JPS6230071B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is a soldering device which, when lowering a printed circuit board to solder it, shortens the transport distance for lowering it as much as possible and can achieve this with an extremely simple configuration. The present invention relates to a printed circuit board conveyance device for use in a printed circuit board.

When soldering while transporting a carrier with a printed circuit board attached, lower the carrier diagonally to bring the printed circuit board as close to the solder liquid level as possible, then move it horizontally while soldering. , it is being raised diagonally to return it to its original level. In this case, conventionally, the transfer rail has been formed with an inclined part that gradually descends and rises, or the transfer rail has been cut out at the solder bath, and a movable rail that descends and rises has been provided in this cutout, or There are models that have auxiliary rails installed parallel to the transport rail so that the front and rear wheels of the carrier move simultaneously on the descending or ascending slopes of the transport rail, but these tend to be larger and have more complicated mechanisms. In any case, the disadvantage was that the soldering device became large.

This invention was made in order to eliminate the above-mentioned drawbacks. This invention will be explained below.

Figures 1a and 1b show an embodiment of the present invention, with Figure 1a being a plan view and Figure 1b being a side view. In these figures, 1 is a printed circuit board, 2
3 and 4 are carriers on which the printed circuit board 1 is removably mounted and transported;
A pair of front wheels and a rear wheel are provided; 5 is a solder tank; 6 is a conveyor rail that guides the left and right front wheels 3 and rear wheels 4 and conveys the carrier 2 by a drive chain (not shown); 7, 8; is the front wheel 3 on the conveyor rail 6.
and a rear wheel 4, each of which is provided with a slope, a horizontal surface, and a recess formed by a slope at a predetermined interval.
The second trapezoidal recesses 9 and 10 are the first and second guide rails that are concave upwardly located above the recesses 7 and 8, and have elongated holes 11 and 12 in the center, respectively; It is attached by loosely fitting the fixed shafts 13 and 14 into the respective elongated holes 11 and 12. 1
Reference numerals 5 and 16 denote bearings on which the fixed shafts 13 and 14 are attached in a cantilevered manner, and both are fixed to the transport rail 6. (Not shown) Reference numerals 17 and 18 are holders that hold the first and second guide rails 9 and 10 so that they do not slip out.

Next, the operations of the first and second recesses and the first and second guide rails in the printed circuit board conveying device for a soldering apparatus according to the present invention will be explained with reference to FIGS. 2 and 3.

Figure 2 a, b and Figure 3 a, b are enlarged views of the main parts of Figure 1, respectively.
Figure a is a plan view, and Figures 2b and 3b are side views. In addition, for convenience of explanation, the second recess 8 and the second guide rail 10 will be described in both FIGS. 2 and 3.

FIGS. 2a and 2b show the rear part 1 of the second guide rail 10.
When 0b is in the horizontal position, the front portion 10a is in a pushed up state. In this state, the fixed shaft 14 is pressed against the front portion 10a of the elongated hole 12, so the weight of the rear portion 10b is greater than that of the front portion 10a. Therefore, the rear portion 10b is stable in terms of weight, contacts the rear edge of the recess 8, and is continuous with the horizontal surface 6a of the conveyance rail 6 to maintain a horizontal level.
Then, the front wheel 3 that has advanced on the horizontal surface 6a of the conveyance rail 6 is moved to the rear part 10b of this guide rail 10.
Move up and run.

The front wheel 3 advances further and runs on the front part 10a of the guide rail 10, as shown in FIG. 3b. At this time, the front portion 10a is pushed down by the weight of the front wheels 3, so that it is in a horizontal position and the rear portion 10b is pushed up. Since the fixed shaft 14 is pressed against the rear part 10b of the elongated hole 12, contrary to FIG. 2, the weight of the front part 10a is greater than that of the rear part 10b. For this reason, the front portion 10a is switched to the horizontal position and comes into contact with the front edge of the recess 8 in a stable manner in terms of weight, and continues to the horizontal surface 6b of the conveyance rail 6 and maintains a horizontal level. And the front wheel 3 is a guide rail 10
The vehicle moves from the front portion 10a of the vehicle to the horizontal surface 6b and runs.

Next, as shown in FIG. 3b, the rear wheel 4, which has advanced from the horizontal plane 6a, moves from the rear edge of the recess 8 to the slope 8.
It descends while traveling on the horizontal surface 8b, then travels on the slope 8c, and pushes up the front part 10a of the guide rail 10 from below.
The rear portion 10b is in a horizontal position, that is, the rear portion 10b is on the rear side of the concave portion 8 in preparation for the passage of the next front wheel 3. Next, the rear wheels 4 run on the horizontal plane 6b.

In this manner, the stable state shown in FIG. 2 is automatically switched to the stable state shown in FIG. 3 by the running of the front wheels 3. This is because the center of gravity of the guide rail 10 moves back and forth with respect to the fixed shaft 14.

Next, FIG.
~i will be explained.

FIGS. 4 a to 4 i are explanatory diagrams showing the operations of the front and rear wheels of the carrier and the first and second guide rails in the soldering process. In these figures, a carrier 2 with a printed circuit board 1 mounted thereon travels on a transport rail 6 by a drive chain (not shown), and reaches a solder bath 5 via a flux processing device and a preheating device.

Here, as shown in FIG. 4a, the front wheels 3 of the carrier 2 run on the rear part 10b of the second guide rail 10 which is in a horizontal position from the horizontal surface 6a of the conveyor rail 6, and further as shown in FIG. 4b. The vehicle then travels on the front portion 10a and reaches the horizontal surface 6b.

