JPS6224193B2 - - Google Patents
Info
- Publication number
- JPS6224193B2 JPS6224193B2 JP57197982A JP19798282A JPS6224193B2 JP S6224193 B2 JPS6224193 B2 JP S6224193B2 JP 57197982 A JP57197982 A JP 57197982A JP 19798282 A JP19798282 A JP 19798282A JP S6224193 B2 JPS6224193 B2 JP S6224193B2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- laser beam
- laser
- shielding plate
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
本発明は、レーザ加工機の一部を構成するレー
ザ加工用光学ヘツドの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in an optical head for laser processing, which constitutes a part of a laser processing machine.
従来のこの種の装置としては第1図に示すもの
が知られている。第1図において、1はレーザ発
振器を示し、該レーザ発振器1にはレーザの取出
し側に部分反射鏡3が設けられ、この部分反射鏡
3に対向して全反射鏡4が配設されている。上記
レーザ発振器1のレーザ取出口5には、レーザ加
工用光学ヘツドH1を構成する筒体6が連設さ
れ、レーザビーム7の通過経路を形成している。
該筒体6はそのほぼ中央で直角方向に屈曲して形
成され、この屈曲部には反射鏡8を設けて上記発
振器1から取出されたレーザビーム7を90゜折曲
させ、上記筒体6の屈曲方向に沿つて進行させる
ようにしている。そして上記筒体6の先端部近傍
には集光レンズ9が筒体6の軸心に直交して配設
され、さらに該筒体6の先端部にノズル10が取
付けられている。この筒体6を通過するレーザビ
ーム7は上記焦光レンズ9で集束されて、ノズル
10から外部に出て被加工物11に照射される。 As a conventional device of this type, the one shown in FIG. 1 is known. In FIG. 1, reference numeral 1 indicates a laser oscillator, and the laser oscillator 1 is provided with a partial reflection mirror 3 on the laser extraction side, and a total reflection mirror 4 is provided opposite to this partial reflection mirror 3. . A cylindrical body 6 constituting an optical head H1 for laser processing is connected to the laser outlet 5 of the laser oscillator 1, and forms a path through which the laser beam 7 passes.
The cylindrical body 6 is bent at a right angle at approximately the center thereof, and a reflecting mirror 8 is provided at this bent portion to bend the laser beam 7 taken out from the oscillator 1 by 90 degrees. It is made to advance along the bending direction. A condenser lens 9 is disposed near the tip of the cylinder 6 so as to be orthogonal to the axis of the cylinder 6, and a nozzle 10 is attached to the tip of the cylinder 6. The laser beam 7 passing through the cylinder 6 is focused by the focusing lens 9, exits from the nozzle 10, and is irradiated onto the workpiece 11.
なお、上記筒体6の先端部で集光レンズ9のノ
ズル10側に補助口12が突設されており、この
補助口12からは補助ガスが上記筒体6およびノ
ズル10を経て被加工物11に吹き付けられるよ
うになつている。 An auxiliary port 12 is provided at the tip of the cylindrical body 6 on the nozzle 10 side of the condensing lens 9, and auxiliary gas flows from the auxiliary port 12 through the cylindrical body 6 and the nozzle 10 to the workpiece. It is designed to be sprayed on 11.
