JPS6222237B2 - - Google Patents
Info
- Publication number
- JPS6222237B2 JPS6222237B2 JP56040138A JP4013881A JPS6222237B2 JP S6222237 B2 JPS6222237 B2 JP S6222237B2 JP 56040138 A JP56040138 A JP 56040138A JP 4013881 A JP4013881 A JP 4013881A JP S6222237 B2 JPS6222237 B2 JP S6222237B2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- ceramic substrate
- electrical connector
- contacts
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
【発明の詳細な説明】
この発明はLSIおよび超LSIを搭載した多ピン
付チツプキヤリアパツケージなどをプリント基板
に実装するための電気接続器に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrical connector for mounting a multi-pin chip carrier package on which an LSI or a very LSI is mounted on a printed circuit board.
従来、多ピン付チツプキヤリアパツケージのた
めの電気接続器はこのパツケージ端子との接触・
解除をスライドレバーあるいは回転レバーによつ
て行なう構成である。しかしながら、このような
電気接続器はスライドレバー機構による形状の大
型化および構造の複雑化を免れ得ない。また、
1000端子以上の超多ピンパツケージに対応するこ
とが困難である。これに対応するために超多ピン
のLSI搭載パツケージ用には液体状金属を使用す
ることが考えられるが、この場合には衝撃力によ
つて収納部からの飛散および脱落が生じ易く、振
動による共振瞬断および取付位置のかたよりによ
り接触を安定保持することが極めて困難である。 Conventionally, electrical connectors for chip carrier packages with multiple pins have been designed to make contact with the package terminals.
The release is performed using a slide lever or a rotary lever. However, such an electrical connector inevitably has a larger size and a more complicated structure due to the slide lever mechanism. Also,
It is difficult to support extremely high-pin packages with over 1000 terminals. In order to cope with this, it is possible to use liquid metal for LSI mounting packages with a large number of pins, but in this case, it is easy to scatter or fall off from the storage part due to impact force, and it is likely to be caused by vibration. It is extremely difficult to maintain stable contact due to instantaneous resonance interruptions and uneven mounting positions.
この発明の目的は、上述した問題点を解決する
ためになされたものであり、熱エネルギーを加え
たり除去したりすることにより超弾性による形状
回復作用をなす形状記憶合金を利用して導電性接
触部材を構成することにより、極めて僅かな付与
力にて挿抜を行なうことができる上に、高信頼度
な接触状態を形成できる電気接続器を提供するこ
とにある。 The purpose of the present invention was to solve the above-mentioned problems, and the purpose of the present invention is to create a conductive contact using a shape memory alloy that recovers its shape due to superelasticity when thermal energy is applied or removed. It is an object of the present invention to provide an electrical connector that can be inserted and removed with an extremely small applied force by configuring the members, and can also form a highly reliable contact state.
本発明による電気接続器は、複数の貫通孔と該
貫通孔に隣接して印刷配置された発熱体とを有す
るセラミツク基板と、形状記憶合金からなり縦方
向にスリツトを有し挿入されるピン端子を受容す
る開口筒状部を上端に有し下端を前記セラミツク
基板の貫通孔に挿入配置した複数の接触子と、該
接触子を搭載した前記セラミツク基板を収納し前
記開口筒状部に対応する位置に複数の前記ピン端
子を貫通させる孔を有するハウジングとを備え、
前記発熱体への通電による温度変化に応答して前
記接触子の開口筒状部が前記ピン端子を締結ある
いは開放することを特徴とする。 The electrical connector according to the present invention includes a ceramic substrate having a plurality of through holes and a heating element printed and arranged adjacent to the through holes, and a pin terminal made of a shape memory alloy and having a longitudinal slit and inserted. A plurality of contacts having an open cylindrical part at the upper end and having a lower end inserted into the through hole of the ceramic substrate, and the ceramic substrate on which the contacts are mounted are accommodated and correspond to the open cylindrical part. a housing having a hole through which a plurality of the pin terminals pass through the housing;
It is characterized in that the open cylindrical portion of the contactor connects or opens the pin terminal in response to a temperature change due to energization of the heating element.
