JPS6229150B2 - - Google Patents
Info
- Publication number
- JPS6229150B2 JPS6229150B2 JP57190241A JP19024182A JPS6229150B2 JP S6229150 B2 JPS6229150 B2 JP S6229150B2 JP 57190241 A JP57190241 A JP 57190241A JP 19024182 A JP19024182 A JP 19024182A JP S6229150 B2 JPS6229150 B2 JP S6229150B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- focal point
- contact
- laser beam
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
この発明は、レーザー加工機の集光レンズまた
は凹面鏡の焦点を被加工物の表面に自動的に追従
させる装置の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a device for automatically following the focus of a condenser lens or a concave mirror of a laser processing machine onto the surface of a workpiece.
従来、この種の装置として第1図に示すものが
あつた。図において、1はレーザー発振器(図示
せず)から送られて来るレーザービーム、1aは
レーザービーム1の焦点、2は支持フレーム、3
は支持フレーム2に取付けられたサーボモータ
(駆動体)、4は支持フレーム2に対しスムースに
上下にすべるようにはめ合わされたレンズ筒、5
はサーボモータ3に連結された送りネジ、6はレ
ンズ筒4を保持するホルダー、6aは送りネジ5
にはめ合うナツト部、6bはスライド部、7はレ
ンズ筒4に取付けられたノズル、8はレンズ筒4
に取付けられたレンズホルダー、9はレンズホル
ダー8に取付けられたレンズ、10はホルダー6
に取付けられた差動トランス、10aは差動トラ
ンス10のプランジヤー、11はスライド部6b
に上下にすべるようにはめ合いプランジヤー10
aを介して差動トランス10に上下の変位量を伝
えるスライド棒、12はスライド棒11に取付け
られたプローブ、13はレーザービーム1によつ
て加工される被加工物、14は被加工物13を乗
せるXYテーブルである。このXYテーブル14は
数値制御装置(図示せず)によつて制御される2
個のモーター(図示せず)によつて2次元平面内
を運動する。このXYテーブル14の面に対しレ
ーザービーム1の光軸は垂直である。また被加工
物13の表面にレーザービーム1はレンズ9によ
つて焦点1aを結ばれる。差動トランス10はプ
ランジヤー10aの変位に比例する信号をサーボ
アンプ(図示せず)に送りこのサーボアンプ(図
示せず)は受け取つた信号によつてサーボモータ
3を制御するようになつている。 Conventionally, there has been a device of this type as shown in FIG. In the figure, 1 is a laser beam sent from a laser oscillator (not shown), 1a is the focus of laser beam 1, 2 is a support frame, and 3
4 is a servo motor (driver) attached to the support frame 2; 4 is a lens barrel fitted to the support frame 2 so as to smoothly slide up and down; 5
6 is a feed screw connected to the servo motor 3, 6 is a holder that holds the lens barrel 4, and 6a is a feed screw 5.
6b is the slide part, 7 is the nozzle attached to the lens barrel 4, and 8 is the lens barrel 4.
9 is a lens attached to lens holder 8, 10 is holder 6
10a is a plunger of the differential transformer 10, and 11 is a slide portion 6b.
The plunger 10 fits so that it slides up and down.
12 is a probe attached to the slide rod 11; 13 is a workpiece to be processed by the laser beam 1; 14 is a workpiece 13; It is an XY table on which the This XY table 14 is controlled by a numerical controller (not shown).
It moves in a two-dimensional plane by motors (not shown). The optical axis of the laser beam 1 is perpendicular to the surface of the XY table 14. Further, the laser beam 1 is focused 1a on the surface of the workpiece 13 by a lens 9. The differential transformer 10 sends a signal proportional to the displacement of the plunger 10a to a servo amplifier (not shown), and the servo amplifier (not shown) controls the servo motor 3 based on the received signal.
