JPS6223983B2 - - Google Patents
Info
- Publication number
- JPS6223983B2 JPS6223983B2 JP12383880A JP12383880A JPS6223983B2 JP S6223983 B2 JPS6223983 B2 JP S6223983B2 JP 12383880 A JP12383880 A JP 12383880A JP 12383880 A JP12383880 A JP 12383880A JP S6223983 B2 JPS6223983 B2 JP S6223983B2
- Authority
- JP
- Japan
- Prior art keywords
- polymerization inhibitor
- molding material
- synthetic resin
- resin molding
- chlorine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012778 molding material Substances 0.000 claims description 21
- 238000006116 polymerization reaction Methods 0.000 claims description 19
- 239000003112 inhibitor Substances 0.000 claims description 18
- 239000003063 flame retardant Substances 0.000 claims description 14
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 239000000057 synthetic resin Substances 0.000 claims description 11
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 10
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 claims description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- SYKNUAWMBRIEKB-UHFFFAOYSA-N [Cl].[Br] Chemical compound [Cl].[Br] SYKNUAWMBRIEKB-UHFFFAOYSA-N 0.000 claims description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 description 11
- 150000002367 halogens Chemical class 0.000 description 7
- 229910000039 hydrogen halide Inorganic materials 0.000 description 5
- 239000012433 hydrogen halide Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- -1 hydrogen halides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
この発明は合成樹脂成形材料に関するものであ
る。
一般に、電子部品用の合成樹脂成形材料には、
難燃剤が配合されている。このような合成樹脂成
形材料（以下「成形材料」と略す）のうち、ハロ
ゲン系難燃剤が配合されている成形材料にはつぎ
のような難点があつた。すなわち、この成形材料
は、それを用いてつくられるプラスチツク成形品
が加熱時（熱分解時）にハロゲンラジカル（例え
ばＢ〓ｒ、Ｃ〓ｌ）を発生し、このハロゲンラジカル
が腐食性に富むハロゲン化水素になるため、周囲
のもの、例えば接点等の金属材料の腐食を招くと
いう難点を有していた。したがつて、このような
成形材料を用いてつくられた電子部品は、加熱時
に、ハロゲン化水素によつて接点部分の金属や端
子金属等の金属材料の腐食が起こり、それらの性
能が低下していた。例えば、接点においては、接
触抵抗の増加が起こつていた。そのため、このよ
うな問題の起こらない成形材料の実現が強く求め
られていた。
この発明は、このような事情に鑑みなされたも
ので、ベンゼン環を有する塩素、臭素系難燃剤の
うちの少なくとも１種と、キノン類重合禁止剤お
よびニトロベンゼン系重合禁止剤のうちの少なく
とも１種とが配合されていることを特徴とする合
成樹脂成形材料をその要旨とするものである。
すなわち、この成形材料には、キノン類系重合
禁止剤および／またはニトロベンゼン系重合禁止
剤（以下、「重合禁止剤」とのみ記す）が配合さ
れており、この重合禁止剤が、加熱時にハロゲン
系難燃剤類から発生するハロゲンラジカルを捕促
し不活性化して腐食性に富むハロゲン化水素の発
生を阻止するため、上記のような問題の発生が防
がれるのである。
成形材料中に配合されるベンゼン環を有する塩
素、臭素系難燃剤（以下、「ハロゲン系難燃剤
類」とのみ記す）としては、まず、例えば下記の
式で示されるようなハロゲン系難燃剤があげられ
る。
This invention relates to synthetic resin molding materials. Generally, synthetic resin molding materials for electronic parts include:
Contains flame retardant. Among such synthetic resin molding materials (hereinafter abbreviated as "molding materials"), molding materials containing halogen flame retardants have the following disadvantages. In other words, this molding material generates halogen radicals (e.g., B〓r, C〓l) when the plastic molded products made using it are heated (during thermal decomposition), and these halogen radicals generate corrosive halogenated products. Since it becomes hydrogen, it has the disadvantage of causing corrosion of surrounding objects, such as metal materials such as contacts. Therefore, when electronic parts made using such molding materials are heated, hydrogen halide causes corrosion of metal materials such as contact metals and terminal metals, reducing their performance. Ta. For example, at contacts, an increase in contact resistance has occurred. Therefore, there has been a strong demand for a molding material that does not cause such problems. This invention was made in view of the above circumstances, and includes at least one kind of chlorine and bromine flame retardants having a benzene ring, and at least one kind of a quinone polymerization inhibitor and a nitrobenzene polymerization inhibitor. The gist of the invention is a synthetic resin molding material characterized by containing the following. In other words, this molding material contains a quinone-based polymerization inhibitor and/or a nitrobenzene-based polymerization inhibitor (hereinafter simply referred to as "polymerization inhibitor"), and this polymerization inhibitor causes halogen-based polymerization during heating. The above-mentioned problems are prevented because the halogen radicals generated from flame retardants are captured and inactivated to prevent the generation of highly corrosive hydrogen halides. As the chlorine- and bromine-based flame retardants having a benzene ring (hereinafter simply referred to as "halogen-based flame retardants") that are blended into molding materials, first, halogen-based flame retardants such as those shown by the following formula are used. can give.
