket contact 2 that fits each terminal 1 is fixed in advance on a printed circuit board 4, as shown in FIG. Mounting is carried out by fitting the terminals 1 of the flat plate 5 to be mounted into each socket contact and pushing the flat plate into the socket. However, with this method, as the number of terminals on the flat plate increases, the clamping force of the entire socket contact increases, so a large force is required when inserting or removing the flat plate from the socket, and there is a risk of accidentally damaging the terminals or the flat plate itself. In addition to the possibility of serious accidents, since the terminal and socket contact are connected in series, the conductive path from the flat plate to the printed circuit board becomes long, which has an adverse effect on high frequency characteristics. Furthermore, there are mounting methods as shown in FIGS. 2 and 3 for devices having connection terminals that are directly attached to a flat plate called a pad. For example, Figure 2a
Reference numeral 6 denotes a flat plate to be mounted, which has a pad 7 on its periphery. A housing 9 is mounted on the printed circuit board 8 in advance, and elastic metal contacts 11 corresponding to the pads 7 are arranged in a recess 10 in the housing, and one end of the contact protrudes from the lower surface of the housing 9 and is mounted on the printed circuit board. Since it is connected to the conductor pattern 12 of
is stored in the recess 10, then a cover 13 is placed from above, the four corners are screwed together with the housing 9 to the printed circuit board, and the flat plate 6 is pressed.
As shown in FIG. 2B (A-A' sectional view in FIG. 2A), the contact 11 comes into elastic contact with the pad 7, thereby connecting the flat plate and the conductive pattern of the printed circuit board. Further, in the method shown in FIG. 3, no contact is provided in the recess 10' of the housing 9' mounted on the printed circuit board 8', and instead, the end 14 of the conductor pattern 12' corresponds to the pad 7 of the flat plate 6. arranged in position. It is a plate-shaped elastic insulator that is approximately the same size as the flat plate, and around its periphery, there is conductive metal foil or the like in a U-shape that faces the pad 7 and the conductor pattern end 14 and short-circuits them. First, the relay elastomer 16 on which the terminals 15 are arranged is placed in the recess 10'.
By placing the flat plate 6 on top of the flat plate 6, covering it with the cover 13 and screwing it onto the printed circuit board as in the case of FIG. 2, the flat plate is pressed by the cover and the flat plate presses the elastomer 16. Due to the elasticity of the elastomer, the terminal 15 comes into sufficient contact with the pad 7 and the conductor pattern end 14, thereby achieving connection between the flat plate and the conductor pattern. In either of the methods shown in FIG. 2 or 3, by sufficiently pressing the flat plate 6 with the cover 13, the contact 11 or the elastomer 1
6 has its own elasticity and comes into contact with the pad of the flat plate with sufficient contact pressure, and by simply attaching and removing the cover, the flat plate can be attached to or removed from the printed circuit board without the need to apply any particular force to the flat plate, thus preventing damage. In addition to being easy to carry out without fear, this method has the advantage that the conductive path can be made shorter than in the case of FIG. 1, so that high frequency characteristics can be improved. However, as the flat plate becomes larger and the number of pads increases, the elasticity of the contacts or elastomer causes the intermediate portions of the housings 9, 9' to become weaker in areas away from the screws that fix the cover, as shown in Figure 4. At most, the cover 13 and the printed circuit boards 8, 8' may be bent as shown by X and X', and as a result, sufficient contact pressure cannot be obtained at the contact area between each pad and the contact or terminal, resulting in electrical contact. There was a risk that it would cause instability. Furthermore, in the above mounting method, the area of the housing on the printed circuit board and the volume including the cover are larger than that of the flat plate body. Increasing the thickness of the cover or increasing the number of fixing screws on the cover not only increases the area occupied by the housing, but also increases the number of screw holes provided on the printed circuit board, which creates disadvantages in terms of printed circuit board circuit design. .