以上の構成を有するレーザ加工用光学ヘツド
H1では、上記レーザ発振器1に発生した光2の
一部は部分反射鏡3を通過してレーザビーム7と
して光学ヘツドH1を構成する筒体6内に入射
し、筒体6の屈曲部に配設した反射鏡8によりそ
の進行方向を90゜折曲されてそのまま直進し、集
光レンズ9に達する。集光レンズ9に達したレー
ザビーム7は、ここで集束されつつノズル10を
通過し、被加工物11上に高密度エネルギとして
供給され、被加工物11の切断、溶接、熱処理等
に供される。このとき、レーザビーム7の照射と
同時に補助ガスが補助口12から供給され、被加
工物11表面に吹き付けられるが、この補助ガス
は被加工物11と酸化反応を起こし、この反応熱
により被加工物11をますます高温にし、その切
断等の処理を有効に遂行させることになる。また
この補助ガスは、上記生成酸化物に吹き付けられ
てこれを除去し、あるいは溶融金属を外部雰囲気
中の不純物から保護するほか、上記ノズル10と
ともに熱処理部から飛散されるスパツタなどから
集光レンズ9を有効に保護する機能をも有してい
る。 Optical head for laser processing with the above configuration
At H 1 , a part of the light 2 generated by the laser oscillator 1 passes through the partial reflecting mirror 3 and enters the cylinder 6 constituting the optical head H 1 as a laser beam 7, and the light 2 is transmitted through the bent portion of the cylinder 6. The traveling direction of the light is bent by 90 degrees by a reflecting mirror 8 disposed at the front, and the light travels straight to reach a condenser lens 9. The laser beam 7 that has reached the condensing lens 9 is focused here, passes through the nozzle 10, is supplied as high-density energy onto the workpiece 11, and is used for cutting, welding, heat treatment, etc. of the workpiece 11. Ru. At this time, at the same time as the laser beam 7 is irradiated, auxiliary gas is supplied from the auxiliary port 12 and blown onto the surface of the workpiece 11, but this auxiliary gas causes an oxidation reaction with the workpiece 11, and the reaction heat causes the workpiece to be processed. The object 11 is heated to an increasingly high temperature, and processing such as cutting of the object 11 is effectively carried out. In addition, this auxiliary gas is blown onto the generated oxide to remove it, or protects the molten metal from impurities in the external atmosphere. It also has the function of effectively protecting the
さて上述のごとく、被加工物11が溶接等され
る際、レーザビーム6の被照射部は高温に達し、
この部分からレーザビーム7が乱反射されること
となり、この乱反射光はノズル10を介して光学
ヘツドH1内に入射し、集光レンズ9を経て反射
鏡8で折曲され、上記レーザ発振器1内に進入す
る。すると、該発振器1内の光はこの入射光でさ
らに増幅され、その光エネルギは所期の基準値よ
り高くなつて部分反射鏡3およ全反射鏡4に過度
の負荷をかけることとなり、これら反射鏡3,4
の寿命が短縮されるという欠点を有していた。 Now, as mentioned above, when the workpiece 11 is welded or the like, the part to be irradiated with the laser beam 6 reaches a high temperature,
The laser beam 7 is diffusely reflected from this part, and this diffusely reflected light enters the optical head H1 through the nozzle 10 , passes through the condensing lens 9, is bent by the reflecting mirror 8, and is reflected inside the laser oscillator 1. enter. Then, the light inside the oscillator 1 is further amplified by this incident light, and its optical energy becomes higher than the desired reference value, putting an excessive load on the partial reflection mirror 3 and the total reflection mirror 4, which causes Reflector 3, 4
This had the disadvantage that the lifespan of the device was shortened.
本発明は叙上の点に鑑みなされたもので、上記
取出口と集光レンズとの間に、上記取出口から取
出されたレーザビームを集光する第1のレンズ
と、この第1レンズの焦点位置に配置され上記第
1レンズで集光されたレーザビームを通過させる
細孔を設けた遮蔽板と、該遮蔽板を通過したレー
ザビームを平行光線束に戻す第2のレンズとを介
在させることにより、被加工物からレーザ発振器
に入射する乱反射光を阻止できるようにしたもの
である。 The present invention has been made in view of the above points, and includes a first lens for condensing a laser beam taken out from the above-mentioned outlet, and a first lens between the above-mentioned outlet and the condenser lens. A shielding plate arranged at a focal position and provided with a pore through which the laser beam focused by the first lens passes, and a second lens that returns the laser beam that has passed through the shielding plate into a parallel beam bundle are interposed. This makes it possible to prevent diffusely reflected light from entering the laser oscillator from the workpiece.