【式】【formula】
【式】【formula】
【式】
また、上記のもの以外に、臭素化ジフエニルエ
ーテル、塩素化ジフエニルエーテル等もあげられ
る。つぎに、塩素、臭素化化合物を原料として用
いてつくられたベンゼン環を有する塩素、臭素系
難燃性ポリマーもハロゲン系難燃剤類としてあげ
られる。そのようなものとして、臭化物モノマー
を用いてつくられた臭素化ポリブチレンテレフタ
レート樹脂、臭素化エポキシ樹脂等があげられ
る。
重合禁止剤としては、例えば下記の式で示され
るような化合物があげられる。[Formula] In addition to the above, brominated diphenyl ether, chlorinated diphenyl ether, etc. may also be mentioned. Next, chlorine- and bromine-based flame-retardant polymers having benzene rings and made from chlorine- and brominated compounds as raw materials are also included as halogen-based flame retardants. These include brominated polybutylene terephthalate resins made using bromide monomers, brominated epoxy resins, and the like. Examples of the polymerization inhibitor include compounds represented by the following formula.
【式】【formula】
【式】
この重合禁止剤（ｐ−ベンゾキノン）によるハ
ロゲンラジカルの不活性化はつぎの式のように行
われると考えられる。
重合禁止剤の使用量は、ハロゲン系難燃剤類に
対して、重合禁止剤が0.5重量％（以下「％」と
略す）以上10％以下になるように選ぶことが好ま
しい。重合禁止剤の使用量が上記の範囲を下まわ
ると、加熱（例えば120℃）時のハロゲン化水素
の発生を充分阻止することができなくなり、金属
材料の腐食等の問題が生じる傾向がみられるので
ある。逆に上記の範囲を上まわると、加熱（例え
ば120℃）時に重合禁止剤自身が揮発し、それが
電子部品の接点金属に付着して接触抵抗の増加を
招く等の弊害を生じる恐れがあるのである。
成形材料に用いる合成樹脂としては、フエノー
ル樹脂、ポリアミド樹脂等があげられる。
この発明の成形材料は、例えば、上記の合成樹
脂に、ハロゲン系難燃剤類、重合禁止剤および必
要な場合には、その他の原料を配合することによ
りつくられるのである。
このようにして得られた成形材料は、加熱時に
ハロゲン化水素を発生することのない成形品をつ
くりうるため、電子部品用等として最適である。
つぎに、実施例について比較例と併せて説明す
る。
次表に示す合成樹脂およびハロゲン系難燃剤類
を通常の割合で配合し、これに同表に示す重合禁
止剤を同表に示す量だけ配合した。つぎに、得ら
れた成形材料を通常のようにして成形し、縦10
mm、横25mm、高さ15mmの中空ケースをつくつた。
つぎに、この中空ケースを接点にかぶせて接触抵
抗を測定した。その結果を次表に併せて示した。
表から明らかなように、実施例（No.２〜７、９〜
12）の成形材料を用いてつくられたものは、ハロ
ゲン化水素の発生が抑制されているため、ハロゲ
ン化水素の腐食に起因する接触抵抗の増加現象が
殆んど起こつていない。これに対して比較例（No.