本発明の目的は従来方法における上記の如き各
欠点を除き、プリント基板への平板の装着又は取
外しは容易であつてまた平板からプリント基板に
至る導電路が短いので高周波特性は良好であり、
平板実装のために必要とするプリント基板上の面
積及び体積を大きくすることなく特に平板が大形
となり接続用端子の数が多くなつても回路パター
ンとの接触の信頼性の高い平板状回路体実装方法
を提供することにある。
The purpose of the present invention is to eliminate the above-mentioned drawbacks of the conventional method, to make it easy to attach or remove a flat plate to a printed circuit board, and to have good high frequency characteristics because the conductive path from the flat plate to the printed circuit board is short.
A flat circuit board that provides reliable contact with circuit patterns even when the flat board is large and the number of connection terminals increases, without increasing the area and volume of the printed circuit board required for flat board mounting. The purpose is to provide an implementation method.

以下、本発明の一実施例につき図面を参照して
詳細に説明する。
Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

先ず本発明による回路平板実装方法に使用され
るIC、LSI、プリント基板等の平板の構造を示す
第5図において、平板20の下面には複数のピン
端子30が立設されており、このピン端子と対向
するプリント基板の導体パターンとが導電体を介
して接触することにより平板とプリント基板との
電気的接続が行われるようになつている。
First, in FIG. 5 showing the structure of a flat plate such as an IC, LSI, or printed circuit board used in the circuit flat board mounting method according to the present invention, a plurality of pin terminals 30 are erected on the bottom surface of a flat plate 20. Electrical connection between the flat plate and the printed circuit board is established by bringing the terminals into contact with the conductive pattern of the printed circuit board facing each other via a conductor.