次に動作について説明する。レーザービーム1
がレンズ9によつて被加工物13の上に集光され
焦点1aを結ぶ。次にXYテーブル14を所定の
形状に移動させると被加工物13はその形状に切
断加工される。この切断を行うためにはレーザー
ビーム1の焦点1aが被加工物13の表面に結ば
れていなければならない。被加工物13が完全な
平面でない場合、XYテーブル14の移動につれ
プローブ12は被加工物13に接して上下する。
このプローブ12の変位はスライド棒11および
プランジヤー10aを介して差動トランス10に
伝えられ、差動トランスはこの変位量に比例した
信号をサーボアンプ(図示せず)に送り、サーボ
アンプ(図示せず)はその信号に基づいてサーボ
モータ3を駆動する。このサーボモータ3の駆動
で送りねじ5が回転され、ホルダー6と共にレン
ズ筒4がプローブ12の変位に追従して上下し、
焦点1aが常に被加工物13の表面で結ぶように
制御される。 Next, the operation will be explained. laser beam 1
is condensed onto the workpiece 13 by the lens 9 to a focal point 1a. Next, when the XY table 14 is moved to a predetermined shape, the workpiece 13 is cut into that shape. In order to perform this cutting, the focal point 1a of the laser beam 1 must be focused on the surface of the workpiece 13. If the workpiece 13 is not completely flat, the probe 12 will move up and down in contact with the workpiece 13 as the XY table 14 moves.
This displacement of the probe 12 is transmitted to the differential transformer 10 via the slide rod 11 and the plunger 10a, and the differential transformer sends a signal proportional to this amount of displacement to a servo amplifier (not shown). 1) drives the servo motor 3 based on the signal. The feed screw 5 is rotated by the drive of the servo motor 3, and the lens barrel 4 along with the holder 6 moves up and down following the displacement of the probe 12.
Control is performed so that the focal point 1a is always focused on the surface of the workpiece 13.
従来の焦点追従装置は以上のように構成されて
いるので、第4図に示すように焦点1aが被加工
物13の上にあつてもプローブ12が被加工物1
3の上から外れてしまうことがあるなどの欠点が
あつた。また第5図に示すように焦点1aによつ
て被加工物13にあけられた穴17にプローブ1
2がはまつてしまうなどの欠点があつた。 Since the conventional focus tracking device is configured as described above, even if the focal point 1a is on the workpiece 13 as shown in FIG.
It had some drawbacks, such as sometimes coming off the top of the 3. Further, as shown in FIG.
There were drawbacks such as 2 being mixed together.
この発明は上記のような従来のものの欠点を除
去するためになされたもので、棒状のプローブ1
2の代わりに焦点1aの周囲を囲むように形成さ
れた接触子を設けることにより焦点1aが被加工
物13の上にある限り接触子が落込まずに被加工
物13の高さの位置を検出できる焦点追従装置を
提供することを目的としている。 This invention was made in order to eliminate the drawbacks of the conventional probes as described above.
By providing a contact formed to surround the focal point 1a instead of 2, as long as the focal point 1a is above the workpiece 13, the height position of the workpiece 13 can be detected without the contact falling down. The purpose is to provide a focus tracking device that can
以下、この発明の一実施例を図によつて説明す
る。第2図において15はスライド棒11に取付
けられているアーム、16はアーム15に取付け
られたリング状の接触子である。この接触子16
は第3図に示すようにほぼ焦点1aがその中心に
来るように取付けられ、その形状は底のない皿に
似ており、穴のあいた底の部分にレーザービーム
1の焦点1aが来るようになつている。また接触
子16の外周は皿のようにもち上つており、被加
工物13に接してすべつて行くときに、被加工物
13に段があつても乗り上げやすいような形状と
なつている。その他の部分は従来の例と同等であ
るので説明を省略する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings. In FIG. 2, 15 is an arm attached to the slide rod 11, and 16 is a ring-shaped contactor attached to the arm 15. This contact 16
As shown in Fig. 3, the laser beam 1 is installed so that the focal point 1a is at its center, and its shape resembles a bottomless dish, and the focal point 1a of the laser beam 1 is located at the bottom with a hole. It's summery. Further, the outer periphery of the contactor 16 is raised like a plate, and is shaped so that when sliding in contact with the workpiece 13, it can easily run onto the workpiece 13 even if there is a step. The other parts are the same as the conventional example, so their explanation will be omitted.
