JPS6224229B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plate polishing apparatus, and particularly to an improvement in the structure of a polishing apparatus for thin printed circuit boards.

Conventionally, when automatically polishing a plate-shaped object such as a printed circuit board, as shown in Figure 1, a polishing brush that rotates the printed circuit board in one direction and a metal bag placed opposite the polishing brush are used. A means was provided for polishing while transporting the pinch rollers, which were placed in a pair of upper and lower ends at an appropriate distance from each other at both ends of the up roller. However, as shown in Figure 2a, in order to polish a thin printed circuit board (hereinafter referred to as a thin board), a plurality of polishing brushes are provided between the conveyor 3 installed adjacent to the left end of the pinch roller and the polishing brush 2. The tip of the thin plate 9 may not be able to cross between the pinch rollers 4, and the tip of the thin plate 9 may hang down and get under the pinch roller 4 on the lower side. 2
Since the rotation direction of the polishing brush 2 is only in one direction when the polishing brush 2 reaches between the back end and the polishing section consisting of the back-up roller 14, when the rear end of the thin plate 9 leaves the pinch roller 4, the polishing brush 2 rotates. The center of the plate was bent and bent due to a strong pushing force acting on the pinch roller 4 side that was holding the tip (Figure 2 b).
When the rear end of the thin plate 9 was released from the polishing section, the thin plate 9 could not be polished continuously because the end of the plate would be scratched or bent. Therefore, when polishing the thin plate 9, it has been done by placing it in close contact with a thick splint, by hand polishing on a flat plate, or by using a vibrator with sandpaper attached. However, with such conventional means, it was not possible to polish both sides at the same time. In addition, uneven polishing occurred, and variations in polishing such as scratches and bends occurred, making it impossible to obtain a polished surface of uniform quality.

On the other hand, in terms of equipment, when the thin plate 9 is not inserted between the polishing brush 2 and the backup rollers 14, the polishing brush 2 and the backup roller 14 are always in contact with each other. The surface of the back-up roller 14 is scraped by the brush 2. Therefore, Backup Prora 1
There was also a drawback that the plane uniformity of the thin plate 4 deteriorated early and the quality of the thin plate 9 deteriorated.

An object of the present invention is to provide a plate polishing apparatus that eliminates such conventional drawbacks.

According to the present invention, there is provided a running roller that horizontally moves the plate to be polished, a back-up roller inserted between the running rollers with a predetermined interval maintained, and a forward/reverse mechanism provided close to the back-up roller. A polishing mechanism consisting of a polishing brush, a guide plate installed above and below the polishing mechanism with a running gap for the plate to be processed before and after the polishing mechanism, and a guide plate installed above and below the polishing mechanism with a running gap for the plate to be processed before and after the polishing mechanism. A plate polishing device is obtained, which includes a guide plate and a warp correcting plate that moves diagonally up and down between the guide plate and the polishing mechanism.

Hereinafter, a third embodiment of the plate polishing apparatus according to the present invention will be described.
This will be explained with reference to FIG.

FIG. 3 shows the first embodiment, in which the flushing valve 1 is opened and water is applied to the polishing brush 2 to prevent heat generation and to remove copper powder produced when polishing the thin plate 9. Next, the input switch 6 of the motor 5 that drives the feed conveyor 3 that transports the thin plate 9 and the pinch roller 4 is turned on, and the feed conveyor 3 and the pinch roller 4 are rotated. Next, the input switch 8 of the servo motor 7 is turned on and the polishing brush 2 is rotated to rotate in the direction in which the thin plate 9 advances, that is, around the reflector (normal rotation).

Next, when the thin plate 9 is placed on the conveyor 3, the thin plate 9 passes through the running gap between the pair of upper and lower guide plates 10 while being held between the pair of upper and lower pinch rollers 4 rotating toward the polishing brush 2a. Then, the warp at the end of the plate is corrected and the plate is sent toward the polishing brush 2a. At this time, when the tip of the thin plate 9 reaches below the detector 11 that detects the passage of the thin plate 9, a signal detecting the passage of the thin plate 9 causes the timer 12 to start until the tip of the thin plate 9 reaches the pinch roller 4b. The delay time starts counting. Further, just before the thin plate 9 advances and comes into contact with the polishing brush 2a, the warping correction plate 13, which is arranged to move diagonally up and down along the outer periphery of the polishing brush 2a, automatically moves to a position with a gap corresponding to the thickness of the thin plate 9. Then, the thin plate 9 is smoothly inserted between the polishing brush 2a and the back-up roller 14 while correcting the warpage of the tip of the thin plate 9, and advances to a position where the tip of the thin plate 9 is completely pinched by the rear pinch roller 4. When the timer 12 reaches the point, the timer 12 which started operating based on the signal from the detector 11 described above returns to 0, the contact section is cut off, and the polishing brush 2 starts reverse operation.

When the rear end of the thin plate 9 continues to advance until it passes the detector 11, the timer 12 starts counting again based on this signal, and the timer 12 returns to 0 when the rear end of the thin plate 9 passes the polishing brush 2a. The polishing brush 2a returns to its original normal rotating operation.

As described above, the present invention has the following effects.

(i) Even very thin printed circuit boards can be polished continuously without damage.

(ii) The polished surface can be made uniform and the number of polishing steps can be reduced.

By arranging a plurality of polishing brushes as shown in FIG. 4, the polished surface of the thin plate can be polished more uniformly.

Furthermore, by arranging the polishing brushes above and below, it is of course possible to polish both sides of the thin plate at the same time.

[Brief explanation of the drawing]

1 and 2 are side sectional views of a conventional polishing machine. 3 and 4 are side sectional views of the plate polishing apparatus of the present invention. 1...Washing valve, 2...Polishing brush, 3...
Feed conveyor, 4... pinch roller, 5... drive motor, 6, 8... input switch, 7... servo motor, 9... thin plate, 10... guide plate,
11...detector, 12...timer, 13...warp correction plate, 14...backup roller.

Claims (1)

[Claims] 1 Polishing consisting of a running roller that horizontally moves the plate to be processed, a back-up roller inserted between the running rollers with a predetermined interval maintained, and an abrasive brush provided close to the back-up roller and having a forward/reverse mechanism. A mechanism, a guide plate disposed above and below the polishing mechanism with a running gap for the plate to be processed before and after the polishing mechanism, and a warpage correcting plate that moves diagonally up and down between the guide plate and the polishing mechanism. Features of plate polishing equipment.