JPS6221204B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dual circuit board that is mounted on a printed wiring board, etc., and used to fabricate an integrated circuit structure.
It relates to electronic devices for mounting on boards, such as in-bagage type switches (deep switches).

Conventionally, as the electronic device, for example, a first
As shown in Figures a to 1c, the terminal 3 is attached to the case 2.
a, 3b are fixed by insert molding, and a striker 6, which is a knob, is slidably provided so as to face the window 5a provided in the cover 4 fixed to the case 2, and by sliding this striker 6. , there is one in which a single switch 8, which is an electronic mechanism section consisting of a movable piece 7 provided inside the striker 6 and both terminals 3a and 3b, is turned on and offset.

When this electronic device 1 is attached to a printed wiring board such as a control circuit, for example, preliminary soldering is performed, and then various other electronic devices and electronic components (usually, It is molded in resin) and can be attached.

By the way, during the preliminary soldering and mounting on the board, dirt such as flux adheres to the terminal group 3 of the electronic device 1, so after soldering,
This dirt needs to be removed.

This dirt removal work is done after the soldering work.
Each step was done by hand and was very tedious. This is because openings such as the window 5a (window group 5) are provided on the top surface of the electronic device 1, so after the soldering work, it is necessary to wash it with a cleaning solution such as an organic solvent to remove dirt such as flux. This is because it cannot be removed.

On the other hand, when mounting the electronic device 1 on a printed wiring board, first, after mounting other electronic devices that can be washed with a cleaning solution, care must be taken to prevent contamination such as flux from adhering to the board. A method of manually soldering using a soldering iron or the like has also been used, but even this method is troublesome because it requires double soldering.

The present invention has been made in view of the above-mentioned problems. During soldering, the electronic device itself is vacuum-packed with a thermoplastic synthetic resin film and a synthetic resin sheet, and after cleaning, The present invention aims to provide an electronic device for attaching to a board which has effects such as good storage stability until use by peeling off the film.

Next, the present invention will be explained with reference to FIG. 2, which is an embodiment.

In the drawings, the electronic device 11 is the first device described above.
It is exactly the same as shown in the figure.

Reference numeral 12 is a sheet made of thermoplastic synthetic resin such as polyester, which has good moisture proofing properties and electrical insulation properties, and is easy to cut.

This sheet 12 includes an electronic device mounting section 12a for placing the electronic device 11 in close contact with the terminal group 3 inserted therein, and a cutting section 13a for easily cutting the electronic device 11 without using scissors, a knife, etc. is formed with a large number of vacuum suction/cutting holes 13 such as perforations.

Reference numeral 14 denotes a transparent or translucent thermoplastic resin film, which is used to connect each electronic device 11 to the peripheral surface of each electronic device mounting portion 12a of the sheet 12 through the vacuum suction/cutting hole 13. It is a vacuum pack.

Reference numeral 14b denotes a peeling piece portion formed on the film 14 with one surface portion 12b of the peripheral edge portion of each electronic device mounting portion of the sheet 12;
2b is in a non-contact state.

In the single electronic device 11 separated from the cut portion 13a of the sheet 12, it is vacuum packed with the sheet 12 and the film 14, and all the window groups 5 of the electronic device 11 are sealed. After preliminary soldering, the flux and other stains that adhered during soldering can be easily removed by washing with a cleaning solution.

After cleaning, as shown in FIG. 4, other electronic components 16 (usually resin-molded) are mounted on the printed wiring board 15 such as a control circuit.
At the same time, it is attached by soldering, etc.
In this way, the electronic device 1 mounted on the board 12
Since No. 1 is completely sealed, dirt such as flux adhering to this mounting board during soldering can be easily removed by washing with a cleaning solution in the same manner as described above. Further, it can be mounted all at once without requiring the double effort of soldering unlike in any conventional type. Further, after cleaning the mounting board 15, the film 14 is peeled off by grasping and pulling the peeling piece 14b by hand. As a result, the window group 5 of the electronic device 11 is exposed, and the setting operation can be performed without any trouble as in the conventional case. This completes the preparation for operation of the printed wiring board 15 (integrated circuit structure).

Note that the technical idea of the present invention is not limited to the case where the electronic device 11 is a dip switch as in the present embodiment, but is applicable to other devices such as a dip timer, etc. It can also be applied to electronic equipment provided with an opening that communicates with the.

As is clear from the above explanation, according to the electronic device for mounting on a board according to the present invention, the vacuum suction and cutting hole is not provided before the terminal is pre-soldered or mounted on a printed wiring board, etc. Since it is vacuum-packed with a synthetic resin sheet and a transparent or translucent thermoplastic synthetic resin film, dirt such as flux that adheres during soldering can be easily removed by washing with a cleaning solution. , Therefore, the implementation work can be extremely simplified.

In addition, since it is possible to maintain the vacuum packed state until use, it not only has good storage stability, but also
Since multiple electronic devices are in a continuous state, by using the sheet as a tape carrier,
It is also possible to automate the transfer to printed wiring boards and the like.

Furthermore, the sheet is provided with numerous holes for vacuum suction and cutting, such as perforations, so that the electronic device mounting parts can be easily separated individually. Each electronic device can be easily separated.

If the film is formed with a peeling piece that is not in close contact with one surface of the peripheral surface of each electronic device placement part of the sheet, the peeling operation after mounting on the board can be facilitated. can be done.

[Brief explanation of the drawing]

1a to 1c are configuration explanatory diagrams of a conventional board-mounted electronic device, and are respectively a plan view, a side view, and a cross-sectional view, and FIG. Perspective view for explaining structure, 3rd
The figure is a sectional view of a main part of the electronic device shown in FIG. 2, and FIG. 4 is an explanatory diagram of the electronic device shown in FIG. 2 mounted on a printed wiring board. 11-electronic device, 12-sheet, 12a-electronic device mounting section, 12b-one surface part of the peripheral surface of the mounting section,
13~vacuum suction and cutting hole, 13a~cutting part,
14 - Film, 14b - Peeling piece, 15 - Printed wiring board.

Claims (1)

[Claims] 1. A case containing an electronic mechanism section has a large number of terminal groups protruding downward, and a plurality of electronic devices having an opening communicating with the inside of the case is connected to a case containing a large number of vacuum holes such as perforations. The terminal is inserted into and placed in the synthetic resin sheet in close contact with the sheet, and the terminal is inserted into the synthetic resin sheet in which an electronic device placement portion and a cutting portion are formed with a suction/cutting hole. 1. An electronic device for mounting on a board, characterized in that each electronic device is vacuum-packed with a peripheral surface of each electronic device mounting portion of the sheet using a resin film. 2. The substrate mounting device according to claim 1, wherein the film is provided with a peeling piece portion that is not in close contact with one surface of the peripheral surface of each electronic device mounting portion of the sheet. Electronics.