次に動作について説明する。レーザービーム1
を被加工物13にレンズ9で集光させ被加工物1
3を乗せたXYテーブル14を動かして切断加工
を行うことは従来例と同じであるが、焦点1aが
被加工物13の端に来ても、焦点1aのまわり
360゜に接触子16があるので、第6図〜第8図
に示すようにノズル7が被加工物13から外れて
落ちこむことはないので切断加工が行える。また
第9図に示すように被加工物13に穴を切り抜い
た時にも接触子16は穴の縁にかかつており中に
落込むことはない。この接触子16が被加工物1
3に接して上下する変位量が差動トランス10で
検出され、フイードバツク制御による駆動体とし
てのサーボモータ3の動作でレンズ筒4が上下
し、焦点1aが被加工物13面に追従して合わさ
れることは、プローブ12がアーム15と接触子
16に変つたことを除けば従来例と同じである。 Next, the operation will be explained. laser beam 1
is focused on the workpiece 13 by the lens 9, and the workpiece 1
The cutting process is performed by moving the XY table 14 on which the workpiece 13 is placed, but even if the focal point 1a reaches the edge of the workpiece 13, the
Since the contact 16 is located at 360 degrees, the nozzle 7 does not fall off the workpiece 13 as shown in FIGS. 6 to 8, so that cutting can be performed. Further, even when a hole is cut out in the workpiece 13, as shown in FIG. 9, the contactor 16 stays on the edge of the hole and does not fall into it. This contactor 16 is the workpiece 1
3 is detected by the differential transformer 10, and the lens barrel 4 is moved up and down by the operation of the servo motor 3 as a driving body under feedback control, and the focal point 1a is aligned to follow the surface of the workpiece 13. This is the same as the conventional example except that the probe 12 is replaced by an arm 15 and a contact 16.
なお、上記実施例では接触子を、焦点の周囲を
囲むように形成したリング状のもので構成した
が、特にリング状の必要はなく、焦点の周囲を囲
むように形成した多角形状のものでもよく、又、
同様に形成されただ円形などのものでもよい。ま
た被加工物を動かしているが、レンズ筒を動かす
場合でもよい。またレンズの代わりに凹面鏡の場
合でもよい。 In the above embodiment, the contact was formed into a ring shape that surrounded the focal point, but it does not need to be ring-shaped, and it may also be a polygonal shape that surrounds the focal point. Well, again,
It may also be formed in a similar manner but in a circular shape. Although the workpiece is being moved, the lens barrel may also be moved. Also, a concave mirror may be used instead of a lens.
なお、切断加工の場合について説明したが溶接
の場合でも上記実施例と同様の効果がある。 Note that although the case of cutting has been described, the same effect as in the above embodiment can be obtained even in the case of welding.
以上のように、この発明によれば、被加工物面
にレーザーの焦点を追従させるためのサーボ機構
の検出器の接触子として、焦点の周囲を囲むよう
に形成された接触子を備えたので焦点が被加工物
面上にある限り、接触子が被加工物から外れるな
どの異常を防止する効果がある。 As described above, according to the present invention, the contact formed to surround the focus is provided as the contact of the detector of the servo mechanism for making the focus of the laser follow the surface of the workpiece. As long as the focus is on the surface of the workpiece, it is effective in preventing abnormalities such as the contact coming off the workpiece.