ピン端子30の平板底面に接する部分は座31
を形成し、またピン端子の先端近くにはその茎部
32よりも直径を大としたフランジ33が設けら
れ、特にフランジの平板に近い側の部分は係止用
段差34を形成し後出の如く係止用の係止孔と係
合する機能を果す。エラストマ40は導電性の材
質よりなりその中心に貫通孔を有していてピン端
子に挿着されかつ自己の弾性によりその端面の一
方を座31に接した状態で常時ピン端子に密着し
ている。なおその外径は後出の如く該エラストマ
が押圧され変形した場合に隣接するエラストマ同
士が接触しない程度でなるべく大きいことが座3
1及び後出の導体パターンとの接触面積を大とす
る上で望ましい。第6図は平板20を実装すべき
プリント基板50上に載置した状態であつてプリ
ント基板50には各ピン端子30に対応する位置
にフランジ33が貫通できる直径を有するスルー
ホール51が設けられる。プリント基板面上には
各スルーホールに接続し所要の回路を構成する導
体パターンが設けられているが、特に平板側のス
ルーホール開孔部周囲には、エラストマ40との
接触面を形成するために通常エラストマの端部と
略等しい外径を有する導体パターン52が設けら
れる。係止板60は平板20をプリント基板50
に固定しかつ平板とプリント基板の導体パターン
との電気的接続を達成させるために用いられるも
ので第9図にその外形を示す。該係止板は実装す
べき平板とほぼ等しい平面寸法を有し、その厚み
は平板をプリント基板上に載置した状態において
プリント基板面より突出するピン端子の係止用段
差34とプリント基板面との距離よりも寸法Yだ
けやや大となつておりその面上には平板の各ピン
端子30の配列寸法と等しい寸法にてピン端子と
同数の鍵孔状外形を有する係止孔61が貫設され
ている。該係止孔は円孔部62とそれに連なる長
孔状の狭小部63とからなつていて円孔部62は
ピン端子30のフランジ33が貫通できる直径を
有するが、狭小部63の巾の寸法は、フランジの
直径より小さく茎部32の直径より大となつてお
り、また狭小部の長さは茎部がその端部を貫通し
たときにフランジの係止用段差と十分係合しうる
ように少くともフランジの半径以上であることを
必要とする。(第10図参照)平板をプリント基
板に載置した第6図の状態から平板を完全に実装
するためには第7図の如く平板20、プリント基
板50及び係止板60を一体に押圧する押し治具
70及び受け治具80を必要とする。押圧時各部
にたわみを生じたり或いは局部的な力が加わつた
りしないようにするため、各治具は剛性の大きい
材料で作られる。なお第11図に受け治具80の
構造を示す。受け治具80はその一面の両側に互
いに平行する突壁81を有し、突壁間は治具使用
時に係止板60が収容される凹平面82を形成す
る。又突壁の凹平面からの高さは係止板の厚みよ
り稍大きい寸法とする。凹平面82には、平板2
0のピン端子30と対応しピン端子のフランジ3
3が貫入しうる径を有する逃げ孔83が穿設され
ている。以上のような構成による回路平板実装方
法は下記のとおりである。
The portion of the pin terminal 30 in contact with the bottom of the flat plate is the seat 31.
A flange 33 having a larger diameter than the stem 32 is provided near the tip of the pin terminal, and a locking step 34 is formed on the side of the flange near the flat plate. It functions to engage with a locking hole for locking. The elastomer 40 is made of a conductive material, has a through hole in its center, is inserted into the pin terminal, and is always in close contact with the pin terminal due to its own elasticity, with one end surface in contact with the seat 31. . The outer diameter of the seat 3 should be as large as possible so that adjacent elastomers do not come into contact with each other when the elastomer is pressed and deformed as described later.
This is desirable in order to increase the contact area with 1 and the conductor pattern described later. FIG. 6 shows a state in which the flat plate 20 is placed on a printed circuit board 50 to be mounted, and the printed circuit board 50 is provided with through holes 51 having a diameter that allows the flanges 33 to pass through them at positions corresponding to each pin terminal 30. . A conductor pattern is provided on the printed circuit board surface to connect to each through hole and configure the required circuit, but especially around the through hole opening on the flat plate side, a conductor pattern is provided to form a contact surface with the elastomer 40. A conductive pattern 52 is typically provided on the elastomer having an outer diameter approximately equal to the end of the elastomer. The locking plate 60 connects the flat plate 20 to the printed circuit board 50.
It is used to fix the plate to the substrate and to establish electrical connection between the flat plate and the conductor pattern of the printed circuit board, and its outline is shown in FIG. The locking plate has approximately the same planar dimensions as the flat plate to be mounted, and its thickness is equal to the height difference 34 for locking the pin terminal that protrudes from the printed circuit board surface when the flat plate is placed on the printed circuit board and the printed circuit board surface. A dimension Y is slightly larger than the distance between the flat plate pin terminals 30, and a locking hole 61 having a keyhole-like outer shape and the same number of pin terminals as the pin terminals is penetrated on the surface thereof. It is set up. The locking hole consists of a circular hole portion 62 and a long hole-shaped narrow portion 63 connected thereto.The circular hole portion 62 has a diameter that allows the flange 33 of the pin terminal 30 to pass through, but the width of the narrow portion 63 is smaller than the diameter of the flange and larger than the diameter of the stem 32, and the length of the narrow portion is such that the stem can sufficiently engage the locking step of the flange when the stem passes through the end thereof. must be at least the radius of the flange. (See Figure 10) In order to completely mount the flat plate from the state shown in Figure 6 where the flat plate is placed on the printed circuit board, press the flat plate 20, printed circuit board 50, and locking plate 60 together as shown in Figure 7. A pushing jig 70 and a receiving jig 80 are required. Each jig is made of a highly rigid material in order to prevent bending or local force from being applied to each part during pressing. Note that FIG. 11 shows the structure of the receiving jig 80. The receiving jig 80 has projecting walls 81 parallel to each other on both sides of one surface, and a concave plane 82 is formed between the projecting walls in which the locking plate 60 is accommodated when the jig is used. Also, the height of the projecting wall from the concave plane is slightly larger than the thickness of the locking plate. The concave plane 82 has a flat plate 2
The flange 3 of the pin terminal corresponds to the pin terminal 30 of 0.
An escape hole 83 having a diameter that allows the passage of 3 is bored. A circuit board mounting method using the above configuration is as follows.

