JPS6222431B2 - - Google Patents
Info
- Publication number
- JPS6222431B2 JPS6222431B2 JP54077779A JP7777979A JPS6222431B2 JP S6222431 B2 JPS6222431 B2 JP S6222431B2 JP 54077779 A JP54077779 A JP 54077779A JP 7777979 A JP7777979 A JP 7777979A JP S6222431 B2 JPS6222431 B2 JP S6222431B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- measuring
- ring
- disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 12
- 238000005259 measurement Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Relating To Insulation (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Description
【発明の詳細な説明】
本発明は両方向に取出されたリード線を有する
電子部品の特性測定装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for measuring characteristics of electronic components having lead wires taken out in both directions.
従来、電子部品の電気特性を測定するには、電
子部品のリード線を固定された測定端子に摺動さ
せながら測定する方法と、電子部品のリード線を
測定端子が挾んだ状態で測定する方法とがある。
前者の場合、測定端子への摺動圧力を強くすると
リード線に傷がつき、また後者の場合は機械的に
複雑になり、高速度での測定は困難であるという
欠点を有していた。 Conventionally, the electrical characteristics of electronic components have been measured by two methods: one is to slide the electronic component's lead wire onto a fixed measurement terminal, and the other is to measure the electronic component's lead wire while it is being held between measurement terminals. There is a method.
In the former case, increasing the sliding pressure on the measurement terminal would damage the lead wire, and in the latter case, it would be mechanically complex, making it difficult to measure at high speeds.
本発明は上記のような従来における欠点を除去
すべくなされたものであり、リード線と測定端子
との接触圧力を大きくし、接触抵抗を低く、しか
も高速度での特性測定を目的とした電子部品の特
性測定装置を提供しようとするものである。 The present invention has been made to eliminate the above-mentioned drawbacks of the conventional technology, and is an electronic device that increases the contact pressure between the lead wire and the measurement terminal, lowers the contact resistance, and aims at high-speed characteristic measurement. The present invention aims to provide a device for measuring the characteristics of parts.
以下、本発明の一実施例について図面とともに
説明する。 An embodiment of the present invention will be described below with reference to the drawings.
まず、本発明装置は部品供給部Ａと測定端子部
Ｂに大別される。部品供給部Ａはシヤフト１０に
回転デイスク９が固定されており、このデイスク
９の外周には等間隔に溝９′が左右対称に形成さ
れ、部品供給シユート１１より供給された電子部
品７は両方向に取出されたリード線７′が上記溝
９′に入る。上記デイスク９の溝９′の部分にはＯ
リング８が装着されており、このＯリング８は溝
９′に入れられた電子部品７のリード線７′に弾接
して該リード線７′を若干浮かすようにしてい
る。また、上記測定端子部Ｂはシヤフト６は絶縁
物５を介して左右一対の測定ローラ４が固定され
ており、この測定ローラ４に同じく左右一対の測
定端子３がバネ２により圧着され、バネ２はバネ
受け１により保持されている。ここで、上記回転
デイスク９と測定ローラ４とは円周上の速度がほ
ぼ同一速度で回転している。 First, the apparatus of the present invention is roughly divided into a component supply section A and a measurement terminal section B. In the component supply section A, a rotary disk 9 is fixed to a shaft 10, and grooves 9' are symmetrically formed at equal intervals on the outer circumference of the disk 9, so that the electronic components 7 supplied from the component supply chute 11 can be rotated in both directions. The lead wire 7' taken out enters the groove 9'. The groove 9' of the disk 9 is
A ring 8 is attached, and this O-ring 8 makes elastic contact with the lead wire 7' of the electronic component 7 placed in the groove 9', so that the lead wire 7' is slightly lifted. Further, in the measuring terminal section B, a pair of left and right measuring rollers 4 are fixed to the shaft 6 via an insulator 5, and a pair of left and right measuring terminals 3 are similarly crimped to the measuring rollers 4 by a spring 2. is held by a spring receiver 1. Here, the rotating disk 9 and the measuring roller 4 are rotating at substantially the same circumferential speed.