第1図は従来のレーザー加工機用焦点追従装置
を示す断面正面図、第2図はこの発明の一実施例
によるレーザー加工機用焦点追従装置を示す断面
正面図、第3図はこの発明の接触子16の形状と
ノズル7との配置関係を示す図、第4図・第5図
は従来の装置による被加工物13と焦点1aおよ
びプローブ12の位置関係を示す平面図、第6図
〜第9図はこの発明の装置による被加工物13と
焦点1aおよび接触子16の位置関係を示す平面
図である。
図において、1はレーザービーム、3はサーボ
モータ(駆動体)、9はレンズ、16は接触子で
ある。なお、図中同一符号は同一または相当部分
を示す。
FIG. 1 is a cross-sectional front view showing a conventional focus tracking device for a laser processing machine, FIG. 2 is a cross-sectional front view showing a focus tracking device for a laser processing machine according to an embodiment of the present invention, and FIG. 3 is a cross-sectional front view showing a focus tracking device for a laser processing machine according to an embodiment of the present invention. 4 and 5 are plan views showing the positional relationship between the workpiece 13, the focal point 1a, and the probe 12 in the conventional apparatus, and FIGS. FIG. 9 is a plan view showing the positional relationship between the workpiece 13, the focal point 1a, and the contact 16 according to the apparatus of the present invention. In the figure, 1 is a laser beam, 3 is a servo motor (driver), 9 is a lens, and 16 is a contact. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
焦点近傍に、前記焦点の周囲を囲むように形成さ
れた接触子を被加工物と摺接するように配設し、
前記接触子の変位量を入力信号とする駆動体によ
つて前記レンズまたは凹面鏡の位置を調節し、レ
ーザー光の焦点が前記接触子で囲まれた位置に調
整されるようにしたことを特徴とするレーザー加
工機用焦点追従装置。1. In the vicinity of the focal point of a lens or concave mirror that focuses the laser beam, a contact element formed so as to surround the periphery of the focal point is arranged so as to be in sliding contact with the workpiece,
The position of the lens or concave mirror is adjusted by a driver that receives the amount of displacement of the contact as an input signal, so that the focal point of the laser beam is adjusted to a position surrounded by the contact. Focus tracking device for laser processing machines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57190241A JPS5978792A (en) | 1982-10-29 | 1982-10-29 | Focus follow-up device for laser working machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57190241A JPS5978792A (en) | 1982-10-29 | 1982-10-29 | Focus follow-up device for laser working machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5978792A JPS5978792A (en) | 1984-05-07 |
| JPS6229150B2 true JPS6229150B2 (en) | 1987-06-24 |
Family
ID=16254847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57190241A Granted JPS5978792A (en) | 1982-10-29 | 1982-10-29 | Focus follow-up device for laser working machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5978792A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01270815A (en) * | 1988-04-22 | 1989-10-30 | Doriimu Sogo Kenkyusho:Kk | Water bed frame |
| JPH0736805U (en) * | 1993-12-21 | 1995-07-11 | 光 森山 | Futon ventilation mat |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4659900A (en) * | 1985-07-06 | 1987-04-21 | Prima Industrie S.P.A. | Laser cutting machine |
| DE502005001790D1 (en) * | 2005-06-23 | 2007-12-06 | Trumpf Werkzeugmaschinen Gmbh | METHOD FOR DETERMINING THE FOCUS OF A LASER BEAM |
| CN104588885B (en) * | 2015-01-22 | 2016-08-24 | 天津市激光技术研究所 | Device is followed the tracks of in the deadweight focusing of abnormal curved surface laser engraving |
-
1982
- 1982-10-29 JP JP57190241A patent/JPS5978792A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01270815A (en) * | 1988-04-22 | 1989-10-30 | Doriimu Sogo Kenkyusho:Kk | Water bed frame |
| JPH0736805U (en) * | 1993-12-21 | 1995-07-11 | 光 森山 | Futon ventilation mat |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5978792A (en) | 1984-05-07 |
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