以下、図面を参照してこの発明の実施例につい
て説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第1図、第2図および第3図はこの発明による
電気接続器の一実施例を示している。各図を参照
すると、この実施例の電気接続器は、複数の貫通
孔1aをマトリツクス状に穿設し発熱体2を主表
面上に蛇行印刷する上に、この発熱体の引出端子
2a,2bを植設してなるセラミツク基板1と、
挿入されるピン端子8aを受容する開口筒状部4
aを有し且つセラミツク基板1の貫通孔1aに嵌
着される形状記憶合金よりなる接触子4と、後述
するLSI搭載パツケージ8を載置する壁面にこの
パツケージのピン端子8aを導入するための複数
の孔6aおよび発熱体2の引出端子2a,2bの
導出孔6aを設けたプラスチツク製のハウジング
6とを備えている。ここで、接触子4を嵌装した
セラミツク基板1は矢印A方向からハウジング6
に嵌装される。また、このように構成された電気
接続器7には、矢印B方向からLSI搭載パツケー
ジ8が載置される。この場合、引出端子2a,2
b間に通電すると発熱体2によつて発熱し周囲温
度を上昇させその熱エネルギーにより形状記憶合
金で造られた接触子4の一端の開口筒状部4aの
内径が拡がりLSI搭載パツケージ8のピン端子8
aは低挿入力あるいは無挿入力で第3図Aに示す
ように装着できる。装着後、引出端子2a,2b
への通電を停止すると発熱体2からの発熱は減少
し形状記憶合金で造られた開口筒状部4aの内径
が狭まりピン端子8a及び接触子4は第3図Bに
示すように圧接接触する。また、接触子4を構成
する形状記憶合金とは公知のように、その高温相
での形状を記憶しており室温や低温でかなり変形
させても加熱して高温相にすればまた元の形状に
もどり、可逆的形状変化を成すことから、LSI搭
載パツケージ8が不良になつたときは引出端子2
a,2bに通電して熱を発生させ接触子4の開口
筒状部4aの内径が拡がる状態に復元させ取はず
しを行なう。 1, 2 and 3 show one embodiment of an electrical connector according to the invention. Referring to each figure, the electrical connector of this embodiment has a plurality of through holes 1a formed in a matrix, a heating element 2 meanderingly printed on the main surface, and lead-out terminals 2a, 2b of the heating element. a ceramic substrate 1 formed by implanting
Open cylindrical portion 4 that receives the inserted pin terminal 8a
a and a contactor 4 made of a shape memory alloy that is fitted into the through hole 1a of the ceramic substrate 1, and a wall surface on which an LSI mounting package 8 (to be described later) is placed, for introducing the pin terminal 8a of this package. It is provided with a plastic housing 6 provided with a plurality of holes 6a and lead-out holes 6a for the lead-out terminals 2a and 2b of the heating element 2. Here, the ceramic substrate 1 with the contacts 4 fitted thereon is shown in the housing 6 from the direction of arrow A.
is fitted in. Furthermore, an LSI mounting package 8 is placed on the electrical connector 7 configured in this manner from the direction of arrow B. In this case, the extraction terminals 2a, 2
When electricity is applied between the terminals B, the heating element 2 generates heat, raising the ambient temperature, and the thermal energy expands the inner diameter of the open cylindrical portion 4a at one end of the contact 4 made of shape memory alloy, which causes the pins of the LSI mounting package 8 to expand. terminal 8
A can be installed as shown in FIG. 3A with low or no insertion force. After installation, pull out terminals 2a, 2b
When the energization is stopped, the heat generated from the heating element 2 decreases, the inner diameter of the open cylindrical part 4a made of shape memory alloy becomes narrower, and the pin terminal 8a and the contact 4 come into pressure contact as shown in FIG. 3B. . In addition, as is well known, the shape memory alloy that makes up the contact 4 remembers its shape in its high-temperature phase, and even if it is considerably deformed at room temperature or low temperature, it will return to its original shape when heated to a high-temperature phase. Since it returns to its original shape and undergoes a reversible shape change, if the LSI mounting package 8 becomes defective, the lead-out terminal 2
A and 2b are energized to generate heat, thereby restoring the inner diameter of the open cylindrical portion 4a of the contact 4 to a state in which it is removed, thereby performing removal.
なお、形状記憶合金(SMA)の有する形状記
憶効果(SME)については一般に知られている
ため詳述しないが、この発明の電気接続器におい
ては、電気的、機械的条件からCu−Al−Ni合金
などにより接触子およびリングを構成することが
好ましい。また、上述したようなLSI搭載パツケ
ージの接続器に制限されることなく、例えば多接
点封入形スイツチ(SMM)のプリント基板実装
用接続器にも適用できる。 Note that the shape memory effect (SME) of shape memory alloy (SMA) is generally known and will not be discussed in detail; however, in the electrical connector of this invention, Cu-Al-Ni It is preferable that the contacts and rings are made of an alloy or the like. Furthermore, the present invention is not limited to the connectors for LSI-equipped packages as described above, but can also be applied to, for example, connectors for mounting printed circuit boards of multi-contact sealed switches (SMM).