先ず第6図の如く平板20をプリント基板50
上に載置してピン端子30をプリント基板のスル
ーホール51を通してその下面に突出せしめ、次
に係止板60を係止孔61にピン端子を貫通させ
た状態でプリント基板の下面に密接させるが、そ
の場合前述の如き係止板の厚みによりピン端子の
フランジの係止用段差34が係止板下面よりもや
や孔内に寸法Yだけ引込んだ位置となる。そして
この状態では第10図aのようにフランジ33が
係止孔の円孔部62の位置にあるため係止板はそ
の水平方向には摺動することができない。次に第
7図の如く平板20、プリント基板50及び係止
板60を一体に押し治具70及び受け治具80に
よつて上下から押圧力Fを加えると、同図bのよ
うに受け治具80はその突壁81でプリント基板
50を押しエラストマ40はプリント基板と平板
20の間にあつて圧縮されるから、その分だけピ
ン端子30のプリント基板下面よりの突出長が大
となる。従つてエラストマの圧縮量が上記の寸法
Yよりも大となるような押圧力Fを加えればフラ
ンジの係止用段差34は係止板61の下面よりも
突出する。そしてこの状態では係止孔内には小さ
い径の茎部32のみが貫通しておりかつ上記のよ
うに係止板は受け治具からの力は直接受けていな
いので、係止板を第7図a又は第9図に示すa方
向に容易に摺動させることが可能となる。そして
係止板をa方向に摺動させ第10図bの如く係止
孔の狭小部63を茎部32の位置まで移動させて
から押し治具及び受け治具を取り去ると、エラス
トマ40は圧縮状態からの反撥弾性により平板と
プリント基板との間隔を離そうとし端子ピン30
も圧縮時の突出状態から再び係止孔内に引き込ま
れようとするが、端子ピンの係止孔の狭小部63
の位置にあるためフランジの係止用段差34が狭
小部により係止されそれ以上係止孔内に戻ること
がない。従つてエラストマはなお第6図で示す寸
法Yだけの圧縮状態を残しているので、その残存
弾性により係止用段差34は狭小部63に圧接さ
れ安定した係合状態を保つと共にエラストマ40
は自己の残存弾性をもつてその両端面をピン端子
の座31及びプリント基板の導体パターン52に
密接させ相互に確実な電気的接触状態を維持す
る。これが第8図に状態にあつてこれにより平板
は確実にプリント基板上に実装されたことにな
る。また実装されている平板をプリント基板から
取り外す必要があるときは上記と逆の方法をとる
ことにより容易に行いうる。なお上記の方法にお
いて実装すべき平板の寸法が大きくなつた場合、
受け治具80でプリント基板50を押圧したとき
にエラストマの反撥弾性により突壁81の中間部
分でプリント基板が平板と逆の側に反つてしまい
その分だけプリント基板面からのピン端子の突出
量が不足しそのため係止板が摺動できなくなる状
態を生ずるおそれがある。そのときは第11図の
ように受け治具の凹平面82に、突壁81と等し
い高さを有し突壁の中間部分でプリント基板を支
える役をする一乃至複数個の反り止めスタンド8
4を立設する。そしてこの場合には第9図の如く
係止板60にもこの反り止めスタンドの貫通する
長孔64が必要である。なおこの長孔の長径方向
の長さは係止板を摺動させたときに反り止めスタ
ンドと当接しない程度でなければならない。その
ほかピン端子と係止板を係合させる方法等は上記
を全く同じである。その他治具で押圧力を加えた
ときにエラストマが圧縮されフランジが係止板の
摺動を妨げない程度に係止板の面よりも突出した
ことを確認する方法としては例えば第7図のよう
に受け治具の逃げ孔83をエラストマが必要量だ
け圧縮されたときに端子ピン30の先端が丁度そ
の孔底に突き当るような深さとしたものでもよ
く、或いは平板とプリント基板の間に所定の厚み
を有するゲージ90を挾む手段をとつてもよい。
First, as shown in FIG.
Place the pin terminal 30 on top of the printed circuit board and make it protrude from the bottom surface of the printed circuit board through the through hole 51, and then place the locking plate 60 in close contact with the bottom surface of the printed circuit board with the pin terminal passing through the locking hole 61. However, in this case, due to the thickness of the locking plate as described above, the locking step 34 of the flange of the pin terminal is at a position slightly recessed into the hole by a distance Y from the lower surface of the locking plate. In this state, as shown in FIG. 10a, the flange 33 is located at the circular hole 62 of the locking hole, so the locking plate cannot slide in the horizontal direction. Next, as shown in FIG. 7, when pressing force F is applied from above and below using the pushing jig 70 and the receiving jig 80, the flat plate 20, the printed circuit board 50, and the locking plate 60 are pressed together, and the receiving jig 80 is pressed as shown in FIG. Since the tool 80 presses the printed circuit board 50 with its projecting wall 81 and the elastomer 40 is compressed between the printed circuit board and the flat plate 20, the protrusion length of the pin terminal 30 from the lower surface of the printed circuit board increases accordingly. Therefore, if a pressing force F is applied such that the amount of compression of the elastomer becomes larger than the above-mentioned dimension Y, the locking step 34 of the flange will protrude beyond the lower surface of the locking plate 61. In this state, only the stem portion 32 with a small diameter has penetrated into the locking hole, and the locking plate is not directly receiving the force from the receiving jig as described above. It becomes possible to easily slide in the direction a shown in Figure a or Figure 9. Then, when the locking plate is slid in the direction a and the narrow part 63 of the locking hole is moved to the position of the stem 32 as shown in FIG. 10b, the pushing jig and the receiving jig are removed. The terminal pin 30 tries to increase the distance between the flat plate and the printed circuit board due to the repulsion from the state.
The terminal pin tries to be pulled into the locking hole again from the protruding state when compressed, but the narrow part 63 of the locking hole of the terminal pin
Since the locking step 34 of the flange is located at this position, the locking step 34 of the flange is locked by the narrow portion and does not return any further into the locking hole. Therefore, the elastomer still remains compressed by the dimension Y shown in FIG.
With its own residual elasticity, both end surfaces are brought into close contact with the pin terminal seat 31 and the conductive pattern 52 of the printed circuit board, thereby maintaining a mutually reliable electrical contact state. This is the state shown in FIG. 8, which means that the flat plate has been reliably mounted on the printed circuit board. Furthermore, if it is necessary to remove the mounted flat plate from the printed circuit board, this can be easily done by using the reverse method to the above. In addition, if the dimensions of the flat plate to be mounted in the above method become large,
When the printed circuit board 50 is pressed by the receiving jig 80, the rebound of the elastomer causes the printed circuit board to warp in the middle part of the projecting wall 81 toward the side opposite to the flat plate, and the pin terminal protrudes from the printed circuit board surface by that amount. There is a risk that the locking plate will not be able to slide due to insufficient amount. In that case, as shown in FIG. 11, one or more anti-warping stands 8 are installed on the concave surface 82 of the receiving jig, which has the same height as the projecting wall 81 and serves to support the printed circuit board at the middle part of the projecting wall.
4 will be erected. In this case, as shown in FIG. 9, the locking plate 60 also needs a long hole 64 through which the anti-warp stand passes. The length of this elongated hole in the major diameter direction must be such that it does not come into contact with the anti-warping stand when the locking plate is slid. Other than that, the method of engaging the pin terminal and the locking plate is exactly the same as described above. Another way to check that the elastomer is compressed when a pressing force is applied with a jig and that the flange protrudes beyond the surface of the locking plate to the extent that it does not interfere with the sliding of the locking plate is as shown in Figure 7. The escape hole 83 of the receiving jig may be made deep enough so that the tip of the terminal pin 30 just hits the bottom of the hole when the elastomer is compressed by the required amount, or a predetermined hole 83 may be provided between the flat plate and the printed circuit board. It is also possible to take measures to sandwich the gauge 90 having a thickness of .

