JPS6220211B2 - - Google Patents

Description

[Detailed description of the invention]

[Technical Field] The present invention relates to a method for producing a phenolic resin used for electrical equipment, electrical laminates, etc. [Background technology] Conventionally, phenolic resins used for casting, insulating coatings, molding materials, and electrical laminates have been unreliable due to poor water resistance and heat resistance during the plating and soldering processes during molded product processing. The current situation is that it cannot keep up with the strict quality requirements that have come with recent developments in electronics. [Object of the Invention] An object of the present invention is to improve the water resistance, heat resistance, etc. of phenolic resin molded products. [Disclosure of the Invention] The present invention involves adding formaldehyde to an oil-modified phenol reactant obtained by reacting phenols with a drying oil, and a xylene resin-modified phenol reactant obtained by reacting phenols with a xylene resin under an alkali catalyst. The present invention will be described in detail below using a method for producing a phenolic resin, which is characterized in that the reaction is carried out in the following manner. Phenols used in the present invention include phenolic compounds such as phenol, cresol, xylenol, etc. alone or in mixtures, and drying oils include tung oil, linseed oil, castor oil, soybean oil, etc. alone or in mixtures. The reaction between phenols and drying oil is
This is carried out by adding 30 to 80 parts of drying oil to 100 parts by weight (hereinafter simply referred to as "parts") of the phenol, and further adding a catalyst such as para-toluenesulfonic acid as necessary, followed by heating. If the amount of drying oil is less than 30 parts, punching workability will decrease, and if it exceeds 80 parts, heat resistance will decrease. Xylene resin is obtained by the reaction of xylene and formaldehyde.
The reaction between the xylene resin and the phenols is carried out by adding 35 to 85 parts of the xylene resin to 100 parts of the phenol, and if necessary, adding a catalyst such as para-toluenesulfonic acid and heating. If the amount of xylene resin is less than 35 parts, water resistance will decrease, and if it exceeds 85 parts, heat resistance will decrease. The reaction between the oil-modified phenol reactant and the xylene resin-modified phenol reactant is the oil-modified phenol reactant.
100 parts and xylene resin modified phenol reactant 10
Formaldehyde such as formalin or paraformaldehyde is added to ~1000 parts, and the mixture is reacted under an alkali catalyst such as ammonia water, various amine compounds, or sodium hydroxide. In addition, since the above composition has good water resistance and heat resistance, it can be used for printed wiring board substrates, variable resistance substrates, terminal boards such as switches, other insulating substrates, insulating molded products, various electronic parts, and electrical equipment. It can be used as a material for The present invention will be explained below based on examples. Example 1 35 parts of paulownia was added to 100 parts of phenol, 1 part of para-toluenesulfonic acid was added, and the mixture was heated at 35° C. for 160 minutes to obtain a tung oil-modified phenol reaction product. Separately, 40 parts of xylene resin (manufactured by Matsushita Electric Works Co., Ltd., product number CJ-10) was added to 100 parts of phenol, and then 1 part of para-toluenesulfonic acid was added and heated at 95°C for 90 minutes to obtain a xylene resin-modified phenol reactant. Ta. Next, 15 parts of the above xylene resin modified phenol reactant were added to 100 parts of the above tung oil modified phenol reactant, and then 70 parts of 37% formalin, 4 c.c. of 25% aqueous ammonia, and 2 c.c. of triethylamine were added and heated at 80°C. 90
After heating for a minute, dehydration is performed under reduced pressure to obtain a phenolic resin, and then the phenolic resin is diluted with methyl alcohol to give a resin amount of 50% by weight (hereinafter simply referred to as %).
A resin varnish was obtained. Furthermore, the thickness of this resin varnish
8 pieces of prepreg obtained by impregnating and drying 0.25 mm Kotton linter paper to a resin content of 45%. Copper foil with a thickness of 35 microns adhesive is placed on the top and bottom surfaces of 8 sheets of prepreg, with the adhesive side facing the prepreg. The laminated body was placed between metal plates and molded at a pressure of 100Kg/cm ² and at 155℃.
Heat and pressure was applied for 60 minutes to obtain a 1.6 mm thick phenolic resin paper base double-sided copper-clad laminate. Example 2 After adding 75 parts of tung oil to 100 parts of phenol, 1.5 parts of para-toluenesulfonic acid was added and heated at 90°C for 175 minutes to obtain a tung oil-modified phenol reaction product. Separately, 80 parts of the same xylene resin as in Example 1 was added to 100 parts of phenol, and then para-toluenesulfonic acid was added.
1.5 parts were added and heated at 90°C for 120 minutes to obtain a xylene resin-modified phenol reactant. Next, 980 parts of the above xylene resin modified phenol reactant was added to 100 parts of the above tung oil modified phenol reactant, and then 630 parts of 37% formalin, 32 c.c. of 25% aqueous ammonia, and 21 c.c. of triethylamine were added at 85°C. After heating for 100 minutes, the phenolic resin was obtained by dehydration under reduced pressure, and then the phenolic resin was diluted with methyl alcohol to reduce the amount of resin.
A 50% resin varnish was obtained. Furthermore, it was treated in the same manner as in Example 1 except that this resin varnish was used, and the thickness was 1.6.
A double-sided copper-clad laminate with a phenolic resin paper base of mm was obtained. Conventional Example A phenolic resin paper base double-sided copper-clad laminate with a thickness of 1.6 mm was obtained in the same manner as in Example 1 except that a phenolic resin varnish having a resin content of 50% was used. Comparative Example A film with a thickness of 1.6
A double-sided copper-clad laminate with an epoxy resin paper base of mm was obtained. [Effects of the Invention] As is clear from Table 1, the performance of the laminates of Examples 1 and 2, the conventional example, and the comparative example is that the laminates obtained using the phenolic resin of the present invention have good water resistance and heat resistance. etc., confirming the superiority of the phenolic resin of the present invention.

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Claims (1)

[Claims] 1 100 parts by weight of an oil-modified phenol reactant obtained by reacting 30 to 80 parts by weight of drying oil with 100 parts by weight of phenols, and 100 parts by weight of phenols.
1. A method for producing a phenolic resin, which comprises adding formaldehyde to 10 to 1000 parts by weight of a xylene resin-modified phenol reactant obtained by reacting 35 to 85 parts by weight of a xylene resin, and reacting the mixture under an alkali catalyst.