JPS6231485B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting electrodes of a chip-shaped electronic component, in which the chip-shaped electronic component is held between both electrode lead wires and immersed in molten solder, and a jig for manufacturing the same.

As shown in FIG. 1, conventional chip-shaped electronic components (hereinafter abbreviated as components), particularly the electrode terminal leads of a component 8 having a rectangular shape, are attached by aligning both electrode lead wires with a substrate 1 and a plurality of equally spaced grooves. Chain lead wires 2A and 2B are stacked and set on a manufacturing jig consisting of a combination of plate 4 and component holder 5, and component 8 is inserted between lead wires 6A and 6B protruding from chain lead wires 2A and 2B. The spring plate 9A connected to the fixing plate 9 holds down the component 8 and the fixing plate 9 is attached to the board 1.
It is fixed with a spring plate retainer 7 which is held at the end of the spring plate. Next, the set manufacturing jig was manually dipped into a solder flux liquid, and then connections were made by dipping it into molten solder.

In the lead wire soldering jig for the conventional electrode terminal structure,
(b) Since there are a large number of assembly parts, a large amount of manual assembly man-hours is required. (b) The manufacturing cost of the jig was high due to the large number of assembled parts, and the jig itself was heavy. Moreover, since the component 8 and the lead wires 6A, 6B were immersed in solder with insufficient adhesion, the lead wires 6A, 6B and the component 8 were connected with solder as shown in FIG. When conducting a solder heat resistance test for reliability investigation, lead wires 6A and 6B
There were drawbacks such as the solder between the parts 8 and 8 melting and flowing out, resulting in frequent connection failures.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for connecting electrodes of chip-shaped electronic components and a jig for manufacturing the same, which solves the conventional drawbacks.

That is, the present invention is characterized in that a chip-shaped electronic component is held between lead wires of different electrodes, the lead wires of both electrodes are moved in opposite directions to increase contact, and the chip is dipped in solder.

Particularly, according to the present invention, there is a step of laminating two chain leads, each consisting of lead wires suspended from a band plate at equal intervals, on a substrate having a positioning guide pin; It is characterized by comprising the steps of placing a chip-shaped electronic component between the wires, moving the electrode lead wires in opposite directions to clamp the chip-shaped electronic component under pressure, and then immersing the chip-shaped electronic component in molten solder. A method for connecting electrodes of chip-shaped electronic components is obtained.

Further, according to the present invention, a substrate having a guide pin for overlapping the chain leads and positioning the electrode lead wires at a constant pitch, and a groove portion projecting parallel to the long side of the substrate, and a comb blade are fitted into each other. a plate-shaped pedestal for seating a chip-shaped electronic component sandwiched between both electrode lead wires held in the notches; There is also obtained a manufacturing jig characterized in that it has a plate-shaped magnetic body for crimping.

The present invention will be explained below with reference to FIGS. 3 to 6.

FIG. 3 shows a perspective view of an embodiment of the present invention, in which cutouts of chain leads 2A and 2B in which lead wires 6A and 6B are protruded from a band plate of the board 1 are used to connect positioning pins of the board 1. Shift the lead wires 6A and 6B to predetermined positions and set them overlapping each other.
Next, the lead wires 6A and 6B protruding from the chain lead wires 2A and 2B, respectively, are held down by a plate-shaped magnetic rubber 3 in which magnetic powder is embedded in an elastic body such as rubber, and the alignment plate 4 is After holding the lead wires 6A and 6B at a constant interval, the component 8 is inserted between the lead wires 6A and 6B. Next, as shown in the partially enlarged view of FIG. and connect the lead wires 6A,
6B is elastically deformed, and the component 8 is clamped and pressurized by its elastic force. At this time, as shown in FIG. 5A, the distance W' between the tips of the lead wires 6A and 6B must be narrower than the width W of the component 8 (W'<W) as shown in FIG. 5B.

The shape of the tip portions of the lead wires 6A and 6B is as follows.
As shown in FIGS. 6A and 6B, the lead wires 6A and 6B may have a cylindrical shape and a plate shape so that they can be held stably even if they deviate from the center of the thickness of the component 8, or they may have a wide tip. Of course, it is also possible to have a flat end surface formed under pressure. Next, the set manufacturing jig is manually immersed in a solder flux liquid in the same manner as in the prior art described above, and then connected by being immersed in a solder dipping tank.

As described above, according to the present invention, (i) the number of assembly parts of the manufacturing jig for electrode connection can be reduced, and the number of connection work steps can be greatly reduced. (ii) The number of parts in the manufacturing jig is also approximately 1/
We were able to reduce it to about 3. Therefore, the manufacturing jig manufacturing cost has been reduced and the weight of the manufacturing jig has been reduced. (iii) By sandwiching and pressurizing the component 8 with the lead wires 6A and 6B and immersing it in solder, the lead wires 6A and
Since 6B is in contact with the component 8, it has many advantages such as not causing a connection failure even if the solder melts at the connection part.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional manufacturing jig in a partially exploded state, FIG. 2 is a plan view showing the relationship between lead wires and components after being dipped in solder, and FIG. 3 is a perspective view of a manufacturing jig according to the present invention. 4 is a plan view showing the moving direction of the lead wire according to the method of the present invention, FIG. 5 A and B are plan views showing the dimensional relationship between the lead wire interval and the chip-shaped electronic component according to the present invention, and FIG. FIGS. A and B are plan views showing the connection relationship between the lead wire and the chip-shaped electronic component and the shape of the tip of the lead wire according to the present invention. Codes in the figure 1...Substrate, 2A, 2B...Chain lead, 3...Magnetic rubber, 4...Alignment plate, 5
...Component holder, 6A, 6B...Lead wire, 7...Spring plate holder, 8...(chip-shaped electronic) component, 9...Fixing plate,
9A...Spring plate.

Claims (1)

[Scope of Claims] 1. A step of stacking two chain leads, each consisting of lead wires suspended from a band plate at equal intervals, on a substrate having positioning guide pins, and both electrodes of the chain leads. The method includes the steps of: placing a chip-shaped electronic component between the lead wires; moving the electrode lead wires in opposite directions to clamp the chip-shaped electronic component under pressure; and then immersing the chip-shaped electronic component in molten solder. Features: Electrode connection method for chip-shaped electronic components. 2. A board having guide pins for positioning the lead wires at regular intervals, and lead wires arranged at equal intervals that fit into grooves projecting parallel to the long sides of the board and having comb-like notches at the upper ends. A chip comprising a plate, a plate-shaped pedestal on which a chip-shaped electronic component held between the lead wires held in the notch is seated, and a plate-shaped magnetic body on which the lead is crimped to the substrate. Manufacturing jig for shaped electronic parts.