JPS6231763B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to adhesive connectors that are often used particularly in small electronic devices.

Conventionally, adhesive connectors used in small calculators and the like are made by applying conductive paint onto a film base 1 such as a polyester film by means such as screen printing, as shown in Figure 1. A wiring circuit 2 is formed using the same method, and a conductive adhesive layer 3 is formed on the wiring circuit 2 by the same means, and an insulating portion that does not require electrical connection is further insulated by the same method. Generally, a adhesive layer 4 is formed thereon. However, heat treatment is required to dry and harden the paint or adhesive applied to the film base, and at this time, as a countermeasure against heat shrinkage of the film base, the film base must be heated in advance and applied after heat shrinking. A preliminary tempering process is required. Further, since the coating operation is performed several times by screen printing or the like, alignment is troublesome and problems tend to occur in terms of accuracy.

This invention was made in view of these problems, and eliminates the need for a preliminary heat treatment process for the film base, eliminates the need for troublesome positioning, improves positional accuracy, and further improves mass productivity. The purpose of the present invention is to provide an adhesive connector that is flexible, can reduce costs, and can be used to make devices smaller and thinner.

Next, embodiments of the present invention will be described with reference to the drawings from FIG. 2 onwards. In the figure, 5 is an adhesive conductive wire formed by covering a conductive core wire 6 such as a metal wire or carbon fiber with a conductive adhesive 7 by extrusion molding or the like, and 8 is a synthetic fiber. It is an adhesive linear insulator formed by coating the periphery of a non-conductive core wire 9 with an insulating adhesive 10 by a method such as extrusion molding. In this embodiment, these adhesive conductive wires 5 and adhesive linear insulators 8 are arranged alternately in parallel and adhered onto an insulating film base 1 such as a polyester film. In the above example, the core wire 6 of the adhesive conducting wire 5 is conductive, and the core wire 9 of the adhesive linear insulator 8 is non-conductive. If sufficient conductivity can be obtained with the adhesive 7 alone, there is no problem in using a non-conductive core wire 6, and if the core wire 9 is exposed from the coating of the insulating adhesive 10, it may cause a live part. If there is no risk of touching the core wires, conductive core wires may be used, and the manufacturing process can be simplified by using the same core wires for the core wires 6 and 9.

FIG. 4 shows an example of the state of use, where 11 is an adhesive connector configured as described above, 12 is an electronic component such as a liquid crystal display element, 13 is a printed wiring board, and the adhesive connector 11 is an adhesive conductor. 5 and the adhesive linear insulator 8, the electronic component 1
2 and printed wiring board 13, and the terminals of electronic component 12 and the wiring portion of printed wiring board 13 are electrically and mechanically connected by adhesive conducting wire 5.

As described above, since the adhesive connector 11 adheres by its own adhesive force, the adhesive should be selected depending on the location where it will be used, that is, the material of the adherend such as electronic components to be adhered. It is necessary to choose. Therefore, silicon-based adhesives are used as adhesives that have good adhesion to both glass and plastic, such as liquid crystal display elements, and polyester adhesives have particularly good adhesion to plastics. Types of adhesives are used, and although they have poor adhesion to plastics, they have excellent adhesion to glass.
Chloroprene rubber-based or nitrile rubber-based materials are used. In addition, when imparting conductivity to these adhesives, for example, those in which carbon particles are mixed and dispersed are used.

FIG. 5 shows an embodiment in which an adhesive layer 14 is formed on a film base 1, and adhesive conductive wires 5 and adhesive linear insulators 8 are alternately adhered thereon. The adhesive force of the linear insulator 8 to the film base 1 can be strengthened by the adhesive layer 14.

In FIG. 6, the adhesive conductive wire 5 is made thin and the adhesive linear insulator 8 is made thick. First, the adhesive linear insulator 8 is arranged densely on the film base 1, and then the adhesive conductive wire 5 is placed on the film base 1 in the same manner. This is an example in which the images are arranged in pitch. This embodiment has a suitable structure and can be used when using a conductive adhesive 7 that does not have good adhesion to the film base 1 but has good adhesion to adherends such as electronic components and printed wiring boards. In addition to widening the range of suitable adhesives, connections by pressure bonding can also be made more reliably.

