JPS6226186B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a large-scale semiconductor device that effectively utilizes semiconductor wafers.

Conventional semiconductor devices have a number of required circuits formed.
It had a configuration in which one or more rectangular semiconductor chips of mm ² to 10 mm ² were mounted on a mounting carrier. Semiconductor chips here are usually obtained by forming a large number of required circuits on a circular semiconductor wafer with a diameter of 1 inch to several inches using semiconductor integrated processing technology, and then cutting the semiconductor wafer into small pieces. It is something. Furthermore, in the mounting mode of the semiconductor chip on the mounting carrier, the semiconductor chip is fixed at a predetermined position on the mounting carrier (for example, a ceramic board) on which wiring has been applied in advance, and the wiring terminals on the semiconductor chip and the mounting It has an aspect in which the wiring on the carrier is electrically connected.

Therefore, in the case of conventional semiconductor devices, when the devices consist of many complex circuits, there is a problem that it takes a lot of man-hours to cut the semiconductor wafer, fix the semiconductor chips on the mounting carrier, and connect the wiring. It was hot. Furthermore, in addition to the area required for the circuits formed on the semiconductor wafer, it must also have a large margin for cutting. By the way, the width of the cutting allowance is about 80 μm, so if, for example, 100 5 mm square semiconductor chips are cut from a semiconductor wafer, the semiconductor wafer will have a width of about 80 μm.
This required an area equivalent to three semiconductor chips as a margin area.

On the other hand, significant advances in semiconductor integrated processing technology and mask manufacturing technology have made it possible to manufacture large semiconductor chips of several tens of mm ² or more. Therefore, by using such large semiconductor chips, it is possible to realize large-scale semiconductor devices. Gender has emerged. However, when a semiconductor chip is shaped into a rectangular shape as in the prior art, there is a drawback that there is a wasted area around the circular semiconductor wafer that cannot be used for circuit formation. For example, if the semiconductor chip is square and its diagonal exceeds the radius of the semiconductor wafer, only one semiconductor chip can be formed.
In this case, only 16 to 63% of the area of the semiconductor wafer can be used for circuit formation, and the remaining area cannot be used and is wasted. This has been a major hindrance to economically producing semiconductor devices using rectangular semiconductor chips.

Further, as a different form from the conventional semiconductor device described above, a semiconductor device has been proposed in which a semiconductor wafer is used as is without being cut. However, the semiconductor device is not large enough to use the entire semiconductor wafer, but only 1/2 of the semiconductor wafer area.
Alternatively, there may be many cases in which only about 1/4 of the integration is required, and in such a case, a wasted area that is not used will naturally remain on the semiconductor wafer.

Therefore, the present invention aims to propose a novel semiconductor device free from the above-mentioned drawbacks, which will become clear from the detailed description below with reference to the drawings.

FIG. 1 shows one embodiment of a semiconductor device according to the present invention, in which a plurality of circuit blocks A having required circuit functions such as transistors, resistors, capacitors, etc.
11 to A15, A16 to A18, and A19, and a plurality of similar circuit blocks A are designated as A21 to A25, A26 to A28, and A29. The semiconductor wafer thus formed is divided into two equal halves B, and a pair of halves B11 and B
21 has a configuration in which it is mounted on the mounting carrier 1.

In this case, the circuit blocks A11 to A15, A16 to A18, and A
19 is an input terminal 1 whose input lines are common to them via wiring formed on the bisecting piece B11.
1, and the output wire is also connected to the bisecting piece B
The control line is connected to the output terminal O1 common to them via a wiring formed on the bisecting piece B11, and the control line is also connected to the common control terminal O1 through a wiring formed on the bisecting piece B11. G1 respectively.

In addition, the circuit blocks A21 to A25, A26 to A28 and A29 formed on the bisected piece B21 are also
These input lines, output lines, and control lines are similarly connected to the common input terminal I2, output terminal O2, and control terminal G2, respectively, via wiring formed on the bisecting piece B21.

Furthermore, input terminals I1 and I2; output terminal O1
and O2; and control terminals G1 and G2 are respectively connected to the common input line I12; output line O112; and control line G12 formed on the mounting carrier 1, and thus the bisecting pieces B11 and B21 Circuit blocks A11 and A21 formed thereon; A1
2 and A22;...The set of A19 and A29 is
Based on the control signal supplied to the control line G12, each set is sequentially controlled in the same manner, and the sets of circuit blocks A11 and A21; A12 and A22;...A19 and A29 are connected to the input line I12. The input signals supplied to each set are sequentially processed in the same manner for each set, and the processed outputs are sequentially derived to the output line O12.