そして、部品供給シユート１１より供給された
電子部品７のリード線７′はデイスク９の溝９′に
入り、Ｏリング８でリード線７′が受けられる。
ついで、溝９′に入つた電子部品７はデイスク９
の回転にしたがつて移動し、測定ローラ４とその
円弧上の一点で接触する。この時、Ｏリング８の
硬度と、測定ローラ４とＯリング８との間隔を適
度に調整しておくと、電子部品７のリード線７′
は測定ローラ４に上述したように該ローラ４の円
弧上の一点で圧着される。この時、測定ローラ
４、測定端子３を介し、電気特性測定器（図示せ
ず）でもつて電子部品の抵抗値等の特性が測定さ
れる。 Then, the lead wire 7' of the electronic component 7 supplied from the component supply chute 11 enters the groove 9' of the disk 9, and the lead wire 7' is received by the O-ring 8.
Then, the electronic component 7 that has entered the groove 9' is inserted into the disk 9.
, and comes into contact with the measuring roller 4 at one point on its arc. At this time, if the hardness of the O-ring 8 and the distance between the measuring roller 4 and the O-ring 8 are appropriately adjusted, the lead wire 7' of the electronic component 7
is pressed onto the measuring roller 4 at one point on the arc of the roller 4 as described above. At this time, the resistance value and other characteristics of the electronic component are measured via the measuring roller 4 and the measuring terminal 3 using an electrical characteristic measuring device (not shown).
なお、Ｏリング８は別段ゴムであれば他のもの
に置き換えてもよく、また電子部品７を案内する
ものとしては回転デイスク９に限られることはな
いものである。 Note that the O-ring 8 may be replaced with other rubber as long as it is made of rubber, and the device for guiding the electronic component 7 is not limited to the rotary disk 9.
以上のように本発明装置は構成されているもの
であり、一対の回転する測定端子の円弧上の一点
に電子部品のリード線をＯリング等のゴムの弾力
で直接圧着させるようにしたため、リード線と測
定端子との圧着力を大きくすることができ、また
それに伴ない接触抵抗を低くすることが可能で、
しかも高速度での特性測定を実現することができ
るものであり、その有用性は大なるものである。 The device of the present invention is constructed as described above, and the lead wire of the electronic component is directly crimped to one point on the arc of the pair of rotating measuring terminals using the elasticity of rubber such as an O-ring. It is possible to increase the crimp force between the wire and the measurement terminal, and to reduce the contact resistance accordingly.
Furthermore, it is possible to measure characteristics at high speed, and its usefulness is great.
第１図は本発明装置の一実施例を示す概略側面
構成図、第２図は同概略断面構成図である。
３，４……測定端子（測定端子、測定ロー
ラ）、７……電子部品、７′……リード線、８……
ゴム（Ｏリング）。
FIG. 1 is a schematic side view of an embodiment of the apparatus of the present invention, and FIG. 2 is a schematic cross-sectional view of the same. 3, 4...Measurement terminal (measurement terminal, measurement roller), 7...Electronic component, 7'...Lead wire, 8...
Rubber (O-ring).
Claims (1)
一対の回転する測定端子の円弧上の一点にＯリン
グ等のゴムの弾力で直接圧着させ、上記電子部品
の特性を測定することを特徴とする電子部品の特
性測定装置。1. Connect the electronic component lead wires taken out in both directions.
A characteristic measuring device for an electronic component, characterized in that the characteristic of the electronic component is measured by directly pressing a pair of rotating measuring terminals at one point on an arc with the elasticity of rubber such as an O-ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7777979A JPS562572A (en) | 1979-06-20 | 1979-06-20 | Measuring instrument for characteristic of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7777979A JPS562572A (en) | 1979-06-20 | 1979-06-20 | Measuring instrument for characteristic of electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS562572A JPS562572A (en) | 1981-01-12 |
| JPS6222431B2 true JPS6222431B2 (en) | 1987-05-18 |
Family
ID=13643444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7777979A Granted JPS562572A (en) | 1979-06-20 | 1979-06-20 | Measuring instrument for characteristic of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS562572A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60168077U (en) * | 1984-04-13 | 1985-11-07 | 関西日本電気株式会社 | Electronic component characteristic measuring device |
| JPH083205B2 (en) * | 1990-02-15 | 1996-01-17 | 積水化学工業株式会社 | Assembly house having lower roof and method of assembling the same |
| JP2686396B2 (en) * | 1992-05-11 | 1997-12-08 | ミサワホーム株式会社 | How to build a building |
-
1979
- 1979-06-20 JP JP7777979A patent/JPS562572A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS562572A (en) | 1981-01-12 |
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