なお上記の実施例ではエラストマは個別のもの
を使用したが、これは第12図のようにピン端子
の外周に接する導電性部分101と、その他の絶
縁性部分102とからなり両者を一体形成して構
成した板状のエラストマ100でもよく、或いは
エラストマの代りに第13図の如く彎曲部分を有
する弾性金属板製のコンタクト200を使用する
こともできる。更に第14図に示すように第12
図の板状エラストマ100と類似する板状エラス
トマ100′を平板側ではなくプリント基板50
の側に接着等の方法で固定するようにしてもよ
い。また本実施例は、係止孔として特定の形状の
もので説明したが、フランジの肩部を係止しうる
狭小部を有するものであれば例えば三角形或いは
その他の形状であつても差支えなく本発明の範囲
内で各種の設計上の変更を含むことは当然であ
る。
In the above embodiment, separate elastomers were used, but as shown in Fig. 12, this elastomer consists of a conductive part 101 that contacts the outer periphery of the pin terminal and another insulating part 102, and both are integrally formed. Alternatively, instead of the elastomer, a contact 200 made of an elastic metal plate having a curved portion as shown in FIG. 13 may be used. Furthermore, as shown in FIG.
A plate-shaped elastomer 100' similar to the plate-shaped elastomer 100 in the figure is placed on the printed circuit board 50 instead of on the flat plate side.
It may also be fixed to the side by adhesive or the like. Further, in this embodiment, the locking hole has a specific shape, but it may be triangular or any other shape as long as it has a narrow portion that can lock the shoulder of the flange. Naturally, various design changes are included within the scope of the invention.

