JPS6230515B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic component wiring device most suitable for use in rechargeable electric shavers, rechargeable portable lamps, and the like.

Conventional devices of this type include so-called printed wiring boards, which are formed by forming a foil-like conductive layer on the main surface of an insulating substrate and removing undesired portions of the conductive layer by etching based on a predetermined circuit. It is used.

However, the foil-like conductive layer described above has a weak mechanical strength, and when a large electronic component or the like is brazed, the brazed portion often peels off.

For this reason, at least one side of a conductive pattern piece molded from a metal plate based on a predetermined circuit is coated with a layer of insulating synthetic resin so that the part for mounting electronic components is exposed. By punching out the undesired parts and brazing the electronic components inserted from one side into the electronic component mounting area, it can be easily manufactured using punching and molding methods, and can be manufactured in a variety of ways. We proposed a method for manufacturing electronic component wiring equipment with strong mechanical strength to which electronic components can be attached.

By the way, when brazing electronic parts, in response to mass production, it is preferable to process them in batches, for example by immersing the other side in a solder bath.

However, in the above-mentioned device, if one attempts to braze the conductive pattern piece by dipping it in the solder bath, only the part of the conductive pattern piece for attaching the electronic component must be made to protrude to the other side by pressing, etc., and in reality, It is difficult to make such a protruding part protrude by press working or the like, and in this case, the outer diameter becomes larger by the height of the protruding part, which goes against the desire to make the product thinner.

Therefore, the present invention involves cutting and raising the electronic component mounting portion of a conductive pattern piece whose at least one side is coated with an insulating synthetic resin to the other side so that the electronic component mounting portion is exposed. After forming the electronic component and brazing the electronic component to this part, the part for attaching the electronic component is bent back toward one side until the brazed part is almost located within the insulating layer on the one side, for example. It is an object of the present invention to provide a method for manufacturing an electronic component wiring device that can be brazed in batches using a solder bath or the like, does not increase the height dimension, and can protect the brazed portion.

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, 1 is a substrate made of insulating synthetic resin, 2 is a conductive pattern piece fixed to the substrate 1, and 3 (3 ₁ , 3 ₂ ) is formed by bending the conductive pattern piece 2 at a predetermined position. At the end of each of these bent parts 3 ₁ and 3 ₂ , there is a
Electronic components 4 (4 ₁ , 4 ₂ ) are fixed with solder 5 or the like, and each bent portion 3 is maintained in an inclined position so that the soldered portion 5 is approximately located within the insulating substrate. .

Next, an example of a method for manufacturing the electronic component wiring device will be explained in order of steps.

First, a metal plate (not shown) such as a copper plate or phosphor bronze plate with a thickness of about 0.15 to 0.3 mm is punched out, and a second
A conductive pattern piece 2 as shown in the figure is formed. Next, the part 3 of the conductive pattern piece 2 for mounting electronic components is exposed, and as shown in FIG. While forming a substrate, undesired portions of the conductive pattern piece 2 are punched out and removed together with the insulating layer 1. Furthermore, the portion 3 for attaching the electronic components is cut and raised toward the other side surface 2b as shown in FIG. This cut-and-raised formation may be performed at the same time as punching out the undesired portions, or may be performed at the same time as punching when making a mold from a metal plate.

After that, each lead wire 4a of the electronic component 4 (4 ₁ , 4 ₂ ) is inserted into the electronic component mounting portion 3 as shown in FIG. When the part 3 is immersed in the solder bath M as shown in FIG. 6, the lead wire 4a of the electronic component 4 is fixed to the electronic part mounting part 3 with solder 5 as shown in FIG. After that, by bending the electronic component mounting portion 3 back toward the one side surface 2a and positioning the soldering portion 5 within the insulating layer 1, the electronic component mounting device shown in FIG. 1 can be obtained. It will be done.

In this way, by covering one side 2a of the conductive pattern piece 2 molded from a metal plate with the insulating synthetic resin 1 in a layered manner and using this as a substrate, it is easier to machine than when using a printed wiring board. Not only can wiring for electrically strong electronic components be easily produced, but also the solder bath M can be easily produced by cutting and forming the portion 3 of the conductive pattern piece 2 for mounting the electronic component toward the other side 2b. can be used for brazing, and can easily be mass-produced.
Furthermore, the above-mentioned part 3 after the above-mentioned brazing is attached to one side 2a.
Since the brazed portion 5 is positioned within the insulating layer 1 by bending it back to the side, the dimension in the height direction is shortened and it can also be made thinner, compared to a method in which a protrusion is formed and brazed. At the same time, the brazed portion 5 can be protected.

In the above embodiment, the insulating layer 1 is formed on one side surface 2a of the conductive pattern piece 2.
Even if the insulating layer 1 is formed on the other side surface 2b side,
A similar effect can be achieved.

As described above, according to the present invention, the electronic component mounting portion of the conductive pattern piece having an insulating layer formed on at least one side is moved to the other side so that the electronic component mounting portion is exposed. Cut and form,
After brazing the electronic parts to this part, we bent it back to one side and positioned the brazed part within the insulating layer on the one side, so it has strong mechanical strength and can be used to attach various electronic parts. The brazing process can be performed in mass production using a solder bath, etc. In particular, the brazed part is bent back into the insulating layer after the brazing process, so the brazed part with low mechanical strength is Therefore, it is possible to prevent damage caused by hitting other objects, etc., and by bending it back in this way, the overall thickness can be made thinner, so that it can be used with electric shavers such as electric shavers. Can support downsizing of equipment.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an example of a wiring device for electronic components obtained by the manufacturing method of the present invention, and FIGS.
The figure is a cross-sectional view showing the manufacturing method of the device in order of steps. 1... Insulating layer (substrate), 2... Conductive pattern piece, 2
a...one side, 2b...other side, 3...part for mounting electronic components, 4...electronic parts, 5...brazing part.

Claims (1)

[Claims] 1. At least one side 2a of a conductive pattern piece 2 molded from a metal plate is coated with an insulating synthetic resin 1 in a layered manner so that a part 3 for mounting electronic components is exposed, and this insulating layer 1 is used as a substrate; Further, an undesired portion of the conductive pattern piece 2 is punched out and removed, and a portion 3 for mounting the electronic component is cut and raised toward the ground surface 2b, and this portion 3 is attached to the one side surface 2a.
After brazing the electronic parts 4 charged from the side,
A method of manufacturing an electronic component wiring device, in which the electronic component mounting portion 3 is bent back toward the one side surface 2a, and the brazed portion 5 is positioned substantially within the insulating layer 1 on the one side surface 2a side.