１、８）では、接触抵抗の著しい増加現象が起こ
つているのである。[Formula] It is thought that the inactivation of halogen radicals by this polymerization inhibitor (p-benzoquinone) is carried out as shown in the following formula. The amount of the polymerization inhibitor used is preferably selected such that the amount of the polymerization inhibitor is 0.5% by weight (hereinafter abbreviated as "%") or more and 10% or less based on the halogen flame retardant. If the amount of polymerization inhibitor used is below the above range, it will not be possible to sufficiently prevent the generation of hydrogen halide during heating (e.g. 120°C), and problems such as corrosion of metal materials will tend to occur. It is. On the other hand, if the temperature exceeds the above range, the polymerization inhibitor itself will volatilize when heated (e.g. 120°C), and it may adhere to the contact metal of electronic components, causing problems such as an increase in contact resistance. It is. Examples of the synthetic resin used as the molding material include phenolic resin and polyamide resin. The molding material of the present invention is produced, for example, by blending the above-mentioned synthetic resin with a halogen flame retardant, a polymerization inhibitor, and, if necessary, other raw materials. The molding material thus obtained can be used to produce molded products that do not generate hydrogen halide during heating, and is therefore ideal for use in electronic parts and the like. Next, examples will be described together with comparative examples. The synthetic resins and halogenated flame retardants shown in the table below were blended in the usual proportions, and the polymerization inhibitors shown in the table were added in the amounts shown in the table. Next, mold the obtained molding material in the usual manner, and then
I made a hollow case with a width of 25 mm and a height of 15 mm.
Next, this hollow case was placed over the contacts and the contact resistance was measured. The results are also shown in the table below.
As is clear from the table, Examples (Nos. 2-7, 9-
Products made using the molding material 12) have suppressed the generation of hydrogen halide, so there is almost no increase in contact resistance due to corrosion of hydrogen halide. In contrast, comparative example (No.
1 and 8), a remarkable increase in contact resistance occurs.
Claims (1)
ちの少なくとも１種と、キノン類系重合禁止剤お
よびニトロベンゼン系重合禁止剤のうちの少なく
とも１種とが配合されていることを特徴とする合
成樹脂成形材料。 ２ キノン類系重合禁止剤および／またはニトロ
ベンゼン系重合禁止剤が、ベンゼン環を有する塩
素、臭素系難燃剤に対して、0.5〜10.0重量％配
合されている特許請求の範囲第１項記載の合成樹
脂成形材料。 ３ 合成樹脂成形材料が電子部品用合成樹脂成形
材料である特許請求の範囲第１項または第２項記
載の合成樹脂成形材料。[Scope of Claims] 1. At least one of chlorine and bromine flame retardants having a benzene ring, and at least one of a quinone polymerization inhibitor and a nitrobenzene polymerization inhibitor are blended. A synthetic resin molding material characterized by: 2. The synthesis according to claim 1, wherein the quinone-based polymerization inhibitor and/or nitrobenzene-based polymerization inhibitor is blended in an amount of 0.5 to 10.0% by weight based on the chlorine- and bromine-based flame retardant having a benzene ring. Resin molding material. 3. The synthetic resin molding material according to claim 1 or 2, wherein the synthetic resin molding material is a synthetic resin molding material for electronic parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12383880A JPS5749658A (en) | 1980-09-06 | 1980-09-06 | Synthetic resin molding compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12383880A JPS5749658A (en) | 1980-09-06 | 1980-09-06 | Synthetic resin molding compound |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5749658A JPS5749658A (en) | 1982-03-23 |
| JPS6223983B2 true JPS6223983B2 (en) | 1987-05-26 |
Family
ID=14870626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12383880A Granted JPS5749658A (en) | 1980-09-06 | 1980-09-06 | Synthetic resin molding compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5749658A (en) |
-
1980
- 1980-09-06 JP JP12383880A patent/JPS5749658A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5749658A (en) | 1982-03-23 |
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