以上の説明によつて明らかなように本発明の回
路平板実装方法によれば、IC、LSIまたはプリン
ト基板等の回路平板プリント基板に実装する場合
に、平板の固定方法としてピン端子のフランジを
係止板に係合させ更にエラストマの反撥弾性によ
り圧接するようにしているのでその固定状態は安
定しているのみならず治具の使用によりプリント
基板への平板の取り付け取り外しは容易であり、
また平板とプリント基板との電気的接続は圧縮さ
れた導電性エラストマが両者に密接することによ
りなされるのでその接触状態は確実であつてかつ
コネクタ等を使用する場合に比し導電路を短くで
きるから高周波特性が良好であるほか、係止板の
使用により平板実装のために必要とするプリント
基板上の面積及び体積が小さくて済みかつプリン
ト基板上に固定ネジ用のネジ孔を設ける必要がな
いからプリント基板回路設計上極めて有利であ
り、特に平板が大形となつても端子とプリント基
板の回路パターンとの接触の信頼性を高く保つこ
とが可能である等の特徴を多く有するので、装置
への適用に際して信頼性を向上することができか
つ装置の小形化に寄与し得更に平板の取り付け取
り外しが容易である点でその得られる効果は極め
て大きい。
As is clear from the above explanation, according to the circuit flat board mounting method of the present invention, when mounting on a circuit flat printed circuit board such as an IC, LSI or printed circuit board, the flange of the pin terminal is used as a method for fixing the flat board. Since it is engaged with the stop plate and pressed against it by the rebound elasticity of the elastomer, the fixed state is not only stable, but also the flat plate can be easily attached to and removed from the printed circuit board by using a jig.
In addition, the electrical connection between the flat plate and the printed circuit board is made by the compressed conductive elastomer coming into close contact with both, so the contact is reliable and the conductive path can be made shorter than when using connectors, etc. In addition to having good high-frequency characteristics, the use of a locking plate reduces the area and volume required on the printed circuit board for flat board mounting, and there is no need to provide screw holes for fixing screws on the printed circuit board. It is extremely advantageous in terms of printed circuit board circuit design, and has many features such as being able to maintain high reliability of contact between the terminal and the circuit pattern of the printed circuit board even when the flat plate becomes large. When applied to the device, the reliability can be improved, the device can be made smaller, and the flat plate can be easily attached and detached, which is an extremely significant effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はソケツトを使用する実装方法の従来例
である。第2図、第3図及び第4図はパツドを有
する平板の実装方法の従来例である。第5図は本
発明に使用される平板の一例の側面図及び平面図
である。第6図、第7図及び第8図は本発明に係
る平板実装方法を示す図である。第9図は本発明
に使用される係止板の一例の平面図である。第1
0図は係止孔とピン端子との位置関係を示す図で
ある。第11図は本発明に使用される受け治具の
一例を示す斜視図である。第12図、第13図及
び第14図は本発明に係る他の実施例である。 20……回路平板(平板)、30……ピン端
子、40……エラストマ、50……プリント基
板、52……回路パターン、60……係止板、7
0……押し治具、80……受け治具。
FIG. 1 shows a conventional example of a mounting method using a socket. FIGS. 2, 3, and 4 show conventional examples of a method for mounting a flat plate having pads. FIG. 5 is a side view and a plan view of an example of a flat plate used in the present invention. FIG. 6, FIG. 7, and FIG. 8 are diagrams showing a flat plate mounting method according to the present invention. FIG. 9 is a plan view of an example of a locking plate used in the present invention. 1st
Figure 0 is a diagram showing the positional relationship between the locking hole and the pin terminal. FIG. 11 is a perspective view showing an example of a receiving jig used in the present invention. FIGS. 12, 13, and 14 show other embodiments of the present invention. 20... Circuit flat plate (flat plate), 30... Pin terminal, 40... Elastomer, 50... Printed circuit board, 52... Circuit pattern, 60... Locking plate, 7
0...Pushing jig, 80...Receiving jig.