The above is the configuration of the embodiment of the semiconductor device according to the present invention.

According to the configuration of the embodiment of the present invention, it has a configuration in which two equal pieces B11 and B21 obtained by dividing a semiconductor wafer into two are mounted on the mounting carrier 1, and, Two of those semiconductor wafers
Since the two equal parts B11 and B12 can be obtained immediately by cutting the semiconductor wafer once, it is possible to easily obtain a large-scale semiconductor device with a small number of mounting steps. By making the number of circuit blocks A formed in the bisecting pieces B11 and B12 sufficiently large to nine as shown in the figure,
Since the entire area of the bisecting pieces B11 and B12 can be effectively utilized, the semiconductor wafer utilization efficiency is significantly increased compared to the conventional case.

Further, according to the configuration of the embodiment of the present invention shown in FIG.
11 and the other bisected piece B21, the set of circuit blocks A21, the set of A12 and A22, the set of A13 and A23, . Thus, the input signal is processed and the processed output is sent to the output line O.
12, the circuit blocks A11 to A19 and A21 to A29 of the bisectors B11 and B21 are
Even if there is a defective circuit block, for example, as shown by diagonal lines in FIG.
1, circuit blocks A13, A15 and A1
8 is the circuit block A2 regarding the bisecting piece B21.
Even if there are defective circuit blocks in the bisecting pieces B11 and B21, such as A24 and A29 being defective circuit blocks, as long as the defective parts of these defective circuit blocks have a mutually complementary relationship (provided that In this case, it is assumed that each circuit block is configured so that the operation of non-defective circuit blocks is not affected by the existence of a defective circuit block), and the intended relationship with the semiconductor device as a whole is maintained. It never loses its functionality.

Therefore, according to the embodiment of the present invention described above with reference to FIG. 1, when each of a plurality of semiconductor wafers is divided into two halves to obtain a large number of halves as shown in FIG. Even if a large number of bisected pieces are obtained as having defective circuit blocks, among them, the defective circuit block positions do not overlap with each other, that is, the two halves have a mutually complementary relationship with respect to the defective locations. By selecting two halves and mounting them on a mounting carrier, it is possible to construct a semiconductor device that provides the desired function. It has a great feature that semiconductor devices can be obtained with high yield.

In the embodiment described above with reference to FIG. 1, a pair of bisected pieces B11 and B21 obtained by dividing the semiconductor wafer into two halves, whose defective locations are in a complementary relationship with each other, are used.
Although the detailed explanation is omitted, as shown in FIG. A plurality of pairs of bisected pieces obtained by dividing are B11, B21, B1
2 and B22, . . . are mounted on the mounting carrier 1, as shown in FIG.
A plurality of sets of pairs of quarter pieces obtained by dividing the semiconductor wafer into quarters, in which the defective parts have a mutually complementary relationship, are mounted on the mounting carrier 1 as C11 and C21, C12 and C22, etc. It will be clear that the same features as those described above with reference to FIG. 1 can be obtained even in this case.

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view showing one embodiment of a semiconductor device according to the present invention. FIGS. 2 and 3 are schematic plan views showing other embodiments of the present invention. 1... Mounting carrier, B11, B12......, B2
1, B22...Half piece of semiconductor wafer, C11,
C12......, C21, C22... Quarter piece of semiconductor wafer, A11-A19, A21-A29... Circuit block, I1, I2... Input terminal, O1, O2
...output terminal, G1, G2...control terminal, I12...input line, O12...output line, G12...control line.

Claims (1)

[Scope of Claims] 1. At least one pair of first and second halves or four halves in which a plurality of circuit blocks are formed, obtained by dividing a circular semiconductor wafer into halves or quarters. The equal pieces are mounted on a mounting carrier, and the first and second halves or quarter pieces are
The first two halves of the pair of halves or the four halves have a mutually complementary relationship with respect to internal defective parts
The input lines, output lines, and control lines of a plurality of circuit blocks formed in equal pieces are connected to the first circuit block, respectively.
connected to a common first input terminal, a first output terminal, and a first control terminal via wiring formed on the halves or quarters of the pair of halves, the first two halves of or 4
The input lines, output lines, and control lines of a plurality of circuit blocks formed in equal pieces are connected to the second circuit block, respectively.
connected to a common second input terminal, a second output terminal, and a second control terminal via wiring formed on a bisecting piece or a quarter piece of the first and second input terminals; a common input line in which a terminal, first and second output terminals, and first and second control terminals are respectively formed on the mounting carrier;
A semiconductor device characterized by having a configuration in which it is connected to an output line and a control line.