Next, as shown in FIG. 4c, the front wheel 3 is moved to the first recess 7.
The vehicle descends while traveling on the slope 7a of the road. At this time,
Since the rear wheels 4 are still running on the horizontal plane 6a,
The printed circuit board 1 mounted on the carrier 2 is immersed in the solder melt in the solder bath 5 while diagonally descending.

Next, as shown in FIG. 4d, the front wheel 3 is moved to the first recess 7.
While running on the horizontal plane 7b of the rear wheel 4, the rear wheel 4 descends while running on the slope 8a of the second recess 8. Next, as shown in FIG. 4e, both the front wheels 3 and the rear wheels 4 run horizontally on the horizontal surfaces 7b and 8b. At this time, the printed circuit board 1 is immersed in the solder melt surface of the solder bath 5 and soldered.

Next, as shown in FIG. 4f, both the front wheels 3 and the rear wheels 4 ascend obliquely on the slopes 7c and 8c, so that the printed circuit board 1 is lifted from the solder melt surface of the solder bath 5 while ascending obliquely.

Next, as shown in FIG. 4g, the front wheels 3 and the rear wheels 4 run horizontally on horizontal surfaces 6c and 6b.

Next, the rear wheel 4 runs on the rear part 9b of the first guide rail 9, as shown in FIG. 4h, and further runs on the front part 9a, as shown in FIG. 4i, until reaching the horizontal surface 6c. In addition, at this time, the first and second guide rails 9,
The position of 10 is the same as in Fig. 4a, and the next front wheel 3
The next printed circuit board 1 is then soldered. In this way, the process of soldering the printed circuit board 1 is completed.

FIG. 5 is an explanatory diagram showing the operation of the printed circuit board 1 in the soldering process shown in FIGS. 4a to 4i.
In this figure, the printed circuit board 1 is placed in a horizontal position 1a.
From there, it descends obliquely as shown in 1b while inclining with respect to the horizontal plane, advances horizontally as shown in 1c while coming into contact with the solder melt in the solder bath 5, and then rises obliquely as shown in 1d while inclining again. , 1e, return to the original horizontal position.

In this case, by changing the angle of inclination of the slopes of the first and second recesses 7 and 8, even if the front wheels 3 and rear wheels 4 start descending at the same time, the printed circuit board 1 can be lowered diagonally.
can be raised. The reason why the printed circuit board 1 is lowered and raised obliquely in this manner is to improve solder cutting and to vent gas.

As explained above, the present invention provides slopes for guiding the front and rear wheels, horizontal surfaces, and slopes at predetermined intervals on the conveyor rail of a soldering device, and concave portions having a concave shape in the upper part and a central slope. a guide rail having an elongated hole in the recessed portion is attached to a fixed shaft provided in the center of each of the recessed portions by loosely fitting each of the elongated holes, and the fixed shaft is attached to a bearing fixed to the conveying rail, Furthermore, the structure is such that the guide rails are switched and held on either the leading edge side or the trailing edge side of each of the recesses by pressing or pushing up the front wheel or the rear wheel, so that the front wheels and the rear wheels are lowered almost simultaneously. As it rises, the distance of the transport rail becomes shorter. In addition, the guide rails are automatically and mechanically switched as the front and rear wheels run, and the long holes and fixed shafts move the center of gravity to maintain a stable state while minimizing the number of parts. Since the guide rails are common to the front and rear wheels, not only can the number of guide rails be minimized, but the widths of the front and rear wheels are the same, so the existing carrier can be used as is, among other advantages. has.

[Brief explanation of the drawing]

Figures 1a and b show one embodiment of the present invention, where Figure 1a is a plan view, Figure 1b is a side view, and Figure 1b is a side view.
Figures a, b and Figures 3 a and b are enlarged views of the main parts of Figure 1, Figures 2 a and 3 a are plan views, Figure 2 b, and Figure 3 b. is a side view, Fig. 4a
~i is an explanatory diagram showing the operation of the front and rear wheels of the carrier and the first and second guide rails in the soldering process, and Figure 5 shows the operation of the printed circuit board in the soldering process of Figures 4 a to i. It is an explanatory diagram. In the figure, 1 is a printed circuit board, 2 is a carrier, 3 is a front wheel, 4 is a rear wheel, 5 is a solder bath, 6 is a transport rail, 7 and 8 are recesses, 9 and 10 are guide rails, 1
1 and 12 are long holes, 13 and 14 are fixed shafts 15 and 16
is a bearing, and 17 and 18 are holders.

Claims (1)

[Claims] 1 Consists of a printed circuit board transport carrier having one pair of left and right front wheels and one rear wheel, and a transport rail that guides the left and right front wheels and rear wheels, respectively, and a transport rail that guides the left and right front wheels and rear wheels, respectively. and a fixed shaft having recesses each formed of a horizontal surface and an inclined surface provided at predetermined intervals to guide the recesses, respectively, and a guide rail having a concave shape upwardly and a long hole in the center provided in the center of each of the recesses. The fixed shaft is attached to a bearing fixed to the conveying rail by loosely fitting each of the elongated holes into the conveyor rail, and the guide rail is fitted into each recess by pressing or pushing up the front wheel or the rear wheel. 1. A print conveyance device for a soldering device, characterized in that the print conveyance device for a soldering device is configured to switch and hold the print on either the leading edge side of the advancing side or the trailing edge side of the advancing side.