In FIGS. 7 and 8, the adhesive linear insulator 8 is not used, and only the adhesive conductive wires 5 are bonded at regular intervals to the film base 1 on which the adhesive layer 14 is formed. In particular, FIG.
The diameter of the conductive adhesive 7 is made smaller than the interval, and when a conductive adhesive 7 with weak adhesive strength is used,
The adhesive layer 14 can reinforce the adhesive force to the adherend, and in this case, the adhesive layer 14 has the function of bonding the adhesive conductive wire 5 to the film base 1;
It is used to exhibit two functions: adhesion to adherends.

FIG. 9 shows another embodiment, in which the film base 1 used in each of the above-mentioned embodiments is not used, and adhesive conductive wires 5 and adhesive linear insulators 8 are alternately arranged in parallel. They are integrated by fusing them together. This embodiment is a double-sided adhesive type suitable for use while being sandwiched between two adherends, and FIG. 10 shows its use. That is, the terminal 1 of the electronic component 12 such as a liquid crystal display element
5 and the wiring part 16 of the printed wiring board 13 are electrically connected by the adhesive conductor 5, and adjacent conductive parts are insulated by the adhesive linear insulator 8. The electronic component 12 and the printed wiring board 13 are bonded to each other, and the electronic component 1
2 can be easily attached to the printed wiring board 13 without taking up much space.

As described above, in this invention, the core wire is coated with a conductive adhesive to form an adhesive conductor wire, and the adhesive conductor wires are arranged in parallel while being mutually insulated. It is easy to manufacture connectors with high precision, the number of terminals can be changed freely, and costs can be reduced because they can be produced continuously at high speed using methods such as extrusion molding. It is easy to store and use as it can be produced and cut to the required length for use, and it is also easy to produce double-sided adhesive type products that do not use a film base. This is effective in making devices thinner and smaller. Furthermore, since the area between the connected electrodes is filled with conductive adhesive, there is no problem of environmental deterioration such as oxidation of the electrodes at the connection part, and the signal is transmitted reliably even when handling minute current signals. be able to. Furthermore, since the state of the connected portion does not change even if a certain amount of external force is applied to the connected portion, there is an advantage that no noise is generated.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional adhesive connector, and FIG. 2 is a sectional view of an embodiment of the adhesive connector of the present invention.
FIG. 3 is a perspective view of the same as the above, FIG. 4 is a perspective view showing an example of the usage state of the same, FIG. 5 is a sectional view of another embodiment, FIG. 6 is a sectional view of another embodiment, and FIG. 8 and 8 are sectional views of still another embodiment, FIG. 9 is a sectional view of still another embodiment, and FIG. 10 is a sectional view of the same in use. DESCRIPTION OF SYMBOLS 1... Film base, 5... Adhesive conducting wire, 6... Conductive core wire, 7... Conductive adhesive, 8... Adhesive linear insulator, 9... Core wire not having electrical conductivity, 10
...Insulating adhesive, 11...Adhesive connector.

Claims (1)

[Claims] 1. A core wire is coated around the core wire with a conductive adhesive to form an adhesive conductor wire, and the adhesive conductor wires are arranged in parallel and integrated in a mutually insulated state. adhesive connector. 2. Claim 1, in which adhesive conductive wires and adhesive linear insulators formed by coating the periphery of the core wire with an insulating adhesive are arranged alternately in parallel and adhered on an insulating film base. Adhesive connector as described. 3. An adhesive connector according to claim 1, wherein adhesive conductive wires are arranged in parallel at regular intervals and adhered to an insulating film base. 4. The adhesive connector according to claim 1, wherein adhesive conductive wires and adhesive linear insulators are alternately arranged in parallel and bonded to each other.