以上説明したようにこの発明によれば、熱エネ
ルギーによつて伸縮して形状変化を成す形状記憶
合金により接触部材を構成することにより、極め
て僅かな付与力にて挿抜できる上に、高信頼度な
接触状態を形成できる電気接続器が得られる。ま
た、特殊な外力付与手段を設けることなく熱エネ
ルギーの供給によつて容易に挿抜させ得るため、
LSI、SMMスイツチなど部品の小形化に追従した
小形の電気接続器を実現できる。 As explained above, according to the present invention, by configuring the contact member with a shape memory alloy that changes shape by expanding and contracting with thermal energy, it can be inserted and removed with extremely little applied force, and has high reliability. An electrical connector is obtained that can form a contact state. In addition, since it can be easily inserted and removed by supplying thermal energy without providing any special external force applying means,
It is possible to create a compact electrical connector that follows the miniaturization of parts such as LSI and SMM switches.
第1図はこの発明による電気接続器の一実施例
を示す構成図、第2図は第1図における基板の詳
細を示す斜視図、第3図Aおよび第3図Bは同実
施例の接触状態を説明する図である。
1……セラミツク基板、2……発熱体、4……
接触子、4a……開口筒状部、6……ハウジン
グ、8……LSI搭載パツケージ、8a……ピン端
子。
FIG. 1 is a configuration diagram showing an embodiment of an electrical connector according to the present invention, FIG. 2 is a perspective view showing details of the board in FIG. 1, and FIGS. 3A and 3B are contacts of the same embodiment. It is a figure explaining a state. 1... Ceramic substrate, 2... Heating element, 4...
Contactor, 4a...Open cylindrical part, 6...Housing, 8...LSI mounting package, 8a...Pin terminal.
Claims (1)
された発熱体とを有するセラミツク基板と、形状
記憶合金からなり縦方向にスリツトを有し挿入さ
れるピン端子を受容する開口筒状部を上端に有し
下端を前記セラミツク基板の貫通孔に挿入配置し
た複数の接触子と、該接触子を搭載した前記セラ
ミツク基板を収納し前記開口筒状部に対応する位
置に複数の前記ピン端子を貫通させる孔を有する
ハウジングとを備え、前記発熱体への通電による
温度変化に応答して前記接触子の開口筒状部が前
記ピン端子を締結あるいは開放することを特徴と
する電気接続器。1. A ceramic substrate having a plurality of through holes and a heating element printed and arranged adjacent to the through holes, and an open cylindrical portion made of a shape memory alloy and having a vertical slit and receiving an inserted pin terminal. a plurality of contacts having an upper end and a lower end inserted into a through hole of the ceramic substrate, and a plurality of pin terminals that house the ceramic substrate on which the contacts are mounted and are located at positions corresponding to the opening cylindrical part. an electrical connector, comprising: a housing having a hole passing through the heating element; the opening cylindrical part of the contactor connects or opens the pin terminal in response to a temperature change due to energization of the heating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56040138A JPS57154778A (en) | 1981-03-19 | 1981-03-19 | Electric connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56040138A JPS57154778A (en) | 1981-03-19 | 1981-03-19 | Electric connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57154778A JPS57154778A (en) | 1982-09-24 |
| JPS6222237B2 true JPS6222237B2 (en) | 1987-05-16 |
Family
ID=12572420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56040138A Granted JPS57154778A (en) | 1981-03-19 | 1981-03-19 | Electric connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57154778A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315546A (en) * | 1988-06-14 | 1989-12-20 | Sekisui Chem Co Ltd | Trough |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL75155A0 (en) * | 1984-05-14 | 1985-09-29 | Krumme John F | Thermally responsive electrical connector |
| JPH0160382U (en) * | 1987-10-08 | 1989-04-17 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1504704A (en) * | 1974-05-14 | 1978-03-22 | Raychem Ltd | Heatrecoverable coupling |
| JPS5546810A (en) * | 1979-08-21 | 1980-04-02 | Mitsubishi Electric Corp | Method of wiring |
-
1981
- 1981-03-19 JP JP56040138A patent/JPS57154778A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315546A (en) * | 1988-06-14 | 1989-12-20 | Sekisui Chem Co Ltd | Trough |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57154778A (en) | 1982-09-24 |
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