以下、図示実施例に基づき、第1図と同一部分
または相当部分には同一符号を付して示す第2図
について本発明を説明すると、同図中、13はレ
ーザビーム取出口5から導びかれて筒体6の軸線
と並進するレーザビーム7を集束させるようにし
た第1のレンズであり、この第1レンズ13を透
過したレーザビーム7は、第1レンズ13の焦点
距離位置に設けた遮蔽板14のピンホール14a
を通過する。このピンホール14aは第1レンズ
13の焦点に位置するよう上記遮蔽板14に穿設
されている。上記遮蔽板14を通過したレーザビ
ーム7は、該遮蔽板14の位置から上記焦点距離
だけ隔てて位置する第2のレンズ15を透過し、
第1レンズ13を透過する前のレーザビーム7と
同一方向に並進するレーザビームとなる。このレ
ーザビーム7の進行方向を示したものが第2図で
ある。このように第2レンズ15を透過したレー
ザビーム7は、従来と同様反射鏡8、集光レンズ
9を経て被加工物に照射され、溶接、切断等の加
工作業に供される。 Hereinafter, based on the illustrated embodiment, the present invention will be explained with reference to FIG. 2, in which the same or equivalent parts as in FIG. 1 are denoted by the same reference numerals. This is a first lens that focuses a laser beam 7 that is tilted and parallel to the axis of the cylinder 6, and the laser beam 7 that has passed through this first lens 13 is provided at a focal length position of the first lens 13. Pinhole 14a of shielding plate 14
pass through. This pinhole 14a is bored in the shielding plate 14 so as to be located at the focal point of the first lens 13. The laser beam 7 that has passed through the shielding plate 14 passes through a second lens 15 located apart from the position of the shielding plate 14 by the focal length,
The laser beam is translated in the same direction as the laser beam 7 before passing through the first lens 13. FIG. 2 shows the direction in which this laser beam 7 travels. The laser beam 7 that has passed through the second lens 15 in this manner is irradiated onto the workpiece through a reflecting mirror 8 and a condensing lens 9, as in the conventional case, and is used for processing operations such as welding and cutting.
本実施例に係るレーザ加工用光学ヘツドH2は
以上の構成を有するため、発振器1を出たレーザ
ビーム7が第1レンズ13で集束されて遮蔽板1
4のピンホール14aを通過し、その後第2レン
ズ15の作用で集束され、そのレーザビーム7は
再び平行なレーザビーム7に戻り、反射鏡8に入
射する。このレーザビーム7はこの反射鏡8で90
゜折曲され集光レンズ9を透過して、高密度エネ
ルギをもつたレーザビーム7として被加工物11
表面に照射され、該被加工物11を切断等するこ
とになる。 Since the optical head H 2 for laser processing according to this embodiment has the above configuration, the laser beam 7 emitted from the oscillator 1 is focused by the first lens 13 and the shielding plate 1
The laser beam 7 passes through the pinhole 14a of No. 4, is focused by the action of the second lens 15, returns to a parallel laser beam 7, and enters the reflecting mirror 8. This laser beam 7 is 90
The workpiece 11 is bent and transmitted through the condensing lens 9 as a laser beam 7 with high density energy.
The surface is irradiated, and the workpiece 11 is cut or the like.
然して、被加工物11の溶接時に、レーザビー
ム7の一部は乱反射して、ノズル10を介して光
学ヘツドH2内に逆進するが、この乱反射光は、
第2レンズ15を透過して遮蔽板14に到達する
と、この遮蔽板14のピンホール14aをほとん
ど通過できず、またアルミニウム、あるいは銅な
どで製作された光吸収度の低い遮蔽板14に反射
されることとなる。そのためレーザ発振器1に逆
進するレーザビーム7の乱反射光はほとんどな
く、該発振器1内のエネルギの基準値を安定的に
保持することができ、部分反射鏡3および全反射
鏡4に過負荷をかけることもなく、これらの寿命
を長期化させることができる。 However, when welding the workpiece 11, a part of the laser beam 7 is diffusely reflected and travels back into the optical head H2 through the nozzle 10, but this diffusely reflected light is
When the light passes through the second lens 15 and reaches the shielding plate 14, it hardly passes through the pinhole 14a of the shielding plate 14, and is reflected by the shielding plate 14, which is made of aluminum or copper, and has low light absorption. The Rukoto. Therefore, there is almost no diffusely reflected light of the laser beam 7 that travels back to the laser oscillator 1, and the reference value of energy within the oscillator 1 can be stably maintained, thereby preventing overload on the partial reflection mirror 3 and the total reflection mirror 4. You can extend the lifespan of these products without having to worry about them.