Claims (1)

【特許請求の範囲】[Claims] 1 電気回路を有する2枚の回路平板の一方を相
互の電気的接続をとりながら他方の回路平板の上
に実装する方法であつて、一方の回路平板はその
片面にピン端子を植立しており、該ピン端子は先
端付近に係止用段差を有するフランジ部と、該フ
ランジ部に連なりフランジ部より小さな径の茎部
と、一方の回路平板と接する個所には該ピン端子
と一体をなす座とをそれぞれ有し、かつ該ピン端
子の周囲には前記座と接して弾性導電体を配し、
また他の回路平板には前記ピン端子が貫通しうる
孔が貫設され該孔の一方の回路平板側の開孔部周
囲には導体部が設けてあり、一方の回路平板を他
方の回路平板に平行に重ねて前記孔に前記ピン端
子を貫通して反対側の面にフランジ部を突出せし
めた後、該フランジ部の係止用段差と他方の回路
平板の面との間に該係止用段差と係合しうる狭小
部を有する係止板を挿入することにより、前記2
枚の回路平板を係止させると共に前記弾性導電体
を圧縮状態とさせその反撥弾性によつて該弾性導
電体自体が前記座と前記導体部とに圧接すること
により前記2枚の回路平板相互の電気的接続が得
られるように構成したことを特徴とする回路平板
実装方法。
1 A method in which one of two circuit boards having an electric circuit is mounted on the other circuit board while making mutual electrical connections, and one circuit board has pin terminals planted on one side. The pin terminal has a flange portion having a locking step near the tip, a stem portion that is connected to the flange portion and has a smaller diameter than the flange portion, and is integral with the pin terminal at a point where it contacts one of the circuit flat plates. a seat, and an elastic conductor is arranged around the pin terminal in contact with the seat,
In addition, a hole through which the pin terminal can pass is provided in the other circuit plate, and a conductor portion is provided around the opening on one circuit plate side of the hole, and one circuit plate is connected to the other circuit plate. After passing the pin terminal through the hole and protruding the flange portion to the opposite surface, the locking portion is placed between the locking step of the flange portion and the surface of the other circuit flat plate. By inserting a locking plate having a narrow portion that can engage with the step, the second
At the same time, the elastic conductor is compressed and the elastic conductor itself is brought into pressure contact with the seat and the conductor portion due to its repulsion, thereby causing the two circuit plates to be in contact with each other. A method for mounting a circuit on a flat board, characterized in that the circuit is configured so as to obtain an electrical connection.
JP6411879A 1979-05-24 1979-05-24 Method of mounting circuit flat board Granted JPS55155480A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6411879A JPS55155480A (en) 1979-05-24 1979-05-24 Method of mounting circuit flat board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6411879A JPS55155480A (en) 1979-05-24 1979-05-24 Method of mounting circuit flat board

Publications (2)

Publication Number Publication Date
JPS55155480A JPS55155480A (en) 1980-12-03
JPS6217832B2 true JPS6217832B2 (en) 1987-04-20

Family

ID=13248822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6411879A Granted JPS55155480A (en) 1979-05-24 1979-05-24 Method of mounting circuit flat board

Country Status (1)

Country Link
JP (1) JPS55155480A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4003230B2 (en) 2003-01-23 2007-11-07 船井電機株式会社 Mounting structure of ball grid array type IC
JP4722715B2 (en) * 2006-01-30 2011-07-13 日本モレックス株式会社 socket

Also Published As

Publication number Publication date
JPS55155480A (en) 1980-12-03

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