JPS6231830B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] With respect to the surface of the protrusion provided on the package thermally conductive support material and the large area outer heat transfer surface of the support material,
The heat receiving surface of the fitting portion of the radiator and the heat receiving surface facing the outer heat receiving surface of the support material were bonded using a thermally conductive binder.

[Industrial application field]

The present invention relates to a semiconductor device having a heat sink.

Semiconductor product packages, especially packages for large-scale integrated circuits and power semiconductor devices that operate at high speed, must quickly dissipate the heat generated there, otherwise the large-scale integrated circuits, semiconductor devices, etc. may be damaged. cannot maintain its function.

A heat dissipation structure has been developed and put into practical use to deal with this problem, but such a heat dissipation structure is adversely affected by the usage environment conditions, such as temperature conditions, and is large and heavy compared to the semiconductor product package.
The joint must have sufficient mechanical strength against temperature rise, vibration, etc.

[Conventional technology]

As mentioned above, it is necessary to radiate the heat generated in semiconductor product packages, and the conventional structure is as shown in FIG. A means of adhesively bonding the semiconductor product package 5 to a metal plate 6 made of molybdenum or the like using an adhesive resin such as an epoxy resin 4 is taken.

[Problem that the invention seeks to solve]

However, since the adhesive joint is simply made by butting the flat surface of the semiconductor product package 5 and the flat surface of the heat sink 3 and bonding these surfaces with adhesive resin, the mechanical strength of the joint is The strength is not sufficient, and there is a risk that the heat radiator 3 may separate from the semiconductor product package 5 due to temperature rise, vibration, etc., resulting in loss of its function and, in turn, damage to the semiconductor element.

The present invention was created in view of such problems, and its purpose is to provide a semiconductor device having sufficient thermal conductivity and mechanical strength between the package thermally conductive support material and the radiator. shall be.

[Means for solving problems]

FIG. 1 shows a basic configuration diagram of the present invention. In this figure, 20 is a package in which a semiconductor element 25 is arranged and hermetically sealed.
The thermally conductive supporting material 21 is a part of the hermetically sealed outer casing, and the semiconductor element 25 is fixed to the inner surface of the thermally conductive supporting material 21 in a heat conductive manner, and the outer heat transfer surface is heated. A conductive protrusion 30 is provided. Reference numeral 31 denotes a fitting portion for the protrusion 30 provided on the radiator 33. The outer heat transfer surface of the thermally conductive support material of the package 20 and the heat transfer surface of the protrusion 30 are made to face the heat receiving surface of the radiator 33 that faces the outer heat transfer surface of the heat conductive support material, and the heat transfer surface of the protrusion portion. A thermally conductive binder 3 is connected between the heat-receiving surface of the fitted part and the
5 to form the device of the present invention.

[Effect]

According to the invention, the package thermally conductive support 2
1 and the heat radiator 33, a structure is provided that can increase the thermal conductivity and strengthen the mechanical strength at the same time as described above, so the temperature of the heat radiating structure increases, and in addition, vibrations, etc. Even if the semiconductor element is given a heat dissipation function, the heat dissipation function for the semiconductor element is maintained, and the thermally weak semiconductor element can be protected from deterioration or destruction. Therefore, the reliability of the device in such a usage environment is improved.

〔Example〕

FIG. 2 shows a first embodiment of the invention. In this figure, 20 is a semiconductor product package (semiconductor device), and this package consists of a metal plate 21 made of molybdenum or the like and an annular ceramic 22 made of alumina, which are bonded together using a high-melting solder such as AgCu alloy. and AuSn or
A semiconductor element 25 is attached to a metal plate 21 in an interior 24 which is sealed and bonded with a low melting point solder such as a PbSn alloy.
is installed and configured. 26 and 27 are internal lead wires, and 28 and 29 are external lead wires.

Reference numeral 30 denotes a protrusion that is provided, for example, by brazing, on the joint surface (heat transfer surface) of the package 20, for example, the joint surface of the metal plate 21. An example of this protrusion is a rod-shaped body such as a stud, which will be described below.

Recessed portion (fitting portion) into which this stud 30 can be inserted
A radiator formed by forming 31 on the support portion 32 is designated by the reference number 33. A heat radiation fin 34 is provided on the support portion 32 of the heat radiator 33.

Furthermore, a thermally conductive binder such as epoxy resin 35 is filled between the bonding surface of the package 20 including the studs 30 and the bonding surface (heat receiving surface) of the radiator 33 including the recess 31. This creates a strong bond between the two.

Therefore, the heat dissipation structure having the above-mentioned coupling mode has a relatively bulky and heavy heat dissipation structure that has sufficient strength to withstand temperature rises, vibrations, etc. Since it has tensile strength, the original function of the heat dissipation structure is maintained, and there is no risk of deterioration or destruction of the semiconductor product.

FIG. 3 shows the embodiment of the present invention shown in FIG. 2, in which a package 20 is formed to form a sealed space between a ceramic 22 and a cap 23, a semiconductor element 25 is housed in the space, and a metal This embodiment differs from the embodiment shown in FIG. 2 in that it has a package structure without a plate, and a stud 30 is provided on the ceramic 22.
Since its constituent elements are the same, they will be given the same reference numerals as those in the embodiment of FIG. 2 and their explanation will be omitted.

Further, it will be stated that the effects of this embodiment can be obtained in the same manner, and the explanation thereof will be omitted.

FIG. 4 shows the stud 30 in the embodiment of FIG.
The difference is that two are provided, and the other configurations are the same, so the same reference numerals will be given to the same components and their explanation will be omitted.

Further, the effects are the same except that they increase in proportion to the addition of the studs 30.

FIG. 5 shows the semiconductor element 2 in the embodiment shown in FIG.
5 is moved to the side facing the heat radiator 33, and the other configurations are the same, so the same reference numerals will be given to the same components and the explanation thereof will be omitted. Further, its operation and effect are almost the same as the embodiment shown in FIG.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, a coupling structure is provided between the package thermally conductive support material and the radiator to increase thermal conductivity and mechanical strength. Thermal conductivity and mechanical strength can be significantly improved. Therefore, even if temperature rise, vibration, etc. are applied to the package, the heat dissipation structure connected to the package can sufficiently withstand the temperature rise and vibration, and therefore the original function of the heat dissipation structure can be maintained, and the semiconductor element can be sufficiently thermally protected, improving the reliability of the device.

[Brief explanation of the drawing]

Figure 1 is a diagram of the principle configuration of the present invention, Figures 2 to 5
The figures each show the heat dissipation structure of each embodiment of the present invention, and FIG. 6 shows the heat dissipation structure of a conventional package. 1 to 5, 20 is a semiconductor product package, 21 and 22 are thermally conductive support materials, and 25
is a semiconductor element, 30 is a protrusion, 31 is a recess, 33
is a heat sink, and 35 is a thermally conductive binder.

Claims (1)

[Claims] 1. Semiconductor element 25 on the inner surface of thermally conductive support material 21
an outer heat transfer surface of the thermally conductive support material 21 of the package 20 which is fixed and hermetically sealed in a heat transfer manner, and a heat transfer surface of the heat conductive protrusion 30 provided on the outer heat transfer surface; The heat receiving surface of the radiator 33 facing the outer heat transfer surface and the radiator 33 into which the protrusion 30 is inserted.
A thermally conductive binder 3 is connected between the heat receiving surface of the fitting part 31 of
A semiconductor device characterized in that it is formed by combining 5.