なお、本実施例では第1、2レンズ13,15
および遮蔽板14をレーザビーム取出口5と反射
鏡8との間に配設したものについて説明したが、
反射鏡8と集光レンズ9との間に配設しても同効
を奏することはいうまでもない。また筒体6につ
いても、本実施例のごとく屈曲したものである必
要はなく、該装置の使用目的に応じて、真直なも
のにしても同効を奏するのは勿論である。 Note that in this embodiment, the first and second lenses 13 and 15
In addition, the shielding plate 14 is arranged between the laser beam extraction port 5 and the reflecting mirror 8.
Needless to say, the same effect can be achieved even if it is disposed between the reflecting mirror 8 and the condensing lens 9. Further, the cylinder 6 does not need to be bent as in this embodiment, and it goes without saying that it can be made straight with the same effect, depending on the purpose of use of the device.
本発明によれば、被加工物からの乱反射光のレ
ーザ発振器への入射を防止することができ、発振
器のエネルギ値を安定化できるとともに、発振器
自体の寿命を長期化することができる。 According to the present invention, it is possible to prevent diffusely reflected light from the workpiece from entering the laser oscillator, to stabilize the energy value of the oscillator, and to extend the life of the oscillator itself.
第1図は従来のレーザ加工用光学ヘツドの要部
を示す断面図、第2図は本発明の一実施例に係る
レーザ加工用光学ヘツドの要部を示す断面図であ
る。
6…筒体、7…レーザビーム、8…反射鏡、9
…集光レンズ、11…被加工物、13…第1レン
ズ、14…遮蔽板、15…第2レンズ。
FIG. 1 is a sectional view showing the main parts of a conventional optical head for laser processing, and FIG. 2 is a sectional view showing the main parts of an optical head for laser processing according to an embodiment of the present invention. 6... Cylindrical body, 7... Laser beam, 8... Reflector, 9
... Condensing lens, 11... Workpiece, 13... First lens, 14... Shielding plate, 15... Second lens.
Claims (1)
集光し高密度エネルギを付与して照射させる集光
レンズとを備えたレーザ加工用光学ヘツドにおい
て、上記取出口と集光レンズとの間に、上記取出
口から取出されたレーザビームを集光する第1の
レンズと、この第1レンズの焦点位置に配置され
第1レンズで集光されたレーザビームを通過させ
る細孔を設けた遮蔽板と、該遮蔽板を通過したレ
ーザビームを平行光線束に戻す第2のレンズとを
介在させたことを特徴とするレーザ加工用光学ヘ
ツド。1. In an optical head for laser processing equipped with a laser beam extraction port and a condensing lens that focuses the laser beam and applies high-density energy to it, there is a space between the extraction port and the condenser lens, a first lens that focuses the laser beam taken out from the extraction port; and a shielding plate that is arranged at the focal point of the first lens and has a pore that allows the laser beam focused by the first lens to pass through. An optical head for laser processing, characterized in that a second lens for returning the laser beam that has passed through the shielding plate into a parallel beam is interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57197982A JPS5987992A (en) | 1982-11-11 | 1982-11-11 | Optical head for laser machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57197982A JPS5987992A (en) | 1982-11-11 | 1982-11-11 | Optical head for laser machining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5987992A JPS5987992A (en) | 1984-05-21 |
| JPS6224193B2 true JPS6224193B2 (en) | 1987-05-27 |
Family
ID=16383541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57197982A Granted JPS5987992A (en) | 1982-11-11 | 1982-11-11 | Optical head for laser machining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5987992A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61151359U (en) * | 1985-01-31 | 1986-09-18 | ||
| JPH04258394A (en) * | 1991-02-05 | 1992-09-14 | Fanuc Ltd | Machining head of laser beam machine |
| US7880116B2 (en) * | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
| US7057134B2 (en) | 2003-03-18 | 2006-06-06 | Loma Linda University Medical Center | Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure |
| US7038166B2 (en) | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Containment plenum for laser irradiation and removal of material from a surface of a structure |
| US7379483B2 (en) | 2003-03-18 | 2008-05-27 | Loma Linda University Medical Center | Method and apparatus for material processing |
| US7286223B2 (en) | 2003-03-18 | 2007-10-23 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
| US7060932B2 (en) | 2003-03-18 | 2006-06-13 | Loma Linda University Medical Center | Method and apparatus for material processing |
-
1982
- 1982-11-11 JP JP57197982A patent/JPS5987992A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5987992A (en) | 1984-05-21 |
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